Light source heat dissipation structure and light source device thereof
By using a carrier plate with high thermal conductivity material in the light source device, the problem of difficulty in miniaturizing the high lumen output light source is solved, efficient heat dissipation and reliable light output are achieved, and miniaturization and lightweight of the light source device are promoted.
Patent Information
- Application Number
- CN202422172981.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-05
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-09-05
AI Technical Summary
High lumen output light sources or light boxes need to be equipped with large-volume radiators, making it difficult to achieve miniaturization or lightweight, hindering its application in the fields of medical and emergency care.
The bearing plate with high thermal conductivity material is adopted, and the light emitting components are arranged in contact on the bearing plate. Through the heat dissipation efficiency and efficiency of the high thermal conductivity material, good control of the temperature of the light emitting components is achieved.
It achieves efficient heat dissipation, provides reliable light output, and facilitates miniaturization and lightweighting of the light source device.
Smart Images
Figure CN223020214U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a heat dissipation structure, in particular to a heat dissipation structure suitable for a light source device. Background Art
[0002] The progress of technology has made the medical field no longer limited to specific places. In other words, the demand for portable and mobile devices in the medical and ambulance fields is increasing. However, due to their special conditions, some devices are difficult to be miniaturized or lightweight. For example, high-lumen output light sources or light boxes often need to be equipped with large-volume radiators, which hinders the miniaturization and lightweight of the light sources or light boxes. However, the sufficient illumination provided by the high-lumen output light source / light box is required for medical treatment and emergency rescue. Therefore, how to meet the heat dissipation efficiency and achieve the miniaturization / lightweight of the device is a problem to be overcome. Summary of the Utility Model
[0003] The utility model provides a light source heat dissipation structure with good heat dissipation performance, high heat dissipation efficiency, and reliable light output.
[0004] The utility model also provides a light source device with good heat dissipation performance and high heat dissipation efficiency, which can provide reliable light output.
[0005] To achieve one or part or all of the above purposes or other purposes, an embodiment of the utility model provides a light source heat dissipation structure, including a light-emitting component and a carrier plate. The carrier plate has a bearing surface, and the light-emitting component is arranged on the bearing surface; wherein the material of the carrier plate is at least a high thermal conductivity material with a thermal conductivity of 380 W / mK or more. The high thermal conductivity material forms a first area on the bearing surface, and the light-emitting component is in contact with and arranged in the first area.
[0006] In an embodiment of the utility model, the above high thermal conductivity material is red copper.
[0007] An embodiment of the utility model also provides a light source device, including the above light source heat dissipation structure, a heat dissipation component, and a box body. The heat dissipation component is connected to the light source heat dissipation structure, and the box body has a light-emitting hole; wherein the light source heat dissipation structure and the heat dissipation component are arranged in the box body, and the light generated by the light-emitting component is suitable for emitting through the light-emitting hole.
[0008] Since the utility model adopts a carrier plate made of a high thermal conductivity material, and the light-emitting component is in contact with and arranged on the carrier plate, the heat dissipation performance and efficiency are excellent. Therefore, the temperature range of the light-emitting component can be well regulated, which helps to provide reliable light output. The adoption of the high thermal conductivity material is also beneficial to achieving good heat dissipation effect with a smaller volume, and further realizing the miniaturization and lightweight of the light source device.
[0009] The above description is only an overview of the technical solution of the present utility model. In order to better understand the technical means of the present utility model, it can be implemented according to the content of the description. And in order to make the above and other purposes, features and advantages of the present utility model more obvious and understandable, the following preferred embodiments are specifically given and described in detail in conjunction with the accompanying drawings. Description of the Drawings
[0010] Figure 1 It is a three-dimensional schematic diagram of the light source heat dissipation structure according to the first embodiment of the present utility model.
[0011] Figure 2 It is Figure 1 a three-dimensional exploded schematic diagram of the light source heat dissipation structure of the embodiment of.
[0012] Figure 3 It is Figure 1 a three-dimensional exploded schematic diagram of another angle of the embodiment of.
[0013] Figure 4 It is a top view schematic diagram of the carrier plate according to the first embodiment of the present utility model.
[0014] Figure 5 It is Figure 4 a cross-sectional schematic diagram along AA of the embodiment of.
[0015] Figure 6 It is a three-dimensional exploded schematic diagram of the light source heat dissipation structure according to the second embodiment of the present utility model.
[0016] Figure 7 It is Figure 6 a three-dimensional exploded schematic diagram of another angle of the embodiment of.
[0017] Figure 8 It is a top view schematic diagram of the carrier plate according to the second embodiment of the present utility model.
[0018] Figure 9 It is Figure 8 a cross-sectional schematic diagram along BB of the embodiment of.
[0019] Figure 10 It is a three-dimensional schematic diagram of the light source device according to the embodiment of the present utility model.
[0020] Figure 11 It is Figure 10 an exploded schematic diagram of the embodiment of.
[0021] Figure 12 It is Figure 11 a partial schematic diagram of the embodiment of.
[0022] Figure 13 It is Figure 12 a partial schematic diagram of the embodiment of.
[0023] Figure 14 The exploded schematic diagram of an embodiment of Figure 13 .
[0024] Figure 15 The schematic diagram of another angle of an embodiment of Figure 13 .
[0025] Figure 16 The partial schematic diagram of the light source device of another embodiment of the present utility model. Specific embodiments
[0026] The light source heat dissipation structure of the present utility model, as shown in the embodiment of Figures 1 - 3 , includes a light emitting component 100 and a carrier plate 200. The carrier plate 200 has a bearing surface 201, and the light emitting component 100 is disposed on the bearing surface 201. The material of the carrier plate 200 is at least a high thermal conductivity material, and the light emitting component 100 can be further in contact with the area of the high thermal conductivity material disposed on the carrier plate 200. In a preferred embodiment of the present utility model, the high thermal conductivity material is preferably red copper or other materials having a thermal conductivity of more than 380 W / mK, for example, and the light emitting component 100 is usually a high heat source. Therefore, the contact setting of the light emitting component 100 on the carrier plate 200 helps to quickly conduct heat and then dissipate it. In the embodiment of the present utility model, the light emitting component 100 can be, for example, a light emitting diode or a laser diode, and is preferably a white light laser diode. The light emitting component 100 can be, for example, TO-CAN package or other types, such as ceramic package.
[0027] The high thermal conductivity material of the carrier plate 200 can further form a first area 2011 on the bearing surface 201, and the light emitting component 100 is in contact with and disposed in the first area 2011. In a preferred embodiment of the present utility model, the first area 2011 is located in the middle of the bearing surface 201. An electrode pair, that is, a positive electrode and a negative electrode, is preferably disposed on the bearing surface 201, and is electrically connected to the light emitting component 100. As shown in Figures 2 - 3 , the electrode pair includes a first electrode pair 310, and the light emitting component 100 can have a pin pair 110. The pin pair 110 is preferably located at the bottom of the light emitting component 100, and the side close to the carrier plate 200 is the bottom. On the one hand, the first electrode pair 310 is electrically connected to the light emitting component 100, for example, the positive electrode 310a is welded to the pin 110a, and the negative electrode 310b is welded to the pin 110b. On the other hand, it can be further electrically connected to an external circuit. The external circuit can be a circuit included in, for example, a power system or a control unit. Therefore, the light emitting component 100 can be driven to emit light through the first electrode pair 310.
[0028] Figure 4 , Figure 5 The top view schematic diagram of the carrier plate 200 and the cross-sectional schematic diagram along AA are shown respectively in Figures 4 - 5As shown, the light source heat dissipation structure 10 further includes a circuit board 500, and the circuit board 500 can be disposed on the bearing surface 201. Except for the first area 2011, the bearing surface 201 can further include a second area 2012 surrounding the first area 2011, and the circuit board 500 can be further disposed in the second area 2012. There is an insulating arrangement between the circuit board 500 and the high thermal conductivity material of the carrier board 200. Preferably, the circuit board 500 includes an insulating layer 510 and a circuit layer 520.
[0029] As Figure 5 shown, the insulating layer 510 can be further disposed at the bottom of the circuit board 500, the part in contact with the carrier board 200, and the surface part of the circuit board 500, and the circuit layer 520 can be located inside the circuit board 500. That is to say, the insulating layer 510 and the circuit layer 520 can be stacked, and in addition, the insulating layer 510 and the circuit layer 520 are not limited to one layer. The circuit board 500 can be further electrically connected to the aforementioned external circuit. In a preferred embodiment of the present invention, the aforementioned first electrode pair 310 can be further disposed on the circuit board 500 and connected to the wire layer 520. As Figure 5 shown, for example, the light-emitting component 100 can be electrically connected to the first electrode pair 310 by soldering, for example, the pin pair 110 to the solder joint 311 inside the first electrode pair 310, and is thus fixed to the carrier board 200. The solder joint 312 outside the first electrode pair 310 can be used for soldering to an external circuit, for example. Therefore, the light-emitting component 100 can be electrically connected to, for example, a power system and a control unit through the circuit board 500.
[0030] The light source heat dissipation structure 10 can further include other components. In a preferred embodiment of the present invention, the light source heat dissipation structure 10 further includes a thermosensitive component 400, which can be used to detect the temperature and temperature change of the light-emitting component 100. In some embodiments of the present invention, the thermosensitive component 400 can be, for example, a thermistor, whose resistance value can change with the change of temperature and feedback to the power system or the control unit, thereby affecting the work done by the light-emitting component 100. For example, the thermosensitive component 400 can prevent the light-emitting component 100 from approaching the temperature threshold and preferably maintain the light-emitting component 100 within an appropriate temperature range, so as to have a reliable brightness output. The thermosensitive component 400 can be further electrically connected to the electrode pair on the bearing surface 201. As Figure 2 As Figure 4 shown, the electrode pair can include a second electrode pair 320 electrically connected to the thermosensitive component 400, for example, the positive electrode and the negative electrode are respectively soldered to the pin pair (not shown in the figure) of the thermosensitive component 400. In addition, the thermosensitive component 400 can also be fixed to the carrier board 200 by soldering.
[0031] Figures 6 - 9 The schematic diagram of the light source heat dissipation structure 10a according to another embodiment of the present invention is shown. As Figures 6 - 9As shown, the light source heat dissipation structure 10a includes a light emitting component 100a and a carrier plate 200a. The difference from the foregoing embodiment is that the bottom of the light emitting component 100a has a pin pair 120, and the fixing base 200a has a jack pair 240 corresponding to the pin pair 120. As Figures 8 - 9 shown, the jack pair 240 passes through the carrier plate 200a and opens at the first region 2011 and the opposite side of the bearing surface 201, and the pin pair 120 passes through the jack pair 240 and can protrude from the opposite side of the bearing surface 201.
[0032] In this embodiment, the light emitting component 100a can be electrically connected to, for example, a power system and a control unit through the pin pair 120. For example, the electrical connection between the pin pair 120 and an external circuit can be achieved by wire soldering, and the light emitting component 100a can be further fixed to the carrier plate 200a. In addition, an insulating layer 242 is respectively provided in each jack pair 240 to separate the pin pair 240 from the inner wall of the jack 240, and the inner wall of the jack 240 may include a region of a material with a high thermal conductivity coefficient. The light emitting component 100a can be, for example, a white light laser diode in a TO-CAN package.
[0033] As Figures 1 - 4 、 Figures 6 - 8 shown, the light source heat dissipation structure 10(10a) of the embodiment of the present invention can also form a through hole 220 on the carrier plate 200(200a). The through hole 220 passes through the carrier plate 200(200a) and opens at the bearing surface 201 and the opposite side of the bearing surface 201, and is suitable for wires to pass through. For example, when an electrode pair such as a first electrode pair 310 and / or a second electrode pair 320 is soldered to a wire of an external circuit, the wire can pass through the through hole 220 and be received therein, but this is not limited thereto. The light source heat dissipation structure 10(10a) of the embodiment of the present invention can also form a notch 260 at the edge of the carrier plate 200(200a). The notch 260 can also be used for wires to pass through and be received therein.
[0034] The present invention also provides a light source device with better heat dissipation and reliable brightness output. Figure 10 is a perspective view of the light source device of the embodiment of the present invention, Figure 11 is its exploded view. As Figures 10 - 11 shown, the light source device 1 includes the light source heat dissipation structure 10, a heat dissipation member 70, and a box body 80 as described above. The heat dissipation member 70 is formed of a material with good thermal conductivity, and preferably has a grooved or finned structure, or other structural designs beneficial to increasing the heat dissipation area. The heat dissipation member 70 is connected to the light source heat dissipation structure 10, and both are disposed in the box body 80.
[0035] As Figure 11As shown, the housing 80 of the light source device 1 can be composed of several parts, such as upper and lower plate members 81, 82, front and rear plate members 83, 84, and left and right plate members 85, 86. The front plate member 83 can further have a light outlet 830 for emitting light. The light source heat dissipation structure 10 faces the direction of the light outlet 830 with the side having the light emitting component 100. In a preferred embodiment of the present invention, the light source device 1 further includes a cylindrical structure 11. The cylindrical structure 11 can be used for the light emitting component 100 to be disposed therein, and is sleeved with the front plate member 83 and extends out of the housing 80 from the light outlet 830. An optical component such as a lens, a mirror, a prism... or a combination thereof can be further disposed in the cylindrical structure 11, and can be used to enhance or change the light output of the light emitting component 100. For example, it is used to adjust the light emitting angle. On the other hand, as Figure 10 shown, since the cylindrical structure 11 protrudes from the housing 80, in some embodiments of the present invention, it is suitable as a connection structure between the light source device 1 and other devices. For example, when the light source device 1 is used in a medical field, such as for providing an endoscope light source, the cylindrical structure 11 can be used to connect to the base of the endoscope.
[0036] The light source device 1 can further include a fan 90 and a control board C, and both are disposed in the housing 80. The fan 90 is preferably disposed adjacent to the heat dissipation member 70, and the number is not limited to one. In some embodiments of the present invention, the heat dissipation member 70 can be approximately in a long column shape, and the fans 90 can be arranged substantially along the column height direction of the heat dissipation member 70. In a preferred embodiment of the present invention, a plurality of fans 90 are disposed on opposite sides of the heat dissipation member 70, such as the left side and the right side, and the fans 90 are arranged along the column height direction on each side. The housing 80 can have openings at positions corresponding to the fans 90, such as on the left plate member 85 and the right plate member 86, for air convection and heat dissipation. The fan 90 can be fixed to the plate members 85, 86 and / or the heat dissipation member 70 by, for example, screwing, but not limited thereto.
[0037] The control board C can be equivalent to the aforementioned control unit, or can perform all or part of the functions of the aforementioned control unit. And the aforementioned power system can be, for example, a DC power supply, an AC power supply, a switching power supply, or a combination thereof. In the embodiment of the present utility model, the control board C in the box body 80 is preferably disposed close to the upper plate member 81 or the lower plate member 82, the left plate member 85 or the right plate member 86, and is electrically connected to the light-emitting component 100, the thermal-sensitive component 400, and the power system. By being electrically connected to the light-emitting component 100, the control board C can control the light-emitting component 100 to emit light. For example, by transmitting power and control signals, the light-emitting component 100 emits light, and the light-emitting component 100 can have different light-emitting brightnesses and variable light-emitting frequencies. For example, the control board C can lower the supply of, for example, current to reduce the light-emitting brightness, or increase the current supply to increase the light-emitting brightness; it can control the supply of, for example, power to be continuous or non-continuous, so that the light-emitting component 100 emits light continuously or, for example, intermittently. And by being electrically connected to the thermal-sensitive component 400, the control board C can receive temperature-related signals and react. For example, after receiving the feedback from the thermal-sensitive component 400, the control board C can lower or limit the supply of, for example, current to avoid the continuous temperature rise of the light-emitting component 100, and / or maintain the light-emitting component 100 within an appropriate temperature range to have a reliable light output.
[0038] In a preferred embodiment of the present utility model, the material of the heat dissipation member 70 is at least a high thermal conductivity material, and preferably copper, and the light source heat dissipation structure 10 is in contact with the heat dissipation member 70. In addition, the control board C can also be further provided thereon for the control board C. Figure 12 Shown is a partial schematic diagram of the light source device. As Figures 11 - 12 shown, the heat dissipation member 70 can further have a platform portion 701, which is suitable for the control board C to be disposed thereon and can help the heat dissipation of the control board C. Figure 13 For Figure 12 partial schematic diagram of, Figure 14 For Figure 13 is Figures 12 - 14 the exploded schematic diagram of. As
[0039] As Figure 14As shown, the connecting member 60 includes a plate body 600 and an annular seat body 650, and the annular seat body 650 is disposed on the plate body 600, wherein an accommodating space 660 is formed between the inner side of the annular seat body 650 and the plate body 600. The light source heat dissipation structure 10 is further disposed in contact with the annular seat body 650, and the carrier plate 200 can cover the accommodating space 660. In a preferred embodiment of the present invention, the projection of the first region 2011 of the bearing surface 201 on the connecting member 60 preferably covers the accommodating space 660. The accommodating space 660 can be used for, for example, accommodating wires. For example, it can accommodate external circuit wires connected to the electrode pair.
[0040] As Figures 14 - 15 shown, the plate body 600 of the connecting member 60 is further formed with at least one through hole 620 and a groove portion 640. The through hole 620 penetrates the plate body 600 and can open into the accommodating space 660, and is adapted for wires to pass through. For example, the external circuit wires connected to the electrode pair can pass through the through hole 620 and then be connected to the control board C. The through hole 620 can communicate with the groove portion 640, but is not limited thereto. The groove portion 640 is located on the opposite side of the plate body 600 where the annular seat body 650 is provided, preferably in a long shape and extending to the edge of the plate body 600, and is adapted to accommodate wires, so as to prevent the wires from protruding on the plate body 600 and affecting the flat attachment between the plate body 600 and the heat dissipation member 70. The connecting member 60 can also form a notch 680 at the edge of the plate body 600. The notch 680 can communicate with the groove portion 640, but is not limited thereto. The notch 680 can allow wires to pass through and accommodate them therein. In some embodiments of the present invention, for example, the wires from the electrode pair can pass through the notch 260 at the edge of the carrier plate 200 and the notch 680 at the edge of the plate body 600, and then be connected to the control board C.
[0041] Figure 16 is a partial schematic view of another light source device of the present invention. The difference from the foregoing embodiment is that Figure 16 the light source device 1 has a light source heat dissipation structure 100a. As described above, the light source structure 100a has a pin pair 120, and the pin pair 120 passes through the jack pair 240 and can protrude from the opposite side of the bearing surface 201, and is used for electrically connecting to an external circuit. In this embodiment, the wires connecting the pin pair 120 can pass through the accommodating space 660 and the through hole 620, and then be connected to the control board C.
[0042] In summary, the light source heat dissipation structure 10 (10a) of the embodiment of the present utility model has characteristics in terms of materials and structure. The material has the property of an ultra-high thermal conductivity coefficient, so the light source heat dissipation structure 10 (10a) has good heat dissipation performance and high heat dissipation efficiency. In terms of structure, there is a direct and effective contact between the high-heat-generating light-emitting component 100 (100a) and the ultra-high thermal conductivity coefficient material, including the contact setting between the light-emitting component 100 (100a) and the carrier plate 200 (200a), the contact setting between the connecting member 60 and the carrier plate 200 (200a) and the heat dissipation member 70, and the flat attachment between the connecting member 60 and the heat dissipation member 70. Moreover, the materials of the carrier plate 200 (200a), the connecting member 60, and the heat dissipation member 70 are all at least materials with an ultra-high thermal conductivity coefficient, so it is more helpful to improve the heat dissipation efficiency of the light source heat dissipation structure 10 (10a). Due to the good heat dissipation performance and heat dissipation efficiency of the light source heat dissipation structure 10 (10a), the temperature range of the light-emitting component 100 (100a) can be well regulated, so a reliable light output can be provided. In addition, due to the good heat dissipation property, the same or better heat dissipation effect can be achieved with a smaller volume, which is beneficial to the miniaturization and light weight of the light source device.
[0043] The above is only a preferred embodiment of the present utility model and does not impose any form of limitation on the present utility model. Although the present utility model has been disclosed above with the preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some changes or modifications to the above-disclosed methods and technical contents within the scope of the technical solution of the present utility model to obtain equivalent embodiments with equivalent changes. However, as long as it does not depart from the content of the technical solution of the present utility model, any simple modification, equivalent change, and modification made to the above embodiment according to the technical essence of the present utility model still fall within the scope of the technical solution of the present utility model.
Claims
1. A light source heat dissipation structure, characterized in that: include: a light emitting component; as well as a load-bearing plate; The carrying plate has a carrying surface, and the light-emitting component is arranged on the carrying surface; The material of the carrier plate is at least a high thermal conductivity material with a thermal conductivity of more than 380 W / mK. The high thermal conductivity material forms a first area on the carrier surface, and the light-emitting component is disposed in contact with the first area.
2. The light source heat dissipation structure according to claim 1, characterized in that: The high thermal conductivity material is copper.
3. The light source heat dissipation structure according to claim 1, characterized in that: The light source heat dissipation structure further includes a first electrode pair disposed on the carrying surface, and the first electrode pair is electrically connected to the light emitting component.
4. The light source heat dissipation structure according to claim 3, characterized in that: The light-emitting component further comprises a pin pair; the light-emitting component is fixed to the supporting board by welding the pin pair, and is further electrically connected to the first electrode pair through the pin pair.
5. The light source heat dissipation structure according to claim 3, characterized in that: The light source heat dissipation structure further includes a circuit board disposed on the bearing surface; wherein the circuit board includes an insulating layer and a circuit layer stacked together, and the first electrode pair is further disposed on the circuit board and connected to the circuit layer.
6. The light source heat dissipation structure according to claim 5, characterized in that: The carrying surface further includes a second area, and the first area is located in the middle of the carrying surface and the second area surrounds the first area; wherein the circuit board is further disposed in the second area.
7. The light source heat dissipation structure according to claim 1, characterized in that: The light source heat dissipation structure further includes a thermally sensitive component and a second electrode pair disposed on the carrying surface, and the thermally sensitive component is electrically connected to the second electrode pair.
8. The light source heat dissipation structure according to claim 1, characterized in that: The carrier board further forms a pair of holes, and the pair of holes passes through the carrier board and opens at the first area and the opposite side of the carrier surface; the light-emitting component further includes a pair of pins, and the pair of pins passes through the pair of holes and protrudes from the opposite side of the carrier surface.
9. The light source heat dissipation structure according to claim 8, characterized in that: An insulating layer is respectively arranged in the center of the plug holes, and each pin is separated from the hole wall of each plug hole by the insulating layer.
10. The light source heat dissipation structure according to claim 1, characterized in that: The carrier board is further formed with at least one through hole, and the at least one through hole passes through the carrier board and opens at the carrier surface and the opposite side of the carrier surface; wherein the through hole is suitable for a wire to pass through.
11. The light source heat dissipation structure according to claim 1, characterized in that: The light emitting component is further a laser diode.
12. A light source device, characterized in that: include: A light source heat dissipation structure according to any one of claims 1 to 11; a heat sink connected to the light source heat dissipation structure; as well as A box body has a light exit hole; wherein the light source heat dissipation structure and the heat dissipation element are arranged in the box body, and the light generated by the light-emitting component is suitable for being emitted through the light exit hole.
13. The light source device according to claim 12, characterized in that: The light source device further includes a connecting member, which is arranged between the light source heat dissipation structure and the heat dissipation member.
14. The light source device according to claim 13, characterized in that: The connecting member includes a plate body and an annular seat body, and the annular seat body is arranged on the plate body; wherein an accommodating space is formed between the inner side of the annular seat body and the plate body.
15. The light source device according to claim 14, characterized in that: The light source heat dissipation structure is further contacted and disposed on the annular seat body, and the carrying plate covers the accommodating space.
16. The light source device according to claim 14, characterized in that: The plate body is further formed with at least one through hole and a groove; the at least one through hole passes through the plate body and opens into the accommodating space, and the groove is located on the opposite side of the plate body where the annular seat body is located; wherein the at least one through hole and the groove are suitable for a wire to pass through.
17. The light source device according to claim 12, characterized in that: The light source device further includes a control board electrically connected to the light source heat dissipation structure, and the control board is suitable for controlling the light emitting component to emit light.