Wafer carrier plate and die bond inspection device
By designing a wafer carrier plate with positioning marking set and glue layer, the problem of the inability to use IC substrates in the prior art is solved, and multiple use of wafers and cost savings are achieved.
Patent Information
- Application Number
- CN202421893205.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-06
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-08-06
AI Technical Summary
In the prior art, IC substrates cannot be used repeatedly, resulting in excessive cost and are unfavorable for multiple inspections and replacement of wafers.
A wafer carrier plate is designed, including a motherboard and at least one glue layer. A positioning mark group is provided on the motherboard, and the glue layer is arranged in the preset direction of the motherboard to bond and locate the wafer to realize the repeated use of the wafer.
Through this wafer carrier plate, multiple bonding and removal of wafers can be achieved, reducing costs and simplifying the wafer inspection and replacement process.
Smart Images
Figure CN223022077U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafers, and more specifically, to a wafer carrier and a die bonding inspection device. Background Art
[0002] In the prior art, generally, a wafer is carried by an IC substrate. The wafer can be fixed through the IC substrate. After being fixed in place, the IC substrate carrying the wafer is placed in an inspection device to inspect the wafer.
[0003] However, the substrate used in the prior art cannot be reused. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a wafer carrier and a die bonding inspection device, which have a simpler structure, save costs, and can be reused.
[0005] The embodiments of the utility model are implemented as follows:
[0006] In a first aspect, the utility model provides a wafer carrier, including:
[0007] A main board, on which at least one set of positioning mark groups is provided. Each positioning mark group includes a plurality of marks that are sequentially spaced apart along a first preset direction; and
[0008] At least one glue layer, which is arranged on the main board along the first preset direction and is used to bond a plurality of wafers in sequence by aligning with the marks.
[0009] In an optional embodiment, the number of the positioning mark groups is multiple, and the multiple positioning mark groups are arranged in parallel and spaced along a second preset direction;
[0010] The number of the glue layers is multiple, and the multiple glue layers correspond to the multiple sets of positioning mark groups one by one;
[0011] Wherein, the second preset direction is perpendicular to the first preset direction.
[0012] In an optional embodiment, the number of the positioning mark groups is multiple, and the multiple positioning mark groups are arranged in parallel and spaced along a second preset direction;
[0013] The number of the glue layers is multiple, and each glue layer is located between two adjacent positioning mark groups;
[0014] Wherein, the second preset direction is perpendicular to the first preset direction.
[0015] In an optional embodiment, the shape of the main board is rectangular, the first preset direction is the length direction of the main board, and the second preset direction is the width direction of the main board.
[0016] In an alternative embodiment, each adhesive layer includes a plurality of adhesion portions, the plurality of adhesion portions are sequentially and spaced apart along a first preset direction, the plurality of adhesion portions correspond to a plurality of marks, and each adhesion portion is used to bond a wafer.
[0017] In an alternative embodiment, for the same set of positioning mark groups, the spacing length between two adjacent marks of the positioning mark group is A; the spacing length between two adjacent sets of positioning mark groups is B; wherein, A < B.
[0018] In an alternative embodiment, A is 8 mm - 13 mm, and / or B is 14 mm - 18 mm.
[0019] In an alternative embodiment, the mark is an annular groove.
[0020] In an alternative embodiment, the annular groove is a laser engraved groove.
[0021] In a second aspect, the present utility model provides a die bonding inspection device, including:
[0022] A guide rail, a robotic arm, and the aforementioned wafer carrier, the main board of the wafer carrier is arranged on the guide rail, and the robotic arm is used to place the wafer on the adhesive layer of the wafer carrier.
[0023] The beneficial effects of the embodiments of the present utility model include:
[0024] The wafer carrier includes a main board and at least one adhesive layer, the main board is provided with at least one set of positioning mark groups, and the positioning mark group includes a plurality of marks that are sequentially and spaced apart along a first preset direction; the adhesive layer is arranged on the main board along the first preset direction, and the adhesive layer is used to sequentially bond a plurality of wafers by aligning with the marks. In this way, the wafers on the adhesive layer can be positioned by the positioning mark groups provided on the main board, and the wafers can be firmly bonded by using the adhesive layer. After the wafers are inspected, the original wafers can be removed and new wafers can be re-bonded, so as to achieve repeated use. Or, when it is necessary to replace the original wafers with other types of wafers after the wafers are placed, the original wafers can be removed and other types of wafers can be re-bonded. Therefore, the use of this wafer carrier can save costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.
[0026] Figure 1 It is a schematic structural diagram of the first wafer carrier provided by the embodiments of the present utility model;
[0027] Figure 2 The structural schematic diagram of the second wafer carrier provided by the embodiment of the present utility model;
[0028] Figure 3 The structural schematic diagram of the wafer adhered to the wafer carrier provided by the embodiment of the present utility model;
[0029] Figure 4 The structural schematic diagram of the third wafer carrier provided by the embodiment of the present utility model;
[0030] Figure 5 The structural schematic diagram of the fourth wafer carrier provided by the embodiment of the present utility model.
[0031] Icon: 100 - wafer carrier; 110 - main board; 120 - adhesive layer; 111 - positioning mark group; 112 - mark; 121 - adhesion part; 200 - wafer. Detailed implementation manners
[0032] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some but not all of the embodiments of the present utility model. Components of the embodiments of the present utility model usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.
[0033] Therefore, the detailed description of the embodiments of the present utility model provided in the accompanying drawings below is not intended to limit the scope of the claimed present utility model, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0034] It should be noted that: like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0035] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present utility model is habitually placed during use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to the present utility model. In addition, terms such as "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.
[0036] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging vertically, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.
[0037] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0038] When encapsulating a wafer, it is necessary to first inspect the wafer to avoid uneven cutting surfaces, curling, burrs, etc. of the wafer during the cutting process due to its own reasons and the influence of the cutting tool and speed, that is, defective wafers.
[0039] If defective wafers are encapsulated, it will affect the use of the product. Therefore, it is necessary to first inspect the wafers, sort out qualified wafers and defective wafers, and then encapsulate the qualified wafers. During the inspection process, an IC substrate is generally used to carry the wafers. However, the existing IC substrate has a complex structure, high price, and is not conducive to repeated use, resulting in too high costs.
[0040] Please refer to Figures 1 - 5 , Figure 1 which is a schematic structural diagram of the first wafer carrier 100 provided by an embodiment of the present utility model; Figure 2 which is a schematic structural diagram of the second wafer carrier 100 provided by an embodiment of the present utility model; Figure 3 which is a schematic structural diagram of the wafer 200 adhered to the wafer carrier 100 provided by an embodiment of the present utility model; Figure 4Schematic diagram of the third structure of the wafer carrier provided by the embodiment of the present invention; Figure 5 Schematic diagram of the fourth structure of the wafer carrier provided by the embodiment of the present invention.
[0041] Based on the above problems, the embodiment of the present invention provides a wafer carrier 100 and a wafer inspection device (not shown in the figure). The wafer inspection device includes a guide rail, a robotic arm, and the wafer carrier 100. The wafer carrier 100 is disposed on the guide rail, and the robotic arm is used to place the wafer 200 on the wafer carrier 100.
[0042] Generally, first place the main board 110 of the wafer carrier 100 on the guide rail. The robotic arm can be used to place the wafer carrier 100. After placing it in place, the robotic arm removes the wafer 200 from the previous process and places it on the wafer carrier 100. It should be noted that the wafer inspection device further includes a sensor for identification and positioning.
[0043] Specifically, the wafer carrier 100 will be described in detail below:
[0044] The wafer carrier 100 includes a main board 110 and at least one adhesive layer 120. The main board 110 is provided with at least one set of positioning mark groups 111. The positioning mark group 111 includes a plurality of marks 112 that are sequentially spaced apart along a first preset direction. The adhesive layer 120 is disposed on the main board 110 along the first preset direction, and the adhesive layer 120 is used to bond a plurality of wafers 200 in sequence by aligning with the marks 112.
[0045] Specifically, the positioning mark group 111 provided on the main board 110 can be used to position the wafer 200 on the adhesive layer 120, and the adhesive layer 120 is used to firmly bond the wafer 200. After the wafer 200 is inspected, the original wafer 200 can be removed and a new wafer 200 can be re-bonded, so as to achieve repeated use. Or, when it is necessary to replace the wafer 200 with another type after placing the wafer 200, the original wafer 200 can be removed and another type of wafer 200 can be re-bonded. Therefore, the cost can be saved by using this wafer carrier.
[0046] It should be noted that in this embodiment, the main board 110 is made of a steel plate, which has a low cost and a stable structure.
[0047] In this embodiment, the adhesive layer 120 is made of double-sided tape. First, one side of the double-sided tape is adhered to the main board 110, and the other side of the double-sided tape is used to adhere the wafer 200. In other embodiments, glue can also be applied to the surface of the main board 110 and allowed to solidify to form the adhesive layer 120.
[0048] Furthermore, please refer to Figure 1, in this embodiment, the number of the positioning mark groups 111 is multiple groups, and the multiple groups of positioning mark groups 111 are arranged in parallel and at intervals along the second preset direction; the number of the adhesive layers 120 is multiple, and the multiple adhesive layers 120 correspond to the multiple groups of positioning mark groups 111 one by one; wherein, the second preset direction is perpendicular to the first preset direction.
[0049] Specifically, in this embodiment, each adhesive layer 120 is located below its corresponding positioning mark group 111. In other embodiments, each adhesive layer 120 may also be located above its corresponding positioning mark group 111, or a part of the adhesive layers 120 are located above their corresponding positioning mark groups 111, and another part of the adhesive layers 120 are located below their corresponding positioning mark groups 111.
[0050] Please refer to Figure 2 , in other embodiments, each adhesive layer 120 is located between two adjacent positioning mark groups 111. It should be noted that if the distance between the two outermost positioning mark groups 111 and the edge of the main board is too small, an adhesive layer 120 is arranged between the two positioning marks 112.
[0051] Please refer to Figure 4 and Figure 5 , in other embodiments, the main board 110 may also be provided with only one group of positioning mark groups 111 and one adhesive layer 120; or, the main board 110 is provided with two groups of positioning mark groups 111 and one adhesive layer 120, and the two groups of positioning mark groups 111 are respectively located above and below the adhesive layer 120.
[0052] Combined with the above content, please refer to Figure 1 and Figure 2 , in this embodiment, the shape of the main board 110 is rectangular, the first preset direction is the length direction of the main board 110, and the second preset direction is the width direction of the main board 110. It can be understood that, in this embodiment, the multiple marks 112 are arranged in an array, so as to reasonably use the space of the main board 110 to place more wafers.
[0053] In other embodiments, the first preset direction and the second preset direction can be adjusted according to the specific shape of the main board 110. For example, when the main board 110 is oval, the first preset direction is the direction of the line where the two foci of the ellipse are located; when the main board 110 is circular, the first preset direction is the direction of a certain diameter of it, and the second preset direction is the direction of the diameter perpendicular to this diameter; when the main board 110 is square, the first preset direction is the direction of a certain side length of it, and the second preset direction is the direction of the other side length intersecting with this side length.
[0054] Further, each adhesive layer 120 includes a plurality of adhesion portions 121, which are sequentially and spaced apart along a first preset direction. The plurality of adhesion portions 121 correspond to a plurality of markers 112, and each adhesion portion 121 is used to bond a wafer 200. Specifically, the interval length between two adhesion portions 121 is equal to the interval length between the two corresponding markers 112. It can be understood that when the wafer 200 is removed, the adhesive layer 120 will deform. By providing a plurality of adhesion portions 121 arranged at intervals, when taking a single wafer 200, it will not affect other wafers 200, so as to ensure that the wafer 200 will not be damaged. Of course, it is not excluded that the interlayer is provided as a long strip of tape.
[0055] Please refer to Figure 1 and Figure 2 , for the same set of positioning marker groups 111, the interval length between two adjacent markers 112 of the positioning marker group 111 is A; the interval length between two adjacent sets of positioning marker groups 111 is B; wherein, A < B. Specifically, at least one adhesive layer 120 is provided between two sets of positioning marker groups 111, and no adhesive layer 120 is provided between two adjacent markers 112 in the same set of positioning marker groups 111 to prevent the wafers 200. In order to prevent more wafers 200, the interval length A between two adjacent markers 112 in the same positioning marker group 111 is less than the interval length B between two adjacent sets of positioning marker groups 111.
[0056] According to the above settings, in this embodiment, A is 8 mm - 13 mm, and / or B is 14 mm - 18 mm. Wafers 200 can be placed between two adjacent sets of positioning marker groups 111, and during the inspection process, two adjacent wafers 200 will not affect each other.
[0057] Further, in this embodiment, the positioning marker 112 is an annular groove formed by laser engraving. Specifically, an annular image is engraved on the main board 110 by a laser engraving machine, thereby forming an annular groove, that is, the annular groove in this embodiment is a laser engraving groove.
[0058] In other embodiments, the positioning marker 112 can also be a through hole, or formed by other means such as stamping. It should be noted that for the convenience of detection, the shape of the positioning marker 112 should be a regular figure.
[0059] The working principle of the wafer carrier 100 in this wafer inspection device is as follows:
[0060] First, place the main board 110 of the wafer carrier 100 on the guide rail, and move the wafer carrier 100 through the guide rail so that the main board 110 faces the sensor. After the sensor recognizes the positioning mark 112 on the positioning mark group 111, use the robotic arm to place the wafer 200 on the adhesive layer 120 corresponding to the positioning mark group 111, so that the wafer 200 is fixed on the wafer carrier 100. Subsequently, inspect the wafer 200 located on the wafer carrier 100 to distinguish between qualified wafers 200 and defective wafers 200.
[0061] When the inspection of the wafer 200 is completed and a new wafer 200 needs to be inspected, remove the original wafer 200, and then a new wafer 200 can be placed again. The material used for the wafer carrier 100 provided by the present utility model has a lower price and a simple structure, and the wafer carrier 100 can be reused repeatedly, further reducing costs.
[0062] It should be noted that, in this embodiment, the adhesive force of the adhesive layer 120 is not greater than 2N so that the wafer 200 can be smoothly removed. Preferably, the adhesive force of the adhesive layer 120 is not greater than 1N so that the adhesive layer 120 can be reused repeatedly.
[0063] In this embodiment, the number of wafers 200 placed is equal to or less than the number of marks 112, and the wafer 200 is adhered to the adhesive layer 120 by aligning with the mark 112. It can be understood that multiple wafers 200 are distributed at intervals along the first preset direction, avoiding the influence on the inspection of the wafers 200 due to too small a distance between the wafers 200 and ensuring inaccurate inspection results.
[0064] In summary, the wafer carrier 100 includes a main board 110 and at least one adhesive layer 120. The main board 110 is provided with at least one group of positioning mark groups 111, and the positioning mark group 111 includes a plurality of marks 112 that are sequentially distributed at intervals along the first preset direction; the adhesive layer 120 is arranged on the main board 110 along the first preset direction, and the adhesive layer 120 is used to bond a plurality of wafers 200 by aligning with the marks 112 in sequence. The number of positioning mark groups 111 is multiple groups, and the multiple groups of positioning mark groups 111 are arranged parallel and at intervals along the second preset direction; the number of adhesive layers 120 is multiple, and the multiple adhesive layers 120 correspond to the multiple groups of positioning mark groups 111 one by one; wherein, the second preset direction is perpendicular to the first preset direction.
[0065] The wafer carrier 100 positions the adhesive layer 120 by setting the positioning mark group 111 on the main board 110, so as to place the wafer 200 on the corresponding adhesive layer 120, that is, use the main board 110 to place the wafer 200 and use the adhesive layer 120 to firmly bond the wafer 200. When different wafers 200 need to be placed, the original wafer 200 can be removed and a new wafer 200 can be re-bonded, thereby realizing repeated use. The structure of the wafer carrier 100 is simpler and the cost is lower.
[0066] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, the present utility model may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A wafer carrier, characterized in that: include: A main board (110), the main board (110) being provided with at least one group of positioning mark groups (111), the positioning mark group (111) comprising a plurality of marks (112) sequentially spaced and distributed along a first preset direction; as well as At least one adhesive layer (120), the adhesive layer (120) being arranged on the main board (110) along the first preset direction, the adhesive layer (120) being used to sequentially bond a plurality of wafers (200) in accordance with the markings (112).
2. The wafer carrier according to claim 1, characterized in that: The number of the positioning mark groups (111) is multiple, and the multiple positioning mark groups (111) are arranged in parallel and at intervals along a second preset direction; The number of the adhesive layers (120) is plural, and the plural adhesive layers (120) correspond one-to-one to the plural groups of positioning mark groups (111); The second preset direction is perpendicular to the first preset direction.
3. The wafer carrier according to claim 1, characterized in that: The number of the positioning mark groups (111) is multiple, and the multiple positioning mark groups (111) are arranged in parallel and at intervals along a second preset direction; There are a plurality of adhesive layers (120), and each adhesive layer (120) is located between two adjacent positioning mark groups (111); The second preset direction is perpendicular to the first preset direction.
4. The wafer carrier according to claim 2 or 3, characterized in that: The main board (110) is in the shape of a rectangle, the first preset direction is the length direction of the main board (110), and the second preset direction is the width direction of the main board (110).
5. The wafer carrier according to any one of claims 1 to 3, characterized in that: Each of the adhesive layers (120) comprises a plurality of adhesive portions (121), the plurality of adhesive portions (121) being distributed in sequence and at intervals along the first preset direction, the plurality of adhesive portions (121) corresponding to the plurality of marks (112), and each of the adhesive portions (121) being used to bond one of the wafers (200).
6. The wafer carrier according to claim 2 or 3, characterized in that: For the same group of positioning mark groups (111), the interval length between two adjacent marks (112) of the positioning mark group (111) is A; the interval length between two adjacent groups of positioning mark groups (111) is B; wherein A <B。 7. The wafer carrier according to claim 6, characterized in that: A is 8mm-13mm, and / or, B is 14mm-18mm.
8. The wafer carrier according to any one of claims 1 to 3, characterized in that: The mark (112) is an annular groove.
9. The wafer carrier according to claim 8, characterized in that: The annular groove is a laser engraved groove.
10. A die bonding inspection device, characterized in that: include: A guide rail, a robotic arm, and a wafer carrier (100) as described in any one of claims 1 to 9, wherein the main board (110) of the wafer carrier (100) is arranged on the guide rail, and the robotic arm is used to place the wafer (200) on the adhesive layer (120) of the wafer carrier (100).