Production device of potting type lead ceramic capacitor

Abstract

The utility model relates to a production device of a potting type lead ceramic capacitor. The potting type lead ceramic capacitor comprises a ceramic chip, two leads oppositely arranged at the two ends of the ceramic chip, two solder layers arranged at the ends of the leads and the ceramic chip respectively, a packaging shell packaged on the periphery of the ceramic chip, and a potting adhesive layer filled in the packaging shell and used for fixing and sealing the ceramic chip. The production device comprises a welding jig and a filling jig, wherein the welding jig is used for welding the two leads at the two ends of the ceramic chip respectively; the filling jig is used for filling a glue solution into a packaging shell clamped with the ceramic chip and the two leads; according to the production device for limiting the potting type lead ceramic capacitor, the welding jig is matched with the filling jig, the lead and the ceramic chip are welded into a whole in a welding mode, then the lead and the ceramic chip are encapsulated into the encapsulation shell, the overall production process is simple, the production efficiency is high, the cost is low, and the production efficiency is high. The process is flexible, and customized production can be carried out according to different requirements of customers.

Description

Technical Field

[0001] The utility model belongs to the field of ceramic capacitor production, and in particular relates to a production device for potting type lead ceramic capacitors. Background Art

[0002] In harsh environments such as aerospace, more reliable components are needed. The characteristic of ceramic chips is that they are resistant to compression but not tension. Single chips are directly soldered on PCB boards and are easily affected by board bending stress. Therefore, the board bending stress will act on the leads instead of affecting the ceramic chips by soldering them together with leads. This solves the board bending stress problem.

[0003] Different customers have different requirements for the size of lead products, which also brings certain difficulties to the production and manufacturing of lead products. Traditional lead products are produced by molding and encapsulation. The size of the mold used for encapsulation is fixed, and one mold can only produce products of one size. Therefore, it is necessary to develop multiple molds to meet the actual needs of customers. The cost of a set of molds is relatively expensive, and the mold design and processing cycle is long, which greatly increases the production efficiency and cost of the entire product, which needs further improvement. Utility Model Content

[0004] The utility model aims to overcome the shortcomings of the prior art and provide a production device for potting type lead ceramic capacitors.

[0005] The utility model adopts the following technical solutions:

[0006] A production device for a potted leaded ceramic capacitor, the potted leaded ceramic capacitor comprising a ceramic chip, two leads arranged at two ends of the ceramic chip, two solder layers arranged at the ends of the leads and the ceramic chip, respectively, an encapsulating shell encapsulating the outer periphery of the ceramic chip, and a potting glue layer filled in the encapsulating shell to fix and seal the ceramic chip;

[0007] The production device comprises a welding fixture for welding two leads to two ends of a ceramic chip respectively and a filling fixture for filling glue into an encapsulating shell clamping the ceramic chip and the two leads.

[0008] Furthermore, the encapsulating shell is formed with a glue pouring groove for filling glue, and the glue pouring groove is extended upward from the bottom surface of the encapsulating shell.

[0009] Furthermore, the bottom surface of the potting glue layer is flush with the bottom surface of the encapsulation shell.

[0010] Furthermore, the welding fixture includes a welding base plate, product grooves arranged at intervals on the welding base plate for placing the ceramic chip and two leads, and a fixing mechanism arranged on the welding base plate for fixing the leads.

[0011] Further, the product groove includes a product groove body for placing a ceramic chip and two lead grooves communicating with the product groove body and extending outward for placing two leads respectively.

[0012] 11. Further, the fixing mechanism includes a fixing block fixed on the top of the lead groove, two fixing holes respectively arranged on both sides of the fixing block, two positioning holes on the welding bottom plate opposite to the two fixing holes, and two fixing pins respectively passing through the two fixing holes and the opposite positioning holes. The bottom surface of the fixing plate is formed with a plurality of positioning grooves extending upward and opposite to a plurality of leads.

[0013] Further, the filling fixture includes a filling bottom plate, a plurality of placement grooves spaced on the filling bottom plate for placing the encapsulation shell, a positioning plate located above the filling bottom plate, a plurality of positioning members spaced on the positioning plate and opposite to the plurality of placement grooves, and a limiting member arranged between the filling bottom plate and the positioning plate. The positioning member is used to fix two leads at both ends of the ceramic chip placed opposite to the placement groove.

[0014] Further, the positioning member includes two positioning holes spaced on the positioning plate for the two lead ends to be respectively embedded.

[0015] Further, the limiting member includes a plurality of first limiting holes arranged on the filling bottom plate, a plurality of second limiting holes on the positioning plate opposite to the plurality of first limiting holes one by one, and a plurality of limiting pins respectively connected between the first limiting holes and the opposite second limiting holes.

[0016] Further, a weight-reducing hole is arranged on the positioning plate.

[0017] As can be seen from the above description of the present invention, compared with the prior art, the beneficial effects of the present invention are as follows: By defining the production device of the encapsulated lead ceramic capacitor, the welding fixture and the filling fixture cooperate, and the lead and the ceramic chip are welded into one body by welding, and then encapsulated into the encapsulation shell. The overall production process is simple, the production efficiency is high, the cost is low, the process is relatively flexible and can be customized according to different customer requirements. Description of the Drawings

[0018] Figure 1 is the structure of the encapsulated lead ceramic capacitor;

[0019] Figure 2 is the exploded view of the encapsulated lead ceramic capacitor;

[0020] Figure 3 is the structural schematic diagram of the welding fixture;

[0021] Figure 4 is the exploded schematic of the welding fixture Figure 1 ;

[0022] Figure 5 Exploded view of the soldering jig Figure 2 ;

[0023] Figure 6 Structural schematic diagram of the filling jig;

[0024] Figure 7 Exploded view of the filling jig;

[0025] In the figure, 1 - potted leaded ceramic capacitor, 2 - soldering jig, 3 - filling jig, 11 - ceramic chip, 12 - lead, 13 - solder layer, 14 - encapsulation shell, 15 - potting glue layer, 16 - potting groove, 21 - soldering bottom plate, 22 - product groove, 221 - product groove body, 222 - lead groove, 23 - fixing mechanism, 231 - fixing block, 232 - fixing hole, 233 - positioning hole, 234 - fixing pin, 235 - positioning groove, 31 - filling bottom plate, 32 - placement groove, 33 - positioning plate, 34 - positioning part, 35 - limiting part, 351 - first limiting hole, 352 - second limiting hole, 353 - limiting pin, 36 - weight reduction hole. Detailed implementation manners

[0026] The following further describes the present utility model through specific implementation manners.

[0027] Referring to Figures 1 to 7 As shown, a production device for a potted leaded ceramic capacitor includes a soldering jig 2 and a filling jig 3.

[0028] The potted leaded ceramic capacitor 1 includes a ceramic chip 11, two leads 12 oppositely arranged at both ends of the ceramic chip 11, two solder layers 13 respectively arranged at the ends of the leads 12 and the ceramic chip 11, an encapsulation shell 14 encapsulating the outer periphery of the ceramic chip 11, and a potting glue layer 15 filled in the encapsulation shell 14 to fixedly seal the ceramic chip 11. Specifically, the encapsulation shell 14 forms a potting groove 16 for filling glue liquid, and the potting groove 16 extends upward from the bottom surface of the encapsulation shell 15; further, the bottom surface of the potting glue layer 14 is flush with the bottom surface of the encapsulation shell 14.

[0029] Among them, the encapsulation shell 14 is designed and processed by 3D printing. The material is ABS synthetic resin, which has excellent impact resistance, heat resistance, low temperature resistance and electrical properties, and also has the characteristics of easy processing, stable product size, good surface gloss, etc. It can also be subjected to secondary processing such as surface metal spraying, electroplating, welding, hot pressing and bonding, and is widely used in industrial fields such as machinery, automobiles, electronic appliances, and instrumentation; the shell is processed by 3D printing, which is simple and efficient, does not require mold opening, and can print and produce different sizes according to customer needs.

[0030] The potting glue layer 15 uses CA2001 silicone potting glue. This potting glue is a low-viscosity two-component silicone potting glue that can be cured at room temperature or by heating, with the characteristic that the higher the temperature, the faster the curing, and no by-products are generated during the curing process. It can be applied to the surfaces of materials such as PC, PP, ABS, and PVC. After being cured through the potting process, it can reduce the influence of the ceramic capacitor chip by external environmental conditions, ensure the good operation of the component in the standard working environment, and improve the normal stability and service life of the component; this potting glue has superior properties such as insulation, moisture-proof, dust-proof, mildew-proof, shock-proof, anti-electric leakage, anti-corona, anti-corrosion, anti-salt spray, anti-acid-base, anti-sulfuration, anti-aging, resistance to high and low temperature shocks, and resistance to high humidity and high temperature.

[0031] The solder layer 13 has a composition of Sn10Pb90. The melting point of this solder after welding is 287°C, which can prevent the risk of the frame and the chip falling apart during the customer's use process.

[0032] The lead 12 is made of copper-clad steel material. As a high-strength steel, copper-clad steel has outstanding mechanical properties. Mechanical property indicators such as the yield strength, tensile strength, and elongation rate of this steel are higher than those of traditional steel types. This steel is processed through processes such as hot forging and hot rolling, making its microstructure dense and the grain size fine, thereby improving the overall mechanical properties. Copper-clad steel also has good high-temperature oxidation resistance and can be used for a long time at high temperatures without losing its mechanical properties due to high-temperature thermal oxidation. Its oxidation resistance depends on the stabilizing elements and strengthening elements in the alloying elements, such as Cr, Ni, Ti, etc.; and copper-clad steel also has good low-temperature toughness and can still maintain its mechanical properties in an extremely low-temperature environment; in a low-temperature environment, the strength and toughness of ordinary steel will decrease significantly, while copper-clad steel can improve its low-temperature toughness through appropriate alloying element addition and heat treatment processes.

[0033] The welding fixture 2 includes a welding base plate 21 for welding the two leads 12 to both ends of the ceramic chip 11 respectively, a product groove 22 spaced on the welding base plate 21 for placing the ceramic chip 11 and the two leads 12, and a fixing mechanism 23 provided on the welding base plate 21 for fixing the leads 12.

[0034] The product groove 22 includes a product groove body 221 for placing the ceramic chip 11 and two lead grooves 222 communicating with the product groove body 221 and extending outwards for placing the two leads 12 respectively.

[0035] The fixing mechanism 23 includes a fixing block 231 fixed to the top of the lead slot 222, two fixing holes 232 respectively arranged on both sides of the fixing block 231, two positioning holes 233 arranged on the welding base plate 21 opposite to the two fixing holes 232, and two fixing pins 234 respectively passing through the two fixing holes 232 and the opposite positioning holes 233; specifically, upwardly extending relative to a plurality of leads 12 are formed on the bottom surface of the fixing plate 231 with a plurality of positioning grooves 235. When the fixing block 231 is fixed to the welding base plate 21, the upper half of the lead 12 is embedded in the corresponding positioning groove 235 and fixed by the fixing block 231.

[0036] When the ceramic chip 11 is welded to the two leads 12, first place the ceramic chip 11 and the two leads 12 in the corresponding product slots 22 respectively, and then through the cooperation of the fixing pins 234 with the positioning holes 233 and the fixing holes 232, the fixing block 231 is cooperated with the welding base plate 21, and the leads 12 are pressed by the weight of the fixing block 231; then at the joint of the ceramic chip 11 and the lead 12, apply high-temperature solder paste, and then place the entire welding jig 2 into the reflow oven for welding. The maximum temperature of the reflow oven is 300 °C, and a semi-finished product in which the ceramic chip 111 is combined with the two leads 2 and the two solder layers 13 is obtained.

[0037] The filling jig 3 includes a filling base plate 31, a plurality of placement slots 32 spaced on the filling base plate 31 for placing the encapsulation shell 14, a positioning plate 33 located above the filling base plate 31, a plurality of positioning members 34 spaced on the positioning plate 33 opposite to the plurality of placement slots 32, and a limiting member 35 arranged between the filling base plate 31 and the positioning plate 33. Specifically, the positioning member 34 includes two positioning holes spaced on the positioning plate 33 for the end portions of the two leads 12 to be respectively embedded, and a weight-reducing hole 36 is arranged on the positioning plate 33.

[0038] The limiting member 35 includes a plurality of first limiting holes 351 arranged on the filling base plate 31, a plurality of second limiting holes 352 arranged on the positioning plate 33 opposite to the plurality of first limiting holes 351 one by one, and a plurality of limiting pins 353 respectively connecting between the first limiting holes 351 and the opposite second limiting holes 352.

[0039] During filling, first place the encapsulation shell 14 in the opposite placement slots 32 on the filling base plate 31, and insert a plurality of limiting pins 353 into the opposite first limiting holes 351, and then place the welded semi-finished product into the encapsulation shell 14; then insert the upper ends of the limiting pins 353 into the corresponding second limiting holes 352, and at the same time insert the two leads 12 on the semi-finished product into the corresponding two positioning holes respectively to complete the positioning of the semi-finished product; then inject the potting glue into the potting groove 16 through a syringe, and the injected amount is flush with the notch of the potting groove of the encapsulation shell 14. Finally, place the entire filling jig 3 into the oven for curing. The oven time is set to 1 h and the temperature is 85 °C. After curing, the potted lead ceramic capacitor 1 is obtained.

[0040] In this application, by defining the production device of the potted lead ceramic capacitor, the welding jig 2 and the filling jig 3 cooperate to weld the lead 12 and the ceramic chip 11 into one body in a welding form, and then pot them into the encapsulation shell 14. The overall production process is simple, the production efficiency is high, the cost is low, the process is relatively flexible and can be customized according to different customer requirements.

[0041] The above is only the preferred embodiment of the present utility model, and thus cannot limit the scope of implementation of the present utility model. That is, equivalent changes and modifications made according to the scope of the present utility model application and the content of the specification should still fall within the scope covered by the present utility model application.

Claims

1. A production device for potted lead ceramic capacitors, characterized in that: The potted lead ceramic capacitor comprises a ceramic chip, two leads arranged at two ends of the ceramic chip, two solder layers arranged at the ends of the leads and the ceramic chip, a sealing shell encapsulating the outer periphery of the ceramic chip, and a potting glue layer filled in the sealing shell to fix and seal the ceramic chip; The production device comprises a welding fixture for welding two leads to two ends of a ceramic chip respectively and a filling fixture for filling glue into an encapsulating shell clamping the ceramic chip and the two leads.

2. The production device of a potted lead ceramic capacitor according to claim 1, characterized in that: The encapsulating shell is formed with a glue pouring groove for filling glue, and the glue pouring groove extends upward from the bottom surface of the encapsulating shell.

3. The production device of a potted lead ceramic capacitor according to claim 1, characterized in that: The bottom surface of the potting glue layer is flush with the bottom surface of the encapsulation shell.

4. The production device of a potted lead ceramic capacitor according to claim 1, characterized in that: The welding fixture comprises a welding base plate, product grooves arranged at intervals on the welding base plate for placing ceramic chips and two leads, and a fixing mechanism arranged on the welding base plate for fixing the leads.

5. The production device of a potted lead ceramic capacitor according to claim 4, characterized in that: The product slot comprises a product slot body for placing the ceramic chip and two lead slots connected to the product slot body and extending outwards for placing two lead slots respectively.

6. The production device of a potted lead ceramic capacitor according to claim 5, characterized in that: The fixing mechanism includes a fixing block fixed on the top of the lead groove, two fixing holes respectively arranged on both sides of the fixing block, two positioning holes arranged on the welding base plate opposite to the two fixing holes, and two fixing pins respectively passing through the two fixing holes and the relative positioning holes. The bottom surface of the fixing block is formed with a plurality of positioning grooves extending upward and opposite to the plurality of leads.

7. The production device of a potted lead ceramic capacitor according to claim 1, characterized in that: The filling jig includes a filling base plate, a plurality of placement grooves spaced apart on the filling base plate for placing the encapsulated shell, a positioning plate located above the filling base plate, a plurality of positioning members spaced apart on the positioning plate and opposite to the plurality of placement grooves, and a limiting member disposed between the filling base plate and the positioning plate, wherein the positioning members are used to fix two leads at both ends of a ceramic chip placed relative to the placement grooves.

8. The production device of a potted lead ceramic capacitor according to claim 7, characterized in that: The positioning member comprises two positioning holes which are arranged at intervals on the positioning plate and into which the ends of the two leads are respectively embedded.

9. The production device of a potted lead ceramic capacitor according to claim 7, characterized in that: The limiting member includes a plurality of first limiting holes arranged on the filling bottom plate, a plurality of second limiting holes arranged on the positioning plate and corresponding to the plurality of first limiting holes one by one, and a plurality of limiting pins respectively connected between the first limiting holes and the corresponding second limiting holes.

10. The production device of a potted lead ceramic capacitor according to claim 7, characterized in that: The positioning plate is provided with weight-reducing holes.

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