Lifting mechanism for wafer in reaction chamber

Abstract

The utility model discloses a lifting mechanism for a wafer inside a reaction chamber, which comprises a mounting base, a cylinder base, a double-stroke cylinder, a transmission connecting piece, a buffer piston assembly and an ejector pin, the cylinder base is mounted on the mounting base, the double-stroke cylinder is mounted inside the cylinder base and serves as a lifting power source, and the transmission connecting piece is mounted on the transmission connecting piece. The transmission connecting piece is installed on a piston rod of the double-stroke air cylinder, the buffering piston assembly is installed on the transmission connecting piece, and the ejector pin is installed on a piston rod of the buffering piston assembly. According to the utility model, three stable position points of high, middle and low positions are arranged by using the double-stroke cylinder, so that the desorption height in the middle of the wafer is ensured, and the wafer processing technology quality is improved; the double-stroke air cylinder is matched with the buffering piston assembly, and the situation that the pushing stroke of the air cylinder is unstable due to vacuum pressure in the vacuum environment is effectively controlled through two-stage stroke buffering and buffering of the buffering piston assembly. And the lifting mechanism has an all-metal surface, so that the mechanism is protected from being corroded in the etching cavity.

Description

Technical Field

[0001] The utility model relates to the technical field of plasma etching, and specifically relates to a lifting mechanism for wafers inside a reaction chamber. Background Technique

[0002] Plasma etching technology has played a crucial role in the manufacturing of micro and nano-scale devices, including integrated circuits, photonic devices, and microelectromechanical systems. With the continuous reduction of device size and the increase in complexity, in order to meet the increasingly strict process requirements, higher requirements are put forward for the design and operation of the reaction chamber.

[0003] The key components of the overall reaction chamber include the chamber body, wafer holder, wafer lifting mechanism, and overall lifting and leveling structure. The overall lifting and leveling structure is connected to the wafer holder outside the chamber body to adjust the horizontal of the wafer holder and determine different reaction heights to meet different process requirements. The wafer lifting mechanism is used to undertake the transfer and positioning requirements of the wafer by an external manipulator.

[0004] During the reaction process, the wafer has three process positions, high, medium, and low, when undertaking transfer. The wafer performs desorption operation at the middle position. However, when an ordinary cylinder moves to the middle position, it is unable to accurately control the height at the middle position, resulting in poor wafer positioning accuracy, position deviation, and poor process performance. Content of the Utility Model

[0005] The utility model provides a lifting mechanism for wafers inside a reaction chamber, which solves the problems of the movement smoothness and position accuracy of the wafer lifting mechanism in the prior art.

[0006] In order to solve the above technical problems, the utility model provides the following technical solutions:

[0007] A lifting mechanism for wafers inside a reaction chamber includes a mounting base, a cylinder base, a double-stroke cylinder, a transmission connecting piece, a buffer piston assembly, and a thimble. The cylinder base is installed on the mounting base, the double-stroke cylinder is installed inside the cylinder base and serves as a lifting power source, the transmission connecting piece is installed on the piston rod of the double-stroke cylinder, the buffer piston assembly is installed on the transmission connecting piece, and the thimble is installed on the piston rod of the buffer piston assembly.

[0008] Preferably, the double-stroke cylinder includes a cylinder body, a partition plate, an upper chamber, a lower chamber, an upper piston, a lower piston, an upper piston rod, and a lower piston rod. The partition plate divides the cylinder body into an upper chamber and a lower chamber. The upper piston is assembled in the upper chamber, the upper piston rod is installed on the upper piston and is connected to the transmission connecting piece at the top. The lower piston is assembled in the lower chamber, and the lower piston rod is installed on the lower piston and its top passes through the partition plate.

[0009] Preferably, it further includes a limit screw. A limit hole is provided on the mounting base. A bottom piston rod is also provided on the double-stroke cylinder. A threaded hole is provided at the bottom of the bottom piston rod. The limit screw is installed in the threaded hole through the limit hole.

[0010] Preferably, the transmission connecting member includes a transmission disk installed at the piston end of the double-stroke cylinder and three support rods connected to the outer wall of the transmission disk. The support rods are distributed annularly around the transmission disk. The buffer piston assembly is installed on the support rods.

[0011] Preferably, the cylinder base is of a cylindrical structure. Three avoidance grooves are provided on the cylinder base to enable the smooth movement of the support rods.

[0012] The beneficial effects of the present utility model are as follows: 1. By using a double-stroke cylinder to set three stable position points of high, medium, and low, the desorption height in the middle of the wafer is ensured, improving the quality of the wafer processing technology; 2. The double-stroke cylinder and the buffer piston assembly cooperate. Through two-stage stroke buffering and the buffering of the buffer piston assembly, the unstable situation of the cylinder propulsion stroke caused by the vacuum pressure in the vacuum environment is effectively controlled; 3. The whole metal surface of the lifting mechanism protects the mechanism from being corroded in the etching cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The drawings are used to provide a further understanding of the present utility model and constitute a part of the specification. They are used together with the embodiments of the present utility model to explain the present utility model and do not constitute a limitation to the present utility model. In the drawings:

[0014] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0015] Figure 2 is a schematic diagram of the structure of the present utility model with the cylinder base omitted Figure 1 ;

[0016] Figure 3 is a schematic diagram of the structure of the present utility model with the cylinder base omitted Figure 2 ;

[0017] Figure 4 is a schematic diagram of the high-point position of the double-stroke cylinder of the present utility model;

[0018] Figure 5 is a schematic diagram of the low-point position of the double-stroke cylinder of the present utility model;

[0019] Figure 6 is a schematic diagram of the middle-point position of the double-stroke cylinder of the present utility model.

[0020] In the figure: 1. Installation base; 101. Limit hole; 2. Cylinder base; 201. Avoidance groove; 3. Double-stroke cylinder; 301. Cylinder body; 302. Partition plate; 303. Upper chamber; 304. Lower chamber; 305. Upper piston; 306. Lower piston; 307. Upper piston rod; 308. Lower piston rod; 309. Bottom piston rod; 310. Threaded hole; 4. Transmission connecting piece; 401. Transmission disc; 402. Support rod; 5. Buffer piston assembly; 6. Thimble; 7. Limit screw. Specific embodiments

[0021] The preferred embodiments of the present utility model will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present utility model, and are not used to limit the present utility model.

[0022] As Figures 1-3 shown, a lifting mechanism for wafers inside a reaction chamber includes an installation base 1, a cylinder base 2, a double-stroke cylinder 3, a transmission connecting piece 4, a buffer piston assembly 5, and a thimble 6. The cylinder base 2 is installed on the installation base 1, the double-stroke cylinder 3 is installed inside the cylinder base 2 and serves as a lifting power source, the transmission connecting piece 4 is installed on the piston rod of the double-stroke cylinder 3, the buffer piston assembly 5 is installed on the transmission connecting piece 4, the thimble 6 is installed on the piston rod of the buffer piston assembly 5, and the wafer to be processed is located on the thimble 6.

[0023] As Figure 4 shown is the internal structure diagram of the double-stroke cylinder. The double-stroke cylinder 3 includes a cylinder body 301, a partition plate 302, an upper chamber 303, a lower chamber 304, an upper piston 305, a lower piston 306, an upper piston rod 307, and a lower piston rod 308. The partition plate 302 divides the cylinder body 301 into an upper chamber 303 and a lower chamber 304. Both the upper chamber 303 and the lower chamber 304 are provided with two air ducts communicating with the outside. The upper piston 305 is assembled in the upper chamber 303, the upper piston rod 307 is installed on the upper piston 305, and the top of the upper piston rod 307 is connected to the transmission connecting piece 4. The lower piston 306 is assembled in the lower chamber 304, the lower piston rod 308 is installed on the lower piston 306, and the top passes through the partition plate 302.

[0024] As Figure 4 shown is the high point of the double-stroke cylinder. At this time, the lower piston 306 is in the lowest position, and the upper piston 305 moves to the top dead center of the cylinder;

[0025] As Figure 5 shown is the low point of the double-stroke cylinder. At this time, the lower piston 306 is in the lowest position, and the upper piston 305 moves to the bottom dead center of the cylinder;

[0026] As Figure 6The figure shows the intermediate position point of the double-stroke cylinder. The lower piston 306 moves upward to the top dead center, and the upper piston rod 307 pushes the upper piston 305 upward and keeps this intermediate position fixed.

[0027] In order to meet the requirements of different wafers for the height of the intermediate stop position, a limit screw 7 is also provided. A limit hole 101 is provided on the mounting base 1. A bottom piston rod 309 is also provided on the double-stroke cylinder 3. A threaded hole 310 is provided at the bottom of the bottom piston rod 309. The bottom of the limit screw 7 has a nut structure with a diameter larger than the limit hole 101. The limit screw 7 is installed in the threaded hole 310 through the limit hole 101. By adjusting the depth of the limit screw 7 in the threaded hole 310, the top dead center position of the upward movement of the lower piston 306 can be limited, and then the height of the intermediate stop position can be adjusted.

[0028] Specifically, the transmission connecting member 4 includes a transmission disk 401 installed at the piston end of the double-stroke cylinder 3 and three support rods 402 connected to the outer wall of the transmission disk 401. The support rods 402 are distributed in a ring around the transmission disk 401. The buffer piston assembly 5 is installed on the support rods 402. The ejector pin 6 is located in the buffer piston assembly 5. The three support rods 402 and the ejector pins 6 thereon support the wafer. The buffer piston assembly 5 is used to relieve the impact on the wafer during the lifting and lowering movement.

[0029] Specifically, the cylinder base 2 is of a cylindrical structure. Three avoidance grooves 201 are provided on the cylinder base 2 to enable the smooth movement of the support rods 402.

[0030] During operation, the double-stroke cylinder 3 drives the transmission connecting member 4 to move. The buffer piston assembly 5 will drive the ejector pin 6 to lift and lower simultaneously, and finally drive the wafer to lift and lower. The double-stroke cylinder 3 can provide three stable stop position points to meet the process requirements of wafer processing.

[0031] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer lifting mechanism inside a reaction chamber, characterized in that: The utility model comprises a mounting base (1), a cylinder base (2), a two-stroke cylinder (3), a transmission connecting piece (4), a buffer piston assembly (5) and a ejector pin (6), wherein the cylinder base (2) is mounted on the mounting base (1), the two-stroke cylinder (3) is mounted inside the cylinder base (2) and serves as a lifting power source, the transmission connecting piece (4) is mounted on the piston rod of the two-stroke cylinder (3), the buffer piston assembly (5) is mounted on the transmission connecting piece (4), and the ejector pin (6) is mounted on the piston rod of the buffer piston assembly (5).

2. The wafer lifting mechanism in a reaction chamber according to claim 1, characterized in that: The double-stroke cylinder (3) comprises a cylinder body (301), a partition (302), an upper chamber (303), a lower chamber (304), an upper piston (305), a lower piston (306), an upper piston rod (307) and a lower piston rod (308); the partition (302) divides the cylinder body (301) into an upper chamber (303) and a lower chamber (304); the upper piston (305) is mounted in the upper chamber (303); the upper piston rod (307) is mounted on the upper piston (305) and the top is connected to the transmission connecting member (4); the lower piston (306) is mounted in the lower chamber (304); the lower piston rod (308) is mounted on the lower piston (306) and the top passes through the partition (302).

3. The wafer lifting mechanism in a reaction chamber according to claim 1, characterized in that: It also includes a limiting screw (7), a limiting hole (101) is provided on the mounting base (1), a bottom piston rod (309) is provided on the double-stroke cylinder (3), a threaded hole (310) is provided at the bottom of the bottom piston rod (309), and the limiting screw (7) passes through the limiting hole (101) and is installed on the threaded hole (310).

4. The wafer lifting mechanism in a reaction chamber according to claim 1, characterized in that: The transmission connection member (4) comprises a transmission disc (401) mounted on the piston end of the double-stroke cylinder (3) and three support rods (402) connected to the outer wall of the transmission disc (401), the support rods (402) are distributed in a ring shape around the transmission disc (401), and the buffer piston assembly (5) is mounted on the support rods (402).

5. The wafer lifting mechanism in a reaction chamber according to claim 1, characterized in that: The cylinder base (2) is a cylindrical structure, and is provided with three avoidance grooves (201) that enable the support rod (402) to move smoothly.

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