Wafer cleaning and recycling device for semiconductor manufacturing

Abstract

The utility model provides a wafer cleaning and recycling device for semiconductor manufacturing, which relates to the technical field of wafer cleaning and comprises a cleaning adjusting mechanism, one side of the outer wall of the cleaning adjusting mechanism is fixedly connected with a drying mechanism, the cleaning adjusting mechanism comprises an ultrasonic cleaning pool, and the top of the ultrasonic cleaning pool is fixedly connected with two first supporting plates. And first holes are formed in one sides of the outer walls of the two first supporting plates. According to the wafer cleaning device, under the action of the cleaning adjusting mechanism, the four electric push rods are used for placing the wafer cleaning basket into the ultrasonic cleaning pool for cleaning, the wafer cleaning basket is contracted and lifted after cleaning is completed, then the driving motor is arranged to drive the two spiral lead screws to rotate at the same time through the toothed belt, and the threaded connecting block is pushed to move horizontally; through the mode, automatic cleaning and transportation of the wafer can be realized, the cleaning efficiency of the wafer is improved, and the stability of the whole device is enhanced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to a wafer cleaning and recycling device for semiconductor manufacturing. Background Technique

[0002] During the manufacturing process of wafers, they will come into contact with various organic substances, particles, and metals of each machine tool, all of which will contaminate the wafers. The contaminants on the wafer surface will seriously affect the quality and yield of devices. Cleaning can ensure the cleanliness of the wafer surface, thereby improving the performance and reliability of devices.

[0003] In the prior art, most of the existing cleaning devices are manually used to carry and move the cleaned wafers to the next step after cleaning, resulting in low cleaning efficiency. And there are many uncertain factors in manual operation. When carrying more wafers at the same time, the stability of the wafers is relatively poor during the moving process. Summary of the Utility Model

[0004] The purpose of the utility model is to solve the problem that when the above-mentioned equipment is used, due to the manual carrying and moving of the cleaned wafers by the existing cleaning device to the next step, resulting in low cleaning efficiency, and to propose a wafer cleaning and recycling device for semiconductor manufacturing.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme: A wafer cleaning and recycling device for semiconductor manufacturing, including a cleaning and adjusting mechanism, and a drying mechanism is fixedly connected to one side of the outer wall of the cleaning and adjusting mechanism;

[0006] The cleaning and adjusting mechanism includes an ultrasonic cleaning tank. Two first support plates are fixedly connected to the top of the ultrasonic cleaning tank. First holes are opened on one side of the outer walls of the two first support plates. First bearings are fixedly inserted into the inner walls of the two first holes. Spiral lead screws are fixedly inserted into the inner walls of the two first bearings. Tooth discs are fixedly sleeved on the outer surfaces of the two spiral lead screws. A toothed belt is meshed and connected between the outer surfaces of the two tooth discs. A driving motor is fixedly connected to one side of the outer wall of one of the two spiral lead screws. Two threaded connection blocks are threadedly connected between the outer surfaces of the two spiral lead screws.

[0007] Preferably, a connecting plate is fixedly connected between the inner walls of the two threaded connection blocks. Four electric push rods are fixedly connected to the bottom of the connecting plate. A wafer cleaning basket is fixedly connected between the bottoms of the four electric push rods.

[0008] Preferably, second bearings are fixedly sleeved on the outer surfaces of the two spiral lead screws. Second support plates are fixedly sleeved on the outer surfaces of the two second bearings.

[0009] Preferably, the drying mechanism includes a drying base, and a protective housing is fixedly connected to the top of the drying base. Five second holes are opened on one side of the outer wall of the protective housing.

[0010] Preferably, hot air blowers are fixedly inserted into the inner walls of all five second holes.

[0011] Preferably, a plurality of air outlets are opened on one side of the outer wall of the protective housing.

[0012] Preferably, one side of the outer wall of the ultrasonic cleaning tank is fixedly connected to one side of the outer wall of the drying base, and the bottoms of the two second support plates are fixedly connected to the top of the drying base.

[0013] Compared with the prior art, the advantages and positive effects of the present utility model are as follows.

[0014] In the present utility model, under the action of the cleaning and adjusting mechanism, the wafer cleaning basket is placed in the ultrasonic cleaning tank for cleaning by using four electric push rods. After the cleaning is completed, it is contracted and lifted. Then, by setting a driving motor to drive two lead screws to rotate simultaneously through a toothed belt, the threaded connection block is pushed to move horizontally. In this way, the automatic cleaning and transportation of the wafer can be realized, the cleaning efficiency of the wafer is improved, and the stability of the entire device is enhanced.

[0015] In the present utility model, under the combined action of the cleaning and adjusting mechanism and the drying mechanism, the cleaned wafer is transported to the top of the drying base and into the protective housing by using a lead screw. By starting a plurality of hot air blowers, the wet wafer is quickly dried, the production and cleaning efficiency is improved, and it has strong practicability. Description of the Drawings

[0016] Figure 1 is the front view three-dimensional structure diagram of a wafer cleaning and recycling device for semiconductor manufacturing proposed by the present utility model;

[0017] Figure 2 is the three-dimensional structure diagram of the cleaning and adjusting mechanism of a wafer cleaning and recycling device for semiconductor manufacturing proposed by the present utility model;

[0018] Figure 3 is the three-dimensional structure disassembled diagram of the cleaning and adjusting mechanism of a wafer cleaning and recycling device for semiconductor manufacturing proposed by the present utility model;

[0019] Figure 4 is the three-dimensional structure diagram of the drying mechanism of a wafer cleaning and recycling device for semiconductor manufacturing proposed by the present utility model.

[0020] Legend Explanation:

[0021] Cleaning and adjusting mechanism; 101, ultrasonic cleaning tank; 102, first support plate; 103, first hole; 104, first bearing; 105, screw rod; 106, gear disc; 107, toothed belt; 108, drive motor; 109, threaded connection block; 110, connecting plate; 111, electric push rod; 112, wafer cleaning basket; 113, second bearing; 114, second support plate

[0022] Drying mechanism; 201, drying seat; 202, protective housing; 203, second hole; 204, hot air blower; 205, air outlet Detailed implementation mode

[0023] In order to more clearly understand the above objects, features and advantages of the present invention, the present invention will be further described below with reference to the drawings and embodiments. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other

[0024] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described herein. Therefore, the present invention is not limited by the limitations of the specific embodiments disclosed in the following specification

[0025] Embodiment 1, as Figures 1-4 shown, the present invention provides a wafer cleaning and recycling device for semiconductor manufacturing, including a cleaning and adjusting mechanism 1, and a drying mechanism 2 is fixedly connected to one side of the outer wall of the cleaning and adjusting mechanism 1

[0026] The cleaning and adjusting mechanism 1 includes an ultrasonic cleaning tank 101. Two first support plates 102 are fixedly connected to the top of the ultrasonic cleaning tank 101. First holes 103 are opened on one side of the outer walls of the two first support plates 102. First bearings 104 are fixedly inserted into the inner walls of the two first holes 103. Screw rods 105 are fixedly inserted into the inner walls of the two first bearings 104. Gear discs 106 are fixedly sleeved on the outer walls of the two screw rods 105. A toothed belt 107 is meshed and connected between the outer walls of the two gear discs 106. A drive motor 108 is fixedly connected to one side of the outer wall of one of the two screw rods 105. Two threaded connection blocks 109 are threadedly connected between the outer walls of the two screw rods 105. A connecting plate 110 is fixedly connected between the inner walls of the two threaded connection blocks 109. Four electric push rods 111 are fixedly connected to the bottom of the connecting plate 110. A wafer cleaning basket 112 is fixedly connected between the bottoms of the four electric push rods 111. Second bearings 113 are fixedly sleeved on the outer walls of the two screw rods 105. Second support plates 114 are fixedly sleeved on the outer walls of the two second bearings 113

[0027] The effect achieved by the entire Embodiment 1 is that under the action of the cleaning and adjusting mechanism, two first support plates 102 are fixedly connected to the top of the ultrasonic cleaning tank 101, and a first hole 103 is provided on one side of the outer walls of the two first support plates 102. First bearings 104 are fixedly inserted into the inner walls of the two first holes 103. Two screw rods 105 are fixedly inserted into the inner walls of the two first bearings 104. The outer walls of the two screw rods 105 are fixedly sleeved on the outer wall of the gear disk 106, so that the outer walls of the two gear disks 106 are meshed and connected with the toothed belt 107. A driving motor 108 is fixedly connected to one side of the outer wall of one of the two screw rods 105. Two threaded connection blocks 109 are threadedly connected between the outer walls of the two screw rods 105. By starting the driving motor 108, the two threaded connection blocks 109 can move left and right in the horizontal direction. A connecting plate 110 is fixedly connected between the inner walls of the two threaded connection blocks 109. Four electric push rods 111 are fixedly connected to the bottom of the connecting plate 110. A wafer cleaning basket 112 is fixedly connected between the bottoms of the four electric push rods 111. The wafer cleaning basket 112 is placed in the ultrasonic cleaning tank 101 for cleaning by using the four electric push rods 111. After cleaning, it is contracted and lifted. In this way, the automatic cleaning and transportation of wafers can be realized, the cleaning efficiency of wafers is improved, and the stability of the entire device is enhanced.

[0028] Embodiment 2, as Figures 2-4 shown, the drying mechanism 2 includes a drying base 201. A protective housing 202 is fixedly connected to the top of the drying base 201. Five second holes 203 are provided on one side of the outer wall of the protective housing 202. Hot air blowers 204 are fixedly inserted into the inner walls of the five second holes 203. A plurality of air outlets 205 are provided on one side of the outer wall of the protective housing 202. One side of the outer wall of the ultrasonic cleaning tank 101 is fixedly connected to one side of the outer wall of the drying base 201. The bottoms of the two second support plates 114 are fixedly connected to the top of the drying base 201.

[0029] The effect achieved by the entire Embodiment 2 is that under the combined action of the cleaning and adjusting mechanism 1 and the drying mechanism 2, the cleaned wafer is transported to the top of the drying seat 201 until inside the protective housing 202 by the spiral lead screw 105, improving the production and cleaning efficiency and having strong practicability. By fixedly connecting a protective housing 202 to the top of the drying seat 201, five hot air blowers 204 are fixedly inserted into the inner walls of five second holes 203 opened on one side of the outer wall of the protective housing 202. By starting a plurality of hot air blowers 204, the wet wafer is quickly dried, and the plurality of air outlets 205 opened on one side of the outer wall of the protective housing 202 cooperate with the hot air blowers 204 to quickly dry the wafer. Among them, one side of the outer wall of the ultrasonic cleaning tank 101 is fixedly connected to one side of the outer wall of the drying seat 201, and the bottoms of two second support plates 114 are fixedly connected to the top of the drying seat 201, enhancing the connection stability of the entire device.

[0030] Working principle: When in use, two first support plates 102 are fixedly connected to the top of the ultrasonic cleaning tank 101, and first holes 103 are formed on one side of the outer walls of the two first support plates 102. First bearings 104 are fixedly inserted into the inner walls of the two first holes 103. Two screw spindles 105 are fixedly inserted into the inner walls of the two first bearings 104. The outer walls of the two screw spindles 105 are fixedly sleeved on the outer wall of the gear disk 106, so that the outer walls of the two gear disks 106 are meshed and connected with the toothed belt 107. A driving motor 108 is fixedly connected to one side of the outer wall of one of the two screw spindles 105. Two threaded connection blocks 109 are threadedly connected between the outer walls of the two screw spindles 105. By starting the driving motor 108, the two threaded connection blocks 109 can move left and right in the horizontal direction. A connecting plate 110 is fixedly connected between the inner walls of the two threaded connection blocks 109. Four electric push rods 111 are fixedly connected to the bottom of the connecting plate 110. A wafer cleaning basket 112 is fixedly connected between the bottoms of the four electric push rods 111. The wafer cleaning basket 112 is placed into the ultrasonic cleaning tank 101 by using the four electric push rods 111 for cleaning. After cleaning, it is retracted and lifted. In this way, the automatic cleaning and transportation of wafers can be realized, the cleaning efficiency of wafers is improved, and the stability of the whole device is enhanced. Among them, under the combined action of the cleaning adjustment mechanism 1 and the drying mechanism 2, the cleaned wafers are transported to the top of the drying seat 201 and then into the protective shell 202 by using the screw spindle 105, which improves the production and cleaning efficiency and has strong practicability. A protective shell 202 is fixedly connected to the top of the drying seat 201. Five hot air blowers 204 are fixedly inserted into the inner walls of five second holes 203 formed on one side of the outer wall of the protective shell 202. By starting the multiple hot air blowers 204, the wet wafers are quickly dried. The multiple air outlets 205 formed on one side of the outer wall of the protective shell 202 cooperate with the hot air blowers 204 to quickly dry the wafers. The outer wall of one side of the ultrasonic cleaning tank 101 is fixedly connected to the outer wall of one side of the drying seat 201. The bottoms of the two second support plates 114 are fixedly connected to the top of the drying seat 201, which enhances the connection stability of the whole device.

[0031] The above is only a preferred embodiment of the present invention, and it is not intended to limit the present invention in other forms. Any person skilled in the art may use the disclosed technical content to make changes or modifications into equivalent embodiments with equivalent changes and apply them to other fields. However, as long as it does not depart from the technical solution content of the present invention, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention still belong to the protection scope of the technical solution of the present invention.

Claims

1. A wafer cleaning and recovery device for semiconductor manufacturing, comprising a cleaning and regulating mechanism (1), characterized in that: A drying mechanism (2) is fixedly connected to one side of the outer wall of the cleaning and adjusting mechanism (1); The cleaning adjustment mechanism (1) comprises an ultrasonic cleaning pool (101), wherein two first support plates (102) are fixedly connected to the top of the ultrasonic cleaning pool (101), a first hole (103) is provided on one side of the outer wall of each of the two first support plates (102), a first bearing (104) is fixedly inserted into the inner wall of each of the two first holes (103), a spiral screw (105) is fixedly inserted into the inner wall of each of the two first bearings (104), a toothed disc (106) is fixedly sleeved on the outer wall of each of the two spiral screws (105), a toothed belt (107) is meshedly connected between the outer walls of the two toothed discs (106), a driving motor (108) is fixedly connected to one side of the outer wall of one of the two spiral screws (105), and two threaded connection blocks (109) are threadedly connected between the outer walls of the two spiral screws (105).

2. A wafer cleaning and recovery device for semiconductor manufacturing according to claim 1, characterized in that: A connecting plate (110) is fixedly connected between the inner surface walls of the two threaded connecting blocks (109), four electric push rods (111) are fixedly connected to the bottom of the connecting plate (110), and a wafer cleaning basket (112) is fixedly connected between the bottoms of the four electric push rods (111).

3. A wafer cleaning and recovery device for semiconductor manufacturing according to claim 2, characterized in that: The outer walls of the two spiral screw rods (105) are both fixedly sleeved with a second bearing (113), and the outer walls of the two second bearings (113) are both fixedly sleeved with a second support plate (114).

4. A wafer cleaning and recovery device for semiconductor manufacturing according to claim 3, characterized in that: The drying mechanism (2) comprises a drying seat (201), the top of the drying seat (201) is fixedly connected to a protective shell (202), and one side of the outer wall of the protective shell (202) is provided with five second holes (203).

5. A wafer cleaning and recovery device for semiconductor manufacturing according to claim 4, characterized in that: A hot air blower (204) is fixedly inserted into the inner surface walls of the five second holes (203).

6. A wafer cleaning and recovery device for semiconductor manufacturing according to claim 5, characterized in that: A plurality of air outlets (205) are provided on one side of the outer wall of the protective shell (202).

7. A wafer cleaning and recovery device for semiconductor manufacturing according to claim 6, characterized in that: One side of the outer wall of the ultrasonic cleaning pool (101) is fixedly connected to one side of the outer wall of the drying seat (201), and the bottoms of the two second support plates (114) are fixedly connected to the top of the drying seat (201).

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