Silver-plated electrode plate with high conductivity
By plating silver layer on the graphite electrode plate substrate and enhancing the edge design, combined with the use of connecting components, the problems of easy deformation and insufficient structural stability under welding connections are solved, and silver-plated electrode plates with high conductivity and corrosion resistance are achieved.
Patent Information
- Application Number
- CN202421874462.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-05
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-08-05
AI Technical Summary
Traditional electrode plates are prone to deform under welding connection methods, affecting the conductivity, are easily damaged in corrosive environments, and lack of structural stability, resulting in the electrode plates being easily deformed, cracked, and even failing during the electroplating process.
The electrode plate substrate made of graphite is made of electrode plate, with a silver layer on the surface, and a conductive beam is fixedly connected to the upper surface. The conductive beam is coated with graphite conductive milk, and edge protrusions are provided at the edges to enhance mechanical strength and connection stability, and the stable connection of multiple electrode plate substrates is achieved through the connection components.
The silver-plated electrode plate with high conductivity and corrosion resistance is achieved, which enhances the mechanical strength and connection stability of the electrode plate, avoids deformation and failure of the electrode plate during the electroplating process, and improves the plating quality and efficiency.
Smart Images
Figure CN223023276U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electrode plates, in particular to a silver-plated electrode plate with high conductivity. Background Art
[0002] In electrochemical energy storage devices, as a core component, the conductive performance of the electrode plate directly affects the energy conversion efficiency and performance stability of the entire device. Although traditional electrode plate materials such as pure copper and nickel have good conductive performance, in some special application scenarios, such as high-frequency current transmission and large-current discharge, their conductive performance is still insufficient. Therefore, a layer of silver needs to be plated on their surface to increase the conductivity.
[0003] Traditional connection methods mostly adopt welding connection. However, the welding method is prone to causing deformation of the electrode plate, affecting the conductive performance, being vulnerable to damage in a corrosive environment, and having insufficient structural stability, resulting in easy deformation, cracking, and even failure of the electrode plate during the electroplating process, which not only increases the cost but also affects the electroplating quality and efficiency. Summary of the Utility Model
[0004] The purpose of the utility model is to solve the shortcomings in the prior art that the welding method is prone to causing deformation of the electrode plate, affecting the conductive performance, being vulnerable to damage in a corrosive environment, and having insufficient structural stability, resulting in easy deformation, cracking, and even failure of the electrode plate during the electroplating process, and to propose a silver-plated electrode plate with high conductivity.
[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:
[0006] A silver-plated electrode plate with high conductivity, including an electrode plate substrate. The electrode plate substrate is in a flat plate shape, made of graphite material, and has a silver layer plated on its surface. A conductive beam is fixedly connected to the upper surface of the electrode plate substrate, and a graphite conductive emulsion is coated on the surface of the conductive beam;
[0007] An edge protrusion is provided at the edge of the electrode plate substrate. The edge protrusion is integrated with the electrode plate substrate, and the thickness of the edge protrusion is greater than that of the electrode plate substrate, that is, the edge part is gradually thickened, and a stepped drop is formed at the junction with the electrode plate substrate;
[0008] A number of connection components are provided between multiple conductive beams. The connection components are used for the fixed connection between multiple electrode plate substrates.
[0009] In a possible design, the connection component includes a connection post. A plurality of through connection holes are provided on one side of the conductive beam. The connection post passes through one of the connection holes. Through holes are respectively provided at both ends of the connection post. Fixing blocks are respectively inserted into the through holes. An inclined surface is provided on one side of each fixing block. An inclined groove is provided in each inclined surface. Insertion rods are respectively inserted into the inclined grooves.
[0010] In a possible design, one end of the fixing block is fixedly connected with a first limiting block. One side of the insertion rod is fixedly connected with a second limiting block. The first limiting block and the second limiting block are respectively matched with the connection post. The first limiting block and the second limiting block are respectively located on both sides of the connection post.
[0011] In a possible design, two convex blocks are fixedly connected in the connection hole. Two grooves are provided on the circumferential surface of the connection post. The convex blocks are respectively matched with the grooves.
[0012] In a possible design, support ribs are fixedly connected inside the electrode plate substrate.
[0013] In a possible design, the edge protrusion and the electrode plate substrate are made of the same material.
[0014] In this application, during use, the silver-plated electrode plate with high conductivity realizes high conductivity through the combination of the graphite material and the silver layer. Through the connection component, multiple electrode plate substrates can be stably connected together to form a whole. The fixing blocks, insertion rods, first limiting blocks and second limiting blocks in the connection component work together to fix the position of the connection post in the connection hole, thereby ensuring the connection stability between the electrode plates. In addition, the support ribs enhance the strength of the electrode plate substrate, and the design of the edge protrusion also helps to improve the connection stability. During the use process, the graphite conductive emulsion can further improve the conductivity of the electrode plate.
[0015] Beneficial effects:
[0016] In the present utility model, for the silver-plated electrode plate with high conductivity, by plating a silver layer on the electrode plate substrate made of graphite material, both the conductivity of the electrode plate is ensured and its corrosion resistance is improved. At the same time, as a noble metal layer, the silver layer also has good conductivity and antioxidant properties, further improving the overall performance of the electrode plate.
[0017] In the present utility model, for the silver-plated electrode plate with high conductivity, a stepped drop is formed at the junction of the edge protrusion and the electrode plate substrate. This design not only increases the mechanical strength of the electrode plate, but also helps to form a stable connection between multiple electrode plates, increasing the strength and corrosion resistance of the edge part of the electrode plate and preventing it from deforming or cracking during the electroplating process. Description of the drawings
[0018] Figure 1 Schematic diagram of the post - silver - plating state structure of a silver - plated electrode plate with high conductivity proposed by the present utility model;
[0019] Figure 2 Schematic diagram of the electrode plate substrate structure of a silver - plated electrode plate with high conductivity proposed by the present utility model;
[0020] Figure 3 Schematic diagram of the connection state structure of a silver - plated electrode plate with high conductivity proposed by the present utility model;
[0021] Figure 4 Schematic diagram of the side view structure of the connection component of a silver - plated electrode plate with high conductivity proposed by the present utility model;
[0022] Figure 5 Schematic diagram of the exploded structure of the connection component of a silver - plated electrode plate with high conductivity proposed by the present utility model.
[0023] In the figure: 1, electrode plate substrate; 2, graphite conductive emulsion; 3, connection hole; 4, convex block; 5, edge protrusion; 6, support rib; 7, connection column; 8, groove; 9, first limit block; 10, through - hole; 11, fixed block; 12, inclined groove; 13, insertion rod; 14, second limit block; 15, conductive beam. Specific embodiments
[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments.
[0025] Embodiment 1
[0026] Refer to Figures 1 - 5 , a silver - plated electrode plate with high conductivity, including: an electrode plate substrate 1 made of graphite material, which has excellent conductivity and stability. The electrode plate substrate 1 is made into a flat shape, and a silver layer is plated on its surface to improve its conductivity. On the upper surface of the electrode plate substrate 1, a conductive beam 15 is fixedly connected by welding, and the surface of the conductive beam 15 is coated with a graphite conductive emulsion 2 to enhance its conductive performance;
[0027] At the edge of the electrode plate substrate 1, there is an edge protrusion 5. The edge protrusion 5 is made of the same material as the electrode plate substrate 1, that is, graphite material, to ensure the overall stability and conductivity. The thickness of the edge protrusion 5 is greater than that of the electrode plate substrate 1, forming a stepped drop. Such a design not only enhances the mechanical strength of the electrode plate but also helps to form a stable connection between multiple electrode plates;
[0028] In order to achieve fixed connection between multiple electrode plate substrates 1, a number of sets of connection components are provided. Each connection component includes a connection post 7. Through holes 10 are provided at both ends of the connection post 7. On one side of the conductive beam 15, a number of through connection holes 3 are provided. The connection post 7 passes through one of the connection holes 3, so that multiple electrode plate substrates 1 can be connected together through the connection post 7;
[0029] In order to enhance the stability of the connection, a fixing block 11 is inserted into the through hole 10. One side of the fixing block 11 is provided with an inclined surface, and an inclined groove 12 is provided in the inclined surface. A plug rod 13 is inserted into the inclined groove 12. When the plug rod 13 is inserted into the inclined groove 12, due to the effect of the inclined surface, the fixing block 11 will be in close fit with the plug rod 13 to prevent the fixing block 11 from moving, thereby fixing the position of the connection post 7;
[0030] In addition, in order to further fix the fixing block 11, one end of the fixing block 11 is fixedly connected with a first limiting block 9, and one side of the plug rod 13 is fixedly connected with a second limiting block 14. The first limiting block 9 and the second limiting block 14 cooperate with the connection post 7 respectively and are located on both sides of the connection post 7 respectively, so as to prevent the fixing block 11 and the plug rod 13 from detaching from the connection post 7.
[0031] Embodiment 2
[0032] Reference Figures 1 - 5 , on the basis of Embodiment 1, the improvement is as follows:
[0033] In order to improve the connection stability between the connection post 7 and the connection hole 3, two convex blocks 4 are fixedly connected in the connection hole 3, and two grooves 8 are provided on the circumferential surface of the connection post 7. The convex blocks 4 cooperate with the grooves 8, so that the connection post 7 is more stable in the connection hole 3;
[0034] In order to enhance the strength of the electrode plate substrate 1, a support rib 6 is fixedly connected inside the electrode plate substrate 1.
[0035] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent replacements or changes, and should be covered by the protection scope of the present invention.
Claims
1. A high conductivity silver-plated electrode plate, characterized in that: include: An electrode plate substrate (1), the electrode plate substrate (1) is in the shape of a flat plate, the electrode plate substrate (1) is made of graphite, a layer of silver is plated on its surface, a conductive beam (15) is fixedly connected to the upper surface of the electrode plate substrate (1), and the surface of the conductive beam (15) is coated with graphite conductive emulsion (2); The edge of the electrode plate substrate (1) is provided with an edge protrusion (5), the edge protrusion (5) and the electrode plate substrate (1) are formed as one body, the thickness of the edge protrusion (5) is greater than that of the electrode plate substrate (1), that is, the edge portion gradually thickens, forming a step-shaped drop at the junction with the electrode plate substrate (1); A plurality of groups of connection components are provided, wherein the connection components are arranged between a plurality of conductive beams (15), and the connection components are used for fixed connection between a plurality of electrode plate substrates (1).
2. A high conductivity silver-plated electrode plate according to claim 1, characterized in that: The connection assembly comprises a connection column (7), a plurality of penetrating connection holes (3) are provided on one side of the conductive beam (15), the connection column (7) is passed through one of the connection holes (3), through holes (10) are provided at both ends of the connection column (7), fixing blocks (11) are respectively inserted into the through holes (10), an inclined surface is provided on one side of the fixing block (11), an inclined groove (12) is provided in the inclined surface, and a plug rod (13) is respectively inserted into the inclined groove (12).
3. A high conductivity silver-plated electrode plate according to claim 2, characterized in that: One end of the fixed block (11) is fixedly connected to a first limit block (9), and one side of the insertion rod (13) is fixedly connected to a second limit block (14). The first limit block (9) and the second limit block (14) are respectively matched with the connecting column (7). The first limit block (9) and the second limit block (14) are respectively located on both sides of the connecting column (7).
4. The high-conductivity silver-plated electrode plate according to claim 2, characterized in that: Two protrusions (4) are fixedly connected in the connection hole (3); the circumferential surface of the connection column (7) is provided with two grooves (8); the protrusions (4) are respectively matched with the grooves (8).
5. The high-conductivity silver-plated electrode plate according to claim 1, characterized in that: Support ribs (6) are fixedly connected inside the electrode plate substrate (1).
6. The high-conductivity silver-plated electrode plate according to claim 1, characterized in that: The edge protrusion (5) and the electrode plate substrate (1) are made of the same material.