Electronic device

Abstract

The utility model discloses an electronic device, a microphone assembly is installed on the inner side wall surface of a housing, the microphone assembly comprises a microphone main body and a connection mainboard, the microphone main body is electrically coupled to the connection mainboard, the connection mainboard is provided with an electric connection member, the electric connection member is electrically connected with a circuit mainboard in the housing, and the electric connection between the connection mainboard and the circuit mainboard is realized. According to the utility model, the microphone assembly is installed on the inner side wall surface of the housing, on one hand, the space of the inner side wall surface of the housing is reasonably utilized, and on the other hand, the microphone main body does not need to be stacked and installed on the circuit mainboard, so that the arrangement flexibility of the microphone main body can be optimized, and the lightness and thinness of the electronic equipment can be improved.

Description

Technical Field

[0001] This application relates to the technical field of terminal devices, and particularly to an electronic device. Background Art

[0002] A microphone is a device that converts received sound wave signals into electrical signals for transmission. The microphone is an important component of most electronic devices. For example, in electronic devices with functions such as voice recognition, voice collection, and voice playback, like smartphones, smart wearable devices, action cameras, speakers, etc., the setting position of the microphone directly affects the overall thin and light design of the electronic device.

[0003] In related technologies, most of them directly stack the microphones in the electronic device on the circuit board. However, in this way, on the one hand, the setting position of the microphone is not flexible enough, and on the other hand, it will also increase the overall thickness of the electronic device, which is not conducive to the thin and light design of the electronic device. Utility Model Content

[0004] The utility model content discloses an electronic device, which is beneficial to improving the flexibility of the microphone setting position and also beneficial to improving the thin and light design of the electronic device.

[0005] To achieve the above object, the utility model content discloses an electronic device, including:

[0006] A housing, the housing having an inner side wall surface;

[0007] A circuit board, the circuit board being disposed in the housing; and

[0008] A microphone assembly, the microphone assembly being disposed in the housing and on the inner side wall surface. The microphone assembly includes a microphone body and a connection main board. The microphone body is disposed on the connection main board and is electrically coupled to the connection main board. The connection main board is provided with an electricity connection member, and the electricity connection member is electrically connected to the circuit board to realize the electrical connection between the connection main board and the circuit board.

[0009] As an optional implementation manner, the connection main board has a first surface, the microphone body and the electricity connection member are both disposed on the first surface, the circuit board is disposed adjacent to the inner side wall surface, the circuit board has a second surface, and the electricity connection member is electrically connected to the second surface; wherein, the second surface intersects with the first surface.

[0010] As an optional implementation manner, a first avoidance notch is provided on one side of the circuit board adjacent to the inner side wall surface, and the first avoidance notch corresponds to the microphone body to avoid the microphone body.

[0011] As an alternative embodiment, the second surface is perpendicular to the first surface. The electrical connection member includes a resilient sheet structure, which includes a first electrical connection portion and a second electrical connection portion vertically disposed on the first electrical connection portion. The first electrical connection portion is disposed on the first surface, and the second electrical connection portion extends to be connected to the second surface.

[0012] As an alternative embodiment, the electrical connection member includes two resilient sheet structures, and the two resilient sheet structures are respectively disposed on two opposite sides of the microphone body.

[0013] As an alternative embodiment, the electronic device further includes a first bracket, which is connected to the connection main board, and the first bracket is also connected to the inner side wall surface to realize the connection between the connection main board and the inner side wall surface.

[0014] As an alternative embodiment, a first sound hole is provided at a position corresponding to the microphone body on the connection main board, and a second sound hole is provided at a position corresponding to the first sound hole on the first bracket; first limiting portions are provided at two side edges of the connection main board, and two second limiting portions corresponding to the two first limiting portions are provided on the first bracket, and the second limiting portions are connected to the corresponding first limiting portions so that the first sound hole and the second sound hole are correspondingly communicated.

[0015] As an alternative embodiment, the electronic device further includes a second bracket, which is connected to the circuit main board along the thickness direction of the circuit main board, and the second bracket is configured to fix the circuit main board.

[0016] As an alternative embodiment, the second bracket includes a first sub-frame body and a second sub-frame body. The first sub-frame body and the second sub-frame body are spaced apart along the thickness direction of the circuit main board to clamp the circuit main board between the first sub-frame body and the second sub-frame body, and the first sub-frame body is connected to the circuit main board and the second sub-frame body through fasteners.

[0017] As an alternative embodiment, a convex portion with a certain height extending along the thickness direction of the circuit main board is provided on one side of the second sub-frame body close to the inner side wall surface. The convex portion abuts against the connection main board to limit the connection main board in a direction perpendicular to the first surface; a second avoidance notch is provided on one side of the second sub-frame body close to the inner side wall surface, and the second avoidance notch is provided corresponding to the resilient sheet structure to avoid the resilient sheet structure.

[0018] Compared with the prior art, the beneficial effects of the present application are:

[0019] An electronic device provided by the present utility model realizes the electrical connection between the microphone main body and the circuit main board by arranging a microphone assembly on the inner side wall surface of the housing, then arranging an electricity connection component on the connection main board of the microphone assembly, and electrically coupling the electricity connection component with the connection main board and electrically connecting the electricity connection component with the circuit main board. By adopting this method, since the microphone assembly is arranged on the inner side wall surface of the housing, the space of the inner side wall surface of the housing can be reasonably utilized, the occupation of the space of the bottom wall surface of the housing can be reduced, and the microphone main body does not need to be directly fixed on the circuit main board, so the setting position of the microphone main body is more flexible, and at the same time, it is beneficial to improve the thinness and lightness of the whole electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0021] Figure 1 is a schematic structural diagram of the electronic device disclosed in the embodiment of the present application;

[0022] Figure 2 is a schematic connection structure diagram of the microphone assembly and the circuit main board disclosed in the embodiment of the present application;

[0023] Figure 3 is a schematic internal structure diagram of the electronic device disclosed in the embodiment of the present application;

[0024] Figure 4 is an exploded view of the internal structure of the electronic device disclosed in the embodiment of the present application;

[0025] Figure 5 is a sectional view of the connection between the circuit main board and the first bracket and the second bracket disclosed in the embodiment of the present application.

[0026] DESCRIPTION OF THE REFERENCE NUMERALS:

[0027] 1 - housing; 2 - circuit main board; 21 - second surface; 22 - first avoidance notch; 3 - microphone assembly; 31 - microphone body; 311 - sound hole; 32 - connection main board; 321 - first surface; 322 - first sound hole; 323 - first limiting portion; 33 - power connection component; 331 - first elastic sheet structure; 331a - first power connection portion; 331b - second power connection portion; 332 - second elastic sheet structure; 34 - back glue; 4 - first bracket; 41 - second sound hole; 42 - second limiting portion; 5 - second bracket; 51 - first sub - frame body; 52 - second sub - frame body; 521 - convex portion; 522 - second avoidance notch; 6 - fastener; 61 - bolt; 62 - nut; 63 - first mounting hole; 64 - second mounting hole. Detailed implementation manner

[0028] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0029] In the present application, the orientation or positional relationship indicated by terms such as "upper", "lower", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit that the indicated device, element or component must have a specific orientation, or be constructed and operated in a specific orientation.

[0030] Moreover, in addition to being able to represent the orientation or positional relationship, some of the above - mentioned terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present application can be understood according to specific situations.

[0031] In addition, the terms "installation", "setting", "connection", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there is an internal connection between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above - mentioned terms in the present application can be understood according to specific situations.

[0032] In addition, terms such as "first", "second", etc. are mainly used to distinguish different devices, components or parts (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, components or parts. Unless otherwise specified, the meaning of "a plurality" is two or more.

[0033] A microphone is an important component of an electronic device and is used to pick up and transmit sound in the electronic device. Sound generates vibrations through the diaphragm of the microphone, and these vibrations change the capacitance with the back plate, thereby generating an electrical signal. Subsequently, the electrical signal undergoes a series of processing and digitization for storage, transmission, and processing. At the receiving end, these signals are decoded and restored to the original sound.

[0034] During use, the microphone needs to be connected to the circuit board to conduct electricity in order to convert the sound wave signal into an electrical signal for transmission in the electronic device. In related technologies, in most electronic devices, the microphone is directly stacked on the circuit board to achieve electrical connection between the two.

[0035] However, this setting method also requires a structural member to be used separately under the circuit board as a sound collection channel. On the one hand, it limits the installation position of the microphone and has low flexibility. On the other hand, it increases the thickness of the electronic device and is not conducive to the thin and light design of the electronic device.

[0036] In view of this, the embodiments of the present application disclose an electronic device. By arranging the microphone assembly on the inner side wall surface of the housing, the space on the inner side wall surface of the housing can be utilized. Compared with the method of directly stacking the microphone on the circuit board, the flexibility of the installation position of the microphone can be improved. In addition, on the basis of arranging the microphone assembly on the inner side wall surface of the housing, the present application further considers the electrical connection method between the microphone assembly and the circuit board. By using the electrical connection member 33 including a shrapnel structure and directly connecting the circuit board through the shrapnel structure to achieve electrical connection, the electrical connection method between the microphone assembly and the circuit board is more direct and effective. At the same time, it can also simplify the electrical connection structure and reduce the space occupied by the electrical connection, thereby being conducive to the thin and light design of the electronic device.

[0037] The technical solutions of the present application will be further described below in conjunction with the embodiments and the drawings.

[0038] Please refer to Figure 1 and Figure 2 , Figure 1 which is a schematic structural diagram of an electronic device disclosed in the embodiments of the present application. Figure 2It is a schematic diagram of the connection structure between a microphone component and a circuit main board disclosed in an embodiment of the present application. The electronic device includes a housing 1, a circuit main board 2, and a microphone component 3. The circuit main board and the microphone component 3 are both arranged in the housing 1. The microphone component 3 includes a microphone body 31 and a connection main board 32. A power connection component 33 is arranged on the connection main board 32. The microphone body 31 is arranged in parallel with the connection main board 32, and the microphone body 31 is electrically coupled to the connection main board 32. The other end of the power connection component 33 on the connection main board 32 is connected to the circuit main board 2 to realize the circuit conduction between the connection main board 32 and the circuit main board 2.

[0039] By arranging the microphone component 3 on the inner side wall surface of the housing 1, compared with directly stacking the microphone component 3 on the circuit main board 2, on the one hand, the flexibility of the setting position of the microphone component 3 is improved, and on the other hand, the thickness of the electronic device is reduced, making it thinner and lighter.

[0040] By arranging the microphone component 3 on the inner side wall surface of the housing 1, the space of the inner side wall surface of the housing 1 can be utilized. Compared with the way of directly stacking the microphone component 3 on the circuit main board 2, the flexibility of the microphone setting position can be improved. In addition, the microphone component 3 and the circuit main board 2 are electrically connected through the power connection component 33, which simplifies the electrical connection structure and reduces the space occupied by the electrical connection, thus being beneficial to the thin and light design of the electronic device.

[0041] It can be understood that the above-mentioned electronic devices may include but are not limited to mobile phones, tablet computers, smart watches, etc. In addition to the above-mentioned circuit main board 2 and microphone component 3, the electronic device may also include devices such as a display screen, a battery, a camera module, a speaker module, an antenna structure, etc.

[0042] It can be understood that taking the electronic device as a mobile phone as an example, the housing 1 is the mobile phone housing. The inner side wall surface of the housing 1 may include, for example, the inner side wall surface of the mobile phone housing along the width direction, or may also include the inner side wall surface of the mobile phone housing along the length direction. Taking the inner side wall surface as the inner side wall surface of the mobile phone housing along the width direction as an example, the inner side wall surface may be the inner side wall surface on one side along the width direction. For example, the left inner side wall surface or the right inner side wall surface of the mobile phone housing can be specifically set according to the actual situation, and this embodiment does not make specific limitations on this.

[0043] Optionally, the circuit main board 2 is the main circuit board of the electronic device, and the circuit main board is a printed circuit board. The circuit main board can be arranged in the housing 1 in a manner substantially parallel to the bottom surface of the housing 1 to reasonably utilize the internal space of the housing 1 while facilitating the electrical connection with other devices in the housing 1.

[0044] Optionally, the microphone body 31 can be an electret condenser microphone or a microelectromechanical microphone. The electret condenser microphone has mature technology and a lower price, while the microelectromechanical microphone has advantages such as small size and high product stability. It can be specifically selected according to actual needs, and the type of the microphone body 31 is not limited in this embodiment.

[0045] Optionally, considering that the connection main board 32 is used to support the microphone body 31 and realize the electrical connection between the microphone body 31 and the circuit main board 2, therefore, the connection main board 32 can adopt a printed circuit board, that is, the connection main board 32 is also a rigid board. Compared with the way of using a flexible circuit board for the connection main board 32, on the one hand, it helps to improve the load-bearing capacity of the microphone body 31, and on the other hand, it helps to improve the economy of the electronic device.

[0046] Optionally, the ways for the microphone body 31 to be electrically coupled to the connection main board 32 can include but are not limited to conductive connectors, wire connections, connectors between circuit boards, or pad connections, etc. The specific way for the microphone body 31 to be electrically coupled to the connection main board 32 is not limited in this embodiment.

[0047] In some embodiments, such as Figure 1 and Figure 2 shown, the connection main board 32 can be generally a square board. When the connection main board 32 is arranged on the inner side wall surface of the housing 1, its length direction can extend along the length direction of the housing 1, and the width direction of the connection main board 32 can extend along the height direction of the housing 1. Thus, when the connection main board 32 is arranged on the inner side wall surface of the housing 1, it can cooperate with the structural trend of the housing 1, so as to reasonably utilize the space on the inner side wall surface of the housing 1 and avoid the situation that the connection main board 32 extends towards the middle direction of the housing 1 and occupies the middle space of the housing 1.

[0048] Optionally, as Figure 2 shown, the side surface of the connection main board 32 away from the inner side wall surface is the first surface 321, and the first surface 321 can be the surface in the thickness direction of the connection main board 32. The first surface 321 is parallel to the inner side wall surface, and the microphone body 31 is electrically coupled to the first surface 321. By electrically coupling the microphone body 31 to the first surface 321, the electrical signal transmission between the microphone body 31 and the connection main board 32 can be realized.

[0049] Optionally, as Figure 2As shown, the circuit main board 2 is disposed close to the inner side wall surface to facilitate electrical connection with the connection main board 32. The circuit main board 2 has a second surface 21, which can also be the surface of the circuit main board in the thickness direction. The first surface 321 and the second surface 21 can intersect, so that the connection main board 32 and the circuit main board 2 are intersectingly arranged instead of being stacked in parallel, thus reducing the overall thickness of the electronic device and improving its thinness and lightness. In addition, the first surface 321 and the second surface 21 are connected through an electrical connection member 33 to achieve electrical conduction between the connection main board 32 and the circuit main board 2, and further realize the normal use of the microphone function.

[0050] As Figure 1 and Figure 2 shown, optionally, the projection of the circuit main board 2 on the first surface 321 is at least partially located at the position of the microphone main body 31 on the first surface 321, and a first avoidance notch 22 is formed on one side of the circuit main board 2 close to the inner side wall surface. The projection size of the first avoidance notch 22 on the second surface 21 is larger than the projection size of the microphone main body 31 on the second surface 21 to avoid the microphone main body 31 and ensure that the microphone main body 31 will not collide with or interfere with the circuit main board 2, improving the structural rationality of the device.

[0051] By setting the projection of the circuit main board 2 on the first surface 321 to be at least partially located at the position of the microphone main body 31 on the first surface 321, that is, the position of the circuit main board 2 in the height direction of the housing 1 is generally located at the setting position of the microphone main body 31 on the connection main board 32. In this way, the circuit main board 2 and the connection main board 32 can be closer, which can further facilitate the electrical connection between the connection main board 32 and the circuit main board 2.

[0052] Optionally, please refer to Figure 2 , the above-mentioned first surface 321 and second surface 21 can be perpendicular to each other, that is, the connection main board 32 and the circuit main board 2 are perpendicularly arranged, and further the microphone main body 31 and the circuit main board 2 are perpendicular to each other. This setting method can reduce the overall thickness compared with directly stacking the microphone main body 31 on the circuit main board 2, which is beneficial to improving the thinness and lightness of the electronic device.

[0053] In some embodiments, please refer to Figure 2 and Figure 3, when the connection main board 32 and the circuit main board 2 are perpendicularly arranged, in order to facilitate the electrical connection between the connection main board 32 and the circuit main board 2, the power connection component 33 may include a spring piece structure. The spring piece structure may include a first power connection portion 331a and a second power connection portion 331b, and the first power connection portion 331a and the second power connection portion 331b are perpendicularly arranged. The first power connection portion 331a is connected to the first surface 321, and the second power connection portion 331b is connected to the second surface 21. By adopting a spring piece structure similar to an L shape, the first power connection portion 331a and the second power connection portion 331b can respectively directly contact and connect the connection main board 32 and the circuit main board 2, maintaining good contact performance. Furthermore, the connection between the connection main board 32 and the circuit main board 2 is more direct, effective, and stable, simplifying the electrical connection design between the connection main board 32 and the circuit main board 2. It can be understood that in other embodiments, the power connection component 33 may also be, for example, a spring pin.

[0054] Optionally, the material of the above spring piece structure may include brass, phosphor bronze, or beryllium copper. Brass has good plasticity and electrical conductivity, and at the same time has good corrosion resistance and oxidation resistance. Using brass as the material of the spring piece structure can enable the spring piece structure to maintain good electrical conductivity and stability during use. Phosphor bronze has higher wear resistance and corrosion resistance. If phosphor bronze is used as the material of the spring piece structure, the service life of the spring piece structure can be longer, reducing the maintenance cost. Beryllium copper is relatively easy to process and form. After forming, it has high strength and hardness and is not prone to problems such as deformation and cracks. Using a spring piece structure made of beryllium copper material has a longer service life.

[0055] Furthermore, the projected shape of the spring piece structure on the first surface 321 may be circular, cross-shaped, triangular, elliptical, rectangular, trapezoidal, irregular, etc., and this embodiment does not limit this.

[0056] Please refer to Figure 2 and Figure 3 , in some embodiments, the power connection component 33 includes two spring piece structures, namely a first spring piece structure 331 and a second spring piece structure 332. The first spring piece structure 331 and the second spring piece structure 332 are respectively symmetrically arranged on both sides of the microphone main body 31, making the force between the circuit main board 2 and the connection main board 32 more balanced, ensuring the connection stability between the circuit main board 2 and the connection main board 32, and improving the overall structural stability of the electronic device.

[0057] In some embodiments, please refer to Figure 3, the electronic device further includes a first bracket 4. The first bracket 4 is parallel to and connected to the main board 32 and the inner wall surface. The first bracket 4 is clamped between the main board 32 and the inner wall surface, and the first bracket 4 is respectively connected to the main board 32 and the inner wall surface to indirectly connect the main board 32 and the inner wall surface. By first connecting the main board 32 to the first bracket 4 and then connecting it to the inner wall surface, on the premise of ensuring that the microphone assembly 3 is arranged on the inner wall surface of the housing 1, the situation where the direct connection between the main board 32 and the inner wall surface causes friction or damage to the main board 32 is avoided.

[0058] Exemplarily, the connection method between the first bracket 4 and the main board 32 can be welding, bonding, snap connection or bolt connection, etc. Taking adhesive connection as an example, as Figure 2 shown, an adhesive tape 34 is provided on the side of the main board 32 close to the first bracket 4, and the main board 32 is adhesively connected to the first bracket 4 through the adhesive tape 34.

[0059] Optionally, the material of the adhesive tape 34 may include acrylic foam double-sided tape. This kind of tape has advantages such as high adhesive force, high temperature resistance, and good stability, making the connection between the main board 32 and the first bracket 4 more stable, and further making the overall structure of the electronic device more stable.

[0060] Optionally, the connection method between the first bracket 4 and the inner wall surface can be welding, snap connection, bonding, etc. Welding has high strength, good rigidity, and can meet the connection requirements of different angles and shapes. Using welding to connect the first bracket 4 and the inner wall surface can permanently connect the two and make the connection more stable; snap connection is more economical and easier to install. By using snap connection, snap joints can be respectively installed on the first bracket 4 and the inner wall surface, and the two snap joints can be snapped together to realize the connection between the first bracket 4 and the inner wall surface; bonding has a large bonding area, is easy to operate, and different effects can be achieved by using adhesives with different characteristics. In this embodiment, the connection method between the first bracket 4 and the inner wall surface is not specifically limited.

[0061] In some embodiments, please refer to Figure 3 and Figure 4 , Figure 4 is an exploded view of the internal structure of an electronic device disclosed in an embodiment of the present application. A sound hole 311 is provided on the side of the microphone body 31 close to the inner wall surface. A first sound hole 322 is provided on the main board 32 corresponding to the position of the sound hole 311. A second sound hole 41 is provided on the first bracket 4 corresponding to the position of the first sound hole 322. The second sound hole 41 is communicated with the first sound hole 322 and the sound hole 311, so as to realize the transmission of sound.

[0062] It can be understood that there can be multiple schemes for setting the sizes of the above sound holes 311, first sound holes 322, and second sound holes 41. For example, the sizes of the first sound holes 322, second sound holes 41, and sound holes 311 can be the same; or, the sizes of the first sound holes 322 and second sound holes 41 are the same, and at the same time, larger than the size of the sound holes 311; or, the size of the first sound holes 322 is larger than the size of the sound holes 311, and the size of the second sound holes 41 is larger than the size of the first sound holes 322. When the sizes of the first sound holes 322, second sound holes 41, and sound holes 311 are inconsistent, it helps to improve the smooth flow of sound. In this embodiment, there are no specific requirements for the scheme of setting the sizes of the first sound holes 322, second sound holes 41, and sound holes 311.

[0063] In some embodiments, such as Figure 3 and Figure 4 , first limiting portions 323 are provided on both side edges of the connection main board 32, and second limiting portions 42 corresponding to the first limiting portions 323 are provided on the first bracket 4. The first limiting portions 323 and the second limiting portions 42 can be connected in cooperation to enable the accurate connection of the connection main board 32 and the first bracket 4, so that the first sound holes 322 and the second sound holes 41 are correspondingly communicated, ensuring the normal sound collection of the microphone assembly 3 and improving the rationality of the structure of the electronic device.

[0064] Furthermore, the number of the above first limiting portions 323 can be set to two or more even numbers and symmetrically arranged on both side edges of the connection main board 32. The number of the second limiting portions 42 is the same as that of the first limiting portions 323, and the setting positions correspond to them. Exemplarily, as Figure 4 shown, there are two first limiting portions 323, which are symmetrically arranged on the side of the connection main board 32. The corresponding second limiting portions 42 are provided as two on the first bracket 4. The two second limiting portions 42 are correspondingly connected to the two first limiting portions 323 to limit the installation position of the connection main board 32 on the first bracket 4. The two first limiting portions 323 are symmetrically arranged, making the forces on both sides of the connection main board 32 more uniform, and further making the connection between the connection main board 32 and the first bracket 4 more stable, improving the rationality and stability of the structure of the electronic device.

[0065] Exemplarily, the above first limiting portion 323 can be a limiting post or a limiting groove, and the second limiting portion 42 corresponds to a limiting groove or a limiting post. The projected shape of the limiting post on the first surface 321 can be circular, triangular, square, rectangular, polygonal, etc., and the projected shape of the corresponding limiting groove on the first surface 321 is also circular, triangular, square, rectangular, polygonal, etc., corresponding to the projected shape of the first limiting post on the first surface 321.

[0066] In some embodiments, such as Figure 3 and Figure 4, the electronic device further includes a second bracket 5 which is arranged in parallel with the circuit main board 2. The second bracket 5 is connected to the circuit main board 2 along the thickness direction of the circuit main board 2 to fix the current position of the circuit main board 2, ensuring the stable position of the circuit main board 2 during use and avoiding the situation of deviation or displacement of the circuit main board 2.

[0067] Furthermore, as Figure 3 shown, the connection manner between the second bracket 5 and the circuit main board 2 can be welding or connection through a fastener 6. Taking the fastener 6 as an example, exemplarily, the fastener 6 can be a bolt, a screw, a rivet, etc. Taking the bolt as an example, nuts are provided on the circuit main board 2, and screw holes corresponding to the nuts are provided on the second bracket 5. The bolt can pass through the screw hole and be threadedly connected with the nut so that the second bracket 5 is connected to the circuit main board 2.

[0068] It can be understood that, as Figure 3 shown, the projection of the second bracket 5 on the first surface 321 is located within the first surface 321. The second bracket 5 can be arranged above the circuit main board 2 or below the circuit main board 2. Herein, the above and below refer to above or below in the thickness direction of the circuit main board 2.

[0069] Furthermore, as Figure 3 and Figure 4 shown, a convex portion 521 with a certain height extending along the thickness direction of the circuit main board 2 is provided on one side of the second bracket 5 close to the inner side wall surface. The convex portion 521 abuts against the connection main board 32 to limit the connection main board 32 in the direction perpendicular to the first surface 321, thereby further assisting in limiting the connection main board 32.

[0070] Optionally, as Figure 3 shown, when the second bracket 5 is arranged above the circuit main board 2 and at least part of the projection of the second bracket 5 on the first surface 321 is located within the projection of the elastic sheet structure on the first surface 321, a second avoidance notch 522 is provided on one side of the second bracket 5 close to the inner side wall surface. The projection size of the second avoidance notch 522 on the second surface 21 is larger than the projection size of the elastic sheet structure on the second surface 21 to avoid the elastic sheet structure and prevent the second bracket 5 from hitting the elastic sheet structure.

[0071] When the second bracket 5 is arranged below the circuit main board 2 and at least part of the projection of the second bracket 5 on the first surface 321 is located within the projection of the microphone main body 31 on the first surface 321, a second avoidance notch 522 is provided on one side of the second bracket 5 close to the inner side wall surface. The projection size of the second avoidance notch 522 on the second surface 21 is larger than the projection size of the microphone main body 31 on the second surface 21 to avoid the microphone main body 31 and prevent the second bracket 5 from colliding with the microphone main body 31.

[0072] Optionally, asFigure 3 As shown, the second bracket 5 includes a first sub-frame body 51 and a second sub-frame body 52. The first sub-frame body 51 and the second sub-frame body 52 are arranged parallel to the circuit main board 2 in the thickness direction of the circuit main board 2. One of them is arranged above the circuit main board 2, and the other is arranged below the circuit main board 2 to clamp the circuit main board 2 between the first sub-frame body 51 and the second sub-frame body 52. At the same time, the first sub-frame body 51 is fixedly connected to the circuit main board 2 and the second sub-frame body 52 through a fastener 6. By arranging two brackets to clamp the circuit main board 2 between them, the position of the circuit main board 2 can be fixed, the stability of the circuit main board 2 during use can be ensured, and thus the smoothness of the electronic device during use is improved.

[0073] In this embodiment, the first sub-frame body 51 is arranged below the circuit main board 2 and the second sub-frame body 52 is arranged above the circuit main board 2 will be taken as the subsequent implementation manner for expansion.

[0074] Optionally, a plurality of the above-mentioned fasteners 6 can be provided, and can be set to two or more. Exemplarily, as Figure 3 shown, two fasteners 6 are provided and are symmetrically arranged on the circuit main board 2, so that the circuit main board 2 is stressed evenly, and the support of the first sub-frame body 51 and the second sub-frame body 52 on the circuit main board 2 is also more uniform.

[0075] It can be understood that the fastener 6 can be a bolt and nut, a rivet, etc. Taking the bolt and nut as an example, as Figure 3 and Figure 4 shown, a nut 62 is arranged on the first sub-frame body 51, and the nut 62 is located on the surface of the first sub-frame body 51 close to the circuit main board 2. A first mounting hole 63 is penetrated through the circuit main board 2 corresponding to the nut 62. A second mounting hole 64 is penetrated through the second sub-frame body 52. The bolt 61 passes through the second mounting hole 64 and the first mounting hole 63 and is threadedly connected to the nut 62, so that the first sub-frame body 51, the circuit main board 2 and the second sub-frame body 52 are fixedly connected.

[0076] Furthermore, as Figure 5 shown, Figure 5 is a sectional view of the connection part of the circuit main board 2, the first sub-frame body 51 and the second sub-frame body 52. The projection dimension of the first mounting hole 63 along the second surface 21 is larger than the outer diameter of the nut 62, so that the first mounting hole 63 can be sleeved on the nut 62. The second mounting hole 64 is a stepped mounting hole. The diameter of the upper end of the second mounting hole 64 matches the diameter of the bolt 61, so that the bolt 61 can pass through. The projection dimension of the lower end diameter of the second mounting hole 64 along the second surface 21 is larger than the projection dimension of the nut 62 along the second surface 21, so that the second mounting hole 64 can also be sleeved on the nut 62. Furthermore, the first sub-bracket and the second sub-bracket can clamp the circuit main board 2 through the threaded connection of the bolt 61 and the nut 62.

[0077] Among them, the nut 62 is made of copper. The way to fix the nut 62 to the second bracket 5 can be hot melt welding. Using hot melt welding for fixing is simple in operation and high in corrosion resistance, thereby increasing the service life of the nut 62 and also improving the service life of the electronic device.

[0078] It can be understood that the material of the above-mentioned bolt 61 can be selected from carbon steel, stainless steel, copper, etc. Carbon steel is low in cost and good in mechanical properties, and is suitable for application scenarios with high requirements for strength and hardness; stainless steel has good corrosion resistance and acid resistance, and is suitable for special application scenarios that require corrosion and acid resistance; copper has good electrical conductivity and corrosion resistance, and is suitable for application scenarios with high requirements for electrical conductivity and corrosion resistance. In this embodiment, the material of the bolt 61 is not specifically limited.

[0079] In some embodiments, as Figure 3 and Figure 4 shown, a second avoidance notch 522 is formed on one side of the second sub-frame body 52 close to the inner side wall surface. The projected size of the second avoidance notch 522 on the second surface 21 is larger than the projected size of the elastic piece structure on the second surface 21 to avoid the elastic piece structure.

[0080] Furthermore, as Figure 3 and Figure 4 shown, a convex portion 521 with a certain height extending along the thickness direction of the circuit main board 2 is provided on one side of the second sub-frame body 52 close to the inner side wall surface. The convex portion 521 abuts against the connection main board 32 to limit the connection main board 32 in the direction perpendicular to the first surface 321, making the position of the connection main board 32 more fixed and the connection with the inner side wall surface more stable.

[0081] It can be understood that the projected shapes of the above-mentioned first avoidance notch 22 and second avoidance notch 522 on the second surface 21 can be square, rectangular, rounded rectangular, etc. This embodiment does not specifically limit this.

[0082] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: The electronic device comprises: A shell having an inner wall surface; A circuit main board, wherein the circuit main board is disposed in the housing; and A microphone assembly, wherein the microphone assembly is arranged in the shell and on the inner wall, the microphone assembly includes a microphone body and a connecting mainboard, the microphone body is arranged on the connecting mainboard and electrically coupled to the connecting mainboard, the connecting mainboard is provided with an electrical connection piece, and the electrical connection piece is electrically connected to the circuit mainboard to realize electrical connection between the connecting mainboard and the circuit mainboard.

2. The electronic device according to claim 1, characterized in that: The connecting mainboard has a first surface, the microphone body and the electrical connection piece are both arranged on the first surface, the circuit mainboard is arranged adjacent to the inner wall surface, the circuit mainboard has a second surface, and the electrical connection piece is electrically connected to the second surface; Wherein, the second surface intersects with the first surface.

3. The electronic device according to claim 2, characterized in that: A first avoidance gap is provided on one side of the circuit main board adjacent to the inner wall surface, and the first avoidance gap is arranged corresponding to the microphone main body to avoid the microphone main body.

4. The electronic device according to claim 2, characterized in that: The second surface is perpendicular to the first surface, the electrical connection member includes a spring structure, the spring structure includes a first electrical connection portion and a second electrical connection portion vertically arranged on the first electrical connection portion, the first electrical connection portion is arranged on the first surface, and the second electrical connection portion extends to connect to the second surface.

5. The electronic device according to claim 4, characterized in that: The power connection member includes two spring structures, and the two spring structures are respectively arranged on two opposite sides of the microphone body.

6. The electronic device according to claim 1, characterized in that: The electronic device further comprises a first bracket, wherein the first bracket is connected to the connecting mainboard, and the first bracket is also connected to the inner wall surface to achieve the connection between the connecting mainboard and the inner wall surface.

7. The electronic device according to claim 6, characterized in that: A first sound hole is provided on the connecting mainboard at a position corresponding to the microphone body, and a second sound hole is provided on the first bracket at a position corresponding to the first sound hole; The two side edges of the connecting mainboard are provided with first limiting parts, the first bracket is provided with two second limiting parts corresponding to the two first limiting parts, and the second limiting parts are connected to the corresponding first limiting parts so that the first sound hole is connected to the second sound hole correspondingly.

8. The electronic device according to claim 5, characterized in that: The electronic device further includes a second bracket, the second bracket being connected to the circuit main board along a thickness direction of the circuit main board, and the second bracket being configured to fix the circuit main board.

9. The electronic device according to claim 8, characterized in that: The second bracket includes a first sub-frame and a second sub-frame, and the first sub-frame and the second sub-frame are arranged at intervals along the thickness direction of the circuit main board to clamp the circuit main board between the first sub-frame and the second sub-frame, and the first sub-frame is connected to the circuit main board and the second sub-frame by fasteners.

10. The electronic device according to claim 9, characterized in that: A convex portion having a certain height extending in the thickness direction of the circuit main board is provided on one side of the second sub-frame adjacent to the inner wall surface, and the convex portion abuts against the connecting main board to limit the position of the connecting main board; A second avoidance gap is provided on one side of the second sub-frame adjacent to the inner wall surface, and the second avoidance gap is arranged corresponding to the spring sheet structure to avoid the spring sheet structure.

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