Mounting structure of PCB (Printed Circuit Board)

Abstract

The utility model relates to an installation structure of a PCB, a side wall of the PCB is provided with an inductor, the installation structure comprises a groove formed on one side of the PCB far away from the inductor, and the groove is arranged corresponding to the inductor; the glue filling holes are formed in the PCB and penetrate through the two opposite sides of the PCB, the glue filling holes are communicated with the PCB, the structure is simple, and the fixing effect is good.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board installation, and particularly refers to an installation structure of a PCB board. Background Art

[0002] A virtual button module usually uses a sensor that can sense minute deformations to replace a physical button. However, in order for the sensor to sense the deformation of the housing, operators need to use PSA (double-sided tape) and glue for pasting.

[0003] The assembly steps of the virtual button module are as follows: Paste PSA on the housing, use the PSA to demarcate an area to accommodate the glue, which corresponds to the setting position of the sensor on the PCB board. Drop a small amount of glue into this area to prevent the glue from overflowing due to extrusion during the subsequent pressing of the PCB board. Then, fit the PCB board and let it stand for 12 hours to wait for the glue to cure.

[0004] However, in the above assembly steps, there may be gaps between the PSA and the housing, resulting in glue loss; when dropping glue into the area, due to the fluidity of the glue itself, the glue may be unevenly distributed or capillary phenomena may occur. Over time, this will result in huge labor and time costs for construction. Summary of the Utility Model

[0005] The purpose of the utility model is to overcome the defects of the prior art and provide an installation structure of a PCB board. When the PCB board needs to be fixed, the PCB board is pasted on the PCB installation position of the housing, and glue is dropped into the perfusion hole. The glue flows through the perfusion hole into the groove and bonds the housing and the PCB board.

[0006] The technical solution for achieving the above purpose is an installation structure of a PCB board. A sensor is provided on the side wall of the PCB board. The installation structure includes:

[0007] A groove formed on the side of the PCB board away from the sensor, and the groove corresponds to the sensor; and

[0008] A glue perfusion hole formed on the PCB board and penetrating through opposite sides of the PCB board, and the glue perfusion hole is in communication with the PCB board.

[0009] Further, the PCB board includes a light guide layer that is adhered to the layer provided with the groove.

[0010] Further, the light guide layer is formed with a through hole corresponding to the glue perfusion hole, and the through hole is in communication with the glue perfusion hole.

[0011] Further, the size of the light guide layer is adapted to the size of the PCB board.

[0012] Further, an exhaust port is formed at the end of the PCB board, and the exhaust port is communicated with the groove.

[0013] Further, the width of the groove is adapted to the width of the inductor.

[0014] Further, an adhesive layer is attached to the side of the PCB board away from the inductor.

[0015] Further, the adhesive layer is disposed around the groove.

[0016] Further, the width of the groove is adapted to the diameter of the glue perfusion hole.

[0017] Further, the depth of the groove is determined according to the fluidity of the glue.

[0018] Compared with the prior art, the present utility model has the following beneficial effects:

[0019] When it is necessary to fix the PCB board, by attaching the PCB board to the PCB mounting position of the housing, dropping glue into the perfusion hole, the glue flows through the perfusion hole into the groove, and bonds the housing and the PCB board. The exhaust port can prevent the gas from being blocked in the groove when the glue is being poured. Preferably, the glue used is UV glue, and UV light is irradiated onto the glue in the groove through the light guide layer to accelerate the curing of the glue. Description of the Drawings

[0020] Figure 1 It is an installation effect diagram of an installation structure of a PCB board of the present utility model.

[0021] Figure 2 It is an overall structure diagram of an installation structure of a PCB board of the present utility model.

[0022] Figure 3 It is a rear view of an installation structure of a PCB board of the present utility model.

[0023] Legend: 1, inductor; 2, PCB board; 21, glue perfusion hole; 3, light guide layer; 4, groove. Detailed Embodiment

[0024] The present utility model will be further described below with reference to the drawings and specific embodiments.

[0025] Refer to Figure 1, a mounting structure for a PCB board. A sensor 1 is provided on the side wall of the PCB board 2. The mounting structure includes: a groove 4 formed on the side of the PCB board 2 away from the sensor 1, and the groove 4 is provided corresponding to the sensor 1; and glue perfusion holes 21 formed in the PCB board 2 and penetrating through opposite sides of the PCB board 2.

[0026] In the present utility model, a preferred implementation is: when it is necessary to fix the PCB board 2, by attaching the PCB board 2 to the PCB mounting position of the housing, dropping glue into the perfusion holes, and the glue flows through the perfusion holes into the groove 4 and flows through the position where the sensor 1 is mounted on the PCB board 2, thereby bonding the housing and the PCB board 2. Preferably, a glue curing lamp can be irradiated in the glue perfusion holes 21 to accelerate the curing of the glue in the groove 4.

[0027] Furthermore, the glue is UV glue. In the present utility model, the glue used is 4310 liquid glue.

[0028] Furthermore, the PCB board 2 includes a light guide layer 3 attached to the layer provided with the groove. Preferably, the light guide layer can be made of acrylic material or plastic material; when it is necessary to perform UV light curing on the glue, UV light can be irradiated towards the light guide layer 3, and the UV light passes through the light guide layer 3 to cure the glue in the groove 4, thereby reducing the waiting time for fixing the PCB board 2 and the housing.

[0029] Furthermore, the light guide layer 3 is formed with a through hole corresponding to the glue perfusion holes 21, and the through hole is communicated with the glue perfusion holes 21.

[0030] Furthermore, the size of the light guide layer 3 is adapted to the size of the PCB board 2.

[0031] Furthermore, an exhaust port is formed at the end of the PCB board 2, and the exhaust port is communicated with the groove. Preferably, when an operator pours glue into the glue perfusion holes, the gas in the groove and the glue perfusion holes flows along the groove towards the exhaust port to avoid blockage of the groove and the glue perfusion holes due to the gas in the groove not being discharged in time, resulting in the glue not flowing smoothly.

[0032] Furthermore, the width of the groove 4 is adapted to the width of the sensor 1.

[0033] Further, a bonding layer is attached to the side of the PCB board 2 away from the inductor 1. Preferably, the PCB board 2 is fixed through the bonding layer. The operator can first pre-fix the PCB board 2 through the bonding layer, and then test the pre-fixed PCB board 2 to detect the installation position and installation direction of the PCB board 2, so as to ensure that the installation position of the PCB board 2 meets the design requirements. After the operator confirms that the installation position of the PCB board 2 meets the design requirements, the construction worker drops glue into the perfusion hole. The glue flows through the perfusion hole into the groove 4 and flows through the position where the inductor 1 is installed on the PCB board 2, and UV light is irradiated towards the light guide layer 3 to accelerate the curing of the glue. The PCB board 2 after the fixation is re-tested to ensure that the setting and triggering of the inductor 1 fixed on the PCB board 2 are fault-free. After confirmation, the next installation of the assembled PCB board 2 and the housing is continued.

[0034] Further, the bonding layer is arranged around the groove 4.

[0035] Further, the size of the groove 4 is adapted to the size of the bonding position of the PCB board 2.

[0036] Further, the depth of the groove 4 is determined according to the fluidity of the glue. When the fluidity of the glue is poor, the depth of the groove 4 can be increased to meet the flow of the glue.

[0037] The following describes the usage process of an installation structure of a PCB board of the present invention.

[0038] When the PCB board 2 needs to be fixed, the PCB board 2 is fixed through the bonding layer. The operator can first pre-fix the PCB board 2 through the bonding layer, and then test the pre-fixed PCB board 2 to detect the installation position and installation direction of the PCB board 2, so as to ensure that the installation position of the PCB board 2 meets the design requirements. After the operator confirms that the installation position of the PCB board 2 meets the design requirements, the construction worker drops glue into the perfusion hole. The glue flows through the perfusion hole into the groove 4 and flows through the position where the inductor 1 is installed on the PCB board 2. When the operator observes that glue overflows from the exhaust port, stop pouring glue into the glue perfusion hole 21, wipe off the glue that overflows in the exhaust section, and irradiate UV light towards the light guide layer 3 to accelerate the curing of the glue. The PCB board 2 after the fixation is re-tested to ensure that the setting and triggering of the inductor 1 fixed on the PCB board 2 are fault-free. After confirmation, the next installation of the assembled PCB board 2 and the housing is continued. Preferably, the exhaust port can prevent gas from being blocked in the groove 4 due to the inability to be discharged in time when pouring glue.

[0039] The above-described embodiments of the present invention have been described in detail with reference to the accompanying drawings. Those of ordinary skill in the art can make various variations to the present invention based on the above description. Therefore, certain details in the embodiments should not constitute a limitation to the present invention, and the scope of the present invention will be defined by the scope of the appended claims.

Claims

1. A PCB mounting structure, wherein a sensor is provided on the side wall of the PCB, wherein: The mounting structure comprises: A groove is formed on a side of the PCB board away from the sensor, and the groove is arranged corresponding to the sensor; and A glue injection hole is formed on the PCB board and penetrates two opposite sides of the PCB board, and the glue injection hole is communicated with the PCB board.

2. The PCB mounting structure according to claim 1, characterized in that: The PCB board includes a light guide layer attached to a layer provided with grooves.

3. The PCB mounting structure according to claim 2, characterized in that: The light guide layer is formed with a penetration hole corresponding to the glue injection hole, and the penetration hole is communicated with the glue injection hole.

4. The PCB mounting structure according to claim 2, characterized in that: The size of the light guide layer is compatible with the size of the PCB board.

5. The PCB mounting structure according to claim 1, characterized in that: An exhaust port is formed at the end of the PCB board, and the exhaust port is communicated with the groove.

6. The PCB mounting structure according to claim 1, characterized in that: The width of the groove is matched to the width of the sensor.

7. The PCB mounting structure according to claim 1, characterized in that: A bonding layer is attached to a side of the PCB board away from the sensor.

8. The PCB mounting structure according to claim 7, characterized in that: The adhesive layer is disposed around the groove.

9. The PCB mounting structure according to claim 1, characterized in that: The width of the groove is matched to the diameter of the glue pouring hole.

10. The PCB mounting structure according to claim 1, characterized in that: The depth of the groove is determined according to the fluidity of the glue.

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