Massage head and beauty instrument

Abstract

The utility model relates to a massage head and a beauty instrument. The massage head comprises a semiconductor chilling plate and a shell. The semiconductor chilling plate is provided with a heat exchange surface, the shell comprises an outer shell part and a heat dissipation block part, the outer shell part and the heat dissipation block part are integrally arranged, and the heat dissipation block part is arranged on one side of the heat exchange surface of the semiconductor chilling plate and is in heat conduction contact with the heat exchange surface. According to the massage head, the heat dissipation block part of the shell is in heat conduction contact with the semiconductor chilling plate and is integrated with the outer shell part, the heat dissipation block part and the outer shell part can jointly serve as a heat source of the semiconductor chilling plate, and compared with the mode that only the heat dissipation block part serves as the heat source, the mass is larger, and more heat can be absorbed or provided; and the normal work of the semiconductor chilling plate can be maintained for a longer time. Meanwhile, the heat dissipation block part can directly exchange heat with external air through the surface of the outer shell part, dissipate heat to the external air or absorb heat, the heat dissipation block part and the outer shell part are integrated, so that the over-high temperature rise caused by heat blockage in the shell is relieved, and the working endurance time of the massage head can be prolonged.

Description

Technical Field

[0001] This application relates to the technical field of electrical equipment, and particularly to a massage head and a beauty device. Background Art

[0002] Common handheld beauty devices basically have functions of hot compress and ice compress. The temperature change effect is achieved by a semiconductor refrigeration sheet conducting heat to the surface of the massage head of the handheld beauty device.

[0003] However, due to the characteristics of the semiconductor refrigeration sheet in transferring heat and controlling the temperature difference, when the temperature difference on both sides of the semiconductor refrigeration sheet reaches the limit during refrigeration and heating, it is difficult to continue maintaining the target temperature constant. At this time, the hot compress and ice compress functions are difficult to operate normally, and this is also the main factor why the refrigeration or heating gear functions of handheld beauty devices are generally designed to have a short working time. Utility Model Content

[0004] Based on this, in view of the above problems, it is necessary to provide a massage head and a beauty device that can increase the working duration of hot compress or ice compress.

[0005] A massage head, comprising:

[0006] A semiconductor refrigeration sheet having a heat exchange surface; and

[0007] A housing including a housing portion and a heat dissipation block portion. The housing portion and the heat dissipation block portion are integrally provided. The heat dissipation block portion is disposed on one side of the heat exchange surface of the semiconductor refrigeration sheet and is in thermal contact with the heat exchange surface.

[0008] In one embodiment, the semiconductor refrigeration sheet further has a working surface disposed opposite to the heat exchange surface;

[0009] The massage head further includes a contact head. The contact head is disposed on a side of the semiconductor refrigeration sheet facing away from the heat dissipation block portion and is in thermal contact with the working surface.

[0010] In one embodiment, the massage head includes at least two contact heads, and the contact heads are made of a conductive material. The massage head further includes an electrode plate, and all the contact heads are electrically connected to the electrode plate.

[0011] In one embodiment, the massage head includes at least two contact heads, and the massage head further includes a heat conducting plate. The heat conducting plate is disposed between the contact heads and the semiconductor refrigeration sheet, and all the contact heads are in thermal contact with the working surface through the heat conducting plate.

[0012] In one embodiment, the massage head further includes a second temperature sensor. The second temperature sensor is disposed inside the housing portion and is configured to be able to detect the temperature of the contact head and / or the heat conducting plate.

[0013] In one embodiment, the massage head further includes a heat conducting layer;

[0014] The heat conducting layer is provided between the heat conducting plate and the contact head; and / or, the heat conducting layer is provided between the semiconductor refrigerating sheet and the heat conducting plate.

[0015] In one embodiment, the massage head further includes a head cover which covers the housing portion. The semiconductor refrigerating sheet is disposed inside the housing portion with its working surface facing the head cover. The contact head is embedded in the head cover and at least partially exposed on the surface of the head cover.

[0016] In one embodiment, the massage head further includes a first temperature sensor which is disposed on the heat dissipation block portion.

[0017] In one embodiment, the housing is made of a metal material.

[0018] In one embodiment, the heat dissipation block portion has a limiting groove. The semiconductor refrigerating sheet is disposed in the limiting groove, and its heat exchange surface is in thermal contact with the bottom of the limiting groove.

[0019] In one embodiment, the massage head further includes a heat conducting layer; the bottom of the limiting groove is an uneven surface and is covered with the heat conducting layer.

[0020] A beauty instrument includes the above-mentioned massage head.

[0021] For the above-mentioned massage head and beauty instrument, the heat dissipation block portion of its housing is in thermal contact with the semiconductor refrigerating sheet and is integrally provided with the housing portion. The two can jointly serve as the heat source of the semiconductor refrigerating sheet. Compared with relying only on the heat dissipation block portion as the heat source, the mass of the heat source is larger. Correspondingly, the heat storage capacity is stronger, and the heat that can be absorbed or provided is also more. It can maintain the normal operation of the semiconductor refrigerating sheet for a longer time and improve the working endurance of the massage head for hot compress or cold compress. At the same time, by integrally setting the heat dissipation block portion and the housing portion, the structures of the two are continuous, and heat convection can be directly carried out with the outside air through the surface of the housing portion to dissipate heat to the outside air or absorb heat from the outside air. The integrated heat dissipation block portion and housing portion also relieve the over-high temperature rise caused by the internal heat blockage of the housing. All of these can improve the working endurance of the massage head for hot compress or cold compress. Description of the Drawings

[0022] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.

[0023] Figure 1 It is a schematic cross-sectional structure diagram of a beauty instrument with a massage head in an embodiment of the present application.

[0024] Figure 2 For Figure 1 An enlarged schematic diagram of the beauty instrument at the massage head as shown.

[0025] Figure 3 For Figure 1 A schematic structural diagram of the housing in the massage head as shown.

[0026] Figure 4 For Figure 3 Another perspective structural diagram of the housing as shown.

[0027] Figure 5 For Figure 3 A schematic cross-sectional structure diagram of the housing as shown.

[0028] Figure 6 For Figure 1 An exploded structural diagram of the massage head as shown.

[0029] Figure 7 For Figure 6 An enlarged schematic diagram of the massage head at A as shown.

[0030] Figure 8 For Figure 6 An enlarged schematic diagram of the massage head at B as shown.

[0031] Figure 9 For Figure 1 Another exploded structural diagram of the massage head as shown.

[0032] Figure 10 For Figure 9 An enlarged schematic diagram of the massage head at C as shown.

[0033] Figure 11 For Figure 1 Another exploded structural diagram of the massage head as shown.

[0034] Figure 12 For Figure 11 An enlarged schematic diagram of the massage head at D as shown.

[0035] Figure 13 ForFigure 11 An enlarged schematic view of the massage head at position E as shown.

[0036] Explanation of reference numerals: 100, massage head; 10, semiconductor refrigeration sheet; 11, heat exchange surface; 12, working surface; 20, housing; 21, outer shell part; 211, accommodation cavity; 212, buckle rib; 213, neck; 22, heat dissipation block part; 221, limit groove; 222, first temperature measurement cavity; 231, first assembly hole; 232, second assembly hole; 24, screw; 25, wire passing hole; 30, heat conduction layer; 41, first temperature sensor; 42, second temperature sensor; 50, contact; 51, working end; 52, heat conduction end; 60, electrode plate; 71, gland; 72, head cover; 73, rear cover; 80, heat conduction plate; 81, second temperature measurement cavity; 200, beauty instrument; 210, fuselage; 2101, upper cover of fuselage; 2102, outer shell of fuselage; 2103, bottom cover of fuselage; 2104, main control board; 2105, battery; 2106, charging interface; 2107, button. Detailed implementation manners

[0037] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0038] In the description of the present application, it should be understood that if terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application.

[0039] In addition, if the term "and / or" appears, "and / or" is merely a description of the relationship between associated objects and indicates that there can be three relationships. For example, A and / or B can represent the relationship between A and B: A exists alone, A and B exist simultaneously, and B exists alone. Additionally, in this text, the character " / " generally represents an "or" relationship between the associated objects before and after it. If the terms "first" and "second" appear, these terms are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, four, five, etc., unless otherwise specifically and clearly defined.

[0040] In this application, unless otherwise clearly specified and defined, if terms such as "installed", "connected", "joined", "fixed", etc. appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0041] In this application, unless otherwise clearly specified and defined, if there is a description such as a first feature being "on" or "under" a second feature, its meaning can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over", and "on top of" the second feature can mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath", and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0042] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there can also be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If so, the terms "vertical", "horizontal", "up", "down", "left", "right", and similar expressions used in this application are only for the purpose of illustration and do not represent the only implementation.

[0043] In addition to what is described in the background art, a handheld beauty device can use a heat dissipation block to control the temperature of a thermoelectric cooler. However, after a user performs a hot compress or ice compress operation once, they need to wait for the heat dissipation block to return to its initial temperature before they can continue working. The temperature of the heat dissipation block located inside the handheld beauty device recovers slowly, directly causing the user to be unable to restart it within a short time or making it difficult to reach the target temperature again after startup.

[0044] Please refer to Figures 1 to 5 , the massage head 100 provided by an embodiment of the present application includes a thermoelectric cooler 10 and a housing 20. Among them, the massage head 100 has a heat exchange surface 11, and the housing 20 includes a housing part 21 and a heat dissipation block part 22. The housing part 21 and the heat dissipation block part 22 are integrally provided. The heat dissipation block part 22 is arranged on one side of the heat exchange surface 11 of the thermoelectric cooler 10 and is in thermal contact with the heat exchange surface 11.

[0045] The housing part 21 and the heat dissipation block part 22 are of an integral structure. Understandably, the heat dissipation block part 22 is located inside the housing part 21. The housing part 21 has a receiving cavity 211. The thermoelectric cooler 10 is installed in the receiving cavity 211 and is in thermal contact with the heat dissipation block part 22 located inside the housing part 21.

[0046] The thermoelectric cooler 10 has a heat exchange surface 11 and a working surface 12 arranged opposite to each other. Among them, the heat exchange surface 11 is in thermal contact with the heat dissipation block part 22 so as to be able to form contact heat conduction with the heat dissipation block part 22 and perform heat exchange through heat conduction. The two can be in direct contact or indirectly in contact through a heat conducting member. When the thermoelectric cooler 10 is working, the working surface 12 is responsible for generating the required target temperature and conducting it to the surface of the massage head 100. Specifically, the thermoelectric cooler 10 can realize the function switching of heating and cooling on the working surface 12 by reverse-polar power supply, and the massage head 100 accordingly has the functions of hot compress and ice compress.

[0047] In other words, when the massage head 100 performs a hot compress, the temperature of the working surface 12 of the thermoelectric cooler 10 rises to provide heat for the hot compress. Correspondingly, the temperature of the heat exchange surface 11 decreases. At this time, the heat dissipation block part 22 in contact with the heat exchange surface 11 and the housing part 21 integrally connected to the heat dissipation block part 22 act as a high-temperature heat source to provide heat for it and relieve the decrease in its temperature to ensure stable and continuous heating of the working surface 12. When the massage head 100 performs an ice compress, the temperature of the working surface 12 of the thermoelectric cooler 10 decreases to absorb external heat. Correspondingly, the temperature of the heat exchange surface 11 rises. At this time, the heat dissipation block part 22 in contact with the heat exchange surface 11 and the housing part 21 integrally connected to the heat dissipation block part 22 act as a low-temperature heat source to dissipate heat for it and relieve the increase in its temperature to ensure stable and continuous cooling of the working surface 12. Therefore, under the action of the heat dissipation block part 22, the time required for the temperature difference between the working surface 12 and the heat exchange surface 11 to reach the limit is extended, and the thermoelectric cooler 10 can work continuously for a longer time.

[0048] Based on this, the housing 20 can serve as the heat source of the thermoelectric cooler 10. Its ability to maintain the normal working duration of the thermoelectric cooler 10 is directly affected by its ability to absorb or provide heat, and its ability to absorb or provide heat is affected by its heat capacity. Given the same temperature change and a certain specific heat capacity, the larger the mass of the heat source of the thermoelectric cooler 10, the stronger its heat capacity, and the more heat it can absorb or provide. By integrally forming the heat dissipation block part 22 and the outer shell part 21, the entire housing 20 can be used as the heat source. Compared with relying only on the heat dissipation block part 22 as the heat source, its mass is increased. In addition, the ability of the housing 20 to absorb or provide heat is also affected by its thermal conductivity. Therefore, the housing 20 is preferably made of a material with a high thermal conductivity.

[0049] For the above-mentioned massage head 100, the heat dissipation block part 22 of its housing 20 is in thermal contact with the thermoelectric cooler 10 and is integrally formed with the outer shell part 21. The two can jointly serve as the heat source of the thermoelectric cooler 10. Compared with relying only on the heat dissipation block part 22 as the heat source, the mass of the heat source is larger. Correspondingly, its ability to store heat is stronger, and the heat it can absorb or provide is also more. It can maintain the normal operation of the thermoelectric cooler 10 for a longer time, improving the working endurance of hot compress or cold compress of the massage head 100. At the same time, by integrally forming the heat dissipation block part 22 and the outer shell part 21, the two structures are continuous, and heat convection can be directly carried out with the outside air through the surface of the outer shell part 21 to dissipate heat to the outside air or absorb heat from the outside air. The integrated heat dissipation block part 22 and outer shell part 21 also alleviate the over-high temperature rise caused by internal heat blockage of the housing 20. All of these can improve the working endurance of hot compress or cold compress of the massage head 100. In addition, after the massage head 100 completes a hot compress or cold compress operation, the heat dissipation block part 22 and the outer shell part 21 can also exchange heat with the outside air through convection to quickly return to the initial temperature, reducing the required cooling time, and thus shortening the time interval between two normal operations of the thermoelectric cooler 10, enabling the massage head 100 to achieve the effect even when powered on again shortly.

[0050] Specifically, the housing 20 is made of a metal material, which includes but is not limited to aluminum, copper, etc. Such metals have a high thermal conductivity.

[0051] In this way, the heat exchange between the thermoelectric cooler 10 and the housing 20 can be carried out more efficiently, making full use of the heat capacity effect of the heat dissipation block part 22 and the heat dissipation effect of the entire housing 20, and prolonging the sustainable working time of the thermoelectric cooler 10.

[0052] It can be understood that in some other embodiments, the housing 20 can also be made of a non-metal material, such as thermally conductive ceramics, graphite, etc., as long as it has good thermal conductivity, and no specific limitation is made here.

[0053] In some embodiments, the heat dissipation block portion 22 has a limiting cavity, the thermoelectric cooler 10 is disposed in the limiting groove 221, and the heat exchange surface 11 is in thermal contact with the bottom of the limiting groove 221.

[0054] The thermoelectric cooler 10 is located in the limiting groove 221, and its heat exchange surface 11 faces the bottom of the limiting groove 221. The limiting groove 221 can be formed by a local concavity on the surface of the heat dissipation block portion 22, or can be formed by a convex enclosure on the surface of the heat dissipation block portion 22, as long as it can limit the thermoelectric cooler 10 located therein, and no specific limitation is made here.

[0055] In this way, the thermoelectric cooler 10 can be stably located in the limiting groove 221 to prevent it from moving, and the heat exchange surface 11 of the thermoelectric cooler 10 is in full contact with the heat dissipation block portion 22.

[0056] Further, the massage head 100 further includes a heat conducting layer 30. The bottom of the limiting groove 221 is an uneven surface and is provided with a heat conducting layer 30.

[0057] The heat conducting layer 30 can be obtained by applying a heat conducting material to the bottom of the groove. Among them, the heat conducting material can be, but is not limited to, heat conducting silicone grease, etc. It can be understood that as a heat conducting coating, the heat conducting silicone grease can be first coated on the bottom of the limiting groove 221, and then the thermoelectric cooler 10 can be installed into the limiting groove 221.

[0058] In this way, the uneven surface formed at the bottom of the groove can improve the adhesion of the heat conducting layer 30, which is more conducive to coating the heat conducting layer 30 and forming full contact with the heat exchange surface 11 of the thermoelectric cooler 10, reducing the heat blockage caused by the existence of gaps.

[0059] In some embodiments, the massage head 100 further includes a first temperature sensor 41, and the first temperature sensor 41 is disposed on the heat dissipation block portion 22 for detecting the temperature of the heat dissipation block portion 22.

[0060] Among them, the heat dissipation block portion 22 may have a first temperature measurement cavity 222, the first temperature sensor 41 is disposed in the first temperature measurement cavity 222, and the first temperature measurement cavity 222 may be filled with a heat conducting material, such as heat conducting silicone grease, etc., to improve the temperature measurement accuracy of the first temperature sensor 41.

[0061] The first temperature sensor 41 can be, but is not limited to, a thermistor, a thermocouple, etc., as long as it can detect the temperature of the heat dissipation block portion 22, and no specific limitation is made here.

[0062] Thus, when the semiconductor is refrigerated, the temperature of the outer shell portion 21 will rise. The first temperature sensor can detect and reflect the temperature of the outer shell portion 21 to avoid the problem that the outer shell temperature is too high after operation when the working or ambient temperature is too high, which may cause burns to the user. Through the temperature monitoring of the first temperature sensor, when the detected temperature reaches the set limit threshold, the power output of the semiconductor refrigeration chip 10 is restricted to give priority to ensuring safety. The first temperature sensor 41 can monitor the limit temperature, which not only ensures the use safety but also extends the service life of the product.

[0063] Please refer to Figure 6 and Figure 7 , in some embodiments, the massage head 100 further includes a contact head 50. The contact head 50 is disposed on the side of the semiconductor refrigeration chip 10 facing away from the heat dissipation block portion 22 and is in thermally conductive contact with the working surface 12 of the semiconductor refrigeration chip 10.

[0064] It can be understood that the contact head 50 is in thermally conductive contact with the working surface 12 of the semiconductor refrigeration chip 10 so as to form contact heat conduction with the semiconductor refrigeration chip 10 and perform heat exchange through heat conduction. The two can be in direct contact or indirectly in contact through a heat conductive member. At least a part of the contact head 50 is exposed on the surface of the massage head 100 so as to be able to directly contact the human skin for hot compress and cold compress operations.

[0065] Thus, the semiconductor refrigeration chip 10 can conduct the temperature of the working surface 12 to the contact head 50 to perform hot compress or ice compress on the skin by means of the contact head 50.

[0066] Please refer to Figure 9 , Figure 11 and Figure 12 , in some embodiments, the massage head 100 includes at least two contact heads 50, and the contact heads 50 are made of conductive materials. The massage head 100 further includes an electrode plate 60, and all the contact heads 50 are electrically connected to the electrode plate 60.

[0067] The contact heads 50 are dispersedly arranged and have conductivity, can draw electricity from the electrode plate 60, and emit current to realize other functions such as microcurrent or RF radio frequency (emitting electromagnetic waves of a specific frequency).

[0068] Thus, in addition to being able to perform hot compress and cold compress through the contact head 50, the massage head 100 can also perform functions such as microcurrent or RF radio frequency through the contact head 50.

[0069] Further, the massage head 100 further includes a gland 71. The gland 71 is disposed within the housing portion 21. The gland 71 and the electrode plate 60 are located on one side of the working surface 12 of the semiconductor refrigeration sheet 10, and the gland 71 is positioned between the electrode plate 60 and the semiconductor refrigeration sheet 10. The electrode plate 60 is disposed on the gland 71. The contact 50 passes through the electrode plate 60 and the gland 71 and is in thermally conductive contact with the working surface 12 of the semiconductor refrigeration sheet 10. On the other hand, the gland 71 cooperates with the housing 20.

[0070] In this way, the gland 71 can provide stable installation for the electrode plate 60 and also cooperate with the housing 20 to limit the semiconductor refrigeration sheet 10 within the accommodation cavity 211.

[0071] In some embodiments, the massage head 100 further includes a head cover 72. The head cover 72 covers the housing portion 21. The semiconductor refrigeration sheet 10 is disposed within the housing portion 21, and the working surface 12 faces the head cover 72. The contact 50 is embedded in the head cover 72 and at least partially exposed on the surface of the head cover 72.

[0072] It can be understood that the surface of the head cover 72 is the outer surface of the massage head 100. The contact 50 is embedded in the head cover 72 and exposed on its surface, enabling direct contact with the human skin to perform functions such as hot compress, cold compress, and microcurrent release. Among them, the contact 50 can be embedded by insert molding. The contact 50 can include a working end 51 and a heat-conducting end 52. The working end 51 is embedded in the head cover 72, and the heat-conducting end 52 is in thermally conductive contact with the working surface 12.

[0073] Specifically, the head cover 72 covers outside the accommodation cavity 211, and the gland 71 is located between the head cover 72 and the housing 20. The housing 20 is provided with a first assembly hole 231. The housing 20 can be fixed to the head cover 72 and the gland 71 by passing a screw 24 through the first assembly hole 231.

[0074] In this way, the contact 50 can be stably positioned and can directly contact the human skin to perform work.

[0075] In some embodiments, the massage head 100 further has a rear cover 73. The housing portion 21 of the housing 20 has a snap rib 212 at the rear. The rear cover 73 has a snap and is snap-connected to the snap rib 212 of the housing portion 21 to complete the installation and is used to cover the first assembly hole 231.

[0076] Among them, the rear cover 73 can be made of a metal material with better thermal conductivity. At the interface with the housing portion 21, a thermal conductive material such as thermal conductive silicone grease is applied to further increase the heat dissipation area of the massage head 100 on the original basis and improve the performance.

[0077] In some embodiments, the massage head 100 further includes a heat conducting plate 80, the heat conducting plate 80 is disposed between the contact head 50 and the semiconductor refrigerating sheet 10, and all the contact heads 50 are in heat conducting contact with the working surface 12 of the semiconductor refrigerating sheet 10 through the heat conducting plate 80.

[0078] The massage head 100 includes at least two contact heads 50, the contact heads 50 are dispersedly arranged, and the number thereof can be 2, 4, 6, 9, 10, etc., and no specific limitation is made herein.

[0079] In this way, by arranging the heat conducting plate 80 in the middle, the temperature of the working surface 12 of the semiconductor refrigerating sheet 10 is evenly and dispersedly transferred to each contact head 50, reducing the possibility of uneven temperature of each contact head 50.

[0080] Please refer to Figure 8 and Figure 10 simultaneously, in some embodiments, the massage head 100 further includes a second temperature sensor 42, the second temperature sensor 42 is disposed in the housing portion 21 and is configured to be able to detect the temperature of the contact head 50 and / or the heat conducting plate 80.

[0081] Wherein, the second temperature sensor 42 can be disposed on the electrode plate 60 and is electrically connected to the electrode plate 60. The second temperature sensor 42 can be but is not limited to a thermistor, a thermocouple, etc., as long as it can detect the temperature of the contact head 50 or the heat conducting plate 80, and no specific limitation is made herein.

[0082] In this way, the temperature detected by the second temperature sensor 42 can directly or indirectly reflect the temperature in contact with the human skin, that is, the surface temperature of the massage head 100, so as to feedback to control the power of the semiconductor refrigerating sheet 10 to keep the temperature of the massage head 100 constant.

[0083] Specifically, the second temperature sensor 42 is configured to detect the temperature of the heat conducting plate 80, the heat conducting plate 80 has a second detection cavity, the second temperature sensor 42 is located in the second temperature measurement cavity 81, and the second temperature measurement cavity 81 can be filled with a heat conducting material, such as heat conducting silicone grease, etc., to improve the temperature measurement accuracy of the second temperature sensor 42.

[0084] In some embodiments, a heat conducting layer 30 is disposed between the semiconductor refrigerating sheet 10 and the heat conducting plate 80.

[0085] In this way, the heat conducting layer 30 can fill the contact gap between the semiconductor refrigerating sheet 10 and the heat conducting plate 80 and enhance the heat conducting effect therebetween.

[0086] In some embodiments, the heat conducting layer 30 is disposed between the heat conducting plate 80 and the contact head 50. Similarly, the heat conducting layer 30 can fill the contact gap between the semiconductor refrigerating sheet 10 and the heat conducting plate 80 and enhance the heat conducting effect therebetween.

[0087] Please refer to Figure 13 Specifically, the contact surface of the heat conduction plate 80 in contact with the semiconductor refrigeration sheet 10 can also be an uneven surface, which can improve the adhesion of the heat conduction layer 30, is more conducive to coating the heat conduction layer 30, and forms full contact with the heat exchange surface 11 of the semiconductor refrigeration sheet 10, reducing the heat blockage caused by the existence of gaps.

[0088] The present application also provides a beauty instrument 200, including the above-mentioned massage head 100. Specifically, the beauty instrument 200 can be a handheld beauty instrument 200, which is composed of two main parts: a body 210 and a massage head 100.

[0089] Among them, the body 210 includes a housing and internal components provided in the body 210. The housing includes an upper body cover 2101, an outer body shell 2102, and a bottom body cover 2103. The upper body cover 2101 is connected to the massage head 100. The internal components include a main control board 2104, a battery 2105, and a charging interface 2106. The main control board 2104 is electrically connected to and controls all electrical components. In addition, there are also buttons 2107 on the body 210. Through the buttons 2107, the user can input instructions to the main control board 2104 correspondingly.

[0090] In some embodiments, the housing 20 also has a wire passing hole 25. In this way, the wiring of electrical components such as the electrode plate 60 and the semiconductor refrigeration sheet 10 is connected to the main control board 2104 inside the body 210 through this wire passing hole 25.

[0091] In some embodiments, a second assembly hole 232 is also provided on the housing 20. The second assembly hole 232 is used to be tightly connected to the upper body cover 2101 on the body 210. In addition, the outer shell portion 21 of the housing 20 may also have a neck 213 and be docked with the body 210 through the neck 213.

[0092] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0093] The above-described embodiments only represent several implementation manners of the present application. Their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several deformations and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A massage head, characterized in that: include: A semiconductor cooling sheet (10) having a heat exchange surface (11); and The shell (20) comprises an outer shell portion (21) and a heat sink portion (22), wherein the outer shell portion (21) and the heat sink portion (22) are integrally arranged, and the heat sink portion (22) is arranged on one side of the heat exchange surface (11) of the semiconductor refrigeration plate (10) and is in thermal contact with the heat exchange surface (11).

2. The massage head according to claim 1, characterized in that: The semiconductor refrigeration plate (10) further comprises a working surface (12) disposed opposite to the heat exchange surface (11); The massage head further comprises a contact (50), wherein the contact (50) is arranged on a side of the semiconductor cooling plate (10) facing away from the heat dissipation block portion (22) and is in heat-conducting contact with the working surface (12).

3. The massage head according to claim 2, characterized in that: The massage head comprises at least two contacts (50), and the contacts (50) are made of a conductive material. The massage head also comprises an electrode plate (60), and all the contacts (50) are electrically connected to the electrode plate (60).

4. The massage head according to claim 2, characterized in that: The massage head comprises at least two contacts (50), and the massage head further comprises a heat conducting plate (80), wherein the heat conducting plate (80) is arranged between the contacts (50) and the semiconductor cooling plate (10), and all the contacts (50) are in heat conducting contact with the working surface (12) via the heat conducting plate (80).

5. The massage head according to claim 4, characterized in that: The massage head further comprises a second temperature sensor (42), wherein the second temperature sensor (42) is disposed in the housing portion (21) and is configured to detect the temperature of the contact (50) and / or the heat conducting plate (80).

6. The massage head according to claim 4, characterized in that: The massage head also includes a heat-conducting layer (30); The heat-conducting layer (30) is provided between the heat-conducting plate (80) and the contact (50); and / or the heat-conducting layer (30) is provided between the semiconductor cooling sheet (10) and the heat-conducting plate (80).

7. The massage head according to claim 2, characterized in that: The massage head further comprises a head cover (72), wherein the head cover (72) is covered on the outer shell (21), the semiconductor cooling sheet (10) is arranged in the outer shell (21), and the working surface (12) faces the head cover (72), and the contact (50) is embedded in the head cover (72) and at least partially exposed on the surface of the head cover (72).

8. The massage head according to claim 1, characterized in that: The massage head further comprises a first temperature sensor (41), wherein the first temperature sensor (41) is arranged on the heat dissipation block portion (22).

9. The massage head according to claim 1, characterized in that: The housing (20) is made of metal.

10. The massage head according to claim 1, characterized in that: The heat dissipation block portion (22) has a limiting groove (221), the semiconductor cooling plate (10) is arranged in the limiting groove (221), and the heat exchange surface (11) is in thermal contact with the bottom of the limiting groove (221).

11. The massage head according to claim 10, characterized in that: The massage head further comprises a heat-conducting layer (30); the bottom of the limiting groove (221) is a concave-convex surface and is covered with the heat-conducting layer (30).

12. A beauty instrument, characterized in that: The massage head comprises the massage head according to any one of claims 1 to 11.

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