Auxiliary positioning device for microphone processing laser cutting machine

Abstract

The utility model discloses an auxiliary positioning device for a microphone processing laser cutting machine, and particularly relates to the technical field of microphone processing, the auxiliary positioning device comprises a base, the top end of the base is fixedly provided with a device base frame, the two sides of the top end of the device base frame are both fixedly provided with positioning pieces, the two positioning pieces are of a symmetrical distribution structure, and the positioning pieces are arranged on the base frame. An auxiliary part is fixedly clamped in the middle of the top end of the device base frame, and a substrate for processing the back polar plate is arranged between the positioning part and the auxiliary part; the positioning part comprises an L-shaped frame and a limiting frame, the L-shaped frame and the limiting frame are fixedly installed at the top end of the device base frame and are close to each other, a bottom pad is fixedly installed on the inner side of the limiting frame, and a telescopic air cylinder is fixedly installed at the top end of the L-shaped frame. And waste remaining in the penetrating hole can be conveniently cleaned, the cut back polar plate body can be conveniently discharged, and the using effect of the whole device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of microphone processing, in particular to an auxiliary positioning device for a laser cutting machine for microphone processing. Background Technique

[0002] A microphone, also known as a microphone or a transducer, is a transducer that converts sound signals into electrical signals; the structure of a microphone mainly consists of a housing, a diaphragm, a back plate, and a magnetic field. The diaphragm is the sensing element of the microphone. It is usually made of a light and thin metal or plastic film. When sound waves act on the diaphragm, the diaphragm will vibrate. The back plate is located on the back of the diaphragm, and a capacitor is formed between it and the diaphragm. When the diaphragm vibrates, the distance of this capacitor will change, thereby generating a changing voltage signal. The magnetic field is generated by a permanent magnet or an electromagnet inside the microphone, which provides a bias magnetic field for the diaphragm, enabling the vibration of the diaphragm to generate an electrical signal.

[0003] When processing a microphone, it is necessary to perform laser cutting on the components of the microphone to cut holes. During laser cutting, it is necessary to position the components of the microphone. The traditional positioning device can only position the components. During subsequent cutting and processing, some waste materials will be generated. The waste materials may get stuck in the holes and still need to be processed manually, which affects the overall processing efficiency of the microphone components. Therefore, we propose an auxiliary positioning device for a laser cutting machine for microphone processing to solve the above problems. Content of the Utility Model

[0004] The purpose of the utility model is to provide an auxiliary positioning device for a laser cutting machine for microphone processing to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: an auxiliary positioning device for a laser cutting machine for microphone processing, including a base, a device base frame is fixedly installed at the top of the base, positioning members are fixedly installed on both sides of the top of the device base frame, and the two positioning members are symmetrically distributed. An auxiliary member is fixedly clamped in the middle of the top of the device base frame, and a substrate for back plate processing is arranged between the positioning member and the auxiliary member;

[0006] The positioning member includes an L-shaped frame and a limiting frame. The L-shaped frame and the limiting frame are fixedly installed at the top of the device base frame. The L-shaped frame and the limiting frame are close to each other. A bottom pad is fixedly installed inside the limiting frame. A telescopic cylinder is fixedly installed at the top of the L-shaped frame, and a pressing plate is fixedly installed at the driving end of the telescopic cylinder. A top pad is fixedly installed at the bottom of the pressing plate.

[0007] Preferably, the substrate for back plate processing is movably clamped between the two limiting frames, and the upper surface and the lower surface of the substrate for back plate processing are respectively in contact with the top pad and the bottom pad.

[0008] Preferably, a plurality of backplate bodies evenly distributed are movably clamped on the substrate for backplate processing, and through holes are formed in the backplate bodies.

[0009] Preferably, the auxiliary member includes an auxiliary outer frame, the auxiliary outer frame is fixedly installed in the middle of the top end of the device base frame, a first frame is slidably clamped on the inner top of the auxiliary outer frame, a first clamping shaft is fixedly installed at the bottom end of the first frame, the bottom end of the first clamping shaft is movably clamped at the bottom end of the auxiliary outer frame, a ring frame corresponding to the backplate body is fixedly installed on the first frame, a first ejector rod corresponding to the through hole is fixedly installed at the top end of the ring frame, the first ejector rod is movably clamped at the top end of the auxiliary outer frame, a second frame is slidably clamped on the inner bottom of the auxiliary outer frame, a second clamping shaft is fixedly installed at the bottom end of the second frame, the bottom end of the second clamping shaft is movably clamped at the bottom end of the auxiliary outer frame, a second ejector rod corresponding to the backplate body is fixedly installed at the top end of the second frame, the second ejector rod movably penetrates through the corresponding ring frame, and the second ejector rod is movably clamped at the top end of the auxiliary outer frame.

[0010] Preferably, the lower surface of the substrate for backplate processing contacts the upper surface of the auxiliary outer frame.

[0011] Preferably, a first groove corresponding to the first clamping shaft is formed in the device base frame, and a first telescopic rod is fixedly installed in the first groove, and the driving end of the first telescopic rod is fixedly installed with the bottom end of the corresponding first clamping shaft.

[0012] Preferably, a second groove corresponding to the second clamping shaft is formed in the device base frame, and a second telescopic rod is fixedly installed in the second groove, and the driving end of the second telescopic rod is fixedly installed with the bottom end of the corresponding second clamping shaft.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] 1. By arranging the positioning member, the substrate for backplate processing is assisted in positioning, and the stability during the subsequent laser cutting processing of the substrate for backplate processing is improved.

[0015] 2. By arranging the auxiliary member, it is convenient to clean the waste materials remaining in the through holes and to discharge the cut backplate bodies, and the use effect of the whole device is improved. Description of the Drawings

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0017] Figure 1 It is a schematic structural diagram of the present invention.

[0018] Figure 2 It is a schematic structural diagram of the positioning member and the auxiliary member in the present invention.

[0019] Figure 3 For the present invention Figure 2 An enlarged view of part A.

[0020] Figure 4 For the present invention Figure 2 An enlarged view of part B.

[0021] Figure 5 For the present invention Figure 2 An enlarged view of part C.

[0022] In the figure: 1, base; 2, device base frame; 201, first groove; 202, second groove; 21, first telescopic rod; 22, second telescopic rod; 3, positioning member; 4, auxiliary member; 5, substrate for backplate processing; 51, backplate body; 501, perforation; 31, L-shaped frame; 32, limiting frame; 321, bottom pad; 33, telescopic cylinder; 34, pressing plate; 341, top pad; 41, auxiliary outer frame; 42, first frame; 421, first clamping shaft; 43, ring frame; 431, first ejector rod; 44, second frame; 45, second ejector rod; 46, second clamping shaft. Detailed implementation manners

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0024] Embodiment: As Figures 1-5As shown in the figure, the utility model provides an auxiliary positioning device for a laser cutting machine for microphone head processing, which includes a base 1. A device base frame 2 is fixedly installed at the top of the base 1. Positioning members 3 are fixedly installed on both sides of the top of the device base frame 2. The two positioning members 3 are symmetrically distributed. An auxiliary member 4 is fixedly clamped in the middle of the top of the device base frame 2. A substrate 5 for back plate processing is arranged between the positioning member 3 and the auxiliary member 4;

[0025] The positioning member 3 includes an L-shaped frame 31 and a limiting frame 32. The L-shaped frame 31 and the limiting frame 32 are fixedly installed at the top of the device base frame 2. The L-shaped frame 31 and the limiting frame 32 are close to each other. A bottom pad 321 is fixedly installed inside the limiting frame 32. A telescopic cylinder 33 is fixedly installed at the top of the L-shaped frame 31. A pressing plate 34 is fixedly installed at the driving end of the telescopic cylinder 33. A top pad 341 is fixedly installed at the bottom of the pressing plate 34. The substrate 5 for back plate processing is movably clamped between the two limiting frames 32. The upper surface and the lower surface of the substrate 5 for back plate processing are respectively in contact with the top pad 341 and the bottom pad 321. When laser cutting the microphone head, the substrate 5 for back plate processing is movably clamped between the two limiting frames 32 for limiting. Subsequently, control the two telescopic cylinders 33 to drive the pressing plate 34 and the top pad 341 to descend, so as to assist in positioning the substrate 5 for back plate processing and improve the stability during the subsequent laser cutting processing of the substrate 5 for back plate processing.

[0026] A plurality of uniformly distributed back plate bodies 51 are movably clamped on the substrate 5 for back plate processing. Through holes 501 are opened on the back plate bodies 51. After positioning, use a laser cutting machine to first laser cut a plurality of through holes 501 on the substrate 5 for back plate processing. Subsequently, cut out a plurality of back plate bodies 51 at the positions of the through holes 501 to perform laser cutting processing of the microphone head.

[0027] The auxiliary member 4 includes an auxiliary outer frame 41. The auxiliary outer frame 41 is fixedly installed in the middle of the top of the device base frame 2. The lower surface of the substrate 5 for back plate processing is in contact with the upper surface of the auxiliary outer frame 41. A first frame 42 is slidably clamped at the inner top of the auxiliary outer frame 41. A first clamping shaft 421 is fixedly installed at the bottom of the first frame 42. The bottom end of the first clamping shaft 421 is movably clamped at the bottom of the auxiliary outer frame 41. A ring frame 43 corresponding to the back plate body 51 is fixedly installed on the first frame 42. A first ejecting rod 431 corresponding to the through hole 501 is fixedly installed at the top of the ring frame 43. The first ejecting rod 431 is movably clamped at the top of the auxiliary outer frame 41. After cutting out a plurality of through holes 501, waste materials are left in the plurality of through holes 501. Control the first clamping shaft 421 to move upward, drive the first frame 42, a plurality of ring frames 43, and the first ejecting rod 431 to move upward. The first ejecting rod 431 extends out of the auxiliary outer frame 41 and is inserted into the through hole 501 to eject the waste materials, which is convenient for cleaning the waste materials left in the through hole 501. After the waste materials are cleaned, reset the first ejecting rod 431;

[0028] A second rack 44 is slidably clamped to the inner bottom of the auxiliary outer frame 41. A second clamping shaft 46 is fixedly installed at the bottom end of the second rack 44. The bottom end of the second clamping shaft 46 is movably clamped to the bottom end of the auxiliary outer frame 41. A second ejector rod 45 corresponding to the back plate body 51 is fixedly installed at the top end of the second rack 44. The second ejector rod 45 movably penetrates through the corresponding ring frame 43. The second ejector rod 45 is movably clamped to the top end of the auxiliary outer frame 41. After multiple back plate bodies 51 are cut out, the multiple back plate bodies 51 are left on the substrate 5 for back plate processing. Control the second clamping shaft 46 to move upward, driving the second rack 44 and multiple second ejector rods 45 to move upward. The second ejector rod 45 extends out of the auxiliary outer frame 41 to push out the back plate body 51, facilitating the blanking of the cut-out back plate body 51. After blanking, reset the second ejector rod 45 and remove the substrate 5 for back plate processing without positioning.

[0029] A first groove 201 corresponding to the first clamping shaft 421 is provided in the device base frame 2. A first telescopic rod 21 is fixedly installed in the first groove 201. The driving end of the first telescopic rod 21 is fixedly installed with the bottom end of the corresponding first clamping shaft 421. During use, control the first telescopic rod 21 to be turned on to drive the corresponding first clamping shaft 421 to move upward.

[0030] A second groove 202 corresponding to the second clamping shaft 46 is provided in the device base frame 2. A second telescopic rod 22 is fixedly installed in the second groove 202. The driving end of the second telescopic rod 22 is fixedly installed with the bottom end of the corresponding second clamping shaft 46. Control the second telescopic rod 22 to be turned on to drive the corresponding second clamping shaft 46 to move upward.

[0031] Working principle: During use, the substrate 5 for back plate processing is movably clamped between the two limiting frames 32 for limiting. Subsequently, control the two side telescopic cylinders 33 to be turned on to drive the pressure plate 34 and the top pad 341 to descend, for auxiliary positioning of the substrate 5 for back plate processing;

[0032] After positioning, use a laser cutting machine to first laser-cut multiple through-holes 501 in the substrate 5 for back plate processing. The waste is left in the multiple through-holes 501. Control the first telescopic rod 21 to be turned on to drive the corresponding first clamping shaft 421 to move upward, driving the first rack 42, multiple ring frames 43, and first ejector rods 431 to move upward. The first ejector rods 431 extend out of the auxiliary outer frame 41 and are inserted into the through-holes 501 to eject the waste, facilitating the cleaning of the waste left in the through-holes 501. After the waste is cleaned, reset the first ejector rods 431;

[0033] Subsequently, a plurality of backplate bodies 51 are cut at the positions of the perforations 501 for laser cutting processing of the microphone head. After a plurality of backplate bodies 51 are cut, the plurality of backplate bodies 51 are left on the substrate 5 for backplate processing. The second telescopic rod 22 is controlled to be opened to drive the corresponding second clamping shaft 46 to move upward, driving the second frame 44 and a plurality of second ejector rods 45 to move upward. The second ejector rods 45 extend out of the auxiliary outer frame 41 to push out the backplate bodies 51, facilitating the blanking of the cut backplate bodies 51. After the blanking is completed, the second ejector rods 45 are reset, and the substrate 5 for backplate processing is removed after losing its positioning.

[0034] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An auxiliary positioning device for a microphone processing laser cutting machine, comprising a base (1), characterized in that: A device base frame (2) is fixedly mounted on the top of the base (1), positioning members (3) are fixedly mounted on both sides of the top of the device base frame (2), and the two positioning members (3) are symmetrically distributed. An auxiliary member (4) is fixedly mounted in the middle of the top of the device base frame (2), and a substrate (5) for back plate processing is arranged between the positioning member (3) and the auxiliary member (4); The positioning member (3) comprises an L-shaped frame (31) and a limiting frame (32); the L-shaped frame (31) and the limiting frame (32) are fixedly mounted on the top of the device base frame (2); the L-shaped frame (31) and the limiting frame (32) are close to each other; a bottom pad (321) is fixedly mounted on the inner side of the limiting frame (32); a telescopic cylinder (33) is fixedly mounted on the top of the L-shaped frame (31); a pressure plate (34) is fixedly mounted on the driving end of the telescopic cylinder (33); and a top pad (341) is fixedly mounted on the bottom end of the pressure plate (34).

2. The auxiliary positioning device for a microphone processing laser cutting machine according to claim 1, characterized in that: The back plate processing substrate (5) is movably clamped between the two limit frames (32), and the upper surface and lower surface of the back plate processing substrate (5) are in contact with the top pad (341) and the bottom pad (321) respectively.

3. The auxiliary positioning device for a microphone processing laser cutting machine according to claim 1, characterized in that: A plurality of evenly distributed back pole plate bodies (51) are movably mounted on the back pole plate processing substrate (5), and a through hole (501) is formed on the back pole plate body (51).

4. The auxiliary positioning device for a microphone processing laser cutting machine according to claim 3, characterized in that: The auxiliary component (4) comprises an auxiliary outer frame (41), the auxiliary outer frame (41) is fixedly mounted at the middle of the top end of the device base frame (2), a first frame (42) is slidably mounted on the inner top of the auxiliary outer frame (41), a first clamping shaft (421) is fixedly mounted on the bottom end of the first frame (42), the bottom end of the first clamping shaft (421) is movably clamped on the bottom end of the auxiliary outer frame (41), a ring frame (43) corresponding to the back plate body (51) is fixedly mounted on the first frame (42), and a first top rod (431) corresponding to the through hole (501) is fixedly mounted on the top end of the ring frame (43). ), the first push rod (431) is movably clamped on the top end of the auxiliary outer frame (41), the inner bottom of the auxiliary outer frame (41) is slidably clamped with a second frame (44), the bottom end of the second frame (44) is fixedly installed with a second clamping shaft (46), the bottom end of the second clamping shaft (46) is movably clamped on the bottom end of the auxiliary outer frame (41), the top end of the second frame (44) is fixedly installed with a second push rod (45) corresponding to the back plate body (51), the second push rod (45) movably passes through the corresponding ring frame (43), and the second push rod (45) is movably clamped on the top end of the auxiliary outer frame (41).

5. The auxiliary positioning device for a microphone processing laser cutting machine according to claim 4, characterized in that: The lower surface of the back plate processing substrate (5) is in contact with the upper surface of the auxiliary outer frame (41).

6. The auxiliary positioning device for a microphone processing laser cutting machine according to claim 4, characterized in that: The device base frame (2) is provided with a first groove (201) corresponding to the first clamping shaft (421), a first telescopic rod (21) is fixedly installed in the first groove (201), and a driving end of the first telescopic rod (21) is fixedly installed with a bottom end corresponding to the first clamping shaft (421).

7. The auxiliary positioning device for a microphone processing laser cutting machine according to claim 4, characterized in that: The device base frame (2) is provided with a second groove (202) corresponding to the second clamping shaft (46), a second telescopic rod (22) is fixedly installed in the second groove (202), and a driving end of the second telescopic rod (22) is fixedly installed with a bottom end corresponding to the second clamping shaft (46).

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