Silicon wafer splitting device

Abstract

The utility model provides a silicon wafer splitting device. The silicon wafer splitting device comprises a bearing table, a fixed suction cup, a calibration assembly, a sliding piece and a cutting piece. The bearing table comprises a bearing surface and a fixed surface opposite to the bearing surface, a limiting through hole penetrating through the bearing table is formed, the limiting through hole extends in the first direction, and the bearing table is further provided with a first limiting guide part and a second limiting guide part which extend in the first direction. The fixed suction cup is embedded in the bearing face of the bearing table. The calibration assembly is arranged on one side of the bearing face of the bearing table and used for marking the position, needing to be cut, of the silicon wafer. The sliding piece is matched with the first limiting guide piece and the second limiting guide piece and slides in the first direction. The cutting piece is arranged on the sliding piece and limited in the limiting through hole. Therefore, through the structure, the cutting position of the silicon wafer can be accurately aligned, and the cutting precision is remarkably improved. In addition, the structure allows the silicon wafer to be cut in any direction and is not limited by the single crystal characteristic of the silicon wafer, and the design flexibility of the semiconductor device is enhanced.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and more particularly, to a silicon wafer cracking device. Background Art

[0002] In the process of semiconductor device manufacturing, accurately observing the microscopic structure of the silicon wafer cross-section is crucial for understanding and optimizing performance. Currently, there are two ways to crack silicon wafers on the market. One is to use a cutting pen with a diamond tip to make a notch at the intersection of the required graphic cross-section position and the silicon wafer boundary, and then manually break it. This method is highly affected by human factors, resulting in insufficient cracking accuracy or silicon wafer damage.

[0003] The other is to place a sharp needle and a ruler for alignment parallel to each other on a platform with support legs. The silicon wafer is placed between the sharp needle and the ruler, with the sharp needle below the silicon wafer. After aligning the ruler with the required graphic, the silicon wafer is pressed down, and the sharp needle is used to crack the silicon wafer to obtain a cross-section. Although this method reduces human factors, there are still problems with cracking accuracy and stability. In addition, due to the single-crystal characteristics of the silicon wafer, both of the above two cracking methods limit the cracking direction and increase the operation difficulty. Summary of the Utility Model

[0004] To overcome the technical problems mentioned in the above technical background, an embodiment of this application provides a silicon wafer cracking device, which includes:

[0005] A carrier table, which includes a bearing surface for bearing the silicon wafer and a fixed surface opposite to the bearing surface. The carrier table is provided with a limiting through-hole penetrating the carrier table. The limiting through-hole extends in a first direction. The carrier table is further provided with a first limiting guide and a second limiting guide extending in the first direction. Among them, the first limiting guide and the second limiting guide are located on opposite sides of the limiting through-hole;

[0006] A fixed suction cup, which is embedded in the bearing surface of the carrier table. The fixed suction cup is used to adsorb and fix the silicon wafer. The fixed suction cups are distributed on opposite sides of the limiting through-hole;

[0007] A calibration component, which is arranged on one side of the bearing surface of the carrier table and is used to mark the position on the silicon wafer that needs to be cut;

[0008] A sliding member, which is respectively engaged with the first limiting guide and the second limiting guide and slides along the first direction. The sliding member is located on the side where the fixed surface of the carrier table is located;

[0009] A cutting member, which is arranged on the sliding member. The cutting member is limited in the limiting through-hole, and the tip of the cutting member protrudes relative to the bearing surface.

[0010] In a possible implementation, the sliding member includes a first sliding member, the cutting member includes a first cutting member, and the first cutting member is disposed on the first sliding member;

[0011] The first sliding member cooperates with the first limit guiding member and the second limit guiding member to push the first cutting member to slide along the first direction in the limit through hole, and the first cutting member is used to leave a cutting guide mark at a position on the silicon wafer that needs to be cut.

[0012] In a possible implementation, the material of the first cutting member includes diamond.

[0013] In a possible implementation, the sliding member further includes a second sliding member, the cutting member further includes a second cutting member, and the second cutting member is disposed on the second sliding member;

[0014] The second sliding member cooperates with the first limit guiding member and the second limit guiding member to push the second cutting member to slide along the first direction in the limit through hole, and the second cutting member is used to cut the silicon wafer based on the cutting guide mark.

[0015] In a possible implementation, one side of the second cutting member facing the fixed suction cup has a cutting portion, and the cutting portion includes an arc-shaped cutting blade.

[0016] In a possible implementation, the silicon wafer splitting device further includes a driving member, and the driving member is disposed close to the second sliding member;

[0017] At least one adsorption hole is disposed on one side of the fixed suction cup close to the bearing surface, and one side of the fixed suction cup away from the bearing surface is connected to the driving member, and the driving member is used to provide adsorption power for the fixed suction cup.

[0018] In a possible implementation, the bearing table is further provided with at least two through holes penetrating the bearing table, and the through holes are distributed on two opposite sides of the limit through hole;

[0019] The fixed suction cup is embedded in the bearing table through the through holes.

[0020] In a possible implementation, the calibration assembly includes a bracket and a calibration member, one end of the bracket is fixed to the bearing table, and one end of the bracket is fixed to the calibration member;

[0021] The shape of the bracket includes an L shape, and the calibration member includes a laser calibrator.

[0022] In a possible implementation, the silicon wafer cleaving device further includes a support member located on one side of the fixed surface of the carrier table;

[0023] The support member includes a first support member, a second support member, a third support member, and a fourth support member. The first support member and the second support member are arranged along the first direction, and the third support member and the fourth support member are also arranged along the first direction. Among them, the first support member and the second support member are located on one side of the limit through hole, and the third support member and the fourth support member are located on the other side of the limit through hole;

[0024] Both ends of the first limit guiding member are fixed to the first support member and the second support member respectively, and both ends of the second limit guiding member are fixed to the third support member and the fourth support member respectively.

[0025] In a possible implementation, the fixed suction cups distributed on opposite sides of the limit through hole have the same shape in the orthographic projection on the carrier table, and the shape of the orthographic projection of the fixed suction cup on the carrier table includes a circle.

[0026] Based on any of the above aspects, an embodiment of the present application provides a silicon wafer cleaving device. In this way, through the above structure, the cutting position of the silicon wafer can be accurately aligned, and the cutting accuracy can be significantly improved. In addition, this structure allows the silicon wafer to be cut in any direction, without being limited by the single crystal characteristics of the silicon wafer, enhancing the flexibility of semiconductor device design. Description of the Drawings

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be referred to in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0028] Figure 1 It is a top view of a silicon wafer cleaving device provided in this embodiment;

[0029] Figure 2 It is a partial structural schematic diagram of the cutting member provided in this embodiment;

[0030] Figure 3 It is a partial structural schematic diagram of a silicon wafer cleaving device provided in this embodiment;

[0031] Figure 4 It is a partial top view of a silicon wafer cleaving device provided in this embodiment;

[0032] Figure 5Structural schematic diagram of a silicon wafer splitting device at a first angle provided in this embodiment;

[0033] Figure 6 Structural schematic diagram of a silicon wafer splitting device at a second angle provided in this embodiment.

[0034] Icons: 1 - silicon wafer splitting device, 10 - carrier table, 20 - fixed suction cup, 30 - calibration component, 40 - sliding member, 50 - cutting member, 60 - driving member, 70 - supporting member, 100 - limiting through hole, 110 - first limiting and guiding member, 120 - second limiting and guiding member, 130 - through hole, 200 - adsorption hole, 300 - bracket, 310 - calibration member, 400 - first sliding member, 4001 - first sliding part, 4002 - first gripping part, 410 - second sliding member, 4101 - second sliding part, 4102 - second gripping part, 500 - first cutting member, 510 - second cutting member, 5101 - cutting blade, 700 - first supporting member, 710 - second supporting member, 720 - third supporting member, 730 - fourth supporting member. Detailed implementation manners

[0035] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are some, but not all, of the embodiments of the present application. Generally, the components of the embodiments of the present application described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0036] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application that is claimed, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the scope of protection of the present application.

[0037] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0038] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "upper" and "lower" is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of this application is usually placed during use. This is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. In addition, terms such as "first" and "second" are only used for differential description and should not be construed as indicating or implying relative importance.

[0039] It should be noted that, without conflict, different features in the embodiments of the present application can be combined with each other.

[0040] In order to solve the technical problems mentioned in the foregoing background art, the inventor innovatively designs the following technical solutions. The specific implementation solutions of the present application will be described in detail below with reference to the drawings.

[0041] Please refer to Figure 1 , Figure 1 which is a top view of a silicon wafer cleaving device 1 provided in this embodiment. The silicon wafer cleaving device 1 includes a carrier table 10, a fixed suction cup 20, a calibration assembly 30, a sliding member 40, and a cutting member 50.

[0042] The carrier table 10 includes a bearing surface for bearing the silicon wafer and a fixed surface opposite to the bearing surface. The carrier table 10 is provided with a limiting through hole 100 penetrating the carrier table 10, and the limiting through hole 100 extends along the first direction A.

[0043] In this embodiment, the silicon wafer is arranged on the bearing surface of the carrier table 10, and the limiting through hole 100 penetrates the carrier table 10, which can allow the cleaving tool to directly act on the silicon wafer.

[0044] It is worth noting that the length of the limiting through hole 100 is not specifically limited here and needs to be selected according to actual requirements.

[0045] The carrier table 10 is further provided with a first limiting guide 110 and a second limiting guide 120 extending along the first direction A. Among them, the first limiting guide 110 and the second limiting guide 120 are located on opposite sides of the limiting through hole 100.

[0046] In this embodiment, the first limiting guide 110 and the second limiting guide 120 are located on one side of the fixed surface of the carrier table 10. The main functions of the first limiting guide 110 and the second limiting guide 120 are to guide and position the cleaving tool to ensure that it acts on the silicon wafer precisely along the predetermined first direction A.

[0047] The fixed suction cup 20 is embedded in the bearing surface of the carrier table 10. The fixed suction cup 20 is used to adsorb and fix the silicon wafer and is distributed on opposite sides of the limiting through hole 100.

[0048] In this embodiment, the fixed suction cup 20 fixes the silicon wafer by the principle of vacuum adsorption. By forming a low-pressure area inside the fixed suction cup 20, the fixed suction cup 20 can firmly adsorb the silicon wafer, reducing damage to the surface of the silicon wafer. At the same time, the design of the fixed suction cup 20 can adapt to silicon wafers of different thicknesses and materials, and can provide sufficient adsorption force to resist the forces that may be generated during the cutting process.

[0049] It should be noted that the position and number of the fixed suction cups 20 are not specifically limited herein and need to be selected according to the size and shape of the silicon wafer to be cut.

[0050] The calibration component 30 is arranged on one side of the bearing surface of the bearing table 10 and is used to mark the position on the silicon wafer that needs to be cut.

[0051] The sliding member 40 is respectively engaged with the first limit guiding member 110 and the second limit guiding member 120 and slides along the first direction A. The sliding member 40 is located on the side where the fixed surface of the bearing table 10 is located. The cutting member 50 is arranged on the sliding member 40. The cutting member 50 is limited in the limit through hole 100, and the tip of the cutting member 50 protrudes relative to the bearing surface.

[0052] In this embodiment, the cutting member 50 is arranged on the sliding member 40 and is limited to move along the first direction A in the limit through hole 100, which can ensure the precise positioning and stability of the cutting member 50 during the cutting process.

[0053] Further, please refer to Figure 1 again. The sliding member 40 includes a first sliding member 400, and the cutting member 50 includes a first cutting member 500. The first cutting member 500 is arranged on the first sliding member 400.

[0054] The first sliding member 400 cooperates with the first limit guiding member 110 and the second limit guiding member 120 to push the first cutting member 500 to slide along the first direction A in the limit through hole 100. The first cutting member 500 is used to leave a cutting guide mark at the position on the silicon wafer that needs to be cut.

[0055] In this embodiment, the first limit guiding member 110 and the second limit guiding member 120 can be sliding rods. The first sliding member 400 includes a first sliding portion 4001 and a first holding portion 4002. The first sliding portion 4001 can be sleeved on the first limit guiding member 110 and the second limit guiding member 120, and the first holding portion 4002 is used to push the first sliding portion 4001 to slide on the first limit guiding member 110 and the second limit guiding member 120.

[0056] The first cutting member 500 is mounted on the first sliding member 400 and is used to leave a cutting guide mark on the silicon wafer. The cutting guide mark provides a clear reference path for the actual cutting. As a pretreatment before the actual cutting operation, it helps to guide the cutting along the predetermined cutting guide mark, thereby improving the cutting accuracy. And through the cooperation of the first sliding member 400 with the first limiting and guiding member 110 and the second limiting and guiding member 120, the accurate movement of the first cutting member 500 along the predetermined first direction A is ensured.

[0057] It should be noted that during the actual operation, the silicon wafer is placed on the fixed suction cup 20. The operator can hold the first holding portion 4002 with both hands and push the first sliding portion 4001 to slide on the first limiting and guiding member 110 and the second limiting and guiding member 120, and drive the first cutting member 500 to the silicon wafer. The first cutting member 500 leaves a cutting mark on the back of the silicon wafer.

[0058] Furthermore, the material of the first cutting member 500 includes diamond.

[0059] In this embodiment, diamond is a mineral formed by carbon atoms arranged in a specific structure. It is the hardest natural substance and has excellent wear resistance and thermal conductivity. The cutter head of the first cutting member 500 can be a diamond rolling cutter head, and its rolling mechanism can reduce the direct impact and pressure on the silicon wafer.

[0060] Furthermore, please refer to again Figure 1 , the sliding member 40 further includes a second sliding member 410, and the cutting member 50 further includes a second cutting member 510. The second cutting member 510 is disposed on the second sliding member 410.

[0061] The second sliding member 410 cooperates with the first limiting and guiding member 110 and the second limiting and guiding member 120 to push the second cutting member 510 to slide in the limiting through hole 100 along the first direction. The second cutting member 510 is used to cut the silicon wafer based on the cutting guide mark.

[0062] In this embodiment, the first limiting and guiding member 110 and the second limiting and guiding member 120 can be slide rods. The second sliding member 410 includes a second sliding portion 4101 and a second holding portion 4102. The second sliding portion 411 can be sleeved on the first limiting and guiding member 110 and the second limiting and guiding member 120. The second holding portion 4102 is used to push the second sliding portion 4101 to slide on the first limiting and guiding member 110 and the second limiting and guiding member 120.

[0063] The second cutting member 510 is mounted on the second sliding member 410 for cutting the silicon wafer based on the cutting guide mark. The first cutting member 500 pre-cuts the cutting guide mark, and the second cutting member 510 completes the final cutting along the cutting guide mark. This not only reduces the need for secondary positioning of the silicon wafer and improves the cutting efficiency, but also ensures the cutting accuracy and consistency, and guarantees the neatness and smoothness of the cutting edge of the silicon wafer.

[0064] It should be noted that during the actual operation process, after the pretreatment by the first cutting member 510, the operator holds the second holding portion 4102 with both hands and pushes the second sliding portion 4101 to slide on the first limiting and guiding member 110 and the second limiting and guiding member 120, and drives the second cutting member 510 to the silicon wafer to complete the cutting of the silicon wafer.

[0065] Further, please refer to Figure 1 and Figure 2 , Figure 2 which is a schematic diagram of the second cutting member 510 provided in this embodiment. The side of the second cutting member 510 facing the fixed suction cup 20 has a cutting portion, and the cutting portion includes an arc-shaped cutting blade 5101.

[0066] In this embodiment, the arc-shaped cutting blade 5101 can provide a smooth and continuous cutting path, reduce the roughness of the cutting surface, and improve the cutting quality. At the same time, the arc-shaped cutting blade 5101 helps to distribute the force more evenly during the cutting process, reduce stress concentration, and prevent the silicon wafer from cracking or generating micro-cracks.

[0067] Further, please refer to Figure 1 and Figure 3 , Figure 3 which is a schematic diagram of the fixed suction cup 20 provided in this embodiment. The silicon wafer splitting device 1 further includes a driving member 60, and the driving member 60 is disposed close to the second sliding member 410. At least one adsorption hole 200 is provided on the side of the fixed suction cup 20 close to the bearing surface, and the side of the fixed suction cup 20 away from the bearing surface is connected to the driving member 60, and the driving member 60 is used to provide adsorption power for the fixed suction cup.

[0068] In this embodiment, the driving member 60 provides adsorption power for the fixed suction cup 20, and the silicon wafer can be effectively adsorbed and fixed through the adsorption hole 200. The driving member 60 and the fixed suction cup 20 can be connected through a hose and are both disposed on the side away from the bearing surface, allowing the driving member 60 to provide power without interfering with the cutting operation.

[0069] It should be noted that the number of the adsorption holes 200 on the fixed suction cup 20 is not specifically limited herein and needs to be selected according to the actual situation.

[0070] Further, please refer to Figure 1 and Figure 4 ,Figure 4 This is a top view of the carrier table 10 provided in this embodiment. The carrier table 10 is further provided with at least two through holes 130 penetrating the carrier table, and the through holes 130 are distributed on opposite sides of the limit through hole 100.

[0071] The fixed suction cup 20 is embedded in the carrier table 10 through the through hole 130.

[0072] In this embodiment, the uniform distribution of the multiple through holes 130 on the carrier table 10 helps to apply the adsorption force more evenly and improve the adsorption stability of the silicon wafer. In addition, the fixed suction cup 20 can be fixed in the through hole 130 by bonding.

[0073] It should be noted that the positions and numbers of the through holes 130 are not specifically limited herein and need to be set according to the size of the silicon wafer and the cutting position.

[0074] Furthermore, please refer to Figure 5 , Figure 5 This is a front view of a silicon wafer splitting device 1 provided in this embodiment. The calibration assembly 30 includes a bracket 300 and a calibration member 310. One end of the bracket 300 is fixed to the carrier table 10, and one end of the bracket 300 is fixed to the calibration member 310. The shape of the bracket 300 includes an L shape, and the calibration member 310 includes a laser calibrator.

[0075] In this embodiment, the laser calibrator usually uses laser as a reference source. Before the silicon wafer is cut, the laser calibrator can mark an accurate cutting line on the surface of the silicon wafer, which not only does not cause physical damage or contamination to the surface of the silicon wafer, but also ensures the accuracy of subsequent cutting.

[0076] Furthermore, please refer to Figure 4 and Figure 6 , Figure 6 This is a left view of a silicon wafer splitting device 1 provided in this embodiment. The silicon wafer splitting device 1 further includes a support member 70, and the support member 70 is located on one side of the fixed surface of the carrier table 10.

[0077] The support member 70 includes a first support member 700, a second support member 710, a third support member 720, and a fourth support member 730. The first support member 700 and the second support member 710 are arranged along the first direction A, and the third support member 720 and the fourth support member 730 are also arranged along the first direction A. Among them, the first support member 700 and the second support member 710 are located on one side of the limit through hole 100, and the third support member 720 and the fourth support member 730 are located on the other side of the limit through hole 100.

[0078] Both ends of the first limit guiding member 110 are fixed to the first support member 700 and the second support member 710 respectively, and both ends of the second limit guiding member 120 (not shown in the figure) are fixed to the third support member 720 and the fourth support member 730 respectively.

[0079] Further, please refer to Figure 1 , the orthographic projection shapes of the fixed suction cups 20 distributed on the opposite sides of the limit through hole 100 on the bearing table 10 are the same, and the orthographic projection shape of the fixed suction cup 20 on the bearing table 10 includes a circle.

[0080] In summary, a wafer cracking device provided by the present application. The wafer cracking device includes a bearing table, fixed suction cups, a calibration assembly, a sliding member and a cutting member. The bearing table includes a bearing surface and an opposite fixed surface, and is provided with a limit through hole penetrating the bearing table, the limit through hole extends along a first direction, and the bearing table is further provided with a first limit guiding member and a second limit guiding member extending along the first direction. The fixed suction cups are embedded in the bearing surface of the bearing table. The calibration assembly is arranged on one side of the bearing surface of the bearing table and is used for marking the position on the wafer to be cut. The sliding member is respectively matched with the first limit guiding member and the second limit guiding member and slides along the first direction. The cutting member is arranged on the sliding member and is limited in the limit through hole. In this way, through the above structure, the cutting position of the wafer can be accurately aligned, and the cutting accuracy can be significantly improved. In addition, this structure allows the wafer to be cut in any direction, is not limited by the single crystal characteristics of the wafer, and enhances the flexibility of semiconductor device design.

[0081] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A silicon wafer splitting device, characterized in that: The silicon wafer splitting device comprises: A carrying platform, the carrying platform comprising a carrying surface for carrying a silicon wafer and a fixed surface opposite to the carrying surface, the carrying platform is provided with a limiting through hole penetrating the carrying platform, the limiting through hole extends along a first direction, the carrying platform is further provided with a first limiting guide and a second limiting guide extending along the first direction, wherein the first limiting guide and the second limiting guide are located at opposite sides of the limiting through hole; A fixed suction cup, which is embedded in the bearing surface of the bearing platform, and is used to absorb and fix the silicon wafer, and is distributed on two opposite sides of the limiting through hole; A calibration component, which is arranged on one side of the carrying surface of the carrying platform and is used to mark the position on the silicon wafer that needs to be cut; a sliding member, respectively cooperating with the first limiting guide member and the second limiting guide member and sliding along the first direction, the sliding member being located on a side where the fixed surface of the bearing platform is located; A cutting member is arranged on the sliding member, the cutting member is limited in the limiting through hole, and the tip of the cutting member protrudes relative to the bearing surface.

2. The silicon wafer splitting device according to claim 1, characterized in that: The sliding member includes a first sliding member, the cutting member includes a first cutting member, and the first cutting member is arranged on the first sliding member; The first sliding member cooperates with the first limiting guide member and the second limiting guide member to push the first cutting member to slide in the limiting through hole along the first direction, and the first cutting member is used to leave a cutting guide mark at a position on the silicon wafer that needs to be cut.

3. The silicon wafer splitting device according to claim 2, characterized in that: The first cutting element is made of a material including diamond.

4. The silicon wafer splitting device according to claim 2, characterized in that: The sliding member further comprises a second sliding member, and the cutting member further comprises a second cutting member, wherein the second cutting member is arranged on the second sliding member; The second sliding member cooperates with the first limiting guide member and the second limiting guide member to push the second cutting member to slide in the limiting through hole along a first direction, and the second cutting member is used to cut the silicon wafer based on the cutting guide mark.

5. The silicon wafer splitting device according to claim 4, characterized in that: The second cutting member has a cutting portion on one side facing the fixed suction cup, and the cutting portion includes an arc-shaped cutting blade.

6. The silicon wafer splitting device according to claim 4, characterized in that: The silicon wafer splitting device further comprises a driving member, and the driving member is arranged close to the second sliding member; At least one adsorption hole is arranged on a side of the fixed suction cup close to the bearing surface, and a side of the fixed suction cup away from the bearing surface is connected to the driving member, and the driving member is used to provide adsorption power for the fixed suction cup.

7. The silicon wafer splitting device according to claim 1, characterized in that: The carrying platform is also provided with at least two through holes penetrating the carrying platform, and the through holes are distributed on two opposite sides of the limiting through hole; The fixed suction cup is embedded in the bearing platform through the through hole.

8. The silicon wafer splitting device according to claim 1, characterized in that: The calibration assembly includes a bracket and a calibration piece, one end of the bracket is fixed to the bearing platform, and one end of the bracket is fixed to the calibration piece; The shape of the bracket includes an L-shape, and the calibration piece includes a laser calibrator.

9. The silicon wafer splitting device according to claim 1, wherein: The silicon wafer splitting device further includes a support member, and the support member is located on one side of the fixed surface of the supporting platform; The support member includes a first support member, a second support member, a third support member and a fourth support member, the first support member and the second support member are arranged along the first direction, and the third support member and the fourth support member are also arranged along the first direction, wherein the first support member and the second support member are located on one side of the limiting through hole, and the third support member and the fourth support member are located on the other side of the limiting through hole; Two ends of the first position-limiting guide are respectively fixed to the first support member and the second support member, and two ends of the second position-limiting guide are respectively fixed to the third support member and the fourth support member.

10. The silicon wafer splitting device according to claim 1, characterized in that: The orthographic projection shapes of the fixed suction cups distributed on opposite sides of the limiting through hole on the bearing platform are the same, and the orthographic projection shape of the fixed suction cups on the bearing platform includes a circle.

Images