Silicon wafer slicing and liquid spraying structure and cutting system

Abstract

The utility model relates to a silicon wafer slice liquid spraying structure and a cutting system.The silicon wafer slice liquid spraying structure comprises a mortar pipe and a spraying assembly, the spraying assembly comprises a plurality of liquid inlets and a shared liquid outlet, at least one liquid inlet is connected with a cleaning water pipeline, each liquid inlet is provided with a control valve, and the mortar pipe is connected with the mortar pipe; and a spray head is mounted on the liquid outlet. By means of the silicon wafer slicing liquid spraying structure and the silicon wafer cutting system, cutting cooling liquid can be discharged more evenly, meanwhile, the liquid outlet covering range in the cutting process is enlarged, and accumulation of silicon powder in a mortar pipe and at the cutting position of a diamond wire is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of photovoltaic technology, and more specifically, to a liquid spraying structure for slicing silicon wafers and a cutting system. Background Art

[0002] In the photovoltaic industry, the slicing process is an important link in the manufacturing of silicon wafers. The quality of silicon wafers depends on the cutting process and the material lifting process in the slicing process. Cutting coolant is particularly important in the cutting process and plays a crucial role in both the cutting process and the material lifting process.

[0003] During the cutting process, the cutting coolant ejected through the mortar pipe device plays a role in cooling, lubricating, and rapidly cooling the surface of the diamond wire, thereby improving the cutting force of the diamond wire and removing the silicon powder accumulation generated at the cutting position. At the same time, the flow rate, direction, etc. of the cutting coolant controlled by the mortar pipe device are particularly critical to the product quality of silicon wafers.

[0004] The existing mortar pipe device has the following disadvantages:

[0005] The liquid discharge of the cutting coolant is uneven;

[0006] The angle of the liquid discharge position during the cutting process is single, and the coverage area is low;

[0007] Silicon powder hard blocks are likely to accumulate inside the mortar pipe device. Utility Model Content

[0008] The purpose of the present application is to provide a liquid spraying structure for slicing silicon wafers and a silicon wafer cutting system to solve the above-mentioned technical problems.

[0009] To achieve the above purpose, in a first aspect, the present utility model provides a liquid spraying structure for slicing silicon wafers, including: a mortar pipe, and a spraying component. The spraying component includes a plurality of liquid inlets and a shared liquid outlet. At least one of the liquid inlets is connected to a cleaning water pipeline, a control valve is provided on each liquid inlet, and a spray head is installed on the liquid outlet.

[0010] Based on the mortar pipe, by adding a spraying component, liquid volume can be supplemented and the liquid spraying volume can be increased.

[0011] By connecting a cleaning water pipe to one of the liquid inlets, it is possible to increase the path for pure water cleaning, while increasing the liquid output volume, providing a basic condition for the switching between cutting coolant and cleaning water. Through the pure water introduced into the cleaning water pipe, different application scenarios can be switched, and flushing can be carried out during the cutting process. On the one hand, the cutting part can be flushed to reduce the adsorption force between the slices, thereby reducing the friction between the silicon wafer and the cutting diamond wire, greatly reducing the bright line defects generated during the material lifting process; on the other hand, the spraying component can be flushed to avoid the accumulation of silicon powder inside the mortar pipe device.

[0012] By providing control valves on each liquid inlet, it is convenient to control the on-off of the liquid inlet channels of each liquid inlet, thus facilitating the switching control between cleaning and cutting.

[0013] By installing a nozzle on the liquid outlet, the coverage range of the spraying component can be increased, enabling the cutting coolant and / or pure water to be output in a shower-like manner, ensuring the cleaning effect and the cutting cooling effect.

[0014] In an alternative embodiment, the spraying component includes two liquid inlets. One of the liquid inlets is connected to a cleaning water pipe, and the other liquid inlet is connected to a cutting coolant pipe. The liquid outlet and the two liquid inlets form a Y-shaped structure.

[0015] Through this setting method, the spraying component can be externally connected to two different media simultaneously to switch between flushing and cutting operations.

[0016] In an alternative embodiment, the control valve includes a manual valve. The manual valve includes a screwing switch, and the screwing switch is installed on the liquid inlet.

[0017] The knob switch and the manual valve facilitate the switching control of different ejected media, which is beneficial to improving the convenience of switching operation.

[0018] In an alternative embodiment, the included angle between the two liquid inlets is not less than 90°.

[0019] In an alternative embodiment, the liquid inlet and the liquid outlet are of an integral structure.

[0020] In an alternative embodiment, the spraying component further includes an inlet nozzle and an outlet nozzle. The inlet nozzle and the outlet nozzle are respectively detachably screwed to the liquid inlet and the liquid outlet.

[0021] In an alternative embodiment, the outlet nozzle and the nozzle are made of wear-resistant materials.

[0022] In an alternative embodiment, the mortar pipe and the spraying assembly are installed on both sides of the wafer cutting rod, and the spraying assembly is arranged above the mortar pipe.

[0023] In a second aspect, the present utility model provides a silicon wafer cutting system, including the silicon wafer slicing liquid spraying structure according to any one of the foregoing embodiments, and a cutting diamond wire for cutting and slicing the wafer cutting rod.

[0024] In an alternative embodiment, the orientation of the mortar pipe corresponds to the cutting part of the cutting diamond wire;

[0025] The wafer cutting rod is supported and fixed on a wafer carrier, and the spraying range of the nozzle correspondingly covers the wafer carrier and the wafer cutting rod.

[0026] By means of the silicon wafer slicing liquid spraying structure and the silicon wafer cutting system in the present utility model, it is possible to make the cutting coolant liquid outlet more uniform, while increasing the coverage range of the liquid outlet during the cutting process, and reducing the accumulation of silicon powder inside the mortar pipe and at the cutting part of the diamond wire.

[0027] Other features and advantages of the present application will be described in detail in the subsequent specific embodiment part. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative efforts.

[0029] Figure 1 It is a schematic structural diagram of the silicon wafer slicing liquid spraying structure in the present application;

[0030] Figure 2 It is a schematic structural diagram of the spraying assembly in the present application.

[0031] Reference Signs:

[0032] 1 - Mortar pipe;

[0033] 2 - Spraying assembly; 21 - Liquid inlet; 22 - Liquid outlet; 23 - Control valve; 24 - Screw switch; 25 - Liquid inlet nozzle; 26 - Liquid outlet nozzle;

[0034] 3 - Cleaning water pipeline;

[0035] 4 - Nozzle;

[0036] 5 - Cutting coolant pipeline;

[0037] 6 - Wafer cutting rod;

[0038] 7 - cutting diamond wire;

[0039] 8 - crystal carrier. Detailed implementation manners

[0040] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are some, but not all, of the embodiments of the present application. Usually, the components of the embodiments of the present application described and illustrated herein can be arranged and designed in various different configurations.

[0041] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of this application is usually placed when in use. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. In addition, terms such as "first", "second", etc. are only used for descriptive distinction and cannot be understood as indicating or implying relative importance.

[0042] In the description of the present application, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "connect" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0043] Refer to Figure 1 - Figure 2 , the silicon wafer slicing liquid spraying structure in the present application mainly includes a mortar pipe 1 and a spraying assembly 2. The spraying assembly 2 includes a plurality of liquid inlets 21 and a common liquid outlet 22. At least one of the liquid inlets 21 is connected to a cleaning water pipeline 3, and a control valve 23 is provided on each liquid inlet 21, and a nozzle 4 is installed on the liquid outlet 22.

[0044] Specifically, the spraying assembly 2 includes two liquid inlets 21. One of the liquid inlets 21 is connected to the cleaning water pipeline 3, and the other liquid inlet 21 is connected to a cutting coolant pipeline 5. The liquid outlet 22 and the two liquid inlets 21 are in a Y-shaped structure. By connecting the cleaning water pipeline 3 and the cutting coolant pipeline 5 respectively through the two liquid inlets 21, pure water cleaning water and cutting coolant can be introduced to the spraying assembly 2. Combining the control valves 23 provided on each liquid inlet 21, the switching control of the liquid medium at the liquid outlet 22 can be performed.

[0045] The control valve 23 includes a manual valve, and the manual valve includes a screwing switch 24 which is installed on the liquid inlet 21. This enables convenient control of the on / off of pure water and cutting coolant on the spraying assembly 2 through the screwing switch 24.

[0046] To ensure the operating space for the manual valve, the angle between the two liquid inlets 21 is not less than 90°, allowing for convenient screwing of the valve switch to control rapid switching in different application scenarios.

[0047] The liquid inlet 21 and the liquid outlet 22 are of an integral structure. Preferably, the liquid inlet 21 and the liquid outlet 22 are integrally formed by machining, enabling the two liquid inlet channels to share the liquid outlet channel and allowing for the introduction and ejection of the medium in different scenarios.

[0048] To facilitate the connection of pipes, the spraying assembly 2 further includes a liquid inlet nozzle 25 and a liquid outlet nozzle 26. The liquid inlet nozzle 25 is detachably screwed onto the liquid inlet 21, and the liquid outlet nozzle 26 is detachably screwed onto the liquid outlet 22.

[0049] Considering the angle that the cutting spray liquid contains silicon powder particles, to enhance wear resistance and extend the service life of the spraying assembly 2, both the liquid outlet nozzle 26 and the nozzle 4 are made of wear-resistant metal materials. At the same time, the integrally formed Y-shaped distributed liquid inlet 21 and liquid outlet 22 are also made of wear-resistant metal materials, which can withstand the erosion of particle-containing fluid for a long time.

[0050] The silicon wafer slicing liquid spraying structure in the present utility model is applied in the slicing process of the ingot 6. Specifically, the mortar pipe 1 and the spraying assembly 2 are installed on both sides of the ingot 6 being cut, and the spraying assembly 2 is arranged above the mortar pipe 1.

[0051] Through this setting form, the mortar pipe 1 can maintain basic cutting cooling, while the spraying assembly 2 sprays the crystal carrier 8 and the ingot 6 to ensure the cutting and flushing effect in the form of increasing the spraying amount and enlarging the coverage range.

[0052] In the present utility model, to address the uneven liquid outlet of the cutting coolant, an additional spraying assembly 2 is adopted for liquid volume compensation.

[0053] On the premise that the liquid outlet position angle of the mortar pipe 1 is single and the coverage area is low during the original cutting process, by installing a nozzle 4 on the liquid outlet 22 of the spraying assembly 2, the cutting coolant and / or pure water are sprayed out in a shower-like manner.

[0054] From the perspective of the easy formation of hard silicon powder accumulations inside the mortar pipe 1 device, to prevent silicon powder accumulations, a liquid inlet switching mechanism is adopted in the spraying assembly 2, and at least one liquid inlet 21 is connected to the cleaning water pipe 3, so that the liquid discharged from the spraying assembly 2 can be switched between the cutting coolant where silicon powder is likely to accumulate and pure water for cleaning.

[0055] Control valves 23 are provided on each liquid inlet 21, forming a three-way structure with a switchable valve to control the on / off of the pure water / cutting coolant passage, and manually switch the liquid inlet type before the cutting / feeding process according to different usage scenarios.

[0056] The present utility model also provides a silicon wafer cutting system, including the above-mentioned silicon wafer slicing liquid spraying structure and a cutting diamond wire 7, and the ingot 6 is cut and sliced by the cutting diamond wire 7.

[0057] The orientation of the mortar pipe 1 corresponds to the cutting part of the cutting diamond wire 7, the ingot 6 is supported and fixed on the ingot holder 8, and the spraying range of the nozzle 4 correspondingly covers the ingot holder 8 and the ingot 6.

[0058] On the basis of the original mortar pipe 1, an additional outlet of the spraying assembly 2 is added, and in a shower spraying mode, the ingot holder 8, the ingot 6 and the cutting part are cooled, lubricated, etc., which can effectively reduce the temperature rise of the ingot 6 during cutting, avoid problems such as liquid breakage and low coverage area of the mortar pipe 1, and the implementation steps are as follows:

[0059] The cutting liquid is split through the spraying assembly 2 in the cutting liquid incoming direction, one path of the cutting liquid enters the mortar pipe 1, and the other path enters the spraying assembly 2. The supply of the cutting liquid is controlled by rotating the switch 24 of the control valve 23, so as to perform double-liquid spraying during the cutting process;

[0060] After cutting is completed, the supply of the cutting coolant is stopped by rotating the switch 24 of the control valve 23, so that pure water enters the spraying assembly 2 to wash both sides of the silicon wafer;

[0061] A three-way switchable valve mechanism with a switch is added to the water inlet pipe to switch the usage scenarios of pure water / cutting coolant, and manually switch the liquid inlet type before the cutting / feeding process.

[0062] The spraying assembly 2 of the double-spray mechanism can greatly increase the spraying coverage area, so that the ingot 6 has a cooling effect during cutting, and a similar atomized environment is formed in the cutting chamber, greatly reducing the dust floating in the cutting chamber and reducing the temperature of the overall cutting environment. By increasing the heat dissipation, the cutting diamond wire 7 cools faster and has stronger cutting ability.

[0063] Through the unidirectional spraying and bidirectional liquid inlet structure of the spraying assembly 2, the cleaning function of the spraying assembly 2 can be effectively given.

[0064] During the material lifting process, through the spraying method, the concentration of the cutting fluid between wafers can be reduced, and the adsorption capacity can be weakened, thereby reducing the friction between the wafers and the cutting wire 7, and greatly reducing the bright line defects generated during the material lifting process. At the same time, it can effectively reduce the wire breakage abnormality caused by insufficient cutting fluid during the cutting process, reduce the defective products produced by the wafers during the cutting process / material lifting process, and improve the yield of the product.

[0065] It should be noted that, without conflict, the features in the embodiments of the present application can be combined with each other.

[0066] The above are only the preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A liquid spraying structure for silicon wafer slicing, characterized in that: include: A mortar pipe and a spray assembly, wherein the spray assembly includes a plurality of liquid inlets and a common liquid outlet, wherein at least one of the liquid inlets is connected to a cleaning water pipeline, each of the liquid inlets is provided with a control valve, and a spray head is installed on the liquid outlet.

2. The liquid spraying structure for silicon wafer slicing according to claim 1, characterized in that: The injection assembly includes two liquid inlets, one of which is connected to a cleaning water pipeline, and the other is connected to a cutting coolant pipeline, and the liquid outlet and the two liquid inlets are in a Y-shaped structure.

3. The liquid spraying structure for silicon wafer slicing according to claim 1, characterized in that: The control valve comprises a manual valve, and the manual valve comprises a rotary switch, and the rotary switch is installed on the liquid inlet.

4. The liquid spraying structure for silicon wafer slicing according to claim 1, characterized in that: The angle between the two liquid inlets is not less than 90°.

5. The liquid spraying structure for silicon wafer slicing according to claim 1, characterized in that: The liquid inlet and the liquid outlet are an integrated structure.

6. The liquid spraying structure for silicon wafer slicing according to claim 1, characterized in that: The injection assembly further comprises a liquid inlet nozzle and a liquid outlet nozzle, wherein the liquid inlet nozzle and the liquid outlet nozzle are detachably screwed to the liquid inlet and the liquid outlet, respectively.

7. The liquid spraying structure for silicon wafer slicing according to claim 6, characterized in that: The liquid outlet nozzle and the spray head are made of wear-resistant material.

8. The liquid spraying structure for silicon wafer slicing according to claim 1, characterized in that: The mortar pipe and the injection assembly are installed on both sides of the cut crystal rod, and the injection assembly is arranged above the mortar pipe.

9. A silicon wafer cutting system, characterized in that: The invention comprises a silicon wafer slicing liquid spraying structure as claimed in any one of claims 1 to 8, and a cutting diamond wire, wherein the cutting diamond wire is used to slice a crystal rod.

10. The silicon wafer cutting system according to claim 9, characterized in that: The orientation of the mortar tube corresponds to the cutting position of the cutting diamond wire; The crystal rod support is fixed on the crystal tray, and the spray range of the nozzle covers the crystal tray and the crystal rod accordingly.

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