Silicon wafer boxing mechanism and packaging machine
By designing a silicon wafer boxing mechanism including guide plates and guide rods, the problems of complex structure and inaccurate positioning of the existing boxing mechanism are solved, and accurate horizontal embedding and efficient boxing of the silicon wafer are realized, avoiding secondary pollution.
Patent Information
- Application Number
- CN202420899676.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-28
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-04-28
AI Technical Summary
The existing silicon wafer boxing mechanism has complex structure and insensitive components, which leads to inaccurate positioning when the silicon wafer is loaded into the foam box horizontally, resulting in misaligned placement, affecting the production rhythm, and may cause secondary contamination of the silicon wafer.
A silicon wafer boxing mechanism is designed, including a boxing position, a boxing part and a guide assembly. The boxing part is equipped with a boxing table and a guide assembly. The guide assembly is composed of a guide plate and a guide rod arranged along the periphery of the box. Through the rotation of the guide plate and the installation of the guide rod, the horizontal embedding of the silicon wafer is realized. At the same time, vertical guide cylinders and horizontal guide cylinders are provided to control the movement of the guide plate and guide rods, and are equipped with sensors to monitor the placement of the wafer.
The boxing mechanism is simple and precise in combination. The silicon wafer can be introduced into the material box at one time without personnel assistance. It is safe and simple in operation, has good boxing consistency and high efficiency, and avoids secondary pollution to the silicon wafer.
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Figure CN223031372U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the technical field of solar photovoltaic packaging, and particularly relates to a wafer loading mechanism and a packaging machine provided with the loading mechanism. Background Art
[0002] In the existing loading mechanism, due to the complex structural design and insensitive cooperation between components, when the wafers are horizontally loaded into the foam box, inaccurate positioning leads to misplacement, resulting in the wafers being unable to be loaded into the box at one time and requiring manual assistance for adjustment before flowing into the next process. This seriously affects the production rhythm and also causes secondary contamination of the wafers during manual assisted loading. Summary of the Invention
[0003] This application provides a wafer loading mechanism and a packaging machine provided with the loading mechanism, solving the technical problems of poor loading quality and easy misalignment during wafer loading in the existing packaging process.
[0004] To solve at least one of the above technical problems, the technical solution adopted in this application is:
[0005] A wafer loading mechanism for horizontally embedding wafers into a packaging box, at least including:
[0006] A loading position;
[0007] A loading part configured at the loading position, which is provided with a loading table and a guiding component;
[0008] The guiding component includes guiding pieces and guiding rods arranged along the periphery of the packaging box;
[0009] The suspended end of the guiding piece is obliquely placed inside the packaging box and can rotate axially along its mounting axis to guide the wafers to be horizontally embedded into the packaging box;
[0010] The guiding rod can support the wafers to be horizontally placed above the guiding piece.
[0011] Further, the guiding piece is guided and fixed above the loading table and extends obliquely outward from bottom to top along the height direction of the packaging box.
[0012] Further, a vertical guiding cylinder for controlling the up and down movement of the guiding piece is also provided on the guiding fixed frame; and a sensor for monitoring whether there are wafers placed inside the packaging box is provided at the top of the vertical guiding cylinder on one side.
[0013] Further, a vertical guiding cylinder for controlling the up and down movement of the guiding piece along the vertical direction and a horizontal guiding cylinder for horizontally moving along the sliding direction of the loading table are also provided on the guiding fixed frame.
[0014] Furthermore, the guide rods are arranged at each vertex of the box loading platform, and are driven by a push cylinder to be arranged horizontally along the sliding direction of the box loading platform.
[0015] Furthermore, the movable ends of all the guide rods are arranged toward the middle position of the silicon wafer; and the pushing cylinder is arranged below the box loading platform.
[0016] Furthermore, it also includes a box loading slide rail that cooperates with the box loading platform, and the box loading position is located at one end of the box loading slide rail; and a positioning block for clamping the packaging box is also provided on the box loading platform.
[0017] Furthermore, it also includes a finished product section for transporting silicon wafers after packaging, which has:
[0018] Finished product conveyor line, which is arranged in parallel with the cartoning slide rail;
[0019] A finished product carrier, placed on the finished product conveying line and slidably matched with the finished product conveying line;
[0020] A finished product position is provided at one end of the finished product conveying line, and the finished products are arranged side by side at the boxing position.
[0021] Furthermore, it also includes a transfer section arranged across the box loading slide rail and the finished product conveying line, which is equipped with a transfer assembly, a clamping claw for clamping a silicon wafer or a packaging box, and a pressing block located between the clamping claws;
[0022] The transfer assembly controls the clamping claw to move back and forth between the box loading position and the finished product position;
[0023] The pressing block can push the silicon wafer downward when the silicon wafer is embedded in the packaging box.
[0024] A packaging machine is provided with the cartoning mechanism as described above.
[0025] The silicon wafer boxing mechanism designed by the present application has a simple structure and precise coordination, can introduce silicon wafers into the material box at one time, does not require human assistance, is safe and simple to operate, has good boxing consistency, is highly efficient, and avoids the problem of secondary contamination of silicon wafers. The present application also proposes a packaging machine equipped with the boxing mechanism. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 is a three-dimensional diagram of a box loading unit according to an embodiment of the present application;
[0027] Figure 2 It is a three-dimensional diagram of a box loading portion according to an embodiment of the present application.
[0028] In the figure:
[0029] 100. Cartoning mechanism; 10. Cartoning section; 11. Cartoning slide rail
[0030] 12. Cartoning position; 13. Cartoning table; 14. Positioning block
[0031] 15. Guiding component; 151. Guiding piece; 152. Guiding fixing bracket
[0032] 153. Vertical guiding cylinder; 154. Horizontal guiding cylinder; 155. Guiding rod
[0033] 156. Pushing cylinder; 16. Sensor; 17. Installation platform
[0034] 20. Finished product section; 21. Finished product conveyor line; 22. Finished product position
[0035] 23. Finished product carrier; 24. Fixed bracket; 30. Transfer section
[0036] 31. Transfer component; 32. Claw; 33. Pressing block
[0037] 40. Packaging box Detailed implementation mode
[0038] The present application will be described in detail below with reference to the accompanying drawings and specific embodiments.
[0039] This embodiment provides a silicon wafer cartoning mechanism, as Figure 1 shown, a cartoning mechanism 100 for loading bagged silicon wafers into a packaging box 40, which includes a cartoning section 10, a finished product section 20 and a transfer section 30. Among them, the cartoning section 10 and the finished product section 20 are parallel and are staggered at the head and tail, and the transfer section 30 arranged across the width direction of the cartoning section 10 and the finished product section 20 is used for reciprocating transportation.
[0040] In this embodiment, the silicon wafers are collectively referred to as a stack of stacked substrates. They can be substrates with a square structure or substrates with a rectangular structure, and all of them comply with all the units in the present application and are within the protection scope of this case. Correspondingly, the packaging box 40 is a foam box, the upper end face of which is an open structure and is adapted to the structure of the silicon wafers, and the surrounding is a box body structure surrounded by foam, which is convenient for subsequent plastic film packaging, and the specific drawings are omitted. The outer shape of the packaging box 40 is the same as that of the silicon wafers, both being a square structure or a rectangular structure. For the clamping or transfer of rectangular silicon wafers, other components in the present application can be applied to this type of structure, and only by changing its regular width, the effect can be ensured, and the corresponding drawings are omitted; only square-structured silicon wafers are taken as examples below. The silicon wafers referred to in the present application can be original silicon wafers or silicon wafers with upper and lower packaging materials. Among them, the packaging materials include but are not limited to corrugated boards, sulfur-free papers, packaging films, etc., and are collectively referred to as silicon wafers hereinafter.
[0041] The silicon wafer is transferred by the transfer unit 30 to the boxing section 10 in the boxing mechanism 100 for automatic boxing, and then flows out from the unloading port in the finished product section 20 to prepare for the next film process. During the entire boxing process, the transfer unit 30 driven by the sliding guide rail across its conveyor line clamps the silicon wafer for transportation. The entire structure and mechanism 100 is not only simple in structure and precise in coordination, but also can guide the silicon wafer into the material box at one time without the need for human assistance, avoiding the problem of secondary contamination of the silicon wafer; the boxing consistency is good and the efficiency is high.
[0042] Specifically, a box loading slide 11 is provided in the box loading section 10, and a finished product conveying line 21 parallel to the box loading slide 11 is provided in the finished product section 20, and one end of the box loading slide 11 is connected end to end with one end of the finished product conveying line 21, that is, the box loading position 12 and the finished product position 22 are arranged side by side and staggered. This structure not only facilitates the delivery of product materials, but also saves the number of parts, and also saves the space occupied by the entire box loading mechanism 100, has a simple structure, safe and convenient operation, convenient transportation, and reduces the number of turnovers and turnover space.
[0043] Among them, the transfer part 30 is arranged across the width of the box loading slide 11 and the finished product conveying line 21, a box loading position 12 is provided on the box loading slide 11, and a finished product position 22 is provided on the finished product conveying line 21. The box loading position 12 and the finished product position 22 are arranged in the same row as the horizontal frame of the transfer part 30, and are both constructed directly below the horizontal frame of the transfer part 30, so as to enable movability connection between the box slide 11 and the finished product conveying line 21.
[0044] Specifically, the box loading slide rail 11 is fixed on the mounting platform 17, and is mainly used to drive the box loading platform 13 to transfer the empty packaging box 40 to the box loading position 12, and then return to the storage position of the empty packaging box 40 to retrieve the packaging box 40. The lower end surface of the box loading platform 13 is slidably matched with the box loading slide rail 11, and the box loading platform 13 is driven by a motor to reciprocate along the length direction of the box loading slide rail 11. The finished product conveying line 21 is fixed on the fixed bracket 24 and is located on one side of the box loading slide rail 11, and the fixed bracket and the mounting platform 17 are located on the same chassis; the finished product conveying line 21 is mainly used to move the finished products formed by the packaging box 40 carrying silicon wafers from the finished product position 22 to the unloading port.
[0045] The loading position of the packaging box 40 is set at one end of the box loading slide 11 away from the box loading position 12, and is placed on the box loading table 13 transferred to the loading position. The empty packaging box 40 and the box loading table 13 are transferred along the box loading slide 11 to the box loading position 12 and are stationary, waiting for the silicon wafers clamped by the clamping claws 32 in the transfer part 30 to be transferred to the top of the box loading position 12, waiting for box loading.
[0046] like Figure 2As shown in the figure, on the upper end surface of the cartoning table 13, there are positioning blocks 14 for clamping and fixing the packaging box 40. The positioning blocks 14 are arranged at the middle positions of the four sides of the cartoning table 13, and are controlled by a cylinder placed below the cartoning table 13 to expand and contract along the middle line position direction of the side of the cartoning table 13, so as to clamp the outer side of the packaging box 40 or release the packaging box 40.
[0047] The cartoning part 10 further includes a guiding assembly 15 arranged above the cartoning position 12 and used for guiding the silicon wafers to be horizontally embedded in the packaging box 40. The guiding assembly 15 includes a plurality of guiding pieces 151 and a plurality of guiding rods 155 arranged along the periphery of the packaging box 40. Among them, the suspended ends of all the guiding pieces 151 are obliquely placed inside the packaging box 40. The installation shaft driving the guiding piece 151 can make its suspended end rotate along the axis of its installation shaft from the side close to the silicon wafer towards the side close to the outer wall surface of the packaging box 40, so as to guide the silicon wafers to be horizontally embedded into the packaging box 40. All the guiding rods 155 are horizontally arranged transversely. They can support the silicon wafers to be horizontally placed above the suspended ends of the guiding pieces 151. Mainly, they horizontally support and suspend the silicon wafers in the space surrounded by the guiding pieces 151 before the silicon wafers come into contact with the guiding pieces 151. After the position of the silicon wafers is confirmed, the guiding rods 155 are horizontally withdrawn, so that the silicon wafers come into contact with the inclined surfaces of the guiding pieces 151, and are slowly guided and slid into the packaging box 40 as the guiding pieces 151 rotate from the inclined direction to the vertical direction.
[0048] The guiding pieces 151 are configured by a guiding fixing frame 152 directly above the cartoning position 12, and their suspended ends are obliquely arranged inside the packaging box 40. The guiding fixing frame 152 is fixed on the installation platform 17 and spans the width of the cartoning slide rail 11. There are two groups of it and they are arranged opposite to each other on both sides of the cartoning table 13. On each guiding fixing frame 152, there are two guiding pieces 151 arranged opposite to each other, and all the guiding pieces 151 are obliquely arranged from top to bottom through the installation shaft, that is, the preset initial inclined position of their suspended ends is set on the side close to the silicon wafers, that is, inclined towards the middle position in the packaging box 40.
[0049] When guiding the silicon wafers, its suspended ends can rotate from the side close to the silicon wafers towards the side close to the outer wall surface of the packaging box 40. The two guiding pieces 151 expand obliquely outwards from bottom to top along the height direction of the packaging box, so as to form a guiding space with a trapezoidal structure with a larger upper end surface and a smaller lower end surface, so as to facilitate the silicon wafers sleeved in the storage bag to move vertically downwards along its guiding surface and smoothly slide into the packaging box 40. When the suspended ends of the guiding pieces 151 rotate from the inclined setting on the side close to the silicon wafers to the vertical setting along the outer wall surface of the packaging box 3, it means that the silicon wafers are vertically embedded into the packaging box 40, and then the guiding pieces 151 are controlled to move up and down vertically and leave the packaging box 40, thus completing the cartoning of the silicon wafers.
[0050] On the guiding fixing frame 152, there are also provided a vertical guiding cylinder 153 for controlling the synchronous up-and-down lifting of the guiding piece 151 along the vertical direction and a horizontal guiding cylinder 154 for horizontally moving along the length direction of the cartoning slide rail 11. The guiding piece 151 is a structure that slopes downward from top to bottom, and its inclination angle is preset in advance, mainly to facilitate the precise embedding of the silicon wafers into the packaging box 40. The angle is not specifically limited herein.
[0051] At the top of the vertical guiding cylinder 153 on one side, there is provided a sensor 16 for monitoring whether there are silicon wafers placed in the packaging box 40. The sensor 16 can emit a light beam that is obliquely irradiated into the packaging box 40 to monitor whether there are silicon wafers embedded in the packaging box 40.
[0052] As Figure 2 As shown, there are two structures of guiding pieces 151 in the guiding assembly 15. One structure is a wide guiding piece 151, and the other structure is a narrow guiding piece 151. The lengths of the two guiding pieces 151 are the same. On each side of the guiding fixing frame 152, there is provided a set of narrow guiding pieces 151 arranged in alignment along the length direction of the cartoning slide rail 11 and a wide guiding piece 151 arranged along the width direction of the cartoning slide rail 11. Both are controlled by the same vertical guiding cylinder 153 to move up and down along the vertical direction and are controlled by the same horizontal guiding cylinder 154 to move horizontally along the length direction of the cartoning slide rail 11.
[0053] The guiding rods 155 are horizontally arranged transversely along the length direction of the cartoning slide rail 11. They are configured at the four top corners of the cartoning table 13, and the movable ends of all the guiding rods 155 are horizontally placed towards the middle position side of the silicon wafers. The guiding rods 155 are located inside the narrow guiding pieces 151 and outside the wide guiding pieces 151 on the same side, that is, each guiding rod 155 is horizontally transversely arranged at the gap between the adjacent narrow guiding piece 151 and wide guiding piece 151. The purpose is to support and hold the silicon wafers so that the silicon wafers can be stably transferred between the transfer part 30 and the lifting and supporting plane formed by the four guiding rods 155 at the cartoning position 12, enabling the silicon wafers to be horizontally and stably placed directly above the packaging box 40. Then, after the transfer part 30 retracts, the guiding rods 155 contract and transfer the silicon wafers to the guiding plate formed by the combination of the guiding pieces 151 and into the packaging box 40.
[0054] The guiding pieces 151 and the guiding rods 155 are respectively driven by different cylinders to slide along the length direction of the cartoning slide rail 11. In this embodiment, below each guiding fixing frame 152, there is provided a pair of symmetrically arranged guiding rods 155, which are controlled by the same pushing cylinder 156 to move along the length direction of the cartoning slide rail 11. Among them, the pushing cylinders 156 on both sides are arranged in alignment below the cartoning table 13.
[0055] The finished product position 22 is located at one end of the finished product conveyor line 21 close to the packaging position 12, and is provided with a liftable and movable finished product carrier 23. When the silicon wafer is boxed at the boxing position 12 to form a finished silicon wafer, the transfer unit 30 will clamp the packaging box 40, horizontally move it to the finished product carrier 23 at the highest limit position, release the clamping jaw and place the packaging box 40 of the finished silicon wafer on the finished product carrier 23, and then the transfer unit 30 rises and retracts. The finished product carrier 23 then drives the finished silicon wafer downward, places the finished silicon wafer on the finished product conveyor line 21 and then continues to move downward and away from the finished silicon wafer. Thus, the finished silicon wafer is stably placed on the finished product conveyor line 21, and then is driven by the finished product conveyor line 21 to move forward to the discharge port and flow to the finished product area located outside the packaging machine.
[0056] The transfer unit 30 is equipped with a transfer assembly 31 that can reciprocate vertically and horizontally, a clamping jaw 32 for clamping the silicon wafer or the packaging box, and a pressing block 33 located at the middle position of the clamping jaw 32. The transfer assembly 31 is a horizontal slide rail and a vertical slide rail fixed on its cross frame, which can reciprocate between the boxing position 12 and the finished product position 22 through the clamping jaw 32 and can move up and down along the height direction of the cross frame. A cylinder that can drive the pressing block 33 to move vertically up and down is also provided on the transfer assembly 31, which can control the pressing block 33 to press the silicon wafer during the process of embedding the silicon wafer into the packaging box 40, so that the silicon wafer can be quickly placed into the packaging box.
[0057] During this process, the transfer unit 30 clamps the silicon wafer and transfers it to directly above the boxing table 13 placed at the boxing position 12. At this time, the guide rod 155 and the guide piece 151 are both in place. Among them, the guide rod 155 is located directly above the packaging box 40, and the guide piece 151 is located inside the packaging box 40. When the transfer unit 30 clamps the silicon wafer, the clamping jaws 81 on the four sides clamp the side edges of the silicon wafer, and the pressing block 33 located at the middle position of the silicon wafer is suspended above. The clamping jaws 81 clamp the silicon wafer above the guide rod 155 and drive the silicon wafer downward so that the lower bottom surface of the silicon wafer contacts the guide rod 155. At the same time, the pressing block 33 moves downward and contacts the upper end surface of the silicon wafer. At this time, the four side edges of the silicon wafer contact the surrounding guide piece 151. Then, the clamping jaws 81 move outward along the width direction of the silicon wafer and release the silicon wafer, immediately rise and move away from the boxing table 13, and synchronously control the two side guide rods 155 to move in the length direction of the boxing slide rail 11 in the opposite direction and away from the silicon wafer. As the guide piece 532 rotates from the inclined direction to the vertical direction and controls the pressing block 33 to move downward to push the silicon wafer to slide down smoothly along the side edges surrounded by the guide piece 151 until the silicon wafer is completely embedded in the packaging box 40, thus obtaining the finished silicon wafer.
[0058] When the pressing block 33 moves downward to push the silicon wafer downward, the guide piece 151 is synchronously controlled to move vertically upward to keep it away from the upper end surface of the silicon wafer. Then the guide piece 151 is controlled to move along the length direction of the box loading slide rail 11 toward the side away from the silicon wafer; the positioning block 14 is synchronously controlled to spread outward to release the packaging box 40, and to reserve enough space for the clamping jaws 81 to clamp the packaging box 40. Then the clamping jaws 81 are controlled to move downward to clamp the packaging box 40 of the finished silicon wafer, and move it horizontally along the track to the finished product position 22.
[0059] The clamp 81 clamps the finished silicon wafer and places it on the finished product carrier 23 at the highest limit, releases the packaging box 40 and rises and withdraws. The finished product carrier 23 drives the finished silicon wafer downward, places the finished silicon wafer on the finished product conveyor line 21, and then continues to move downward and away from the finished silicon wafer, and then the finished silicon wafer is stably placed on the finished product conveyor line 21. The finished silicon wafer is then driven by the finished product conveyor line 21 and moves forward to the discharge port to flow to the finished product area outside the packaging machine.
[0060] The silicon wafer boxing mechanism designed by the present application has a simple structure and precise coordination, can introduce silicon wafers into the material box at one time, does not require human assistance, is safe and simple to operate, has good boxing consistency, is highly efficient, and avoids the problem of secondary contamination of silicon wafers. The present application also proposes a packaging machine equipped with the boxing mechanism.
[0061] The above detailed description of the embodiments of the present application is only a preferred embodiment of the present application and cannot be considered to limit the scope of implementation of the present application. All equivalent changes and improvements made within the scope of the present application should still fall within the scope of the patent coverage of the present application.
Claims
1. A silicon wafer boxing mechanism, used to embed silicon wafers horizontally in a packaging box, characterized in that: At least: Boxing position; A box loading section, which is arranged on the box loading position and is provided with a box loading platform and a guide assembly; The guide assembly includes a guide sheet and a guide rod arranged along the periphery of the packaging box; The suspended end of the guide piece is obliquely placed in the packaging box and can rotate along the axial direction of its installation axis to guide the silicon chip to be horizontally embedded in the packaging box; The guide rod can be used to support a silicon wafer horizontally placed above the guide wafer.
2. A silicon wafer boxing mechanism according to claim 1, characterized in that: The guide piece is arranged above the box loading platform by the guide fixing frame, and is inclinedly extended outward from bottom to top along the height direction of the packaging box.
3. A silicon wafer boxing mechanism according to claim 2, characterized in that: A vertical guide cylinder for controlling the upward and downward movement of the guide plate is also provided on the guide fixing frame; and a sensor for monitoring whether there is a silicon wafer placed in the packaging box is provided on the top of the vertical guide cylinder on one side.
4. A silicon wafer box loading mechanism according to claim 3, characterized in that: The guide fixing frame is also provided with a vertical guide cylinder for controlling the guide piece to rise and fall in the vertical direction and a horizontal guide cylinder for horizontally moving along the sliding direction of the box loading platform.
5. A silicon wafer box loading mechanism according to any one of claims 1 to 4, characterized in that: The guide rods are arranged at each vertex of the box loading platform, and are driven by a push cylinder to be arranged horizontally along the sliding direction of the box loading platform.
6. A silicon wafer box loading mechanism according to claim 5, characterized in that: The movable ends of all the guide rods are arranged toward the middle position of the silicon wafer; and the pushing cylinder is arranged below the box loading platform.
7. A silicon wafer box loading mechanism according to any one of claims 1 to 4 and 6, characterized in that: It also includes a box loading slide rail matched with the box loading platform, the box loading position is located at one end of the box loading slide rail; and a positioning block for clamping the packaging box is also provided on the box loading platform.
8. A silicon wafer box loading mechanism according to claim 7, characterized in that: It also includes a finished product section for transporting silicon wafers after packaging, which has: Finished product conveyor line, which is arranged in parallel with the cartoning slide rail; A finished product carrier, placed on the finished product conveying line and slidably matched with the finished product conveying line; A finished product position is provided at one end of the finished product conveying line, and the finished products are arranged side by side at the boxing position.
9. A silicon wafer box loading mechanism according to claim 8, characterized in that: It also includes a transfer section arranged across the box loading slide rail and the finished product conveying line, which is equipped with a transfer assembly, a clamping claw for clamping a silicon wafer or a packaging box, and a pressing block located between the clamping claws; The transfer assembly controls the clamping claw to move back and forth between the box loading position and the finished product position; The pressing block can push the silicon wafer downward when the silicon wafer is embedded in the packaging box.
10. A packaging machine, characterized in that: The invention is provided with a box loading mechanism as described in any one of claims 1 to 9.