Dry and wet finger for transferring silicon wafer and production equipment
By designing an independent and controllable dry and wet fingers, and using the shaft drive system to rotate dry and wet fingers in different states, the problem of cross-contamination of silicon wafers and difficulty in picking and retrieving silicon wafers in existing equipment is solved, and efficient and accurate silicon wafer transfer is achieved.
Patent Information
- Application Number
- CN202422333250.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-09-25
AI Technical Summary
The same clamping mechanism is used in existing equipment to transfer silicon wafers of different states, which can easily cause cross-contamination of silicon wafers and it is difficult to meet the separation and pick-up and placement needs of silicon wafers of different states in different processes.
A dry and wet finger for silicon wafer transfer is designed, including a fixing frame, wet and dry components and a driving system. The wet and dry components are composed of independent and controllable dry and wet fingers. The rotating shaft drives it to rotate in different directions, thereby achieving accurate pick-up and placement of silicon wafers in different states.
It realizes separate pick-up and placement of silicon wafers in different states, avoids cross-contamination, is convenient to operate, accurately and reliably pick-up and place, is compatible with silicon wafers of different sizes, has high working efficiency and fast load transfer speed.
Smart Images
Figure CN223032317U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the technical field of semiconductor silicon wafer production equipment, and particularly relates to a wet and dry finger for silicon wafer transfer and a production equipment using the wet and dry finger. Background Art
[0002] In existing etching and edge-trimming machines, silicon wafers need to be rinsed before being dried. All silicon wafers are in a wet state before drying, and pickling liquid medicine is present on the periphery and surface of the silicon wafers; after drying, they are in a dry state, that is, the finished products. In a situation where there are two wet and dry states in the same process, if the same gripper is still used to grip and pick up the silicon wafers as currently, there will be a risk of secondary contamination of the silicon wafers by the liquid medicine on the wet silicon wafers indirectly through the gripper. Moreover, in the same production equipment, for silicon wafers in different states in different processes, different clamping mechanisms are also required to separate and pick up and place the silicon wafers. How to design a transfer mechanism that can separately pick up and place silicon wafers in different states in the same process or different processes of the same equipment is an important matter to ensure the transfer quality and efficiency of silicon wafers. Summary of the Invention
[0003] This application provides a wet and dry finger for silicon wafer transfer and a production equipment using the wet and dry finger, which solves the technical problem that the same clamping mechanism is used to transfer silicon wafers in different states in the existing equipment, easily causing cross-contamination of the silicon wafers.
[0004] To solve at least one of the above technical problems, the technical solution adopted in this application is:
[0005] A wet and dry finger for silicon wafer transfer, comprising:
[0006] A fixed frame,
[0007] A wet and dry component, including a dry finger and a wet finger arranged on both sides of the fixed frame and facing away from each other, and the dry finger and the wet finger are respectively driven to rotate by a rotating shaft suspended on the fixed frame;
[0008] By driving the rotating shaft, the dry finger and the wet finger can rotate in opposite directions from the first state to the second state, and the dry finger and the wet finger control the transfer of silicon wafers in the first state and are in a non-working static state in the second state.
[0009] Further, the rotating shaft is arranged crosswise with the fixed frame and is connected to a finger motor fixed on both sides of the width of the fixed frame; all the rotating shafts are arranged in the same direction.
[0010] Further, the dry finger and the wet finger have the same structure, and both include a main body with a long strip structure, and one end of the main body is vertically connected to the rotating shaft through a connecting piece.
[0011] Further, one end of the rotating shaft that cooperates with the dry finger and the wet finger has a cross-section configured as a superior arcuate structure, and the plane where the side chord is located is a flat plane.
[0012] Further, the connecting member is configured as a cuboid flat plate structure, and a groove with an L-shaped structure and an outward opening is provided at the end of its lower side;
[0013] The connecting member is clamped on the flat plane in the rotating shaft through the groove.
[0014] Further, the connecting end of the body is arranged on a side surface of the connecting member away from the rotating shaft, and is connected to the connecting member through a cover plate.
[0015] Further, one end of the body away from the rotating shaft is configured as a circular overhanging end, and a plurality of parallel air ducts are provided along the length center line of the body;
[0016] Along the width direction of the body, a plurality of arc-shaped air ducts are provided at intervals in the middle section; on the overhanging end of the body, a plurality of circular air ducts with concentric circle structures are provided.
[0017] Further, the fixing frame is vertically arranged on the suspension beam, and the suspension beam is arranged along the silicon wafer transmission direction;
[0018] On the suspension beam, a transfer assembly for controlling the movement of the dry finger and the wet finger is further provided;
[0019] The transfer assembly at least includes a horizontal transfer group for controlling the movement of the dry finger and the wet finger along the length direction of the suspension beam, and a lifting transfer group for controlling the vertical lifting of the dry finger and the wet finger.
[0020] Further, an isolation plate for isolating the dry finger and the wet finger is further provided on the fixing frame.
[0021] A production device is equipped with the dry and wet fingers as described above.
[0022] A dry and wet finger for silicon wafer transfer designed by the present application is provided with independently controllable dry finger and wet finger, which are used to pick and place silicon wafers in different states respectively. It is not only convenient to operate, but also accurate and reliable in picking and placing; it can also transfer silicon wafers of different sizes, has good compatibility, simple structure, small occupied area, high working efficiency and fast transfer speed. The present application also proposes a production device adopting the dry and wet finger. Description of the Drawings
[0023] Figure 1 It is a perspective view of the transfer mechanism of an embodiment of the present application;
[0024] Figure 2 is a perspective view of a dry-wet component according to an embodiment of the present application;
[0025] Figure 3 is a schematic view of a partial dry-wet component according to an embodiment of the present application;
[0026] Figure 4 is a top view of a dry-wet component according to an embodiment of the present application.
[0027] In the figure:
[0028] 100, transfer mechanism; 10, suspension beam; 20, transfer component
[0029] 21, lifting and transferring group; 22, horizontal transfer group; 30, fixed frame
[0030] 40, dry-wet component; 41, dry finger; 42, wet finger
[0031] 43, isolation plate; 44, finger motor; 45, rotating shaft
[0032] 46, connecting piece; 47, cover plate; 48, air duct Specific embodiments
[0033] The present application will be described in detail below with reference to the accompanying drawings and specific embodiments.
[0034] This embodiment provides a dry-wet finger for wafer transfer. As Figures 1-4 shown, the transfer mechanism 100 includes a suspension beam 10 arranged along the transmission direction, a transfer component 20 arranged based on the suspension beam 10, a fixed frame 30 connected and configured with the transfer component 20, and a dry-wet component 40 for classifying and picking up wafers. Among them, the dry-wet component 40 includes a dry finger 41 and a wet finger 42 arranged on both sides of the width direction of the fixed frame 30 and facing away from each other. The dry finger 41 and the wet finger 42 are respectively driven by a finger motor 44 suspended below the fixed frame 30, and are connected and driven to rotate through a rotating shaft 45. The finger motor 44 drives the rotating shaft 45, which can make the dry finger 41 and the wet finger 42 rotate in opposite directions from the horizontal direction in the first state to the vertical direction in the second state; and make the dry finger 41 and the wet finger 42 pick up and place wafers and control wafer transfer in the first state, and be in a static state when not working in the second state. The transfer mechanism 100 can perform dry-wet classification and picking of different types of wafers as required, and can accurately place them at designated positions, which not only saves time but also does not interfere with each other, is suitable for adsorbing and picking wafers of multiple sizes, does not require manual assistance, has good compatibility and high stability, high working efficiency and high transfer smoothness.
[0035] In this embodiment, the dry finger 41 and the wet finger 42 are respectively driven by two independent finger motors 44 to perform flipping adjustment. Among them, the dry finger 41 and the wet finger 42 are in the first state during their operation, that is, the horizontal state. In this state, it is convenient to pick up and place the silicon wafer and drive the silicon wafer to be transported. The second state is the vertical state, which is the static state of not controlling the silicon wafer. The dry finger 41 and the wet finger 42 are in the second state, that is, the vertical state, when they are not working, and at this time, the dry and wet fingers are static.
[0036] As Figure 1 shown, a transfer component 20 for controlling the movement of the dry and wet fingers is provided on the suspension beam 10, and the fixing frame 30 is suspended on the suspension beam 10 through the transfer component 20. Among them, the transfer component 20 at least includes a horizontal transfer group 22 for controlling the dry and wet fingers to move horizontally along the length direction of the suspension beam, that is, along the transmission direction, and a lifting transfer group 21 for controlling the vertical lifting movement of the dry and wet fingers. Of course, a lateral transfer group along the width direction across the transmission can also be set based on the actual situation. This is a common moving mechanism in the art and can be determined based on the actual situation. The lateral transfer group is omitted in the drawings of this application. Both the horizontal transfer group 22 and the lifting transfer group 21 are common sliding transfer mechanisms in the art, and are driven by a slide rail and a sliding motor to move along a preset track. The structure thereof will not be described in detail here.
[0037] As Figure 2 shown, the fixing frame 30 is configured as a T-shaped structure. Its vertical section is directly connected to the lifting transfer group 21 and is suspended below the suspension beam 10. The horizontal section of the fixing frame 30 is located at its lower end, and two finger motors 44 are symmetrically arranged, that is, the two finger motors 44 are arranged on both sides of the fixing frame along the width direction of the fixing frame; and the finger motor 44 for controlling the dry finger 41 and the finger motor 44 for controlling the wet finger 42 operate independently of each other. The two finger motors 44 are arranged in the same direction, and all the rotating shafts 45 are also arranged in the same direction. The rotating shaft 45 is vertically and crosswise arranged with the fixing frame 30, and both the dry finger 41 and the wet finger 42 are vertically and crosswise connected to the rotating shaft 45, and the dry finger 41 and the wet finger 42 are arranged back to back. Furthermore, the finger motor 44 drives the rotating shaft 45 to rotate, so that the rotating shaft 45 drives the dry finger 41 and the wet finger 42 to work on one side in the length direction of the suspension beam 10 and rotate in opposite directions relative to the fixing frame 30.
[0038] The positions of the dry finger 41 and the wet finger 42 relative to the fixing frame 30 can be swapped with each other, which can be determined based on the actual situation. In order to isolate the working environments of the dry finger 41 and the wet finger 42, an isolation plate 43 with a transparent structure is also provided in the height direction of the fixing frame 30 and between the dry finger 41 and the wet finger 42. The isolation plate 43 can isolate the dry finger 41 and the wet finger 42 in two operating spaces, without affecting each other, and ensure the safety and purity of the operation when the dry silicon wafer is transferred.
[0039] As shown Figure 3 As shown, both the dry finger 41 and the wet finger 42 are connected to the rotating shaft 45 through a connecting member 46. The dry finger 41 and the wet finger 42 are arranged on the upper end surface of the connecting member 46, that is, on the side surface far from the connecting surface of the connecting member 46 and the rotating shaft 45. The dry finger 41 and the wet finger 42 are fixed on the connecting member 46 through a cover plate 47.
[0040] Wherein, one end of the rotating shaft 45 that cooperates with the dry and wet fingers has a cross-section configured as a superior arc structure, and the plane where its side chord is located is a flat plane. The connecting member 46 is a rectangular flat plate structure, and a groove with an L-shaped structure and an outward opening is provided at the end of its lower side surface. The connecting member 46 is clamped on the flat plane of the rotating shaft 45 through the groove.
[0041] The rotating shaft 45 can drive the dry finger 41 or the wet finger 42 to rotate between a horizontal state and a vertical state through the connecting member 46. That is, when the dry finger 41 or the wet finger 42 is in a horizontal state, they are both horizontally arranged, and the surface for adsorbing the silicon wafer is facing upward. At this time, the connecting member 46 is horizontally arranged transversely like the dry finger 41 or the wet finger 42, and its groove is facing downward, and the flat plane of the rotating shaft 45 connected to the groove is horizontally upward. When there is no need to adsorb the silicon wafer, the finger motor 44 will drive the rotating shaft 45 to drive the dry finger 45 or the wet finger 42 to rotate to the vertical state.
[0042] As shown Figure 4 As shown, the dry finger 41 and the wet finger 42 have the same structure, and their working principles and operation processes are the same; the layout structures of the vacuum air channels 48 on the upper end surfaces for adsorbing the silicon wafers are also the same. Specifically, both the dry finger 41 and the wet finger 42 include a long strip-shaped body. The connecting end of the body is arranged on the side surface of the connecting member 46 far from the rotating shaft 45 and is fixed on the connecting member 46 through a cover plate 47. One end of the body far from the rotating shaft 45 is configured as a circular-shaped hanging end, and two parallel air channels 48 are provided along the length center line of the body; along the width direction of the body, several arc-shaped air channels 48 are provided at intervals in the middle section; and on the hanging end of the body, several air channels 48 are provided in a concentric structure with its circular end. These air channels 48 with different structures can not only ensure an increase in the contact surface with the silicon wafer, but also further improve the overall placement stability of the silicon wafer; improve the safety of the silicon wafer in close contact with the finger during the transfer process. These air channels 48 communicate with each other inside the body and are connected to an external air pump through a tracheal joint.
[0043] When the silicon wafer is a wet silicon wafer, it is necessary to pick up the wafer through the wet finger 42. Among them, when the wet finger 42 and the dry finger 41 are not working, they are both in a vertical state; and their initial height is at their upper limit position. The horizontal movement group 22 drives the wet finger 42 to move to the position of the wet silicon wafer, and when the wet finger 42 moves to the specified horizontal position, it stops horizontal movement; then the lifting movement group 21 drives the wet finger 42 to descend to the picking position height. Then the finger motor 44 drives the rotating shaft 45 to drive the wet finger 42 to rotate reversely, so that the wet finger 42 rotates from the vertical state to the horizontal state. The horizontal movement group 22 then drives the horizontally extended wet finger 42 to gradually approach the lower part of the wet silicon wafer, and then slowly controls the wet finger 42 to move upward and closely adhere to the lower bottom surface of the silicon wafer. Then control the air duct on the wet finger 42 to vacuum adsorb the silicon wafer. When the silicon wafer is stably placed on the wet finger 42, first drive the wet finger 42 to drive the wet silicon wafer to rise to a safe height through the lifting component 42, and then drive the wet finger 42 to move towards the specified position through the horizontal movement group 22. During this process, the dry finger 41 always remains stationary and is in the initial vertically set state.
[0044] Correspondingly, when the silicon wafer is a dry silicon wafer, it is necessary to pick up the wafer through the dry finger 41. The dry finger 41 is in a vertical state and is at its initial upper limit position. The horizontal movement group 22 drives the dry finger 41 to move to the position of the dry silicon wafer, and when the dry finger 41 moves to the specified horizontal position, it stops horizontal movement; then the lifting movement group 21 drives the dry finger 41 to descend to the picking position height. Then the finger motor 44 drives the rotating shaft 45 to drive the dry finger 41 to rotate forward, so that the dry finger 41 rotates from the vertical state to the horizontal state. The horizontal movement group 22 then drives the horizontally extended dry finger 41 to gradually approach the lower part of the dry silicon wafer, and then slowly controls the dry finger 41 to move upward and closely adhere to the lower bottom surface of the silicon wafer. Then control the air duct on the dry finger 41 to vacuum adsorb the silicon wafer. When the silicon wafer is stably placed on the dry finger 41, first drive the dry finger 41 to drive the dry silicon wafer to rise to a safe height through the lifting component 42, and then drive the dry finger 41 to move towards the specified position through the horizontal movement group 22. During this process, the wet finger 42 always remains stationary and is in the initial vertically set state.
[0045] A production device uses the dry and wet fingers as described above to transfer dry silicon wafers and wet silicon wafers.
[0046] The dry and wet fingers for silicon wafer transfer proposed in this application are provided with independently controllable dry fingers and wet fingers, which are used to pick up and place silicon wafers in different states respectively. It is not only convenient to operate, but also accurate and reliable in picking up and placing; it can also transfer silicon wafers of different sizes, with good compatibility, simple structure, small occupied area, high working efficiency and fast transfer speed. This application also proposes a production device using the dry and wet fingers.
[0047] The embodiments of the present application have been described in detail above. The above content is only the preferred embodiments of the present application and cannot be considered as limiting the scope of implementation of the present application. All equivalent changes and improvements made within the scope of the present application should still fall within the scope covered by the patent of the present application.
Claims
1. A dry and wet finger for transferring silicon wafers, characterized in that: include: Fixed frame; The dry and wet components include dry fingers and wet fingers arranged on both sides of the fixing frame and facing each other, and the dry fingers and the wet fingers are respectively driven to rotate by a rotating shaft suspended on the fixing frame; By driving the rotating shaft, the dry fingers and the wet fingers can rotate in opposite directions from the first state to the second state, and the dry fingers and the wet fingers can control the transfer of silicon wafers in the first state and be in a non-working static state in the second state.
2. The dry and wet finger for transferring silicon wafers according to claim 1, characterized in that: The rotating shaft is arranged crosswise with the fixing frame, and is connected to the finger motors fixed on both sides of the width of the fixing frame; All the rotating shafts are arranged in the same direction.
3. A dry and wet finger for transferring silicon wafers according to claim 1 or 2, characterized in that: The dry finger and the wet finger have the same structure, both comprising a body of a long strip structure, one end of the body being vertically connected to the rotating shaft through a connecting piece.
4. The dry and wet finger for transferring silicon wafers according to claim 3, characterized in that: The cross section of one end of the rotating shaft that cooperates with the dry finger and the wet finger is constructed as a superior arcuate structure, and the surface where the side chord edge is located is a flat surface.
5. The dry and wet finger for transferring silicon wafers according to claim 4, characterized in that: The connecting piece is constructed as a rectangular flat plate structure, and the end of the lower side thereof is provided with an L-shaped groove with an opening facing outwards; The connecting member is clamped on the flat surface of the rotating shaft through the groove.
6. A wet and dry finger for transferring silicon wafers according to claim 4 or 5, characterized in that: The connecting end of the body is arranged on a side of the connecting member away from the rotating shaft, and is connected to the connecting member through a cover plate.
7. The dry and wet finger for transferring silicon wafers according to claim 6, characterized in that: One end of the body away from the rotating shaft is constructed as a suspended end of a circular structure, and a plurality of air passages arranged in parallel are provided along the midline of the length of the body; Along the width direction of the body, a plurality of arc-shaped air passages are arranged at intervals in the middle section thereof; and a plurality of circular air passages with concentric circle structures are arranged on the hanging end of the body.
8. A wet and dry finger for transferring silicon wafers according to any one of claims 1-2, 4-5, and 7, characterized in that: The fixing frame is vertically arranged on the suspension beam, and the suspension beam is arranged along the transmission direction of the silicon wafer; A transfer assembly for controlling the movement of the dry fingers and the wet fingers is also provided on the suspension beam; The transfer assembly at least includes a horizontal transfer group for controlling the movement of the dry fingers and the wet fingers along the length direction of the suspension beam, and a lifting and lifting transfer group for controlling the vertical lifting and lowering of the dry fingers and the wet fingers.
9. The dry and wet finger for transferring silicon wafers according to claim 8, characterized in that: An isolation plate for isolating the dry finger and the wet finger is also provided on the fixing frame.
10. A production equipment, characterized in that: A dry and wet finger as described in any one of claims 1 to 9 is provided.