High-stability heat-conducting film

Abstract

The utility model discloses a heat-conducting film with high stability, which belongs to the technical field of heat-conducting films and comprises two films, a fixing ring strip is fixedly arranged on the periphery of each film, and a plurality of raised lines are arranged on each fixing ring strip. A plurality of grooves corresponding to the plurality of raised lines are formed in each fixing ring strip, and the close sides of the two films are spliced into a whole through the plurality of raised lines and the grooves on one side; according to the utility model, the first positioning groove and the second positioning groove on the film are bonded through the slots, so that the film can be aligned with the bottom plate of the heat dissipation assembly, and the film cannot be independently deviated from the heat source when bonded on the heat source, so that the alignment and bonding condition of the film can be conveniently judged by a worker, and certain manpower is saved.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat-conducting films, and particularly relates to a heat-conducting film with high stability. Background Technique

[0002] A heat-conducting film, also known as a heat-conducting silica gel sheet, is a heat-conducting medium material synthesized by a special process with silica gel as the base material and adding various auxiliary materials such as metal oxides.

[0003] During the bonding process of traditional heat-conducting films, it is often necessary to first align and bond with the heat dissipation component, and then align and bond the heat-conducting film on the heat dissipation component with the heat source of the object. The two manual aligning and bonding processes consume a lot of manpower. Therefore, a heat-conducting film with high stability is needed to solve the above problems. Content of the Utility Model

[0004] The purpose of the utility model is to provide a heat-conducting film with high stability to solve the problems put forward in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical scheme: A heat-conducting film with high stability includes two films. Fixed ring strips are respectively fixedly arranged around each film. A plurality of convex strips are respectively arranged on each fixed ring strip. A plurality of grooves corresponding to the plurality of convex strips are respectively formed on each fixed ring strip. The adjacent sides of the two films are spliced together through the plurality of convex strips and grooves on one side. A first positioning groove and a second positioning groove are respectively formed on each film. A heat dissipation component is adhesively arranged on the two films together. The lower surface of the heat dissipation component is respectively inserted and adhesively connected into the first positioning groove and the second positioning groove on the two films through a first positioning block and a second positioning block.

[0006] By setting the above structure, when the heat dissipation component needs to be bonded to the film, the heat dissipation component can be positioned and inserted into the first positioning groove and the second positioning groove on the film through the first positioning block and the second positioning block at its bottom. This makes it convenient for the film to be positioned and adhered to the heat dissipation component during bonding. After the film is bonded, the heat dissipation component is then positioned and bonded to the corresponding heat source. In this process, compared with the traditional method that only uses manual positioning bonding for the film once, and through the slot bonding of the first positioning groove and the second positioning groove on the film, the film will be aligned with the bottom plate of the heat dissipation component, so that the film will not deviate from the alignment with the heat source alone when bonded to the heat source, making it convenient for manual judgment of the alignment and bonding situation of the film, thus saving a certain amount of manpower.

[0007] As a preferred implementation manner, the first positioning groove is located at the central part of the film.

[0008] As a preferred embodiment, the second positioning groove is located at a position on the film near the edge.

[0009] As a preferred embodiment, the shape and size of the first positioning block and the second positioning block respectively adapt to the inside of the first positioning groove and the second positioning groove.

[0010] As a preferred embodiment, chamfers are provided at the openings of the first positioning groove and the second positioning groove.

[0011] As a preferred embodiment, the first positioning groove and the second positioning groove are circular in shape.

[0012] By providing chamfers at the openings of the first positioning groove and the second positioning groove, on the one hand, it can expand the bonding area of the first positioning block and the second positioning block in the first positioning groove and the second positioning groove, which helps to make the film bond more firmly and stably. On the other hand, the openings formed by the chamfers for the first positioning groove and the second positioning groove also facilitate the guiding and positioning insertion of the first positioning block and the second positioning block.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] In the present utility model, by providing the first positioning groove and the second positioning groove, when the heat dissipation component needs to be bonded to the film, the heat dissipation component can be positioned and inserted into the first positioning groove and the second positioning groove on the film through the first positioning block and the second positioning block at its bottom. In this way, when the film is bonded, it can be conveniently positioned and fitted on the heat dissipation component. After the film is bonded, the heat dissipation component is then positioned and bonded to the corresponding heat source. In this process, compared with the traditional method that only uses manual positioning and bonding for the film once, and through the slot bonding of the first positioning groove and the second positioning groove on the film, the film will be aligned with the bottom plate of the heat dissipation component. Furthermore, when the film is bonded to the heat source, it will not deviate alone from the alignment with the heat source, which makes it convenient for manual judgment of the alignment and bonding situation of the film, thus saving a certain amount of manpower.

[0015] In the present utility model, by providing chamfers at the openings of the first positioning groove and the second positioning groove, on the one hand, it can expand the bonding area of the first positioning block and the second positioning block in the first positioning groove and the second positioning groove, which helps to make the film bond more firmly and stably. On the other hand, the openings formed by the chamfers for the first positioning groove and the second positioning groove also facilitate the guiding and positioning insertion of the first positioning block and the second positioning block. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the film of the present utility model;

[0017] Figure 2 It is a schematic diagram of the three-dimensional structure of the spliced film of the present utility model;

[0018] Figure 3 It is a schematic diagram of the three-dimensional structure of the heat dissipation component of the present utility model;

[0019] Figure 4 It is a schematic diagram of the three-dimensional structure of the first positioning block of the present utility model;

[0020] Figure 5 For the present utility model Figure 2 It is a schematic diagram of the enlarged three-dimensional structure at position A in the present utility model;

[0021] Figure 6 It is a schematic diagram of the partial three-dimensional structure of the present utility model.

[0022] In the figure: 1, film; 2, fixed ring strip; 3, rib; 4, groove; 5, first positioning groove; 6, second positioning groove; 7, heat dissipation component; 8, first positioning block; 9, second positioning block; 10, chamfer. Specific embodiments

[0023] The following further describes the present utility model in conjunction with embodiments.

[0024] The following embodiments are used to illustrate the present utility model, but cannot be used to limit the protection scope of the present utility model. The conditions in the embodiments can be further adjusted according to specific conditions. Any simple improvement to the method of the present utility model under the premise of the concept of the present utility model belongs to the scope protected by the present utility model.

[0025] Please refer to Figures 1-6, the present utility model provides a highly stable heat-conducting film, which includes two films 1. Fixed ring strips 2 are respectively and fixedly arranged around each film 1. A plurality of convex strips 3 are respectively arranged on each fixed ring strip 2. A plurality of grooves 4 corresponding to the plurality of convex strips 3 are respectively formed on each fixed ring strip 2. The adjacent sides of the two films 1 are spliced together through the plurality of convex strips 3 and grooves 4 on one side respectively. A first positioning groove 5 and a second positioning groove 6 are respectively formed on each film 1. A heat dissipation component 7 is adhesively arranged on the two films 1 together. The lower surface of the heat dissipation component 7 is inserted and adhesively connected into the first positioning groove 5 and the second positioning groove 6 on the two films 1 respectively through a first positioning block 8 and a second positioning block 9. By setting the above structure, when the heat dissipation component 7 needs to be adhesively connected to the film 1, the heat dissipation component 7 can be positioned and inserted into the first positioning groove 5 and the second positioning groove 6 on the film 1 through the first positioning block 8 and the second positioning block 9 at its bottom. In this way, when the film 1 is adhesively connected, it can be conveniently positioned and fitted on the heat dissipation component 7. After the film 1 is adhesively connected well, the heat dissipation component 7 is then positioned and adhesively connected to the corresponding heat source. In this process, compared with the traditional method of only manually positioning and adhesively connecting the film 1 once, and through the slot adhesive connection of the first positioning groove 5 and the second positioning groove 6 on the film 1, the film 1 will be aligned with the bottom plate of the heat dissipation component, so that when the film 1 is adhesively connected to the heat source, it will not deviate alone from the alignment with the heat source, making it convenient for manual judgment of the alignment and adhesive connection situation of the film 1, thus saving a certain amount of manpower.

[0026] The first positioning groove 5 is located at the central part of the film 1.

[0027] The second positioning groove 6 is located at the edge part of the film 1.

[0028] The shapes and sizes of the first positioning block 8 and the second positioning block 9 respectively adapt to the interiors of the first positioning groove 5 and the second positioning groove 6.

[0029] Chamfers 10 are formed at the openings of the first positioning groove 5 and the second positioning groove 6.

[0030] The shapes of the first positioning groove 5 and the second positioning groove 6 are circular. By forming chamfers 10 at the openings of the first positioning groove 5 and the second positioning groove 6, on the one hand, it can expand the adhesive area of the first positioning block 8 and the second positioning block 9 in the first positioning groove 5 and the second positioning groove 6, which helps to make the film 1 adhesively connected more firmly and stably. On the other hand, the openings formed by the chamfers 10 for the first positioning groove 5 and the second positioning groove 6 also facilitate the guiding and positioning insertion of the first positioning block 8 and the second positioning block 9.

[0031] Working principle and usage process of the present utility model: First, when the heat dissipation component 7 needs to be bonded to the film 1, the heat dissipation component 7 can be positioned and inserted into the first positioning groove 5 and the second positioning groove 6 on the film 1 through the first positioning block 8 and the second positioning block 9 at its bottom. This enables the film 1 to be easily positioned and adhered to the heat dissipation component 7 during bonding. After the film 1 is bonded, the heat dissipation component 7 is then positioned and bonded to the corresponding heat source. In this process, compared with the traditional method that only uses manual positioning and bonding for the film 1 once, and through the slot bonding of the first positioning groove 5 and the second positioning groove 6 on the film 1, the film 1 will be aligned with the bottom plate of the heat dissipation component, so that when the film 1 is bonded to the heat source, it will not deviate from the alignment with the heat source alone, making it convenient for manual judgment of the alignment and bonding situation of the film 1. In addition, by providing chamfers 10 at the openings of the first positioning groove 5 and the second positioning groove 6, on the one hand, it can expand the bonding area of the first positioning block 8 and the second positioning block 9 in the first positioning groove 5 and the second positioning groove 6, which helps to make the film 1 adhere more firmly and stably. On the other hand, the openings formed by the chamfers 10 for the first positioning groove 5 and the second positioning groove 6 also facilitate the guiding and positioning insertion of the first positioning block 8 and the second positioning block 9. In addition, by providing convex strips 3 and grooves 4 on the film 1, splicing between two films 1 can be achieved, and the bonding and fixing of a heat dissipation component 7 can be realized by using the splicing of multiple films 1, so that multiple films 1 can flexibly adapt to different bonding areas.

[0032] Although the embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made in these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A highly stable thermally conductive film, comprising two films (1), characterized in that: Each of the films (1) is fixedly provided with a fixing ring strip (2) around its periphery, each of the fixing ring strips (2) is provided with a plurality of convex strips (3), each of the fixing ring strips (2) is provided with a plurality of grooves (4) corresponding to the plurality of convex strips (3), the adjacent sides of the two films (1) are spliced ​​together through the plurality of convex strips (3) and the grooves (4) on one side, each of the films (1) is provided with a first positioning groove (5) and a second positioning groove (6), the two films (1) are bonded together with a heat dissipation component (7), the lower surface of the heat dissipation component (7) is respectively inserted and bonded into the first positioning groove (5) and the second positioning groove (6) on the two films (1) through a first positioning block (8) and a second positioning block (9).

2. A thermally conductive adhesive sheet with high stability according to claim 1, characterized in that: The first positioning groove (5) is located at the center of the film (1).

3. A thermally conductive adhesive sheet with high stability according to claim 1, characterized in that: The second positioning groove (6) is located at an upper edge portion of the film (1).

4. A thermally conductive adhesive sheet with high stability according to claim 1, characterized in that: The shapes and dimensions of the first positioning block (8) and the second positioning block (9) are respectively adapted to the interior of the first positioning groove (5) and the second positioning groove (6).

5. The high-stability thermal conductive film according to claim 1, characterized in that: The first positioning groove (5) and the second positioning groove (6) are provided with chamfers (10) at their notches.

6. The high-stability thermal conductive adhesive according to claim 1, characterized in that: The first positioning groove (5) and the second positioning groove (6) are circular in shape.

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