Wafer macroscopic defect detection equipment

Abstract

The utility model relates to wafer macroscopic defect detection equipment, which belongs to the technical field of wafer manufacturing, and comprises a rack, a Y-axis movement unit is arranged on the rack, an X-axis movement unit is mounted at the movement end of the Y-axis movement unit, an adsorption platform is mounted at the movement end of the X-axis movement unit, and an X-axis movement unit is mounted at the movement end of the adsorption platform. The adsorption platform is provided with more than two concentric-circle-shaped adsorption grooves, and one side of the rack is provided with a wafer conveying unit used for placing wafers on the adsorption platform; a Z-axis movement unit is arranged above the rack, and a detection unit is arranged at the movement end of the Z-axis movement unit. The wafer defect detection device has the beneficial effects that the Y-axis movement unit and the X-axis movement unit are quickly aligned and are matched with the detection unit to carry out defect detection on wafers, the detection efficiency is improved, the wafer production quality is improved, the adsorption grooves of the adsorption platform can adsorb wafers of different sizes, and the compatibility is strong.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer manufacturing, in particular to a wafer macro defect detection device. Background Art

[0002] A wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits. After the semiconductor wafer undergoes the lithography process on the production line, there will be defects such as surface particles, scratches, contamination, and abnormal patterns in the lithography patterns, which seriously affect the quality. Therefore, it is necessary to perform inspections, analyze and summarize the detected defect problems, submit data, and control the product quality.

[0003] In the prior art, the detection equipment has low detection efficiency, cannot be applied to wafers of various different specifications, and has great limitations in use. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is to provide a detection device that can be applied to wafers of various sizes.

[0005] The technical solution of the utility model for solving the above technical problem is as follows: A wafer macro defect detection device includes a frame. A Y-axis movement unit is arranged on the frame. An X-axis movement unit is installed at the moving end of the Y-axis movement unit. An adsorption platform is installed at the moving end of the X-axis movement unit. Two or more concentric adsorption grooves are formed on the adsorption platform. A wafer transfer unit for placing wafers on the adsorption platform is arranged on one side of the frame;

[0006] A Z-axis movement unit is arranged above the frame, and a detection unit is arranged at the moving end of the Z-axis movement unit.

[0007] The beneficial effect of the utility model is that through the rapid alignment of the Y-axis movement unit and the X-axis movement unit, and the cooperation of the detection unit to inspect the wafers for defects, the detection efficiency is improved, the wafer production quality is enhanced, and the adsorption grooves of the adsorption platform can adsorb wafers of different sizes, with strong compatibility.

[0008] Based on the above technical solution, the utility model can be further improved as follows.

[0009] Further, the Y-axis movement unit includes a first guide rail, the first guide rail is fixedly installed on the frame, a first moving platform is mounted on the first guide rail, the X-axis movement unit is installed on the first moving platform, and a first linear motor for driving the first moving platform to move is installed below the first moving platform.

[0010] The beneficial effect of adopting the above further solution is that through the guidance of the first guide rail and the drive of the first linear motor, the accuracy is high and the positioning is accurate.

[0011] Further, the X-axis motion unit includes a second guide rail, which is fixedly installed on the first motion platform and perpendicular to the first guide rail. A second motion platform is mounted on the second guide rail, and an adsorption platform is installed on the second motion platform. A second linear motor for driving the second motion platform to move is installed below the second motion platform.

[0012] The beneficial effect of adopting the above further scheme is that through the guiding cooperation of the second guide rail and the driving of the second linear motor, the accuracy is high and the positioning is accurate.

[0013] Further, a direct drive motor for driving the adsorption platform to rotate is installed on the second motion platform.

[0014] The beneficial effect of adopting the above further scheme is that the adsorption platform can rotate, and different positions of the wafer can be rotated for detection.

[0015] Further, an avoidance groove is formed on the top surface of the adsorption platform.

[0016] The beneficial effect of adopting the above further scheme is that it avoids the mechanical gripper and is convenient for automatic grasping.

[0017] Further, the Z-axis motion unit includes a gantry, which is fixedly arranged on the top surface of the machine frame. The Y-axis motion unit and the X-axis motion unit are located below the gantry. A third guide rail is vertically arranged on the gantry, and a third motion platform is mounted on the third guide rail. A detection unit is arranged on the third motion platform.

[0018] The beneficial effect of adopting the above further scheme is that the horizontal height of the detection unit can be adjusted to be suitable for different detection situations.

[0019] Further, the detection unit includes a microscope and an integrated optical path, and the microscope and the integrated optical path are fixedly installed on the third motion platform.

[0020] The beneficial effect of adopting the above further scheme is that detection is carried out by using a microscope, which has multiple magnification options and high detection accuracy.

[0021] Further, the wafer transfer unit includes an EFEM device.

[0022] The beneficial effect of adopting the above further scheme is that the degree of automation is high and the production efficiency is improved.

[0023] Further, a mainframe outer cover is sleeved outside the machine frame, and the mainframe outer cover is made by welding carbon steel steel pipes and carbon steel plates.

[0024] The beneficial effect of adopting the above further scheme is that it protects the safety of the equipment and also has the functions of dust prevention and shock absorption.

[0025] Furthermore, an air filtration unit is installed on the top of the main machine housing, and a number of exhaust fans are installed on the bottom of the main machine housing.

[0026] The beneficial effects of adopting the above further scheme are as follows: The air filtration unit improves the air cleanliness, and the exhaust fans ensure air circulation and reduce the internal temperature. Description of the Drawings

[0027] Figure 1 It is a schematic diagram of the frame of the present utility model.

[0028] Figure 2 It is a schematic diagram of the adsorption platform of the present utility model.

[0029] Figure 3 It is a schematic diagram of the EFEM device of the present utility model.

[0030] In the drawings, the list of components represented by each reference numeral is as follows:

[0031] 1, frame; 2, adsorption platform; 3, adsorption groove; 4, first guide rail; 5, first moving platform; 6, second guide rail; 7, second moving platform; 8, avoidance groove; 9, gantry; 10, third guide rail; 11, third moving platform; 12, microscope; 13, EFEM device; 14, main machine housing; 15, air filtration unit. Detailed Embodiments

[0032] The principles and features of the present utility model will be described below with reference to the drawings. The examples given are only used to explain the present utility model and are not intended to limit the scope of the present utility model.

[0033] Embodiment 1

[0034] As Figures 1 to 2 shown, a wafer macro defect detection device includes a frame 1, a Y-axis motion unit is arranged on the frame 1, an X-axis motion unit is installed at the moving end of the Y-axis motion unit, an adsorption platform 2 is installed at the moving end of the X-axis motion unit, and two or more concentric adsorption grooves 3 are formed on the adsorption platform 2. A wafer transfer unit for placing wafers on the adsorption platform 2 is arranged on one side of the frame 1;

[0035] A Z-axis motion unit is arranged above the frame 1, and a detection unit is arranged at the moving end of the Z-axis motion unit.

[0036] The beneficial effects of this embodiment are as follows: Through the rapid alignment of the Y-axis motion unit and the X-axis motion unit, and in cooperation with the detection unit, the wafers are inspected for defects, improving the detection efficiency and the wafer production quality. The adsorption grooves 3 of the adsorption platform 2 can adsorb wafers of different sizes, with strong compatibility.

[0037] In this embodiment, the wafer transfer unit picks up a wafer from the wafer transfer cassette, first places it at the alignment position to align the wafer, and then feeds it onto the adsorption platform 2. A number of concentric adsorption grooves 3 are formed on the adsorption platform 2, and the adsorption grooves 3 are all connected to a vacuum pump. The product placed above the adsorption grooves 3 is adsorbed by negative pressure. A number of adsorption grooves 3 in the inner circle are used to adsorb 8-inch products, and the adsorption grooves 3 in the inner and outer circles are jointly used to adsorb 12-inch products, which can adsorb wafers of different sizes and the adsorption is more firm;

[0038] Cooperating with the Y-axis motion unit, the Y-axis motion unit and the Z-axis motion unit in three-axis cooperation to perform detection at any position. After the detection is completed, the wafer is put back into the wafer transfer cassette.

[0039] Specifically, the frame 1 is composed of a marble platform. The bottom surface of the marble platform is supported by a carbon steel welded frame body, and the connection between the two is supported by a shock isolation pad. Shock-absorbing feet are provided at the bottom of the frame, and the overall mechanism ensures shock isolation and motion accuracy.

[0040] Embodiment 2

[0041] As Figure 1 shown, preferably, on the basis of Embodiment 1, the Y-axis motion unit includes a first guide rail 4, the first guide rail 4 is fixedly installed on the frame 1, a first motion platform 5 is mounted on the first guide rail 4, the X-axis motion unit is installed on the first motion platform 5, and a first linear motor for driving the first motion platform 5 to move is installed below the first motion platform 5.

[0042] The beneficial effect of adopting the preferred solution in the above embodiment is: through the guiding of the first guide rail 4 and the driving of the first linear motor, the accuracy is high and the positioning is accurate.

[0043] Preferably, the X-axis motion unit includes a second guide rail 6, the second guide rail 6 is fixedly installed on the first motion platform 5 and is perpendicular to the first guide rail 4, a second motion platform 7 is mounted on the second guide rail 6, the adsorption platform 2 is installed on the second motion platform 7, and a second linear motor for driving the second motion platform 7 to move is installed below the second motion platform 7.

[0044] The beneficial effect of adopting the preferred solution in the above embodiment is: through the guiding of the second guide rail 6 and the driving of the second linear motor, the accuracy is high and the positioning is accurate.

[0045] Embodiment 3

[0046] As Figure 1 shown, preferably, on the basis of Embodiments 1-2, a direct drive motor for driving the adsorption platform 2 to rotate is installed on the second motion platform 7.

[0047] The beneficial effects of adopting the preferred solutions in the above embodiments are as follows: The adsorption platform 2 can rotate, and different positions of the wafer can be rotated for detection.

[0048] Specifically, the direct drive motor, also known as the DD motor, has the advantages of high precision, large torque, simple structure, and no need to set up a speed reducer. The rotation axis of the adsorption platform 2 is perpendicular to the top surface of the frame 1, and it can rotate plus or minus 10 degrees for rotational cooperation detection.

[0049] Embodiment 4

[0050] As Figure 2 shown, preferably, on the basis of Embodiments 1-3, an avoidance groove 8 is formed on the top surface of the adsorption platform 2.

[0051] The beneficial effects of adopting the preferred solutions in the above embodiments are as follows: Avoid the mechanical gripper and facilitate automatic grasping.

[0052] Embodiment 5

[0053] As Figure 1 shown, preferably, on the basis of Embodiments 1-4, the Z-axis motion unit includes a gantry 9, the gantry 9 is fixedly arranged on the top surface of the frame 1, the Y-axis motion unit and the X-axis motion unit are located below the gantry 9, a third guide rail 10 is vertically arranged on the gantry 9, a third motion platform 11 is mounted on the third guide rail 10, and a detection unit is arranged on the third motion platform 11.

[0054] The beneficial effects of adopting the preferred solutions in the above embodiments are as follows: The horizontal height of the detection unit can be adjusted to be applicable to different detection situations.

[0055] Preferably, the detection unit includes a microscope 12 and an integrated optical path, and the microscope 12 and the integrated optical path are fixedly installed on the third motion platform 11.

[0056] The beneficial effects of adopting the preferred solutions in the above embodiments are as follows: Using the microscope 12 for detection, there are multiple magnification options available, and the detection accuracy is high.

[0057] In this embodiment, the microscope 12 has multiple adjustable magnifications of 5X, 10X, and 20X, and can automatically focus to achieve 2D graphic defect detection.

[0058] Embodiment 6

[0059] As Figure 3 shown, preferably, on the basis of Embodiments 1-5, a main machine outer cover 14 is sleeved outside the frame 1, and the main machine outer cover 14 is made by welding carbon steel steel pipes and carbon steel plates.

[0060] The beneficial effects of adopting the preferred solutions in the above embodiments are as follows: Protect the safety of the equipment and also have the functions of dust prevention and shock absorption.

[0061] Preferably, an air filtration unit 15 is installed at the top of the main machine housing 14, and a plurality of exhaust fans are installed at the bottom of the main machine housing 14.

[0062] The beneficial effects of adopting the preferred solution in the above embodiment are as follows: The air filtration unit 15 improves the air cleanliness, and the exhaust fans ensure air circulation and reduce the internal temperature.

[0063] In this embodiment, a lifting door for loading and unloading is provided on one side of the main machine housing 14, and maintenance and repair doors are provided on the other three sides. The doors are made of carbon steel plates and are spray-coated as a whole. An ion wind bar is also installed inside the main machine housing 14 to remove static electricity. The air filtration unit 15 above the main machine housing 14 blows air downward, cooperating with the exhaust fans at the bottom to ensure air flow;

[0064] The lifting door for loading and unloading is driven by an electric cylinder with controllable speed. An operation display keyboard and the like are provided beside the lifting door, which is convenient for observation and operation.

[0065] In addition, an electrical cabinet, a pneumatic control cabinet, an industrial control cabinet, and a factory service interface are provided on the back side of the main machine housing 14.

[0066] Embodiment 7

[0067] As Figure 3 shown, preferably, on the basis of Embodiments 1-6, the wafer transfer unit includes an EFEM device 13.

[0068] The beneficial effects of adopting the preferred solution in the above embodiment are as follows: High degree of automation and improved production efficiency.

[0069] In this embodiment, the EFEM device 13 is installed on the side of the main machine housing 14 where the lifting door is located. The robotic arm of the EFEM device 13 can extend into the main machine housing 14 and cooperate with the adsorption platform 2.

[0070] Specifically, the EFEM device 13 refers to an Equipment Front End Module, which is mainly applied in a high-clean environment and is a wafer front-end transfer system that transfers a single wafer to a process and detection module through a precision robotic arm. The EFEM belongs to semiconductor production equipment, and the wafer loading system Loadport, the wafer transfer robot Robot, and the wafer aligner Aligner are the three most core components.

[0071] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.

[0072] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0073] In the present utility model, unless otherwise clearly specified and defined, the terms "mounted", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0074] In the present utility model, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0075] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0076] Although the embodiments of the present utility model have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present utility model. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present utility model.

Claims

1. A wafer macro defect detection device, characterized in that: The invention comprises a frame (1), wherein a Y-axis motion unit is arranged on the frame (1), an X-axis motion unit is installed on the motion end of the Y-axis motion unit, an adsorption platform (2) is installed on the motion end of the X-axis motion unit, the adsorption platform (2) is provided with two or more concentric adsorption grooves (3), and a wafer transfer unit for placing a wafer on the adsorption platform (2) is arranged on one side of the frame (1); A Z-axis motion unit is arranged above the frame (1), and a detection unit is arranged at the motion end of the Z-axis motion unit.

2. The wafer macro defect detection device according to claim 1, characterized in that: The Y-axis motion unit comprises a first guide rail (4), the first guide rail (4) is fixedly mounted on the frame (1), a first motion platform (5) is mounted on the first guide rail (4), the X-axis motion unit is mounted on the first motion platform (5), and a first linear motor for driving the first motion platform (5) to move is mounted below the first motion platform (5).

3. A wafer macro defect detection device according to claim 2, characterized in that: The X-axis motion unit comprises a second guide rail (6), the second guide rail (6) is fixedly mounted on the first motion platform (5) and is perpendicular to the first guide rail (4), a second motion platform (7) is mounted on the second guide rail (6), an adsorption platform (2) is mounted on the second motion platform (7), and a second linear motor for driving the second motion platform (7) to move is mounted below the second motion platform (7).

4. The wafer macro defect detection device according to claim 3, characterized in that: The second motion platform (7) is provided with a direct drive motor for driving the adsorption platform (2) to rotate.

5. The wafer macro defect detection device according to claim 1, characterized in that: The top surface of the adsorption platform (2) is provided with an avoidance groove (8).

6. The wafer macro defect detection device according to claim 1, characterized in that: The Z-axis motion unit comprises a gantry (9), the gantry (9) is fixedly arranged on the top surface of the frame (1), the Y-axis motion unit and the X-axis motion unit are located below the gantry (9), a third guide rail (10) is vertically arranged on the gantry (9), a third motion platform (11) is mounted on the third guide rail (10), and a detection unit is arranged on the third motion platform (11).

7. The wafer macro defect detection device according to claim 6, characterized in that: The detection unit comprises a microscope (12) and an integrated optical path, and the microscope (12) and the integrated optical path are fixedly mounted on the third motion platform (11).

8. The wafer macro defect detection device according to claim 1, characterized in that: The film transmission unit includes an EFEM device (13).

9. The wafer macro defect detection device according to any one of claims 1 to 8, characterized in that: The frame (1) is provided with a main engine cover (14) on its outer shell, and the main engine cover (14) is made by welding a carbon steel pipe and a carbon steel plate.

10. The wafer macro defect detection device according to claim 9, characterized in that: An air filter unit (15) is installed on the top of the main engine outer cover (14), and a plurality of exhaust fans are installed on the bottom of the main engine outer cover (14).

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