Novel card reader chip module packaging structure

By designing a new card reader chip module packaging structure including packaging box, bidirectional screw, clamp plate and buffer spring, the problem of packaging operation troubles in the prior art and the inability to buffer the chip module during the clamping process is solved, and the rapid disassembly and assembly of the chip module and effective protection are achieved.

CN223038938UActive Publication Date: 2025-06-27WUXI YUXIN MICROELECTRONICS CO LTD
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Patent Information

Application Number
CN202422132682.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-02
Publication Date
2025-06-27
Estimated Expiration
2034-09-02

AI Technical Summary

Technical Problem

The existing new card reader chip module packaging structure has troubles in packaging operation when used, making it difficult to quickly disassemble and assemble, and cannot be buffered during the chip module clamping process, which may lead to damage to the chip module and low protection.

Method used

A new card reader chip module packaging structure including a packaging box, a bidirectional screw, a clamp plate and a buffer spring is designed. The rapid disassembly and assembly of the cover plate is achieved through the rotation of the bidirectional screw and a screw, and the chip module is buffered through the buffer spring to prevent damage.

Benefits of technology

It realizes rapid disassembly and assembly and effective protection of the chip module, improves the convenience and protection of the packaging structure, and avoids the risk of chip module damage due to excessive force during the clamping process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a novel card reader chip module packaging structure, and relates to the module packaging technology field, the novel card reader chip module packaging structure comprises a packaging box, two-way screw rods and two clamping plates, the top of the packaging box is provided with a cover plate in an attached manner, the other end of each screw rod is in threaded sleeve connection with the inner part of a lower installation block, and the two clamping plates are arranged on the two-way screw rods. And a plurality of buffer springs are fixedly arranged on the side wall of each movable plate. Through the arrangement of the two-way lead screw, the multiple buffer springs and the multiple mounting blocks, the cover plate can be rapidly disassembled and assembled by rotating the multiple screws, the rotating disc is rotated to drive the two-way lead screw to rotate, and when the two-way lead screw rotates, the two moving plates, the multiple buffer springs and the two clamping plates can be driven to move in the opposite directions; the chip module can be conveniently and rapidly disassembled and assembled by a user, the chip module can be buffered by the multiple buffer springs in the clamping process, damage to the chip module due to the fact that the clamping force is too large is prevented, and the chip module can be effectively protected.
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Description

Technical Field

[0001] The utility model relates to the technical field of module packaging, in particular to a novel encapsulation structure for a card reader chip module. Background Art

[0002] With the pursuit of miniaturization, high speed and high reliability of electronic products, in traditional card readers, due to the various shapes of PCBA, the internal structure design of the mechanism parts is complex, the appearance plasticity is limited, and key electronic components such as the main chip are directly soldered on the PCB board.

[0003] After retrieval, a novel encapsulation structure for a card reader chip module with the publication number of CN202255638U includes a card reader body, which is composed of a packaging substrate, discrete devices, electronic components, a card holder and a data interface. Among them, the discrete devices and electronic components are fixed on the packaging substrate through a high-temperature welding agent and wires, the outside of the packaging substrate, electronic components and discrete devices is sealed by epoxy resin filling, and the card holder is arranged at the top of the card reader body.

[0004] However, the existing novel encapsulation structure for a card reader chip module has certain drawbacks when in use. Although this encapsulation structure can encapsulate the chip module, the encapsulation operation is relatively troublesome, making it difficult to achieve the quick disassembly and assembly of the chip module. Moreover, there is no buffering during the clamping process of the chip module, which may cause damage to the chip module and result in low protection performance. Summary of the Utility Model

[0005] In view of the problems existing in the above-mentioned existing novel encapsulation structure for a card reader chip module, the present utility model is proposed.

[0006] Therefore, the purpose of the present utility model is to provide a novel encapsulation structure for a card reader chip module, which solves the problems that although this encapsulation structure can encapsulate the chip module, the encapsulation operation is relatively troublesome, making it difficult to achieve the quick disassembly and assembly of the chip module, and there is no buffering during the clamping process of the chip module, which may cause damage to the chip module and result in low protection performance.

[0007] In order to achieve the above purpose, the present utility model provides the following technical solutions:

[0008] A new type of card reader chip module packaging structure includes a sealed box, a bidirectional screw rod, and two clamping plates. A cover plate is attached to the top of the sealed box. A plurality of mounting blocks are fixedly arranged on the side walls of both the sealed box and the cover plate. Screws are movably sleeved inside the upper plurality of mounting blocks, and the other end of each screw is threadedly sleeved inside the lower mounting blocks. The bidirectional screw rod is rotatably arranged on the inner wall of the sealed box. One end of the bidirectional screw rod penetrates through the sealed box and is fixedly provided with a turntable. Two moving plates are threadedly sleeved on the rod wall of the bidirectional screw rod. A plurality of buffer springs are fixedly arranged on the side wall of each moving plate. The two clamping plates are respectively fixedly connected to the other ends of the corresponding buffer springs. Card slots are formed on the side walls of the two clamping plates, and a chip module is clamped between the two card slots.

[0009] Preferably, a rectangular sealing groove is formed on the top side wall of the sealed box, and a rectangular sealing pad is fixedly arranged at the bottom of the cover plate. The rectangular sealing pad is hermetically inserted into the rectangular sealing groove.

[0010] Preferably, a telescopic rod is movably sleeved inside each buffer spring. One end of each telescopic rod is fixedly connected to the corresponding moving plate, and the other end of each telescopic rod is fixedly connected to the corresponding clamping plate.

[0011] Preferably, a limiting rod is fixedly arranged on the inner wall of the sealed box, and the two moving plates are movably sleeved on the rod wall of the limiting rod.

[0012] Preferably, two U-shaped handles are fixedly arranged on the top of the cover plate.

[0013] Preferably, the sealed box is an aluminum alloy box, and the cover plate is an aluminum alloy plate.

[0014] Preferably, anti-slip pads are fixedly arranged at the four corners of the bottom of the sealed box, and the anti-slip pads are rubber pads.

[0015] Preferably, the rectangular sealing pad is a rubber pad.

[0016] Preferably, each screw is a handle plum blossom screw.

[0017] In the above technical solution, the technical effects and advantages provided by the present utility model:

[0018] 1. In this utility model, through the arranged bidirectional lead screw, multiple buffer springs and multiple mounting blocks, rotating multiple screws can achieve the rapid disassembly and assembly of the cover plate. Rotating the turntable drives the bidirectional lead screw to rotate. When the bidirectional lead screw rotates, it can drive two moving plates, multiple buffer springs and two clamping plates to move in the opposite direction, thereby facilitating the user to quickly disassemble and assemble the chip module. During the clamping process, multiple buffer springs can buffer the chip module, thus preventing damage to the chip module caused by excessive clamping force, and effectively protecting the chip module.

[0019] 2. In this utility model, through the arranged rectangular sealing groove and rectangular sealing gasket, a rectangular sealing groove is opened on the top side wall of the sealed box. After the chip module is clamped between two card slots, the cover plate is covered on the top of the sealed box, and the rectangular sealing gasket is hermetically inserted into the interior of the rectangular sealing groove, thereby improving the sealing performance between the sealed box and the cover plate and preventing the influence of external water vapor on the use of the chip module.

[0020] 3. In this utility model, through the arranged multiple telescopic rods, one end of each of the multiple telescopic rods is fixedly connected to the corresponding moving plate, the other end of each of the multiple telescopic rods is fixedly connected to the corresponding clamping plate, and each of the multiple telescopic rods is movably sleeved inside the corresponding buffer spring, thereby being able to limit the deformation of the multiple buffer springs and also being able to limit the movement of the two clamping plates, realizing the stable movement of the multiple clamping plates, and thus being able to stably clamp the chip module inside the two card slots. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0022] Figure 1 It is a three-dimensional structural schematic diagram of this utility model;

[0023] Figure 2 It is of this utility model Figure 1 The top view sectional structural schematic diagram;

[0024] Figure 3 It is of this utility model Figure 2 The enlarged view of part A;

[0025] Figure 4 It is of this utility model Figure 1 The three-dimensional structural schematic diagram of the cover plate;

[0026] Figure 5 It is of this utility model Figure 2 The three-dimensional structural schematic diagram of the clamping plate.

[0027] Explanation of reference numerals:

[0028] 1. Sealing box; 2. Bi-directional lead screw; 3. Clamping plate; 4. Cover plate; 5. Mounting block; 6. Screw; 7. Turntable; 8. Moving plate; 9. Buffer spring; 10. Card slot; 11. Chip module; 12. Rectangular sealing groove; 13. Rectangular sealing gasket; 14. Telescopic rod; 15. Limiting rod; 16. U-shaped handle; 17. Anti-slip pad. Detailed implementation manners

[0029] In order to enable those skilled in the art to better understand the technical solutions of the present utility model, the present utility model will be further introduced in detail below in conjunction with the accompanying drawings.

[0030] An embodiment of the present utility model discloses a novel encapsulation structure for a card reader chip module.

[0031] Embodiment 1

[0032] The present utility model provides a novel encapsulation structure for a card reader chip module as shown in Figures 1-5 which includes a sealing box 1, a bi-directional lead screw 2 and two clamping plates 3. A cover plate 4 is attached to the top of the sealing box 1. A plurality of mounting blocks 5 are fixedly arranged on the side walls of both the sealing box 1 and the cover plate 4. The upper plurality of mounting blocks 5 are internally movably sleeved with screws 6. The other end of each screw 6 is threadedly sleeved inside the lower mounting blocks 5. The bi-directional lead screw 2 is rotatably arranged on the inner wall of the sealing box 1. One end of the bi-directional lead screw 2 penetrates through the sealing box 1 and is fixedly provided with a turntable 7. Two moving plates 8 are threadedly sleeved on the rod wall of the bi-directional lead screw 2. A plurality of buffer springs 9 are fixedly arranged on the side wall of each moving plate 8. The two clamping plates 3 are respectively fixedly connected to the other ends of the corresponding buffer springs 9. Card slots 10 are opened on the side walls of the two clamping plates 3. A chip module 11 is clamped between the two card slots 10. By using the provided bi-directional lead screw 2, a plurality of buffer springs 9 and a plurality of mounting blocks 5, rotating the plurality of screws 6 can realize the quick disassembly and assembly of the cover plate 4. Rotating the turntable 4 drives the bi-directional lead screw 2 to rotate. When the bi-directional lead screw 2 rotates, it can drive the two moving plates 8, a plurality of buffer springs 9 and the two clamping plates 3 to move in the opposite direction, thereby facilitating the user to quickly disassemble and assemble the chip module 11. During the clamping process, the plurality of buffer springs 9 can buffer the chip module 11, thereby preventing the chip module 11 from being damaged due to excessive clamping force, and thus effectively protecting the chip module 11.

[0033] Embodiment 2

[0034] On the basis of Embodiment 1, in order to improve the sealing performance between the sealing box 1 and the cover plate 4 and prevent the influence of external water vapor on the use of the chip module 11, as shown in Figures 1-4As shown, a rectangular sealing groove 12 is provided on the top side wall of the sealed box 1, and a rectangular sealing gasket 13 is fixedly arranged at the bottom of the cover plate 4. The rectangular sealing gasket 13 is hermetically inserted into the inside of the rectangular sealing groove 12. By using the provided rectangular sealing groove 12 and rectangular sealing gasket 13, the sealing performance between the sealed box 1 and the cover plate 4 can be improved, preventing the influence of external water vapor on the use of the chip module 11.

[0035] Embodiment III

[0036] On the basis of Embodiment I, in order to realize the stable movement of multiple clamping plates 3, and then be able to stably clamp the chip module 11 inside the two clamping grooves 10, as Figures 2-3 and Figure 5 shown, a telescopic rod 14 is movably sleeved inside each buffer spring 9. One end of each telescopic rod 14 is fixedly connected to the corresponding moving plate 8, and the other end of each telescopic rod 14 is fixedly connected to the corresponding clamping plate 3. By using the provided multiple telescopic rods 14, the stable movement of multiple clamping plates 3 is realized, and then the chip module 11 can be stably clamped inside the two clamping grooves 10.

[0037] In order to be able to limit the movement of the moving plate 8 and improve the stability of the movement of the two moving plates 8, multiple buffer springs 9, multiple telescopic rods 14 and two clamping plates 3, as Figures 1-3 and Figure 5 shown, a limiting rod 15 is fixedly arranged on the inner wall of the sealed box 1, and the two moving plates 8 are movably sleeved on the rod wall of the limiting rod 15. By using the provided limiting rod 15, the movement of the moving plate 8 can be limited, and the stability of the movement of the two moving plates 8, multiple buffer springs 9, multiple telescopic rods 14 and two clamping plates 3 can be improved.

[0038] In order to be able to facilitate the user to take the cover plate 4, as Figures 1-4 shown, two U-shaped handles 16 are fixedly arranged on the top of the cover plate 4. By using the provided to reduce the weight of the sealed box 1 and the cover plate 4 and reduce the production cost, the user can be facilitated to take the cover plate 4.

[0039] In order to be able to reduce the weight of the sealed box 1 and the cover plate 4 and reduce the production cost, as Figures 1-4 shown, the sealed box 1 is an aluminum alloy box, and the cover plate 4 is an aluminum alloy plate. Both the sealed box and the cover plate are made of aluminum alloy material, and then the weight of the sealed box 1 and the cover plate 4 can be reduced, and the production cost can be reduced.

[0040] In order to be able to improve the anti-slip effect of the sealed box 1 and ensure that the sealed box 1 can be stably placed, as Figures 1-3As shown, anti-slip pads 17 are fixedly arranged at the four corners of the bottom of the sealed box 1. The anti-slip pads 17 are rubber pads. By using the arranged anti-slip pads 17, the anti-slip effect of the sealed box 1 can be improved, ensuring that the sealed box 1 can be stably placed.

[0041] In order to ensure that the rectangular sealing gasket 13 can have a high sealing effect, as Figures 3-4 shown, the rectangular sealing gasket 13 is a rubber gasket, thus ensuring that the rectangular sealing gasket 13 can have a high sealing effect.

[0042] Finally, in order to facilitate the user to rotate multiple screws 6, as Figure 1 shown, each screw 6 is a handle plum blossom screw, which can facilitate the user to rotate multiple screws 6.

[0043] Only some exemplary embodiments of the present invention are described by way of illustration above. Undoubtedly, for those of ordinary skill in the art, the described embodiments can be modified in various different ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the protection scope of the claims of the present invention.

Claims

1. A novel card reader chip module packaging structure, comprising a packaging box (1), a bidirectional screw rod (2) and two card boards (3), characterized in that: The top of the packaging box (1) is fitted with a cover plate (4), and the side walls of the packaging box (1) and the cover plate (4) are fixedly provided with a plurality of mounting blocks (5), the interiors of the upper plurality of mounting blocks (5) are movably sleeved with screw rods (6), and the other end of each screw rod (6) is threadedly sleeved on the interior of the lower mounting block (5), the bidirectional screw rod (2) is rotatably provided on the inner wall of the packaging box (1), one end of the bidirectional screw rod (2) penetrates the packaging box (1) and is fixedly provided with a turntable (7), the rod wall of the bidirectional screw rod (2) is threadedly sleeved with two movable plates (8), and the side wall of each movable plate (8) is fixedly provided with a plurality of buffer springs (9), the two clamping plates (3) are respectively fixedly connected to the other end of the corresponding buffer spring (9), the side walls of the two clamping plates (3) are provided with clamping grooves (10), and a chip module (11) is clamped between the two clamping grooves (10).

2. A novel card reader chip module packaging structure according to claim 1, characterized in that: A rectangular sealing groove (12) is provided on the top side wall of the packaging box (1), and a rectangular sealing gasket (13) is fixedly provided on the bottom of the cover plate (4), wherein the rectangular sealing gasket (13) is sealingly inserted into the interior of the rectangular sealing groove (12).

3. The novel card reader chip module packaging structure according to claim 1 is characterized in that: A telescopic rod (14) is movably sleeved inside each of the buffer springs (9), one end of each of the telescopic rods (14) is fixedly connected to the corresponding movable plate (8), and the other end of each of the telescopic rods (14) is fixedly connected to the corresponding clamping plate (3).

4. The novel card reader chip module packaging structure according to claim 1 is characterized in that: A limiting rod (15) is fixedly provided on the inner wall of the packaging box (1), and the two movable plates (8) are both movably sleeved on the rod wall of the limiting rod (15).

5. The novel card reader chip module packaging structure according to claim 1 is characterized in that: Two U-shaped handles (16) are fixedly arranged on the top of the cover plate (4).

6. The novel card reader chip module packaging structure according to claim 1, characterized in that: The packaging box (1) is an aluminum alloy box, and the cover plate (4) is an aluminum alloy plate.

7. The novel card reader chip module packaging structure according to claim 1, characterized in that: Anti-skid pads (17) are fixedly arranged at the four corners of the bottom of the packaging box (1), and the anti-skid pads (17) are rubber pads.

8. The novel card reader chip module packaging structure according to claim 2, characterized in that: The rectangular sealing pad (13) is a rubber pad.

9. The novel card reader chip module packaging structure according to claim 1, characterized in that: Each of the screw rods (6) is a handle plum screw rod.

Citation Information

Patent Citations

  • Card reader packaging structure

    CN202255638U