Heat-conducting gasket and electronic equipment

Abstract

The utility model discloses a heat-conducting gasket and electronic equipment, and the heat-conducting gasket comprises a heat-conducting pad and a protective layer. The protective layer is connected to the side surface of the heat conduction pad, and a hollow part is arranged in the protective layer. The protection layer is only connected to the side face of the heat conduction pad, so that complete packaging of the side face of the heat conduction pad can be achieved, reinforcement of the edge structure of the heat conduction pad is achieved, chippings can be effectively prevented from falling off from the edge position of the heat conduction pad, meanwhile, the heat dissipation area on the heat conduction pad cannot be reduced, and the heat conduction pad can play a normal heat dissipation effect. Besides, the hollow part is arranged in the protective layer, so that the protective layer can obtain good compressibility and rebound resilience, the compression stress is very low, the corresponding compression stress is not greater than 40psi under the condition that the protective layer generates 50% compression strain, and the thermal resistance can reach 0.080 DEG C * cm < 2 > / W or below, thereby being beneficial to reducing the thermal resistance and improving the heat dissipation efficiency.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation, and specifically relates to a thermal conductive gasket and an electronic device. Background Art

[0002] High-heat-generating devices such as chips generally need to achieve heat dissipation through thermal conductive pads. The thermal conductive pads themselves are relatively brittle, and after cutting, the edges of the thermal conductive pads will become more porous. During the compression and long-term use of the thermal conductive pads, debris may fall off from their edges, causing short circuits in the circuit board.

[0003] In the prior art, solid glue is generally coated on the edges of the thermal conductive pads. The glue will have a certain extension amount on both the upper and lower surfaces of the thermal conductive pads, resulting in a reduction in the heat dissipation area of the thermal conductive pads. Moreover, the cured glue after molding has a high compression modulus, poor compressibility, and a large rebound force, making it not suitable for low-stress scenarios. Summary of the Utility Model

[0004] In view of this, this application provides a thermal conductive gasket and an electronic device to solve the problems in the prior art that when using solid glue to encapsulate the edges of the thermal conductive gasket, the glue will have a certain extension amount on both the upper and lower surfaces of the thermal conductive pad, resulting in a reduction in the heat dissipation area of the thermal conductive pad, and the cured glue after molding has a high compression modulus, poor compressibility, and a large rebound force, making it not suitable for low-stress scenarios.

[0005] In a first aspect, this application provides a thermal conductive gasket, which includes: a thermal conductive pad and a protective layer. The protective layer is connected to the side surface of the thermal conductive pad, and a hollow portion is provided in the protective layer.

[0006] In this application, the protective layer can be connected to the side surface of the thermal conductive pad, so as to achieve a complete encapsulation of the side surface of the thermal conductive pad, strengthen the edge structure of the thermal conductive pad, and effectively prevent debris from falling off at the edge position of the thermal conductive pad. Among them, the protective layer is only provided on the side surface of the thermal conductive pad, and will not be provided on the upper and lower surfaces of the thermal conductive pad, so as not to block the upper and lower surfaces of the thermal conductive pad and reduce the heat dissipation area on the thermal conductive pad, which is beneficial to the thermal conductive pad to exert its normal heat dissipation effect. In addition, by providing a hollow portion in the protective layer, the protective layer can obtain good compressibility and resilience, with a very low compression stress. When a 50% compressive strain is generated in the protective layer, the corresponding compression stress is not greater than 40 psi, and the thermal resistance can reach below 0.080 °C*cm2 / W. That is to say, when the thermal conductive gasket is pressed against high-heat-generating devices such as chips by external pressure, the protective layer only needs a small compression stress to generate a large elastic deformation, which is beneficial to ensuring that when a small external pressure is applied to the thermal conductive gasket, the protective layer will not generate a large elastic resistance, so as to ensure reliable bonding between the thermal conductive pad and high-heat-generating devices such as chips, maximize the bonding area, and at the same time is beneficial to reducing the thermal resistance and improving the heat dissipation efficiency.

[0007] In a possible design, the protective layer is a closed ring, and the protective layer is circumferentially connected to the side surface of the heat-conducting pad along the circumference of the heat-conducting pad. Thus, the protective layer can completely cover and encapsulate all the side surfaces of the heat-conducting pad in the circumferential direction, thereby effectively preventing debris from falling off the edge of the heat-conducting pad.

[0008] In a possible design, the shape of the protective layer is a circular ring or a square ring, and the shape of the protective layer can match the contour shape of the heat-generating device. Exemplarily, when the shape of the heat-conducting pad is square, the shape of the protective layer is a square ring, specifically, it can be in the shape of a "square". Exemplarily, when the shape of the heat-conducting pad is circular, the shape of the protective layer is a circular ring. Thus, by making the shapes of the protective layer and the heat-conducting pad match, it is possible to reliably encapsulate and cover all positions on the side surface of the heat-conducting pad through the protective layer.

[0009] In a possible design, the hollow portion is provided inside the protective layer, and the hollow portion includes closed air bubbles. Among them, by forming air bubbles in the protective layer, it is beneficial for the protective layer to generate a large deformation under a small compressive stress, so that it is beneficial for the heat-conducting pad to reliably adhere to high-heat-generating devices such as chips in a scenario of low compressive stress, ensuring efficient heat dissipation.

[0010] In a possible design, the inner diameter of the hollow portion is between 5 and 500 μm, so that the protective layer can generate a large deformation under a small compressive stress, which is beneficial for the heat-conducting pad to reliably adhere to high-heat-generating devices such as chips in a scenario of low compressive stress, ensuring efficient heat dissipation.

[0011] In a possible design, the hollow portion includes through holes and / or blind holes. These through holes and blind holes can be understood as the aforementioned hollow portion. The center line directions of the through holes and blind holes can be in any direction, and multiple through holes or blind holes can be provided, so that the foam can be easily compressed. That is to say, by forming through holes or blind holes in the protective layer, it is beneficial for the protective layer to generate a large deformation under a small compressive stress, so that it is beneficial for the heat-conducting pad to reliably adhere to high-heat-generating devices such as chips in a scenario of low compressive stress, ensuring efficient heat dissipation.

[0012] In a possible design, the inner diameter of the through hole or the blind hole is between 5 and 500 μm, so that the protective layer can generate a large deformation under a small compressive stress, which is beneficial for the heat-conducting pad to reliably adhere to high-heat-generating devices such as chips in a scenario of low compressive stress, ensuring efficient heat dissipation.

[0013] In a possible design, the thickness of the protective layer is greater than or equal to the thickness of the heat-conducting pad, so as to ensure that the protective layer completely covers the side surface of the heat-conducting pad and effectively prevent debris from falling off the edge of the heat-conducting pad.

[0014] In a possible design, the upper surface of the protective layer is flush with the upper surface of the heat-conducting pad. During the process of applying pressure to the heat-conducting gasket through external pressure, the protective layer and the heat-conducting pad can be deformed simultaneously under pressure, which can ensure that the heat-conducting pad and the protective layer are simultaneously subjected to balanced pressure, facilitating the reliable attachment of the heat-conducting pad to high-heat-generation devices such as chips and improving the heat-conducting effect.

[0015] In a possible design, the width of the protective layer is between 30 and 1000 μm. Within this width range, it is possible to avoid the protective layer occupying too much space, which is beneficial to improving the space utilization rate. At the same time, it can ensure a reliable bonding force between the protective layer and the heat-conducting pad and can also be applicable to scenarios with low compressive stress.

[0016] In a possible design, the protective layer includes a foam layer and an adhesive layer, and the foam layer is connected to the side surface of the heat-conducting pad through the adhesive layer. Among them, the foam layer can be a separately processed and formed part, and the adhesive layer has adhesiveness, and the connection and fixation between the foam layer and the heat-conducting pad can be achieved through the adhesive layer, which is convenient for operation. Exemplarily, the adhesive layer can be a double-sided tape or an adhesive, which can ensure the reliable connection between the foam layer and the heat-conducting pad and enhance the strengthening effect on the structure at the edge of the heat-conducting pad. Among them, through holes or blind holes can be provided on the foam layer, and these through holes and blind holes can be understood as the aforementioned hollow parts. The central line direction of the through holes and blind holes can be in any direction, and multiple through holes or blind holes can be provided, so that the foam can be easily compressed. That is to say, by forming through holes or blind holes in the protective layer, it is beneficial for the protective layer to generate a large deformation under a small compressive stress, thereby facilitating the reliable attachment of the heat-conducting pad to high-heat-generation devices such as chips in a scenario with low compressive stress and ensuring efficient heat dissipation.

[0017] In a possible design, the adhesive layer is a double-sided tape or an adhesive, whereby the reliable connection between the foam layer and the heat-conducting pad can be ensured, and the strengthening effect on the structure at the edge of the heat-conducting pad can be enhanced.

[0018] In a possible design, the material of the foam layer is one of polyurethane, polyolefin, low-density polyethylene, ethylene-vinyl acetate copolymer, and synthetic rubber material. Among them, the foam layer prepared from these materials can obtain good compressibility and resilience, which is beneficial for the protective layer to generate a large deformation under a small compressive stress, thereby facilitating the reliable attachment of the heat-conducting pad to high-heat-generation devices such as chips in a scenario with low compressive stress and ensuring efficient heat dissipation.

[0019] In a possible design, the material of the protective layer is one of silicone, polyurethane, acrylic resin, and polyolefin elastomer.

[0020] In a possible design, the material of the protective layer is an adhesive, the viscosity of the adhesive is 8000 - 150000 mPa*s, and the thixotropic index is greater than 1.5.

[0021] In a possible design, the material of the heat-conducting pad is one of carbon fiber, graphene, carbon nanotubes, and flaky silver. The protective layer prepared from these materials can achieve reliable bonding with the heat-conducting pad. At the same time, a hollow part can be formed in the protective layer, enabling a large deformation amount to be generated with a relatively small compressive stress applied to the protective layer.

[0022] In a possible design, the thickness of the heat-conducting pad is between 200 - 1500 μm. Within this range, the heat dissipation requirements of most high-heat-generating devices can be met. At the same time, excessive occupation of space can be avoided, which is conducive to achieving a thin design.

[0023] In a second aspect, the present application also provides an electronic device, which includes a high-heat-generating device and the heat-conducting gasket provided in the first aspect of the present application, and the heat-conducting gasket is connected to the high-heat-generating device. Among them, the electronic device including the heat-conducting gasket provided in the first aspect of the present application has similar technical effects to the aforementioned heat-conducting gasket, which will not be elaborated here.

[0024] It should be understood that the above general description and the following detailed description are only exemplary and do not limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0026] Figure 1 It is a top view of the heat-conducting gasket provided by the embodiment of the present application;

[0027] Figure 2 It is a side view of the heat-conducting gasket provided by an embodiment of the present application;

[0028] Figure 3 It is a schematic diagram when dispensing glue on the side of the heat-conducting pad using a glue-dispensing tool in the present application;

[0029] Figure 4 It is a scan view of the protective layer provided by the embodiment of the present application;

[0030] Figure 5 It is a side view of the heat-conducting gasket provided by another embodiment of the present application;

[0031] Figure 6Side view of the thermal conductive gasket provided by another embodiment of the present application;

[0032] Figure 7 Side view of the thermal conductive gasket provided by yet another embodiment of the present application.

[0033] Reference numerals:

[0034] 1 - Thermal pad;

[0035] 11 - Upper surface;

[0036] 2 - Protective layer;

[0037] 21 - Hollowed-out part;

[0038] 22 - Protruding part;

[0039] 23 - Foam layer;

[0040] 24 - Adhesive layer;

[0041] 3 - Glue application tool;

[0042] 4 - Platform;

[0043] Z - Thickness direction. Detailed implementation manners

[0044] In order to better understand the technical solutions of the present application, the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0045] It should be clear that the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0046] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms of "a", "the" and "said" used in the embodiments of the present application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0047] It should be understood that the term " / and / " used herein is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after.

[0048] In the description of this application, unless otherwise clearly specified or limited, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance; unless otherwise specified or stated, the term "plurality" means two or more; the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0049] In an electronic device, usually high-heat-generating components such as chips are arranged. High-heat-generating components such as chips generally need to dissipate heat through a thermal pad. The thermal pad itself is relatively brittle, and after cutting, the edges of the thermal pad will become more loose. During the compression and long-term use of the thermal pad, debris may fall off from its edges, causing a short circuit in the circuit board.

[0050] In the prior art, generally a solid glue is coated on the edges of the thermal pad. The glue will have a certain extension amount on both the upper surface and the lower surface of the thermal pad, resulting in a reduction in the heat dissipation area of the thermal pad, reducing the heat dissipation efficiency. Moreover, the compression modulus of the glue after forming and curing is high. The solid structure formed by the curing of the glue has a compression stress as high as 95 psi at 50% compression strain, with poor compressibility and a large rebound force, making it difficult to ensure reliable contact between the thermal pad and high-heat-generating components such as chips. And this solid structure formed by the curing of the glue will also cause a large thermal resistance. The overall thermal resistance of the thermal pad with solid glue is as high as 0.102 °C * cm 2 / W. Therefore, this kind of thermal pad coated with solid glue is not suitable for low-stress scenarios.

[0051] An embodiment of this application provides a thermal pad. This thermal pad can be applied in an electronic device. In the electronic device, high-heat-generating components such as chips can be provided. The thermal pad can be attached to the high-heat-generating component to achieve heat dissipation of the high-heat-generating component. Among them, the electronic device can be a mobile phone, a computer, a mobile internet device (MID), a wearable device, a virtual reality (VR) device, an augmented reality (AR) device, a robotic arm, a camera, a robot, or a smart home device (such as a TV, an air conditioner, a floor sweeper, a speaker, a set-top box), a relay, a customer premise equipment (CPE), etc. The embodiments of this application do not limit the specific technologies and specific device forms adopted by the electronic device.

[0052] Figure 1The structural schematic diagram of the thermal conductive gasket provided by the embodiment of the present application is referred to Figure 1 , the thermal conductive gasket may include a thermal conductive pad 1 and a protective layer 2. Among them, the thermal conductive pad 1 includes an upper surface 11, a lower surface and a side surface. The upper surface 11 and the lower surface are the surfaces on both sides of the thermal conductive pad 1 in the thickness direction Z, and the side surface is the surface of the thermal conductive pad 1 perpendicular to the thickness direction Z. The lower surface of the thermal conductive pad 1 is used to contact high-heat-generating devices such as chips. The heat generated by the high-heat-generating devices can be conducted to the air through the heat-conducting member to achieve heat dissipation. The protective layer 2 can be connected to the side surface of the thermal conductive pad 1, and specifically can be bonded to the side surface of the thermal conductive pad 1 by bonding, so as to realize the complete encapsulation of the side surface of the thermal conductive pad 1, strengthen the edge structure of the thermal conductive pad 1, and effectively avoid the falling of debris at the edge position of the thermal conductive pad 1. Among them, the protective layer 2 is only provided on the side surface of the thermal conductive pad 1, and will not be provided on the upper surface 11 and the lower surface of the thermal conductive pad 1, so that the upper surface 11 and the lower surface of the thermal conductive pad 1 will not be blocked to reduce the heat dissipation area on the thermal conductive pad 1, which is beneficial to the thermal conductive pad 1 to play a normal heat dissipation effect.

[0053] In this embodiment, referring to Figure 1 , the protective layer 2 may be provided with a hollow portion 21. The hollow portion 21 may be filled with air and is not a solid structure. There may be a plurality of the above-mentioned hollow portions 21 in the protective layer 2. The protective layer 2 can obtain good compressibility and resilience, and the compression stress is very low. When the protective layer 2 generates a 50% compressive strain, the corresponding compression stress is not greater than 40 psi, and the thermal resistance can reach below 0.080 °C*cm2 / W. That is to say, when the thermal conductive gasket is pressed against high-heat-generating devices such as chips by external pressure, the protective layer 2 only needs a small compression stress to generate a large elastic deformation, which is beneficial to realizing that when a small external pressure is applied to the thermal conductive gasket, the protective layer 2 will not generate a large elastic resistance, so as to ensure reliable fitting of the thermal conductive pad 1 and high-heat-generating devices such as chips, maximize the fitting area, and at the same time is beneficial to reducing the thermal resistance and improving the heat dissipation efficiency.

[0054] In one implementation, referring to Figure 1 , the protective layer 2 may be a closed ring, and the protective layer 2 is circumferentially connected to the side surface of the thermal conductive pad 1 along the circumference of the thermal conductive pad 1. That is to say, the protective layer 2 can completely cover and encapsulate the side surfaces of the thermal conductive pad 1 in the circumferential direction, so as to effectively avoid the falling of debris at the edge of the thermal conductive pad 1.

[0055] Among them, the shape of the protective layer 2 may be a circular ring or a square ring, and the shape of the protective layer 2 may match the contour shape of the heat-generating device. Exemplarily, when the shape of the thermal conductive pad 1 is square (refer to Figure 1), the shape of the protective layer 2 is a square ring shape, specifically it can be a "mouth" shape. Exemplarily, when the shape of the heat-conducting pad 1 is circular, the shape of the protective layer 2 is an annular shape. Thus, by making the shapes of the protective layer 2 and the heat-conducting pad 1 match, it is possible to reliably encapsulate and cover various positions on the side of the heat-conducting pad 1 through the protective layer 2.

[0056] In one implementation, the width of the protective layer 2 can be between 30 and 1000 μm. Herein, the width of the protective layer 2 refers to the dimension of the protective layer 2 in the direction Z perpendicular to the thickness direction of the heat-conducting gasket. Within this width range, it is possible to avoid the protective layer 2 occupying too much space, which is beneficial to improving the space utilization rate. At the same time, it can ensure a reliable bonding force between the protective layer 2 and the heat-conducting pad 1, and can also be applicable to scenarios with low compressive stress.

[0057] In one implementation, the material of the heat-conducting pad 1 can be a conductive material, such as carbon fiber, graphene, carbon nanotubes, flaky silver, etc., so that the heat-conducting pad 1 can obtain a relatively high thermal conductivity coefficient, which is beneficial to improving the heat dissipation effect of the heat-conducting pad 1 on high-heat-generating devices. In addition, in one embodiment, the thickness of the heat-conducting pad 1 can be between 200 and 1500 μm. Within this range, it can meet the heat dissipation requirements of most high-heat-generating devices, and at the same time can avoid excessive occupation of space, which is beneficial to realizing a thin design.

[0058] In one implementation, Figure 2 is a side view of the heat-conducting gasket provided by an embodiment of the present application. Referring to Figure 2 , in the direction Z perpendicular to the thickness direction of the heat-conducting gasket, the protective layer 2 can have only one layer, that is, the protective layer 2 is a single-layer structure. The material of the protective layer 2 can be an adhesive, and it can be formed by processes such as dispensing, screen printing or spraying. Exemplarily, Figure 3 is a schematic diagram when the dispensing tool 3 is used to dispense glue on the side of the heat-conducting pad 1 in the present application. Referring to Figure 3, during the specific operation process of the dispensing process, the thermal pad 1 can be pre-placed on the platform 4. The platform 4 can be structures such as a table or a bench. The platform 4 has a flat surface, and the thermal pad 1 can be placed flat on the flat surface. After the thermal pad 1 is placed, a dispensing tool 3 such as a dispensing tube can be used to dispense glue to the edge area of the thermal pad 1. Among them, a dispensing tool 3 such as a dispensing tube can be installed on an automated device. The automated device can accurately identify the edge of the thermal pad 1 and can generate a dispensing trajectory, so that the glue can be accurately coated on the side of the thermal pad 1. Through the fluidity of the glue and the adsorption force between molecules, the glue can cover the side of the thermal pad 1. After the glue is cured, the protective layer 2 formed by the glue can be reliably combined with the thermal pad 1, and the bonding force between the protective layer 2 and the thermal pad 1 can be greater than the cohesive force of the thermal pad 1, and the bonding force strength between the protective layer 2 and the thermal pad 1 can be greater than or equal to 0.1 MPa, so that the chips falling off the edge of the thermal pad 1 can be effectively prevented, and it is beneficial to improve the overall tensile strength of the thermal pad 1 and the anti-cracking ability of the thermal pad 1. At the same time, since the protective layer 2 is not provided on the upper surface 11 of the thermal pad 1, the space occupied by the thermal pad in the Z direction of the thickness direction can be reduced, which is beneficial to realizing a thin design.

[0059] In addition, curing the glue into the protective layer 2 and forming the hollow portion 21 in the protective layer 2 can be achieved by heating or other means. Exemplarily, Figure 4 is a scan diagram of the protective layer 2 provided by the embodiment of the present application. Refer to Figure 4 , when the glue is foamed by heating or other means, a large number of closed bubbles can be formed in the glue. The bubbles can be understood as the aforementioned hollow portion 21, and the bubbles are filled with air. The bubbles can make the protective pad easier to be compressed. That is to say, by forming bubbles in the protective layer 2, it is beneficial to make the protective layer 2 generate a large deformation under a small compressive stress, so that the thermal pad 1 can be reliably attached to high-heat-generating devices such as chips in a low-compressive-stress scenario, ensuring efficient heat dissipation.

[0060] In one embodiment, the bubbles can be regular in shape. For example, the bubbles can be spherical or ellipsoidal. Of course, the bubbles can also be irregular in shape. The shape of the bubbles can be naturally formed during the foaming process of the glue, but the volume of the bubbles can be achieved by controlling the selection of the adhesive material, the process parameters of curing and foaming, etc. Exemplarily, the volume of the bubbles can be achieved by controlling the inner diameter of the bubbles. For example, the inner diameter size of the bubbles can be controlled to be between 5 and 500 μm, so that the protective layer 2 can generate a large deformation under a small compressive stress, which is beneficial to the thermal pad 1 being able to be reliably attached to high-heat-generating devices such as chips in a low-compressive-stress scenario, ensuring efficient heat dissipation.

[0061] In one implementation, as described above, the material of the protective layer 2 can be an adhesive, the viscosity of the adhesive can be 8,000 - 150,000 mPa·s, and the thixotropic index is greater than 1.5. Among them, within the above range of the viscosity of the adhesive, it can ensure that the protective layer 2 formed by curing the adhesive can be reliably bonded and fixed to the heat-conducting pad 1, and can effectively prevent debris from falling off the edge of the heat-conducting pad 1. At the same time, by making the thixotropic index of the adhesive greater than 1.5, it can ensure that the adhesive can have a certain three-dimensional shape when coated on the side of the heat-conducting pad 1, reduce fluidity, and is beneficial to curing the adhesive into a protective layer 2 with a preset shape. Exemplarily, when the protective layer 2 uses silicone foam adhesive, the viscosity of the silicone foam adhesive can be 150,000 mPa·s, the thixotropic index can be 2.5, the maximum width after the adhesive cures and foams can reach about 150 μm, and the stress of the protective layer 2 under 50% compressive strain can be 20 psi.

[0062] In one implementation, the material of the protective layer 2 can be one or a combination of silicone, polyurethane, acrylic resin, polyolefin elastomer, etc. The protective layer 2 prepared from these materials can be reliably bonded to the heat-conducting pad 1, and at the same time, a hollow part 21 can be formed in the protective layer 2, which can achieve a large deformation amount with a relatively small compressive stress applied to the protective layer 2.

[0063] In one implementation, Figure 5 is a side view of the heat-conducting gasket provided by another embodiment of the present application. Referring to Figure 5 , the protective layer 2 can include a foam layer 23 and an adhesive layer 24, and the foam layer 23 is connected to the side of the heat-conducting pad 1 through the adhesive layer 24. Among them, the foam layer 23 can be a separately processed and formed part, and the adhesive layer 24 has adhesiveness, and the connection and fixation between the foam layer 23 and the heat-conducting pad 1 can be realized through the adhesive layer 24, which is convenient for operation. Exemplarily, the adhesive layer 24 can be double-sided tape or an adhesive, which can ensure the reliable connection between the foam layer 23 and the heat-conducting pad 1 and enhance the strengthening effect on the structure at the edge of the heat-conducting pad 1.

[0064] Among them, through holes or blind holes can be provided on the foam layer 23, and these through holes and blind holes can be understood as the aforementioned hollow part 21. The center line direction of the through holes and blind holes can be in any direction, and multiple through holes or blind holes can be provided, so that the foam can be more easily compressed. That is to say, by forming through holes or blind holes in the protective layer 2, it is beneficial to make the protective layer 2 generate a large deformation under a relatively small compressive stress, so that the heat-conducting pad 1 can be reliably attached to high-heat-generating devices such as chips in a scenario with a low compressive stress, ensuring efficient heat dissipation.

[0065] In one implementation, the material of the foam layer 23 is one or a combination of polyurethane (PU), polyolefins (PO), expandable polyethylene (EPE), ethylene vinyl acetate copolymer (EVA), and ethylene propylene diene monomer (EPDM). Among them, the foam layer 23 prepared from these materials can obtain good compressibility and resilience, which is beneficial to cause the protective layer 2 to generate a large deformation under a small compressive stress, so that the heat-conducting pad 1 can be reliably attached to high-heat-generation devices such as chips in a scenario of low compressive stress, ensuring efficient heat dissipation.

[0066] In one implementation, the inner diameter size of the through hole or blind hole can be between 5 and 500 μm, so that the protective layer 2 can generate a large deformation under a small compressive stress, which is beneficial to the heat-conducting pad 1 being reliably attached to high-heat-generation devices such as chips in a scenario of low compressive stress, ensuring efficient heat dissipation. Exemplarily, the aperture of the through hole or blind hole on the foam can be 100 μm, and the stress of the protective layer 2 under 50% compressive strain is 25 psi.

[0067] In one implementation, the thickness of the protective layer 2 can be greater than or equal to the thickness of the heat-conducting pad 1, so as to ensure that the protective layer 2 completely covers the side surface of the heat-conducting pad 1 and effectively prevent debris from falling off the edge of the heat-conducting pad 1.

[0068] In one implementation, referring to Figure 5 , when the protective layer 2 includes a separately manufactured foam layer 23, the thickness of the foam layer 23 can be the same as the thickness of the heat-conducting pad 1, that is, after the foam layer 23 is connected and fixed to the heat-conducting pad 1 through the adhesive layer 24, the upper surface of the foam layer 23 is flush with the upper surface 11 of the heat-conducting pad 1. During the process of applying pressure to the heat-conducting gasket by external pressure, the foam layer 23 and the heat-conducting pad 1 can be deformed under pressure at the same time, which can ensure that the heat-conducting pad 1 and the foam layer 23 are simultaneously subjected to balanced pressure, which is beneficial to the reliable attachment of the heat-conducting pad 1 to high-heat-generation devices such as chips and improves the heat-conducting effect.

[0069] In one implementation, Figure 6 is a side view of the heat-conducting gasket provided by another embodiment of the present application. Referring to Figure 6, when the protective layer 2 is a single-layer structure formed by curing an adhesive, for example, when using a dispensing process to apply glue, by controlling process parameters such as the glue output per unit time of the dispensing tool 3 and the moving speed of the dispensing tool 3, the glue can completely cover the side surface of the heat-conducting pad 1. Since the dispensing tool 3 generally moves continuously during dispensing, affected by factors such as the moving speed and the viscosity of the glue itself, during the process of the dispensing tool 3 moving from one dispensing position to the next dispensing position, a part of the glue at the glue outlet of the dispensing tool 3 will be pulled, resulting in a protruding portion 22 appearing at the top of the glue at one dispensing position. The width of the protruding portion 22 gradually decreases from the lower surface of the heat-conducting pad 1 to the upper surface 11. The protruding portion 22 can protrude above the upper surface 11 of the heat-conducting pad 1, and the protruding portion 22 does not contact the side surface of the heat-conducting pad 1 and does not extend to the upper surface 11 of the heat-conducting pad 1. The height of the protruding portion 22 can be the distance between the plane where the upper surface 11 of the heat-conducting pad 1 is located and the end far from the heat-conducting pad 1 on the protruding portion 22. In order to prevent the protruding portion 22 from being squeezed onto the upper surface 11 of the heat-conducting pad 1 under external pressure, resulting in a reduction in the heat dissipation area of the heat-conducting pad 1, the height H of the protruding portion 22 can be less than or equal to 50 μm. The height H of the protruding portion 22 can be controlled by controlling parameters such as the moving speed and the glue output of the dispensing tool 3, and can also be comprehensively considered in combination with the viscosity and thixotropic index of the glue.

[0070] As described above, refer to Figure 2 and Figure 6 , the protective layer 2 connected to the side surface of the heat-conducting pad 1 can have a uniform width. In addition, in some other embodiments, for different glue application processes, the protective layer 2 connected to the side surface of the heat-conducting pad 1 can also have different widths in the thickness direction Z of the heat-conducting pad 1. Figure 7 This is a side view of the heat-conducting gasket provided by another embodiment of the present application. Refer to Figure 7 , the width of the protective layer 2 formed by curing the glue gradually decreases from bottom to top, so that the outer surface of the protective layer 2 on the side far from the heat-conducting pad 1 forms an inclined surface. This shape of the protective layer 2 can also achieve reliable connection and fixation with the heat-conducting pad 1, and is also suitable for scenarios where effective heat dissipation is carried out under low compression stress.

[0071] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A thermally conductive pad, characterized in that: include: Thermal pad; A protective layer is connected to the side of the thermal pad, and a hollow portion is provided in the protective layer.

2. The thermally conductive pad according to claim 1, characterized in that: The protective layer is in a closed ring shape and is connected to the side surface of the thermal conductive pad along the circumference of the thermal conductive pad.

3. The thermally conductive pad according to claim 2, characterized in that: The protective layer is in the shape of a circular ring or a square ring.

4. The thermally conductive pad according to any one of claims 1 to 3, characterized in that: The hollow portion is arranged inside the protective layer, and the hollow portion includes closed bubbles.

5. The thermally conductive pad according to claim 4, characterized in that: The inner diameter of the hollow portion is between 5 and 500 μm.

6. The thermally conductive pad according to any one of claims 1 to 3, characterized in that: The hollow portion includes a through hole and / or a blind hole.

7. The thermally conductive pad according to claim 6, characterized in that: The inner diameter of the through hole or the blind hole is between 5 and 500 μm.

8. The thermally conductive pad according to claim 1, characterized in that: The thickness of the protective layer is greater than or equal to the thickness of the thermal pad.

9. The thermally conductive pad according to claim 1, characterized in that: The upper surface of the protection layer is flush with the upper surface of the thermal pad.

10. The thermally conductive pad according to claim 1, characterized in that: The width of the protective layer is between 30 and 1000 μm.

11. The thermally conductive pad according to any one of claims 1-3, 5, 7-10, characterized in that: The protective layer includes a foam layer and an adhesive layer, and the foam layer is connected to the side of the thermal pad through the adhesive layer.

12. The thermally conductive pad according to claim 11, characterized in that: The bonding layer is a double-sided tape or an adhesive.

13. The thermally conductive pad according to claim 11, characterized in that: The material of the foam layer is one of polyurethane, polyolefin, low-density polyethylene, ethylene-vinyl acetate copolymer, and synthetic rubber material.

14. The thermally conductive pad according to any one of claims 1-3, 5, 7-10, characterized in that: The material of the protective layer is one of silicone, polyurethane, acrylic resin and polyolefin elastomer.

15. The thermally conductive pad according to claim 14, characterized in that: The material of the protective layer is an adhesive, the viscosity of the adhesive is 8000-150000 mPa*s, and the thixotropic index is greater than 1.

5.

16. The thermally conductive pad according to claim 1, characterized in that: The material of the thermal pad is one of carbon fiber, graphene, carbon nanotube, and flaky silver.

17. The thermally conductive pad according to claim 16, characterized in that: The thickness of the thermal pad is between 200 and 1500 μm.

18. An electronic device, characterized in that: It comprises a high-heat-generating device and the thermally conductive gasket according to any one of claims 1 to 17, wherein the thermally conductive gasket is connected to the high-heat-generating device.

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