Integrated circuit chip heat dissipation substrate

Abstract

The utility model discloses an integrated circuit chip heat dissipation substrate, which comprises a bottom plate, a chip body, a heat dissipation assembly and a limiting assembly, and is characterized in that the heat dissipation assembly is arranged at the top of the bottom plate, and the limiting assembly is arranged at the top of the bottom plate; the heat dissipation assembly comprises a semiconductor chilling plate fixedly mounted at the top of the bottom plate, a first heat dissipation plate is fixedly mounted at the top of the semiconductor chilling plate, a first telescopic plate is fixedly mounted at the top of the first heat dissipation plate, a telescopic groove is formed in the top of the first telescopic plate, and a second telescopic plate is slidably mounted in the telescopic groove; and a second heat dissipation plate is fixedly mounted at the top of the second telescopic plate. According to the utility model, comprehensive and stable heat dissipation can be carried out on the chip body through the arranged heat dissipation assembly and the nanofluid, so that the situation that heat on the contact surfaces of the chip body, the first heat dissipation plate and the second heat dissipation plate cannot be dissipated in time is prevented, and the heat dissipation efficiency of the chip heat dissipation substrate on the chip body is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit chips, and particularly relates to a heat dissipation substrate for an integrated circuit chip. Background Art

[0002] A large number of packaged chips are used in power electronic products. The chips have high integration and fast processing speed, which can help products achieve miniaturization and integration. However, at the same time, they also bring problems of high energy consumption and large heat generation. If the heat of the chips cannot be effectively removed, the chips will have problems with reduced working efficiency due to high temperature, and in severe cases, the chips will even be burned out.

[0003] For example, the patent application with the application number CN201922267395.2 includes a package case. A substrate is arranged inside the package case. A plurality of pins are arranged on the side surface of the package case. A chip is arranged on the upper surface of the substrate. The solder pads on the chip are connected to the pins through leads. A base is arranged on the lower surface of the substrate opposite to the chip. The substrate is fixed on the package case through the base. A heat dissipation part Ⅰ is arranged on the substrate opposite to the chip. The heat dissipation part Ⅰ is made of a heat dissipation material. A plurality of heat dissipation holes are arranged on the upper surface of the base. A cavity is arranged inside the base. A vertical channel is arranged between the heat dissipation holes and the cavity. A plurality of side holes are arranged on the side surface of the base. A horizontal channel is arranged between the side holes and the cavity. The utility model helps the chip dissipate heat through the heat dissipation part on the substrate and the heat dissipation channels on the base, thereby improving the service life of the chip and reducing the replacement cost of the product.

[0004] In common circuit chip packages, a heat dissipation part is arranged at the position where the substrate faces the chip, and heat dissipation channels are arranged on the base below the heat dissipation part. The heat of the chip reaches the heat dissipation holes of the base through the heat dissipation part of the substrate, then passes through the vertical channel to reach the cavity, and finally passes through the horizontal channel and is dissipated from the side holes.

[0005] However, the hole sizes of the heat dissipation channels and the heat dissipation holes are limited, resulting in limited air flow in the holes, so that some heat remains on the inner walls of the holes and cannot be dissipated in time, thereby reducing the heat dissipation efficiency of the substrate for the chip. It is urgent to design a heat dissipation substrate for an integrated circuit chip to solve the above problems. Summary of the Utility Model

[0006] The purpose of the utility model is to provide a heat dissipation substrate for an integrated circuit chip to solve the above deficiencies in the prior art.

[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0008] It includes a bottom plate, a chip body, a heat dissipation component and a limiting component. The heat dissipation component is arranged on the top of the bottom plate, and the limiting component is arranged on the top of the bottom plate;

[0009] The heat dissipation component includes a semiconductor refrigerating sheet fixedly installed on the top of the bottom plate. A first heat dissipation plate is fixedly installed on the top of the semiconductor refrigerating sheet. A first telescopic plate is fixedly installed on the top of the first heat dissipation plate. A telescopic groove is formed in the top of the first telescopic plate. A second telescopic plate is slidably installed in the telescopic groove. A second heat dissipation plate is fixedly installed on the top of the second telescopic plate. A heat dissipation groove is formed between the first heat dissipation plate and the second heat dissipation plate.

[0010] The heat dissipation component can comprehensively and stably dissipate heat from the chip body through nanofluid, thereby preventing the situation where the heat on the contact surfaces of the chip body, the first heat dissipation plate and the second heat dissipation plate cannot be dissipated in time, thus increasing the heat dissipation efficiency of the chip heat dissipation substrate for the chip body.

[0011] The first telescopic plate and the second telescopic plate can limit and fix the chip body while dissipating heat from the chip body, thereby increasing the heat dissipation efficiency of the chip heat dissipation substrate for the chip body.

[0012] A baffle is fixedly installed at the rear side of the first heat dissipation plate. Nanofluids are arranged in the heat dissipation groove. A notch is formed in the front side of the second heat dissipation plate, and a valve is fixedly installed in the notch.

[0013] The chip body is clamped between the first heat dissipation plate and the second heat dissipation plate.

[0014] The limiting component includes a top plate, a rotating shaft, a transmission belt, a threaded column, a threaded sleeve, an aluminum plate and aluminum heat dissipation fins. The top plate is fixedly installed on the top of the second heat dissipation plate, and a groove is formed in the top of the top plate.

[0015] The rotating shaft is rotatably installed in the top plate. The transmission belt is sleeved between the rotating shafts. The threaded column is rotatably installed at the bottom of the top plate. The threaded column is connected to the rotating shaft. The threaded sleeve is fixedly installed on the top of the bottom plate. The threaded column is in threaded connection with the threaded sleeve.

[0016] The aluminum plate is fixedly installed on the top of the top plate. The aluminum heat dissipation fins are fixedly installed on the top of the aluminum plate. A circular groove is formed in the top of the aluminum plate. A circular plate is rotatably installed in the circular groove. A rhombus groove is formed in the top of the circular plate. The circular plate is fixedly connected to the rotating shaft.

[0017] In the above technical solution, for an integrated circuit chip heat dissipation substrate provided by the present utility model, the beneficial effects are as follows:

[0018] 1. The heat dissipation component can comprehensively and stably dissipate heat from the chip body through nanofluid, thereby preventing the situation where the heat on the contact surfaces of the chip body, the first heat dissipation plate, and the second heat dissipation plate cannot be dissipated in time, thus increasing the heat dissipation efficiency of the chip heat dissipation substrate for the chip body.

[0019] 2. The first telescopic plate and the second telescopic plate can limit and fix the chip body while dissipating heat from the chip body, thereby increasing the heat dissipation efficiency of the chip heat dissipation substrate for the chip body.

[0020] 3. The limiting component can limit and fix the chip body, thereby improving the stability of the chip heat dissipation substrate during use. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present utility model. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0022] Figure 1 Schematic diagram of the chip heat dissipation substrate structure provided by an embodiment of an integrated circuit chip heat dissipation substrate of the present utility model.

[0023] Figure 2 Schematic cross-sectional structure diagram of the chip heat dissipation substrate provided by an embodiment of an integrated circuit chip heat dissipation substrate of the present utility model.

[0024] Figure 3 Schematic diagram of the heat dissipation component structure provided by an embodiment of an integrated circuit chip heat dissipation substrate of the present utility model.

[0025] Figure 4 Schematic diagram of the limiting component structure provided by an embodiment of an integrated circuit chip heat dissipation substrate of the present utility model.

[0026] 1. Bottom plate; 2. Chip body; 3. Heat dissipation component; 4. Limiting component; 5. Semiconductor refrigeration sheet; 6. First heat dissipation plate; 7. First telescopic plate; 8. Telescopic groove; 9. Second telescopic plate; 10. Second heat dissipation plate; 11. Heat dissipation groove; 12. Baffle; 13. Notch; 14. Valve; 15. Top plate; 16. Rotating shaft; 17. Transmission belt; 18. Threaded column; 19. Threaded sleeve; 20. Aluminum plate; 21. Aluminum heat sink; 22. Groove; 23. Rhombus groove; 24. Round groove; 25. Round plate. Detailed Embodiment

[0027] In order to enable those skilled in the art to better understand the technical solutions of the present utility model, the following will further introduce the present utility model in detail in conjunction with the drawings.

[0028] As Figures 1-4 shown, an integrated circuit chip heat dissipation substrate provided by an embodiment of the present utility model.

[0029] It includes a bottom plate 1, a chip body 2, a heat dissipation component 3 and a limiting component 4. The heat dissipation component 3 is arranged on the top of the bottom plate 1, and the limiting component 4 is arranged on the top of the bottom plate 1;

[0030] The heat dissipation component 3 includes a semiconductor refrigeration sheet 5 fixedly installed on the top of the bottom plate 1. A first heat dissipation plate 6 is fixedly installed on the top of the semiconductor refrigeration sheet 5. A first telescopic plate 7 is fixedly installed on the top of the first heat dissipation plate 6. A telescopic groove 8 is opened on the top of the first telescopic plate 7. A second telescopic plate 9 is slidably installed in the telescopic groove 8. A second heat dissipation plate 10 is fixedly installed on the top of the second telescopic plate 9. A heat dissipation groove 11 is opened between the first heat dissipation plate 6 and the second heat dissipation plate 10. Open the valve 14 and inject the nanofluid into the heat dissipation groove 11 from the valve 14. After the nanofluid injection is completed, close the valve 14. Start the semiconductor refrigeration sheet 5 for refrigeration. The nanofluid dissipates heat from the chip body 2 through the first heat dissipation plate 6, the second heat dissipation plate 10, the first telescopic plate 7 and the second telescopic plate 9, and conducts the heat to the aluminum plate 20. The aluminum plate 20 dissipates heat through the aluminum heat sink 21. The nanofluid absorbs the cold temperature of the semiconductor refrigeration sheet 5 through the first heat dissipation plate 6 and conducts the cold temperature to the chip body 2 for heat dissipation and cooling.

[0031] The heat dissipation component 3 can comprehensively and stably dissipate heat from the chip body 2 through the nanofluid, thereby preventing the situation that the heat on the contact surfaces of the chip body 2, the first heat dissipation plate 6 and the second heat dissipation plate 10 cannot be dissipated in time, thereby increasing the heat dissipation efficiency of the chip heat dissipation substrate for the chip body 2.

[0032] The first telescopic plate 7 and the second telescopic plate 9 can limit and fix the chip body 2 while the chip body 2 is dissipating heat, thereby increasing the heat dissipation efficiency of the chip heat dissipation substrate for the chip body 2.

[0033] Referring Figure 3 , a baffle 12 is fixedly installed at the rear side of the first heat dissipation plate 6 in this embodiment. The nanofluid is arranged in the heat dissipation groove 11. A notch 13 is opened on the front side of the second heat dissipation plate 10, and a valve 14 is fixedly installed in the notch 13.

[0034] The baffle 12 can limit the chip body 2, thereby increasing the stability of the chip heat dissipation substrate during use

[0035] The nanofluid can conduct the cold temperature of the semiconductor refrigeration sheet 5 to the chip body 2 while dissipating heat from the chip body 2, thereby comprehensively and stably dissipating heat from the chip body 2.

[0036] Referring Figure 1, the chip body 2 of this embodiment is clamped between the first heat dissipation plate 6 and the second heat dissipation plate 10.

[0037] Referring to Figure 4 , the limiting component 4 of this embodiment includes a top plate 15, a rotating shaft 16, a transmission belt 17, a threaded column 18, a threaded sleeve 19, an aluminum plate 20 and aluminum heat dissipation fins 21. The top plate 15 is fixedly installed on the top of the second heat dissipation plate 10. A groove 22 is formed on the top of the top plate 15. Place the chip body 2 between the first heat dissipation plate 6 and the second heat dissipation plate 10, and push it to the baffle 12. Insert a tool into the rhombus groove 23 and drive the circular plate 25 to rotate. The circular plate 25 drives the rotating shaft 16 to rotate. The rotating shaft 16 drives other rotating shafts 16 to rotate through the transmission belt 17. The rotating shaft 16 drives the threaded column 18 to rotate. The threaded column 18 drives the top plate 15 to move through the threaded sleeve 19. The top plate 15 drives the second heat dissipation plate 10 to move, so as to squeeze and limit the chip body 2. The second heat dissipation plate 10 drives the second telescopic plate 9 to move, so that it shrinks into the first telescopic plate 7.

[0038] The limiting component 4 can limit and fix the chip body 2, thereby improving the stability of the chip heat dissipation substrate during use.

[0039] The rotating shaft 16 is rotatably installed in the top plate 15. The transmission belt 17 is sleeved between the rotating shafts 16. The threaded column 18 is rotatably installed at the bottom of the top plate 15. The threaded column 18 is connected to the rotating shaft 16. The threaded sleeve 19 is fixedly installed on the top of the bottom plate 1. The threaded column 18 is threadedly connected to the threaded sleeve 19.

[0040] The transmission belt 17 can drive the rotating shafts 16 to rotate synchronously, thereby increasing the stability of the limiting component 4 during use.

[0041] The aluminum plate 20 is fixedly installed on the top of the top plate 15. The aluminum heat dissipation fins 21 are fixedly installed on the top of the aluminum plate 20. A circular groove 24 is formed on the top of the aluminum plate 20. A circular plate 25 is rotatably installed in the circular groove 24. A rhombus groove 23 is formed on the top of the circular plate 25. The circular plate 25 is fixedly connected to the rotating shaft 16.

[0042] The aluminum heat dissipation fins 21 can diffuse the heat dissipation surface of the aluminum plate 20, thereby increasing the heat dissipation effect of the aluminum plate 20.

[0043] Working principle: First, place the chip body 2 between the first heat sink 6 and the second heat sink 10, and push it to the baffle 12. Insert a tool into the rhombic groove 23 and drive the circular plate 25 to rotate. The circular plate 25 drives the rotating shaft 16 to rotate. The rotating shaft 16 drives other rotating shafts 16 to rotate through the transmission belt 17. The rotating shaft 16 drives the threaded column 18 to rotate. The threaded column 18 drives the top plate 15 to move through the threaded sleeve 19. The top plate 15 drives the second heat sink 10 to move, so as to squeeze and limit the chip body 2. The second heat sink 10 drives the second telescopic plate 9 to move, so that it shrinks into the first telescopic plate 7. After the first heat sink 6 and the second heat sink 10 complete the limiting and fixing of the chip body 2, open the valve 14 and inject the nanofluid from the valve 14 into the heat dissipation groove 11. After the nanofluid injection is completed, close the valve 14. Start the semiconductor refrigeration sheet 5 for refrigeration. The nanofluid dissipates heat from the chip body 2 through the first heat sink 6, the second heat sink 10, the first telescopic plate 7 and the second telescopic plate 9, and conducts the heat to the aluminum plate 20. The aluminum plate 20 dissipates heat through the aluminum heat sink 21. The nanofluid absorbs the cold temperature of the semiconductor refrigeration sheet 5 through the first heat sink 6 and conducts the cold temperature to the chip body 2 for heat dissipation and cooling.

[0044] Only some exemplary embodiments of the present invention are described by way of illustration above. Undoubtedly, for those of ordinary skill in the art, without departing from the spirit and scope of the present invention, the described embodiments can be modified in various different ways. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the protection scope of the claims of the present invention.

Claims

1. An integrated circuit chip heat dissipation substrate, comprising a base plate (1), a chip body (2), a heat dissipation component (3) and a limiting component (4), characterized in that: The heat dissipation component (3) is arranged on the top of the base plate (1), and the limiting component (4) is arranged on the top of the base plate (1); The heat dissipation assembly (3) comprises a semiconductor refrigeration sheet (5) fixedly mounted on the top of the base plate (1); a first heat dissipation plate (6) is fixedly mounted on the top of the semiconductor refrigeration sheet (5); a first telescopic plate (7) is fixedly mounted on the top of the first heat dissipation plate (6); a telescopic groove (8) is provided on the top of the first telescopic plate (7); a second telescopic plate (9) is slidably mounted in the telescopic groove (8); a second heat dissipation plate (10) is fixedly mounted on the top of the second telescopic plate (9); and a heat dissipation groove (11) is provided between the first heat dissipation plate (6) and the second heat dissipation plate (10).

2. The integrated circuit chip heat dissipation substrate according to claim 1, characterized in that: A baffle (12) is fixedly mounted on the rear side of the first heat dissipation plate (6), a nanofluid is arranged in the heat dissipation groove (11), a notch (13) is opened on the front side of the second heat dissipation plate (10), and a valve (14) is fixedly mounted in the notch (13).

3. The integrated circuit chip heat dissipation substrate according to claim 1, characterized in that: The chip body (2) is clamped between the first heat dissipation plate (6) and the second heat dissipation plate (10).

4. The integrated circuit chip heat dissipation substrate according to claim 1, characterized in that: The limiting assembly (4) comprises a top plate (15), a rotating shaft (16), a transmission belt (17), a threaded column (18), a threaded sleeve (19), an aluminum plate (20) and an aluminum heat sink (21); the top plate (15) is fixedly mounted on the top of the second heat sink (10); and a groove (22) is formed on the top of the top plate (15).

5. The integrated circuit chip heat dissipation substrate according to claim 4, characterized in that: The rotating shaft (16) is rotatably mounted in the top plate (15), the transmission belt (17) is sleeved between the rotating shafts (16), the threaded column (18) is rotatably mounted on the bottom of the top plate (15), the threaded column (18) is connected to the rotating shaft (16), the threaded sleeve (19) is fixedly mounted on the top of the bottom plate (1), and the threaded column (18) is threadedly connected to the threaded sleeve (19).

6. The integrated circuit chip heat dissipation substrate according to claim 4, characterized in that: The aluminum plate (20) is fixedly mounted on the top of the top plate (15), the aluminum heat sink (21) is fixedly mounted on the top of the aluminum plate (20), a circular groove (24) is provided on the top of the aluminum plate (20), a circular plate (25) is rotatably mounted in the circular groove (24), a prismatic groove (23) is provided on the top of the circular plate (25), and the circular plate (25) is fixedly connected to the rotating shaft (16).

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