Heat dissipation assembly for electronic equipment, circuit module and charging pile

Abstract

The utility model relates to the technical field of heat dissipation, and discloses a heat dissipation assembly for electronic equipment, a circuit module and a charging pile. The heat dissipation assembly comprises a heat dissipation base, an electronic component and a temperature sensor; the heat dissipation base is made of heat conduction materials and comprises a bottom face, an installation inclined face and installation side faces, the installation inclined face inclines relative to the bottom face, and the bottom face is used for being connected with electronic equipment. The electronic component is mounted on the mounting inclined surface; the temperature sensor is installed on the installation side face. Through the arrangement, the technical problem that a temperature sensor in the prior art is difficult to accurately monitor the temperature of an electronic component is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation component, a circuit module and a charging pile for electronic devices. Background Art

[0002] At present, with the continuous development of technology, the integrated circuits in electronic devices are becoming more and more complex, such as the power supply of a charging pile; as a result, the heat generated during the operation of electronic devices is relatively large, and it is difficult to dissipate the heat in the electronic devices. Therefore, a heat dissipation structure needs to be installed in the electronic devices.

[0003] In the related art, most heat dissipation structures include a heat dissipation base made of a heat-conducting material, electronic components, a temperature sensor and a mounting base; among them, the heat dissipation base and the temperature sensor are both mounted on the mounting base, the electronic components are mounted on the heat dissipation base, and a heat dissipation component such as a fan or a water-cooling pipe is also installed on the mounting base; the temperature sensor is used to sense the temperature of the electronic components in real time and control the start or stop of the heat dissipation component according to the temperature condition of the electronic components, so that the electronic components can maintain a stable operating temperature.

[0004] However, generally, the heat-conducting performance of the mounting base is poor, resulting in most of the heat of the electronic components being conducted to the temperature sensor through the air, and it is difficult for the temperature sensor to accurately monitor the temperature of the electronic components. Summary of the Utility Model

[0005] Embodiments of the utility model aim to provide a heat dissipation component, a circuit module and a charging pile for electronic devices, so as to solve the technical problem that it is difficult for a temperature sensor to accurately monitor the temperature of electronic components in the prior art.

[0006] Embodiments of the utility model solve their technical problems by adopting the following technical solutions:

[0007] Provide a heat dissipation component for an electronic device, including:

[0008] A heat dissipation base, the heat dissipation base is made of a heat-conducting material, the heat dissipation base includes a bottom surface, a mounting inclined surface and a mounting side surface, the mounting inclined surface is inclined relative to the bottom surface, and the bottom surface is used for connecting to an electronic device;

[0009] Electronic components, the electronic components are mounted on the mounting inclined surface;

[0010] A temperature sensor, the temperature sensor is mounted on the mounting side surface.

[0011] In some embodiments, the mounting side surface is perpendicular to the bottom surface, a protruding portion is convexly provided on the mounting side surface, and the temperature sensor is mounted on the protruding portion.

[0012] In some embodiments, the heat dissipation component further includes a lead guiding member, which is mounted on the heat dissipation base. The lead guiding member is sleeved on the installation inclined surface and the installation side surface. The lead guiding member is provided with a lead guiding hole, and the leads of the electronic component and the temperature sensor extend out through the lead guiding hole, and the parts of the leads of the electronic component and the temperature sensor extending out of the lead guiding hole are parallel to each other.

[0013] In some embodiments, the heat dissipation base includes two of the installation inclined surfaces, and the two installation inclined surfaces are symmetrically arranged with respect to the central axis of the heat dissipation base.

[0014] In some embodiments, the lead of the electronic component includes a first section and a second section connected to each other. The second section is inclined with respect to the first section. The first section is parallel to a corresponding one of the installation inclined surfaces. The second section is perpendicular to the bottom surface, and the second section extends out of the lead guiding hole; the installation side surface is perpendicular to the bottom surface.

[0015] In some embodiments, the lead guiding member includes a top plate and two side plates. Two ends of the top plate are respectively connected to one of the side plates, and the lead guiding hole is formed in the top plate;

[0016] The heat dissipation base includes a main body and a bottom plate connected to each other. The bottom plate includes the bottom surface, and the bottom surface is located at one end of the bottom plate away from the main body. The main body includes the installation inclined surface and the installation side surface;

[0017] One end of each side plate away from the top plate is connected to the bottom plate, and the temperature sensor is located between the installation side surface and a corresponding one of the side plates.

[0018] In some embodiments, the lead guiding member further includes installation protrusions. Each side plate is connected to two of the installation protrusions. The installation protrusions all face the main body. The two installation protrusions are respectively located on opposite sides of a corresponding one of the side plates. The installation protrusions are mounted on the bottom plate; the top plate, the bottom plate, the installation side surface, the side plates and the two installation protrusions enclose the temperature sensor.

[0019] In some embodiments, the side plate includes two folding members, and the two folding members are respectively located on two opposite sides of the side plate, and the two folding members clamp the bottom plate.

[0020] In some embodiments, the lead guiding component further includes a partition plate. One side of the partition plate is connected to the top plate, and the other opposite side of the partition plate abuts against one end of the main body away from the bottom plate. The partition plate is located between the electronic components and the temperature sensor, and the partition plate separates the leads of the electronic components from the leads of the temperature sensor.

[0021] In some embodiments, the heat dissipation assembly further includes a heat dissipation substrate, which is mounted on the installation inclined surface, and a plurality of the electronic components are mounted on the heat dissipation substrate.

[0022] Another embodiment of the present utility model provides a circuit module, including the heat dissipation assembly in any one of the above.

[0023] Other embodiments of the present utility model provide a charging pile, including the above-mentioned circuit module.

[0024] Compared with the prior art, both the electronic components and the temperature sensor are mounted on the same heat dissipation base, so that the temperature of the electronic components can be directly conducted to the temperature sensor through the heat dissipation base. Since the heat dissipation base is made of a heat-conducting material, the temperature sensor can quickly and accurately sense the temperature of the electronic components.

[0025] In addition, generally, the heat dissipation assembly is mounted on electronic devices such as charging piles. When the electronic components are mounted on the installation inclined surface, the electronic components are in an inclined state; in the horizontal direction, the overall structure of the heat dissipation assembly is more compact, so that the heat dissipation assembly has a narrower installation width and a higher installation height; when the electronic device has the same installation area, more heat dissipation assemblies can be installed on the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] One or several embodiments are exemplarily illustrated by the pictures in the corresponding drawings. These exemplary illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements, unless otherwise stated, and the drawings in the drawings do not constitute a proportional limitation.

[0027] Figure 1 is a perspective view of the heat dissipation assembly for an electronic device in one embodiment of the present utility model;

[0028] Figure 2 is Figure 1 a perspective view of the heat dissipation assembly in after removing the lead guiding structure;

[0029] Figure 3 is Figure 1 a perspective view of the heat dissipation base of the heat dissipation assembly in ;

[0030] Figure 4 is Figure 1Stereogram of the electronic components of the heat dissipation component in

[0031] Figure 5 is Figure 1 Stereogram of the lead guiding component of the heat dissipation component in

[0032] Figure 6 is Figure 1 Cross-sectional view of the heat dissipation component in

[0033] Figure 7 is Figure 1 Exploded view of the heat dissipation base, electronic components and heat dissipation substrate of the heat dissipation component in

[0034] Reference numerals:

[0035] 100, heat dissipation component; 10, heat dissipation base; 12, bottom surface; 14, mounting inclined surface; 16, mounting side surface; 162, convex part; 18, main body; 19, bottom plate; 20, electronic components; 22, first section; 24, second section; 30, temperature sensor; 40, lead guiding component; 402, lead guiding hole; 44, top plate; 46, side plate; 462, flanging member; 48, mounting projection; 49, partition plate; 50, heat dissipation substrate. Detailed implementation manners

[0036] For the convenience of understanding the present utility model, the present utility model will be described in more detail below with reference to the drawings and specific embodiments. It should be noted that when an element is expressed as "connected" to another element, it can be directly on the other element, or there can be one or several intermediate elements therebetween. The terms "upper", "lower", "left", "right", "upper end", "lower end", "top" and "bottom" etc. used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0037] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used in the specification of the present utility model are only for the purpose of describing specific embodiments and are not used to limit the present utility model.

[0038] Below, with reference to all the drawings of the specification, a heat dissipation component 100, a circuit module and a charging pile provided by an embodiment of the present application for an electronic device will be described in detail through specific embodiments.

[0039] Please refer to Figure 1 、 Figure 2 and Figure 3 , in one embodiment of the present utility model, a heat dissipation component 100 for an electronic device is disclosed, which includes a heat dissipation base 10, an electronic component 20 and a temperature sensor 30; the heat dissipation base 10 is made of a heat-conducting material, the heat dissipation base 10 includes a bottom surface 12, an installation inclined surface 14 and an installation side surface 16, the installation inclined surface 14 is inclined relative to the bottom surface 12, and the bottom surface 12 is used to connect to the electronic device; the electronic component 20 is installed on the installation inclined surface 14; the temperature sensor 30 is installed on the installation side surface 16.

[0040] With the above structure, both the electronic component 20 and the temperature sensor 30 are installed on the same heat dissipation base 10, so that the temperature of the electronic component 20 can be directly conducted to the temperature sensor 30 through the heat dissipation base 10. Since the heat dissipation base 10 is made of a heat-conducting material, the temperature sensor 30 can quickly and accurately monitor the temperature of the electronic component 20.

[0041] In addition, generally, the heat dissipation component 100 is installed on an electronic device such as a charging pile. When the electronic component 20 is installed on the installation inclined surface 14, the electronic component 20 is in an inclined state; in the horizontal direction, the overall structure of the heat dissipation component 100 is more compact, so that the heat dissipation component 100 has a narrower installation width and a higher installation height; when the electronic device has the same installation area, more heat dissipation components 100 can be installed on the electronic device.

[0042] Specifically, in this embodiment, the heat dissipation base 10 is made of a metal material, the heat dissipation base 10 is generally in a structure similar to a triangular prism, two of the side surfaces of the heat dissipation base 10 are installation inclined surfaces 14, another side surface of the heat dissipation base 10 is the bottom surface 12, one top surface of the heat dissipation base 10 is the installation side surface 16, and the temperature sensor 30 is installed on one top surface of the heat dissipation base 10. The electronic component 20 is a MOS tube; the number of temperature sensors 30 is one, and the temperature sensor 30 is an NTC thermistor; both the electronic component 20 and the temperature sensor 30 are connected to the heat dissipation base 10 by screws; the leads of the electronic component 20 and the leads of the temperature sensor 30 face the same direction.

[0043] In other embodiments, the heat dissipation base 10 can also be made of other heat-conducting materials, and the heat dissipation base 10 can also be of other structures, for example, the heat dissipation base 10 is generally in a hollow frame structure; the number of installation inclined surfaces 14 can also be other, for example, one; the electronic component 20 can also be of other types, and the temperature sensor 30 can also be of other types; the electronic component 20 and the temperature sensor 30 can also be connected to the heat dissipation base 10 in other ways, such as welding or clamping.

[0044] In some embodiments, the mounting side surface 16 is perpendicular to the bottom surface 12. A protruding portion 162 is provided on the mounting side surface 16, and the temperature sensor 30 is mounted on the protruding portion 162.

[0045] With the above structure, the protruding portion 162 is used to position the temperature sensor 30. In addition, the protruding portion 162 protrudes relative to the mounting side surface 16. Thus, when the temperature sensor 30 is assembled on the protruding portion 162, there is a larger operating space, making it easier to assemble the temperature sensor 30 on the mounting side surface 16.

[0046] Specifically, in this embodiment, the protruding portion 162 has a block structure similar to a cuboid. The temperature sensor 30 is mounted on an end surface of the protruding portion 162 facing away from the mounting side surface 16, and an end surface of the protruding portion 162 facing away from the mounting side surface 16 is parallel to the mounting side surface 16.

[0047] In some embodiments, the heat dissipation assembly 100 further includes a lead guiding member 40. The lead guiding member 40 is mounted on the heat dissipation base 10. The lead guiding member 40 is sleeved on the mounting inclined surface 14 and the mounting side surface 16. The lead guiding member 40 is provided with a lead guiding hole 402. The leads of the electronic component 20 and the temperature sensor 30 extend through the lead guiding hole 402, and the parts of the leads of the electronic component 20 and the temperature sensor 30 extending out of the lead guiding hole 402 are parallel to each other.

[0048] With the above structure, when the lead guiding member 40 is mounted on the heat dissipation base 10, the leads of the electronic component 20 and the temperature sensor 30 are inserted into the corresponding lead guiding holes 402. The lead guiding holes 402 can guide the leads of the electronic component 20 and the temperature sensor 30. And when the leads of the electronic component 20 and the temperature sensor 30 are welded to the electronic device, the lead guiding holes 402 can also support the leads of the electronic component 20 and the temperature sensor 30.

[0049] In addition, the parts of the leads of the electronic component 20 and the temperature sensor 30 extending out of the lead guiding hole 402 are parallel to each other, so that the leads do not contact each other, making it easier to weld the leads of the electronic component 20 and the temperature sensor 30 to the electronic device.

[0050] Specifically, in this embodiment, the lead guiding member 40 has a structure similar to a frame. The lead guiding member 40 is sleeved on the mounting inclined surface 14 and the mounting side surface 16. The lead guiding member 40 and the heat dissipation base 10 enclose a semi-open space, and the lead guiding member 40 and the heat dissipation base 10 jointly surround the electronic component 20 and the temperature sensor 30. The electronic component 20 leaks out through the open space between the lead guiding member 40 and the heat dissipation base 10.

[0051] The lead guiding component 40 includes a top plate 44 (see Figure 5 ), and all the lead guiding holes 402 are formed in the top plate 44 so that the portions of the leads of the electronic component 20 and the leads of the temperature sensor 30 extending out of the lead guiding holes 402 are parallel to each other; the lead guiding holes 402 are circular through holes.

[0052] In other embodiments, the lead guiding component 40 can also be other structures, such as a hollow hemisphere; the lead guiding holes 402 can also be formed on a curved surface; the lead guiding holes 402 can also be other shapes, such as rectangular or rhombic through holes.

[0053] In some embodiments, the heat dissipation base 10 includes two mounting inclined surfaces 14, and the two mounting inclined surfaces 14 are symmetrically arranged with respect to the central axis of the heat dissipation base 10.

[0054] With the above structure, both of the two symmetrically arranged mounting inclined surfaces 14 can be used for mounting the electronic component 20, so that when the area of the bottom surface 12 of the heat dissipation base 10 is fixed, the total area of the mounting inclined surfaces 14 of the heat dissipation base 10 is larger; thus, more electronic components 20 can be mounted on the same heat dissipation base 10 simultaneously.

[0055] Specifically, in this embodiment, the heat dissipation base 10 has a structure similar to a triangular prism. The heat dissipation base 10 includes three side surfaces, one of the side surfaces of the heat dissipation base 10 is the bottom surface 12, and the other two side surfaces of the heat dissipation base 10 are the mounting inclined surfaces 14; the bottom surface 12 and the two mounting inclined surfaces 14 are both rectangular planes, and the area of the bottom surface 12 is larger than the area of the mounting inclined surfaces 14.

[0056] In other embodiments, the bottom surface 12 and the two mounting inclined surfaces 14 can also be other shapes, such as kidney-shaped; the area of the bottom surface 12 can also be equal to the area of the mounting inclined surfaces 14.

[0057] Please refer to Figure 4 , in some embodiments, the lead of the electronic component 20 includes a first segment 22 and a second segment 24 connected to each other. The second segment 24 is inclined with respect to the first segment 22. The first segment 22 is parallel to a corresponding one of the mounting inclined surfaces 14, the second segment 24 is perpendicular to the bottom surface 12, and the second segment 24 extends out of the lead guiding hole 402; the mounting side surface 16 is perpendicular to the bottom surface 12.

[0058] With the above structure, all the second segments 24 are parallel to the bottom surface 12, and thus all the second segments 24 are parallel to each other, so that the second segments 24 are more easily welded to the electronic device; at the same time, during the lead welding process, the hole wall of the lead guiding hole 402 supports the second segment 24, and thus the second segment 24 can be more stable during the welding process and is not easy to shake.

[0059] In addition, the installation side surface 16 is perpendicular to the bottom surface 12, and the temperature sensor 30 is installed on the installation side surface 16, so that in the direction perpendicular to the bottom surface 12, the projected area of the temperature sensor 30 is smaller; furthermore, the installation area of the entire heat dissipation assembly 100 is smaller.

[0060] Specifically, during the production process, the leads of the electronic components 20 can be bent to form a first section 22 and a second section 24, and the angle between the first section 22 and the second section 24 is complementary to the angle between the installation inclined surface 14 and the bottom surface 12; subsequently, each electronic component 20 is installed on the corresponding installation inclined surface 14 so that the second sections 24 are parallel to each other.

[0061] Please refer to Figure 5 and Figure 6 , in some embodiments, the lead guiding member 40 includes a top plate 44 and two side plates 46. The two ends of the top plate 44 are respectively connected to a side plate 46, and the lead guiding holes 402 are formed in the top plate 44; the heat dissipation base 10 includes a main body 18 and a bottom plate 19 connected to each other. The bottom plate 19 includes a bottom surface 12, and the bottom surface 12 is located at one end of the bottom plate 19 away from the main body 18. The main body 18 includes an installation inclined surface 14 and an installation side surface 16; one end of each side plate 46 away from the top plate 44 is connected to the bottom plate 19, and the end of the bottom plate 19 protrudes relative to the main body 18; the side plates 46, the bottom plate 19, the top plate 44, and the installation side surface 16 surround the temperature sensor 30.

[0062] With the above structure, on the one hand, the side plates 46 can be used to connect the bottom plate 19, and the two side plates 46 respectively support the two ends of the top plate 44, so that there is a gap between the top plate 44 and the heat dissipation base 10 for placing the electronic components 20. On the other hand, the side plates 46, the bottom plate 19, the top plate 44, and the installation side surface 16 surround the temperature sensor 30, so that the temperature inside the electronic components 20 is not easily dissipated after being conducted to the temperature sensor 30, ensuring that the temperature sensor 30 can measure the temperature of the electronic components 20 more accurately.

[0063] Specifically, in this embodiment, the top plate 44 and the two side plates 46 are in a rectangular plate-like structure, and the two side plates 46 are both perpendicular to the top plate 44; the bottom plate 19 is also in a cuboid plate-like structure, and the main body 18 is in a structure similar to a triangular prism. The part of the bottom plate 19 protruding from the main body 18 is connected to the side plates 46; the top plate 44, the bottom plate 19, and the two side plates 46 surround to form a structure similar to a cuboid, and the main body 18 is located between the top plate 44 and the bottom plate 19.

[0064] In other embodiments, the top plate 44, the bottom plate 19, and the two side plates 46 can all be other structures. For example, the top plate 44 and the bottom plate 19 are in a kidney-shaped plate-like structure, and the side plates 46 are in a structure similar to a rod shape.

[0065] In some embodiments, the lead guiding member 40 further includes mounting protrusions 48. Each side plate 46 is connected to two mounting protrusions 48. The mounting protrusions 48 all face the main body 18. The two mounting protrusions 48 are respectively located on opposite sides of a corresponding side plate 46. The mounting protrusions 48 are mounted on the bottom plate 19. The top plate 44, the bottom plate 19, the mounting side 16, the side plates 46 and the two mounting protrusions 48 enclose the temperature sensor 30.

[0066] Generally, an electronic device uses a fan to dissipate heat from the heat dissipation component 100, and the fan is installed near the heat dissipation component 100. With the above structure, the top plate 44, the bottom plate 19, the mounting side 16, the side plates 46 and the two mounting protrusions 48 enclose a relatively enclosed space, so that it is difficult for the temperature inside the electronic component 20 to escape after being conducted to the temperature sensor 30. Furthermore, the temperature sensor 30 can more accurately measure the temperature of the electronic component 20.

[0067] In addition, the mounting protrusions 48 are used to provide a mounting space for the lead guiding member 40 to be assembled with the heat dissipation base 10.

[0068] Specifically, in this embodiment, the mounting protrusion 48 has a structure similar to a hollow cylinder. The hollow structure of the mounting protrusion 48 is for a screw to extend into, and the screw is used to connect the mounting protrusion 48 to the bottom plate 19. In other embodiments, the mounting protrusion 48 can also be other structures, such as a solid columnar structure, and the mounting protrusion 48 can also be connected to the bottom plate 19 in other ways, such as snap connection.

[0069] In some embodiments, the side plate 46 includes two folding members 462. The two folding members 462 are respectively located on two opposite sides of the side plate 46, and the two folding members 462 clamp the bottom plate 19.

[0070] With the above structure, when the lead guiding member 40 is installed on the heat dissipation base 10, the folding members 462 clamp the bottom plate 19. Furthermore, the folding members 462 can play a guiding and limiting role on the bottom plate 19, so that the lead guiding member 40 is easily installed on the heat dissipation base 10. In addition, under the clamping action of the folding members 462, the lead guiding member 40 and the heat dissipation base 10 can be more stably connected.

[0071] Specifically, the folding member 462 has a rectangular sheet-like structure. The folding member 462 is perpendicular to the side plate 46. The two folding members 462 are connected to two opposite sides of the corresponding side plate 46, and the end of the bottom plate 19 is located between the corresponding two folding members 462.

[0072] In some embodiments, the lead guiding member 40 further includes a partition plate 49. One side of the partition plate 49 is connected to the top plate 44, and the other opposite side of the partition plate 49 abuts against one end of the main body 18 away from the bottom plate 19. The partition plate 49 is located between the electronic component 20 and the temperature sensor 30, and the partition plate 49 separates the leads of the electronic component 20 from the leads of the temperature sensor 30.

[0073] With the above structure, on the one hand, the partition plate 49 is used to separate the leads of the electronic component 20 from the leads of the temperature sensor 30 to prevent the leads of the electronic component 20 from contacting the leads of the temperature sensor 30; on the other hand, the partition plate 49 can further seal the space formed by enclosing the top plate 44, the bottom plate 19, the mounting side surface 16, the side plate 46 and the two mounting protrusions 48, so that the heat inside the temperature sensor 30 is less likely to dissipate.

[0074] Specifically, the partition plate 49 has a plate-like structure similar to a rectangle, the partition plate 49 is perpendicular to the top plate 44, one side of the partition plate 49 is connected to the top plate 44, and the other opposite side of the partition plate 49 abuts against one end of the main body 18 away from the bottom plate 19.

[0075] Please refer to Figure 7 In some embodiments, the heat dissipation assembly 100 further includes a heat dissipation substrate 50. The heat dissipation substrate 50 is mounted on the mounting inclined surface 14, and a plurality of electronic components 20 are mounted on the heat dissipation substrate 50.

[0076] With the above structure, the heat dissipation substrate 50 is interposed between the mounting inclined surface 14 and the electronic component 20, so that the heat inside the electronic component 20 can be quickly transferred into the main body 18 to improve the heat transfer rate of the heat inside the electronic component 20.

[0077] Specifically, in this embodiment, the heat dissipation substrate 50 is a rectangular ceramic substrate, and the shape of the heat dissipation substrate 50 is adapted to the shape of the mounting inclined surface 14; the electronic component 20 is connected to the main body 18 by screws, the screws pass through the heat dissipation substrate 50, and the electronic component 20 and the main body 18 jointly clamp the heat dissipation substrate 50. In other embodiments, the heat dissipation substrate 50 can also be made of other heat-conducting materials; the heat dissipation substrate 50 can also be of other shapes, such as kidney-shaped.

[0078] In some embodiments, the present utility model further provides a circuit module, including the heat dissipation assembly 100 in any one of the above.

[0079] In some embodiments, the present utility model further provides a charging pile, including the above circuit module.

[0080] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; under the idea of the present invention, the technical features in the above embodiments or different embodiments can also be combined, and the steps can be implemented in any order, and there are many other variations in different aspects of the present invention as described above. For the sake of brevity, they are not provided in detail; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation component for electronic equipment, characterized in that: include: A heat dissipation base, the heat dissipation base is made of a heat-conducting material, the heat dissipation base comprises a bottom surface, a mounting inclined surface and a mounting side surface, the mounting inclined surface is inclined relative to the bottom surface, and the bottom surface is used to connect the electronic device; Electronic components, the electronic components are mounted on the mounting inclined surface; A temperature sensor is installed on the installation side.

2. The heat dissipation assembly according to claim 1, characterized in that: The installation side surface is perpendicular to the bottom surface, a protrusion is convexly provided on the installation side surface, and the temperature sensor is installed on the protrusion.

3. The heat dissipation assembly according to claim 1, characterized in that: It also includes a lead guide component, which is installed on the heat dissipation base, and the lead guide component is sleeved on the installation inclined surface and the installation side surface. The lead guide component is provided with a lead guide hole, and the leads of the electronic components and the leads of the temperature sensor extend out of the lead guide holes, and the parts of the leads of the electronic components and the leads of the temperature sensor extending out of the lead guide holes are parallel to each other.

4. The heat dissipation assembly according to claim 3, characterized in that: The heat dissipation base includes two mounting inclined surfaces, and the two mounting inclined surfaces are symmetrically arranged relative to the central axis of the heat dissipation base.

5. The heat dissipation assembly according to claim 4, characterized in that: The lead of the electronic component includes a first section and a second section connected to each other, the second section is inclined relative to the first section, the first section is parallel to a corresponding one of the mounting slopes, the second section is perpendicular to the bottom surface, and the second section extends out of the lead guide hole; the mounting side surface is perpendicular to the bottom surface.

6. The heat dissipation assembly according to claim 3, characterized in that: The lead wire guide component includes a top plate and two side plates, two ends of the top plate are respectively connected to one of the side plates, and the lead wire guide hole is opened in the top plate; The heat dissipation base comprises a main body and a bottom plate connected to each other, the bottom plate comprises the bottom surface, the bottom surface is located at one end of the bottom plate away from the main body, and the main body comprises the installation inclined surface and the installation side surface; One end of each side plate facing away from the top plate is connected to the bottom plate, and the end of the bottom plate protrudes relative to the main body; the side plates, the bottom plate, the top plate and the installation side surround the temperature sensor.

7. The heat dissipation assembly according to claim 6, characterized in that: The lead guide component also includes a mounting protrusion, each side plate is connected to two mounting protrusions, the mounting protrusions are both facing the main body, the two mounting protrusions are respectively located on opposite sides of a corresponding side plate, and the mounting protrusion is installed on the bottom plate; the top plate, the bottom plate, the mounting side, the side plate and the two mounting protrusions surround the temperature sensor.

8. The heat dissipation assembly according to claim 6, characterized in that: The side plate comprises two folding pieces, the two folding pieces are respectively located at two opposite sides of the side plate, and the two folding pieces clamp the bottom plate.

9. The heat dissipation assembly according to claim 6, characterized in that: The lead guide component also includes a partition plate, one side of which is connected to the top plate, and the other opposite side of the partition plate is abutted against an end of the main body facing away from the bottom plate. The partition plate is located between the electronic component and the temperature sensor, and the partition plate separates the leads of the electronic component from the leads of the temperature sensor.

10. The heat dissipation assembly according to claim 1, characterized in that: It also includes a heat dissipation substrate, which is installed on the installation slope and on which a plurality of electronic components are installed.

11. A circuit module, characterized in that: A heat dissipation component comprising any one of claims 1-10.

12. A charging pile, characterized in that: Includes the circuit module according to claim 11.

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