Semiconductor insulating heat-conducting silica gel gasket

Abstract

The utility model relates to the technical field of silica gel gaskets, in particular to a semiconductor insulation heat conduction silica gel gasket which comprises a gasket body, two clamping holes are formed in the surface of the gasket body, a connecting rod is fixedly installed on the inner walls of the clamping holes, and two pull pads are fixedly installed on the surface of the connecting rod. The surfaces of the pull pads abut against the gasket body, auxiliary grooves are formed in the surfaces of the four pull pads, limiting grooves are formed in the surfaces of the four pull pads, four positioning elastic pads are fixedly installed on the surface of the gasket body, and the inner walls of the limiting grooves abut against the positioning elastic pads. Two reinforcing blocks are fixedly installed on the surface of the gasket body and are rubber blocks. According to the utility model, the defect that the silica gel gasket is not easy to be taken down from the electronic product by a worker due to the small size of the silica gel gasket in the prior art, so that the replacement of the silica gel gasket by the worker is influenced is overcome.

Description

Technical Field

[0001] The utility model relates to the technical field of silica gel gaskets, in particular to a semiconductor insulating and heat-conducting silica gel gasket. Background Art

[0002] A semiconductor insulating and heat-conducting silica gel gasket is a material specially designed for the heat dissipation of electronic components and semiconductor devices. It not only has heat-conducting performance but also good insulation. Its excellent heat-conducting and insulating properties make it an important material for heat dissipation management.

[0003] A Chinese patent with the publication number CN217621739U discloses an insulating and heat-conducting silica gel gasket for semiconductors. The key points of its technical solution are as follows: It includes a main body, a control structure, and an auxiliary structure. The main body is a rectangular structure, and a placement groove is opened inside the main body, and an inner groove is opened inside the placement groove; a control structure is provided inside the main body, and the control column of the control structure is inserted into the inner groove opened in the main body; an auxiliary structure is provided inside the main body, and the auxiliary part of the auxiliary structure is inserted into the placement groove opened in the main body. The top will contact the bottom of the item in use. Through the auxiliary groove, the contact area with the bottom of the item can be reduced, and thus heat conduction can be better carried out. The heat is conducted through the auxiliary groove, which is convenient for heat conduction.

[0004] Regarding the above and related existing technologies, the inventor believes that the following defects often exist: When the silica gel gasket needs to be replaced, due to the small size of the silica gel gasket, it is difficult for the staff to remove the silica gel gasket from the electronic product, which affects the staff's replacement of the silica gel gasket.

[0005] Therefore, the utility model provides a semiconductor insulating and heat-conducting silica gel gasket. Summary of the Utility Model

[0006] The purpose of the utility model is to solve the defect in the prior art that due to the small size of the silica gel gasket, it is difficult for the staff to remove the silica gel gasket from the electronic product, which affects the staff's replacement of the silica gel gasket, and a semiconductor insulating and heat-conducting silica gel gasket is proposed.

[0007] To achieve the above purpose, the utility model adopts the following technical scheme: A semiconductor insulating and heat-conducting silica gel gasket includes a gasket body. Two card holes are opened on the surface of the gasket body. A connecting rod is fixedly installed on the inner wall of the card hole. Two pulling pads are fixedly installed on the surface of the connecting rod, and the surface of the pulling pad abuts against the gasket body.

[0008] The effect achieved by the mutual cooperation of the above components is that it can facilitate the staff to remove the silica gel gasket from the electronic product, thus facilitating the staff to replace the silica gel gasket.

[0009] Preferably, auxiliary grooves are formed on the surfaces of all four of the pulling pads.

[0010] The effect achieved by the above components is that the auxiliary grooves can facilitate the staff to pull the pulling pads.

[0011] Preferably, limiting grooves are formed on the surfaces of all four of the pulling pads, and four positioning elastic pads are fixedly installed on the surface of the gasket body, and the inner walls of the limiting grooves are in contact with the positioning elastic pads.

[0012] The effect achieved by the above components is that the limiting grooves and the positioning elastic pads can clamp the pulling pads on the gasket body.

[0013] Preferably, two reinforcing blocks are fixedly installed on the surface of the gasket body.

[0014] The effect achieved by the above components is that the reinforcing blocks can improve the strength of the gasket body.

[0015] Preferably, the reinforcing blocks are rubber blocks.

[0016] Preferably, a plurality of convex blocks are uniformly fixedly installed on the surface of the gasket body, and the convex blocks are insulating blocks.

[0017] The effect achieved by the above components is that the convex blocks can increase the friction between the gasket and the electronic product.

[0018] Preferably, a plurality of grooves are formed on the surface of the gasket body, and the plurality of grooves are uniformly distributed on the surface of the gasket body.

[0019] The effect achieved by the above components is that the grooves can improve the heat dissipation effect of the gasket.

[0020] In summary:

[0021] In the present utility model, when it is necessary to replace the silicone gasket, the pulling pad is removed from the positioning elastic pad by means of the auxiliary groove. At this time, the pulling pad can be unfolded. At this time, the connecting rod can be driven to move by pulling the two pulling pads. While the connecting rod moves, the silicone gasket is driven to move. After the silicone gasket moves a certain distance, the silicone gasket slides out from the electronic product. At this time, the silicone gasket can be replaced. The effect achieved by the mutual cooperation of the above components is that it can facilitate the staff to remove the silicone gasket from the electronic product, thereby facilitating the staff to replace the silicone gasket. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a three-dimensional structural schematic diagram of the present utility model;

[0023] Figure 2 is the present utility model Figure 1 of the partial structural schematic diagram;

[0024] Figure 3 For the present utility model Figure 2 magnified view of part A;

[0025] Figure 4 For the present utility model Figure 1 side view structure schematic diagram.

[0026] Legend: 1. gasket body; 2. groove; 3. convex block; 4. reinforcement block; 5. card hole; 6. connecting rod; 7. pull gasket; 8. auxiliary groove; 9. limit groove; 10. positioning elastic pad. Specific implementation manner

[0027] Referring to Figures 1-4 as shown, the present utility model provides a technical solution: a semiconductor insulating and heat-conducting silica gel gasket, including a gasket body 1, two card holes 5 are opened on the surface of the gasket body 1, a connecting rod 6 is fixedly installed on the inner wall of the card hole 5, two pull gaskets 7 are fixedly installed on the surface of the connecting rod 6, the surface of the pull gasket 7 abuts against the gasket body 1, auxiliary grooves 8 are opened on the surfaces of the four pull gaskets 7, the auxiliary grooves 8 can facilitate the staff to pull the pull gasket 7, limit grooves 9 are opened on the surfaces of the four pull gaskets 7, four positioning elastic pads 10 are fixedly installed on the surface of the gasket body 1, the inner wall of the limit groove 9 abuts against the positioning elastic pad 10, the limit groove 9 and the positioning elastic pad 10 can clamp the pull gasket 7 on the gasket body 1, two reinforcement blocks 4 are fixedly installed on the surface of the gasket body 1, the reinforcement blocks 4 can improve the strength of the gasket body 1, the reinforcement blocks 4 are rubber blocks, a plurality of convex blocks 3 are uniformly fixedly installed on the surface of the gasket body 1, the convex blocks 3 are insulating blocks, the convex blocks 3 can increase the friction between the gasket and the electronic product, a plurality of grooves 2 are opened on the surface of the gasket body 1, the plurality of grooves 2 are uniformly distributed on the surface of the gasket body 1, and the grooves 2 can improve the heat dissipation effect of the gasket.

[0028] Working principle: When it is necessary to replace the silica gel gasket, the pull gasket 7 is removed from the positioning elastic pad 10 by means of the auxiliary groove 8. At this time, the pull gasket 7 can be unfolded. At this time, the connecting rod 6 can be driven to move by pulling the two pull gaskets 7. While the connecting rod 6 moves, the silica gel gasket is driven to move. After the silica gel gasket moves a certain distance, the silica gel gasket slides out from the electronic product. At this time, the silica gel gasket can be replaced. The effects achieved by the mutual cooperation of the above components are: it can facilitate the staff to remove the silica gel gasket from the electronic product, thereby facilitating the staff to replace the silica gel gasket.

[0029] In the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood through specific circumstances.

Claims

1. A semiconductor insulating thermally conductive silicone gasket, comprising a gasket body (1), characterized in that: The surface of the gasket body (1) is provided with two clamping holes (5), the inner wall of the clamping hole (5) is fixedly mounted with a connecting rod (6), the surface of the connecting rod (6) is fixedly mounted with two pull pads (7), and the surface of the pull pads (7) is in contact with the gasket body (1).

2. The semiconductor insulating thermally conductive silicone gasket according to claim 1, characterized in that: Auxiliary grooves (8) are provided on the surfaces of the four pull pads (7).

3. The semiconductor insulating thermally conductive silicone gasket according to claim 1, characterized in that: The surfaces of the four pull pads (7) are each provided with a limiting groove (9), and the surface of the gasket body (1) is fixedly mounted with four positioning elastic pads (10), and the inner wall of the limiting groove (9) is in contact with the positioning elastic pad (10).

4. The semiconductor insulating thermally conductive silicone gasket according to claim 1, characterized in that: Two reinforcement blocks (4) are fixedly mounted on the surface of the gasket body (1).

5. The semiconductor insulating thermally conductive silicone gasket according to claim 4, characterized in that: The reinforcement block (4) is a rubber block.

6. The semiconductor insulating thermally conductive silicone gasket according to claim 1, characterized in that: A plurality of protrusions (3) are evenly and fixedly mounted on the surface of the gasket body (1), and the protrusions (3) are insulating blocks.

7. The semiconductor insulating thermally conductive silicone gasket according to claim 1, characterized in that: The surface of the gasket body (1) is provided with a plurality of grooves (2), and the plurality of grooves (2) are evenly distributed on the surface of the gasket body (1).

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