Novel director box with good heat dissipation effect
By setting a heat dissipation hole and air guide channel on the outer wall of the guide box, and using a fan to discharge hot air, the problem of excessive temperature inside the guide box is solved, and the heat dissipation effect and the operating efficiency of the integrated circuit are improved.
Patent Information
- Application Number
- CN202422273563.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-18
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-09-18
AI Technical Summary
The heat dissipation structure of the existing guide box causes hot air to accumulate inside the guide box, causing internal temperature to rise and reducing the operating efficiency of the integrated circuit.
A new type of guide box is designed, by providing first and second heat dissipation holes on the outer wall of the guide box body, and a heat sink, a air guide plate and a fan are arranged between the two to form a air guide channel. The fan direction of the fan is arranged along the length direction of the air guide channel to achieve effective hot air discharge.
This design significantly improves the heat dissipation effect of the guide box, effectively solves the problem of excessive temperature inside the guide box, and improves the operating efficiency of the integrated circuit.
Smart Images

Figure CN223040454U_ABST