Heat exchange system and processing equipment
By setting up a heat exchange system for circulating air on both sides of the cache space, the problem of slow cooling of high-temperature sheets is solved, and faster cooling and capacity improvement are achieved.
Patent Information
- Application Number
- CN202422199081.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-06
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-09-06
AI Technical Summary
In the prior art, the cooling rate of high-temperature sheets after the oven is slow, resulting in a decrease in product production capacity.
A heat exchange system is designed, including a first heat exchange mechanism and a second heat exchange mechanism on both sides of the buffer space, and cooling is reduced by circulating air. The first heat exchange mechanism introduces external air into the buffer space, and the heated air is exported through the second heat exchange mechanism to realize circulating heat dissipation of the buffer space.
The cooling rate of the sheet is significantly improved through circulating heat dissipation technology, saving the time when the sheet is left to cool down in the buffer area, and improving the product production capacity.
Smart Images
Figure CN223040499U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the fields of semiconductor and photovoltaic technologies, and particularly to a heat exchange system and a processing device. Background Art
[0002] With the development of photovoltaic technology, semiconductor or photovoltaic materials are widely used in industries such as electronics and new energy. Semiconductor or photovoltaic materials usually need to be chemically processed before they can be applied to products. The processing of semiconductor or photovoltaic materials is usually achieved by feeding sheet materials into a reaction furnace and reacting them under certain temperature and pressure conditions.
[0003] After the sheet materials are reacted in the high-temperature environment of the furnace chamber of the reaction furnace, the reacted sheet materials are accompanied by a very high temperature after being taken out of the furnace. At this time, it is usually necessary to send the reacted sheet materials to a buffer cooling area, and the sheet materials can enter the next processing step only after being cooled in the buffer cooling area. In the buffer cooling area, structures such as a water curtain wall and water cooling pipes are generally provided for cooling the sheet materials. However, it still takes a relatively long time to cool the high-temperature sheet materials, and the cooling effect is not significant, resulting in a reduction in the production capacity of the products. Summary of the Utility Model
[0004] In view of this, the embodiments of the present disclosure provide a heat exchange system and a processing device to solve the problem of the slow cooling rate of the high-temperature sheet materials after being taken out of the furnace in the related art.
[0005] In a first aspect, an embodiment of the present disclosure provides a heat exchange system applied to a processing device. The processing device has at least one buffer space configured to buffer a carrier carrying a plurality of sheets. The heat exchange system includes: a first heat exchange mechanism and a second heat exchange mechanism arranged at intervals in a first direction in the buffer space. The carrier is located between the first heat exchange mechanism and the second heat exchange mechanism. The first direction is perpendicular to the vertical direction. The first heat exchange mechanism includes: a first housing having a first heat exchange flow channel. The first housing is provided with a first inlet and a first outlet communicating with the first heat exchange flow channel. The first inlet communicates with the outside, and the first outlet communicates with the buffer space. A first heat exchange component is arranged in the first heat exchange flow channel and is configured to introduce outside air from the first inlet into the first heat exchange flow channel, cool the air entering the first heat exchange flow channel, and then export it from the first outlet to the buffer space. The second heat exchange mechanism includes: a second housing having a second heat exchange flow channel. The second housing is provided with a second inlet and a second outlet communicating with the second heat exchange flow channel. The second inlet communicates with the buffer space, and the second outlet communicates with the outside. A second heat exchange component is arranged in the second heat exchange flow channel and is configured to introduce the air in the buffer space from the second inlet into the second heat exchange flow channel and export it from the second outlet to the outside through the second heat exchange flow channel. The first outlet and the second inlet are oppositely arranged on both sides of the carrier in the first direction. The cooled air exported from the first outlet can flow into the gap between adjacent sheets and carry the heat of the sheets into the second inlet.
[0006] In some embodiments, the first heat exchange component includes: at least one first fan arranged at a position corresponding to the first inlet in the first heat exchange flow channel. The first fan is configured to introduce outside air from the first inlet into the first heat exchange flow channel and export it from the first outlet. A first cooling member is arranged in the first heat exchange flow channel and is configured to cool the air before it is exported from the first outlet. The second heat exchange component includes: at least one second fan arranged at a position corresponding to the second outlet in the second heat exchange flow channel. The second fan is configured to introduce the air in the buffer space from the second inlet and export it from the second outlet.
[0007] In some embodiments, the first housing includes: a first bottom plate; a first top plate located above the first bottom plate; a first side plate parallel to the first direction, the first side plate connecting the first bottom plate and the first top plate; a second side plate disposed at one side of the first side plate at an interval along the second direction, the second direction being perpendicular to the first direction; a third side plate respectively connected to the first side plate and the second side plate, the third side plate being parallel to the second direction; a fourth side plate respectively connected to the first side plate and the second side plate, the fourth side plate being located on the side of the third side plate facing the carrier along the first direction, the first bottom plate, the first top plate, the first side plate, the second side plate, the third side plate and the fourth side plate enclose a first heat exchange flow channel, a first inlet is disposed on the first side plate, and a first outlet is disposed on the fourth side plate; wherein, the fourth side plate includes: a first sub-plate parallel to the third side plate, the first sub-plate being connected to the first side plate; a second sub-plate parallel to the third side plate, the second sub-plate being connected to the second side plate, the first outlet is disposed on the second sub-plate, the distance from the first sub-plate to the third side plate is greater than the distance from the second sub-plate to the third side plate; a third sub-plate connecting the first sub-plate and the second sub-plate, the third sub-plate having a first windward surface facing the first heat exchange flow channel, and a first preset angle is formed between the third sub-plate and the second sub-plate; wherein, a first fan is disposed at a position of the first side plate corresponding to the first inlet, a first cooling member is disposed on the third side plate, the first fan can introduce external air from the first inlet into the first heat exchange flow channel, and under the action of the first windward surface, guide the incoming air to the first cooling member.
[0008] In some embodiments, the first preset angle is between 90° and 180°.
[0009] In some embodiments, the included angle between the second side plate and the third side plate is less than or equal to 90°.
[0010] In some embodiments, the first housing further includes: a wind guiding plate connected to a side of the second sub-plate away from the third side plate, and the wind guiding plate surrounds the first outlet, and the wind guiding plate is configured to guide the air flowing out from the first outlet to the carrier.
[0011] In some embodiments, the first cooling member includes: a heat exchange pipeline wound around a side of the third side plate facing the fourth side plate, and the heat exchange pipeline is at least arranged in a region of the third side plate opposite to the second sub-plate in the first direction, the heat exchange pipeline includes a water inlet and a water outlet, and the water inlet and the water outlet extend out of the first heat exchange flow channel to be respectively connected to an external water inlet pipe and a water outlet pipe.
[0012] In some embodiments, the second heat exchange assembly further includes: a second cooling member disposed in the second heat exchange flow path, the second cooling member being configured to cool the air entering from the second inlet; the second housing includes: a second bottom plate; a second top plate located above the second bottom plate; a fifth side plate parallel to the first direction, the fifth side plate connecting the second bottom plate and the second top plate; a sixth side plate disposed at one side of the fifth side plate at an interval along the second direction, the second direction being perpendicular to the first direction; a seventh side plate respectively connected to the fifth side plate and the sixth side plate, the seventh side plate being parallel to the second direction; an eighth side plate respectively connected to the fifth side plate and the sixth side plate, the eighth side plate being located on the side of the seventh side plate facing the carrier along the first direction, the second bottom plate, the second top plate, the fifth side plate, the sixth side plate, the seventh side plate and the eighth side plate enclose to form the second heat exchange flow path, the second outlet is disposed on the fifth side plate, and the second inlet is disposed on the eighth side plate; wherein, the eighth side plate includes: a fourth sub-plate parallel to the seventh side plate, the fourth sub-plate being connected to the fifth side plate; a fifth sub-plate parallel to the seventh side plate, the fifth sub-plate being connected to the sixth side plate, the second inlet is disposed on the fifth sub-plate, the distance from the fourth sub-plate to the seventh side plate is greater than the distance from the fifth sub-plate to the seventh side plate; a sixth sub-plate connecting the fourth sub-plate and the fifth sub-plate, the sixth sub-plate having a second windward surface facing the second heat exchange flow path, and a second preset angle is formed between the sixth sub-plate and the fifth sub-plate; wherein, the second fan is disposed at the position of the fifth side plate corresponding to the second outlet, the second cooling member is disposed on the seventh side plate, the second fan can introduce the air in the buffer space from the second inlet into the second heat exchange flow path, the second cooling member cools the entering air, and under the action of the second windward surface, guides the air to the second outlet.
[0013] In some embodiments, it further includes: a first filter member connected to the position of the first housing corresponding to the first inlet, the first filter member at least covering the first inlet, the first filter member being configured to allow the filtered air to enter the first heat exchange flow path from the first inlet; and / or, a second filter member connected to the position of the second housing corresponding to the second outlet, the second filter member at least covering the second outlet, the second filter member being configured to allow the air flowing out of the second outlet to flow to the outside after being filtered.
[0014] In a second aspect, an embodiment of the present disclosure further provides a processing device, including at least one buffer space configured to buffer a carrier carrying a plurality of sheets, the plurality of sheets being arranged at intervals in the vertical direction; at least one of the above-described heat exchange systems arranged in at least one buffer space.
[0015] A heat exchange system and a processing device provided by an embodiment of the present disclosure utilize a first heat exchange mechanism and a second heat exchange mechanism arranged on both sides of a sheet, enabling the first heat exchange component to introduce air outside the buffer space, cool it, and blow it towards the sheet, and allowing the cooled air to pass through the gaps between the sheets to carry away the heat of the sheet, and introducing the heated air through the second inlet via the second heat exchange component and then discharging it outside the buffer space through the second outlet. Thus, the cyclic heat dissipation of the buffer space is achieved through the provided first heat exchange mechanism and second heat exchange mechanism, quickly removing the heat of the sheet in the buffer space, increasing the cooling rate of the sheet, and saving the time for the sheet to stand and cool in the buffer area.
[0016] In addition, in the cooperation between the first heat exchange mechanism and the second heat exchange mechanism and the carrier carrying the sheet, the first outlet and the second inlet are oppositely arranged on both sides of the carrier, such that when the cyclic air cools the buffer space, the air cooled by the first heat exchange mechanism can flow more concentratedly from the first outlet towards the sheet and the gaps between the sheets, and the second heat exchange mechanism can quickly discharge the air heated after flowing through the sheet, further increasing the cooling rate of the sheet. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] By describing the embodiments of the present disclosure in more detail in conjunction with the accompanying drawings, the above and other objects, features, and advantages of the present disclosure will become more obvious. The accompanying drawings are used to provide a further understanding of the embodiments of the present disclosure, and constitute a part of the specification, and are used to explain the present disclosure together with the embodiments of the present disclosure, and do not constitute a limitation to the present disclosure. In the accompanying drawings, the same reference numerals generally represent the same components or steps.
[0018] Figure 1 Shown is a schematic diagram of a processing device provided by an embodiment of the present disclosure.
[0019] Figure 2 Shown is a schematic diagram when there are multiple heat exchange systems provided by an embodiment of the present disclosure.
[0020] Figure 3 Shown is a schematic diagram of a heat exchange system provided by an embodiment of the present disclosure in a buffer space.
[0021] Figure 4 Shown is a top view of a heat exchange system provided by an embodiment of the present disclosure in a buffer space.
[0022] Figure 5 Shown is an exploded view of a first heat exchange mechanism provided by an embodiment of the present disclosure.
[0023] Figure 6 Shown is a schematic diagram of a heat exchange system provided by another embodiment of the present disclosure in a buffer space.
[0024] Figure 7 The following is an exploded view of a second heat exchange mechanism provided by an embodiment of the present disclosure.
[0025] Reference numerals:
[0026] 100, processing equipment; 10, heat exchange system; 1, first heat exchange mechanism; 11, first housing; 11a, first inlet; 11b, first outlet; 11c, first heat exchange flow path; 11d, first wind shielding surface; 111, first bottom plate; 112, first top plate; 113, first side plate; 114, second side plate; 115, third side plate; 116, fourth side plate; 1161, first sub-plate; 1162, third sub-plate; 1163, second sub-plate; 12, first heat exchange component; 121, first fan; 122, first cooling member; 1221, water inlet; 1222, water outlet; 1223, water-cooled plate support; 13, first filter member; 14, air guide plate; 2, second heat exchange mechanism; 21, second housing; 21a, second inlet; 21b, second outlet; 21c, second heat exchange flow path; 21d, second wind shielding surface; 211, second bottom plate; 212, second top plate; 213, fifth side plate; 214, sixth side plate; 215, seventh side plate; 216, eighth side plate; 2161, fourth sub-plate; 2162, sixth sub-plate; 2163, fifth sub-plate; 22, second heat exchange component; 221, second fan; 222, second cooling member; 23, second filter member; 3, fixing member; 4, water inlet pipe; 5, water outlet pipe; 20, reaction equipment; 201, reaction furnace; 30, conveying line; 40, buffer area; 401, buffer space; 50, carrier; 60, sheet; X, first direction; Y, second direction; M, heat exchange direction; Q, first preset angle; S, second preset angle. Detailed implementation manners
[0027] Next, the technical solutions in the embodiments of the present disclosure will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present disclosure without creative efforts shall fall within the protection scope of the present disclosure.
[0028] Figure 1 The following is a schematic diagram of processing equipment provided by an embodiment of the present disclosure. Figure 2 The following is a schematic diagram when there are multiple heat exchange systems provided by an embodiment of the present disclosure. Figure 3 The following is a schematic diagram of a heat exchange system in a buffer space provided by an embodiment of the present disclosure. Figure 4 The following is a top view of a heat exchange system in a buffer space provided by an embodiment of the present disclosure. Figure 5The figure shows an exploded view of a first heat exchange mechanism provided by an embodiment of the present disclosure. Among them, the direction indicated by arrow X is the first direction, the direction indicated by arrow Y is the second direction, the first direction X and the second direction Y are perpendicular to each other on the horizontal plane and perpendicular to the vertical direction, and the direction indicated by arrow M is the air circulation flow direction of the heat exchange system, that is, the heat exchange direction M.
[0029] An embodiment of the present disclosure provides a heat exchange system, such as Figure 1 and Figure 2 , which is applied to a processing device 100. The processing device 100 has a buffer area 40, and a heat exchange system 10 is arranged in the buffer area 40. The processing device 100 further includes a reaction furnace 201. The sheet 60 undergoes chemical treatment of the process surface in the reaction furnace 201 under certain temperature and pressure conditions. After the reaction, the sheet 60 with a very high temperature is transferred to the buffer area 40, so that the sheet 60 stands still in the buffer area 40 and the heat exchange system 10 cools the sheet 60 to a normal temperature.
[0030] It can be understood that at least one sheet 60 can be chemically treated in the reaction furnace 201, and the sheet 60 is carried on the carrier 50 so that the previous one or more sheets 60 on the carrier 50 can be simultaneously moved into or out of the reaction furnace 201.
[0031] Optionally, the sheet 60 can be a solar cell, or a sheet-shaped semiconductor structure, without specific limitation. The shape of the sheet 60 can include a rectangle, a square, a circle, etc. In the embodiment of the present disclosure, the sheet 60 is a rectangular solar cell, and will not be emphasized separately hereafter.
[0032] In addition, the carrier 50 for carrying at least one sheet 60 can be a graphite boat, so that while being able to carry multiple sheets 60, the process surface of the sheet 60 can be exposed to realize the reaction of the process surfaces of multiple sheets 60 in the reaction furnace 201. The specific structure of the graphite boat will not be described in detail.
[0033] Optionally, the processing equipment may include a reaction equipment 20. The reaction furnace 20 provided in the reaction equipment 20 may be, for example, an LPCVD reaction furnace of a low pressure chemical vapor deposition (LPCVD) equipment, an ALD reaction furnace of an atomic layer deposition (ALD) equipment, etc., without specific limitation. In the embodiments of the present disclosure, the reaction furnace 201 is set as an LPCVD reaction furnace, and the LPCVD reaction furnace may further be set as an LPCVD reaction furnace of a vertical LPCVD equipment capable of saving space. In the LPCVD reaction furnace of the vertical LPCVD equipment, the carrier 50 is placed vertically, that is, the plurality of sheets 60 carried on the carrier 50 are placed horizontally or approximately horizontally, and the plurality of sheets 60 are arranged at intervals in the vertical direction on the carrier 50.
[0034] The processing equipment 100 may further include a conveying line 30 for conveying the carrier 50 carrying the sheet 60 to a position near the furnace mouth of the LPCVD reaction furnace, and may further include a manipulator for carrying the carrier 50 on the conveying line 30 into the furnace chamber of the LPCVD reaction furnace, and a robotic arm for carrying the carrier 50 in the furnace chamber to a corresponding position in the buffer space 401, etc., which will not be described in detail here.
[0035] It should be emphasized that the buffer area 40 may be used to buffer only one carrier 50 carrying the sheet 60, or may be used to buffer a plurality of carriers 50 carrying the sheet 60. That is, the buffer area 40 may be divided into one or more buffer spaces 401, and each buffer space 401 is configured to buffer one carrier 50 carrying the high-temperature sheet 60 after the reaction. And a heat exchange system 10 may be provided in each buffer space 401, so that a plurality of carriers 50 can be cooled simultaneously in different buffer spaces 401 through the heat exchange system 10.
[0036] It can be understood that the plurality of buffer spaces 401 divided in the buffer area 40 may be arranged adjacent to each other or at intervals, without specific limitation. In the embodiments of the present disclosure, the plurality of buffer spaces 401 are arranged adjacent to each other along the first direction X, so that the heat exchange systems 10 between adjacent buffer spaces 401 can be fixed by the same fixing member 3. The fixing member 3 may be, for example, a fixing seat, a fixing frame, etc., and the heat exchange system 10 is fixed in the corresponding buffer space 401 by means of bolt fastening or snap connection, etc., which will not be elaborated.
[0037] Such as Figures 3 to 5, taking the heat exchange system 10 provided in a buffer space 401 as an example, the heat exchange system 10 includes a first heat exchange mechanism 1 and a second heat exchange mechanism 2 which are arranged at intervals in the buffer space 401 along the first direction X, and a carrier 50 is located between the first heat exchange mechanism 1 and the second heat exchange mechanism 2. Among them, the first heat exchange mechanism 1 includes a first housing 11 and a first heat exchange component 12. The first housing 11 has a first heat exchange flow channel 11c. The first housing 11 is provided with a first inlet 11a and a first outlet 11b which are communicated with the first heat exchange flow channel 11c. The first inlet 11a is communicated with the outside, and the first outlet 11b is communicated with the buffer space 401. The first heat exchange component 12 is arranged in the first heat exchange flow channel 11c. The first heat exchange component 12 is configured to introduce outside air from the first inlet 11a into the first heat exchange flow channel 11c, and after cooling the air entering the first heat exchange flow channel 11c, export it from the first outlet 11b to the buffer space 401. The second heat exchange mechanism 2 includes a second housing 21 and a second heat exchange component 22. The second housing 21 has a second heat exchange flow channel 21c. The second housing 21 is provided with a second inlet 21a and a second outlet 21b which are communicated with the second heat exchange flow channel 21c. The second inlet 21a is communicated with the buffer space 401, and the second outlet 21b is communicated with the outside. The second heat exchange component 22 is arranged in the second heat exchange flow channel 21c. The second heat exchange component 22 is configured to introduce the air in the buffer space 401 from the second inlet 21a into the second heat exchange flow channel 21c, and export it from the second outlet 21b to the outside through the second heat exchange flow channel 21c. Among them, the first outlet 11b and the second inlet 21a are relatively arranged on both sides of the carrier 50 along the first direction X. The cooled air exported from the first outlet 11b can flow into the gap between adjacent sheets 60 and carry the heat of the sheets 60 into the second inlet 21a.
[0038] It can be understood that the buffer space 401 can be an enclosed space, that is, the buffer area 40 can be provided with a buffer device, and one or more buffer spaces 401 are arranged in the buffer device. The external environment of the enclosed space is the outside world, and the first inlet 11a and the second outlet 21b are respectively communicated with the outside world. Alternatively, the buffer space 401 can also be an open space, and the open space is communicated with the external environment. At this time, the external environment can be the workshop where the processing device 100 is placed, or the natural environment outside the workshop. The first inlet 11a and the second outlet 21b can be directly communicated with the workshop, or can be led out from the workshop through pipelines, etc. and communicated with the natural environment, without specific limitation. In the embodiments of the present disclosure, the buffer space 401 is set as an open space, the buffer space 401 is communicated with the workshop, and the first inlet 11a and the second outlet 21b are communicated with the workshop. The first inlet 11a can introduce the air in the workshop and flow to the sheet 60 in the buffer space 401 after cooling to cool the sheet 60, and the second inlet 21a can introduce the air that has been heated after flowing through the sheet 60, and discharge the heated air to the workshop through the second heat exchange component 22.
[0039] The heat exchange system 10 provided by the present disclosure uses the first heat exchange mechanism 1 and the second heat exchange mechanism 2 arranged on both sides of the sheet 60, so that the first heat exchange component 12 can introduce the air outside the buffer space 401 and blow it to the sheet 60 after cooling, and make the cooled air pass through the gap between the sheets 60 to carry the heat of the sheet 60, and introduce the heated air from the second inlet 21a through the second heat exchange component 22 and then discharge it out of the buffer space 401 through the second outlet 21b. Thus, the cyclic heat dissipation of the buffer space 401 is realized through the arranged first heat exchange mechanism 1 and second heat exchange mechanism 2, so as to quickly take away the heat of the sheet 60 in the buffer space 401, improve the cooling rate of the sheet 60, and save the static cooling time of the sheet 60 in the buffer area 40.
[0040] In addition, in the cooperation between the first heat exchange mechanism 1 and the second heat exchange mechanism 2 and the carrier 50 carrying the sheet 60, the first outlet 11b and the second inlet 21a are oppositely arranged on both sides of the carrier 50, so that when the cyclic air moves along the heat exchange direction M to cool the buffer space 401, the air cooled by the first heat exchange mechanism 1 can more concentratedly flow from the first outlet 11b to the sheet 60 and the gap between the sheets 60, and the second heat exchange mechanism 2 can quickly export the air heated after flowing through the sheet 60, further improving the cooling rate of the sheet 60.
[0041] It can be understood that the first inlet 11a provided on the first housing 11 can be provided as one or multiple, and the shape, size, etc. of the first inlet 11a can be adaptively adjusted according to requirements. The second outlet 21b can be provided as one or multiple, and the shape, size, etc. of the first outlet 11b can be adaptively adjusted according to requirements. In addition, the number, shape, size, etc. of the first inlet 11a and the second inlet 21a can be set to be the same or different. The air intake volume entering from the first inlet 11a and the air outlet volume blown out from the first outlet 11b can be the same or different, without specific limitation. Similarly, the settings of the second inlet 21a and the second outlet 21b provided on the second housing 21 can refer to the relevant descriptions of the first inlet 11a and the first outlet 11b of the first housing 11, and will not be elaborated here.
[0042] Optionally, the length, cross-sectional shape, area, etc. of the first heat exchange channel 11c and the second heat exchange channel 21c extending in the corresponding housing can be adaptively adjusted according to requirements, without specific limitation.
[0043] In some embodiments, the first heat exchange assembly 12 includes at least one first fan 121 and a first cooling member 122. The first fan 121 is disposed at a position of the first heat exchange channel 11c corresponding to the first inlet 11a. The first fan 121 is configured to introduce outside air from the first inlet 11a into the first heat exchange channel 11c and discharge it from the first outlet 11b. The first cooling member 122 is disposed in the first heat exchange channel 11c. The first cooling member 122 is configured to cool the air before it is discharged from the first outlet 11b. The second heat exchange assembly 22 includes at least one second fan 221. The second fan 221 is disposed at a position of the second heat exchange channel 21c corresponding to the second outlet 21b. The second fan 221 is configured to introduce the air in the buffer space 401 from the second inlet 21a and discharge it from the second outlet 21b. Specifically, the rotation of the first fan 121 can introduce outside air from the first inlet 11a into the first heat exchange channel 11c and discharge it along the first heat exchange channel 11c from the first outlet 11b. During the process of the first fan 121 controlling the air to flow along the first heat exchange channel 11c, the first cooling member 122 can cool the flowing air. The cooled cold air is discharged into the buffer space 401 and flows to the sheet 60. The cold air carries the heat of the sheet 60 to heat the air and cool the sheet 60. The heated air can be introduced into the second heat exchange channel 21c from the second inlet 21a and discharged from the second outlet 21b under the action of the second fan 221, thereby realizing rapid cooling of the sheet 60.
[0044] It can be understood that the number of the first fans 121 can match the number of the provided first inlets 11a, each first fan 121 is arranged at the position of a corresponding first inlet 11a, the number of the second fans 221 can match the number of the provided second outlets 21b, each second fan 221 is arranged at the position of a corresponding second outlet 21b, and the rotation directions of the first fans 121 and the second fans 221 are opposite, so that the first heat exchange mechanism 1 and the second heat exchange mechanism 2 can realize the circulating flow of the air in the buffer space 401 along the heat exchange direction M. In other embodiments, the number of the first fans 121 may not match the number of the provided first inlets 11a, the first fans 121 are arranged at the positions close to the first inlets 11a in the first heat exchange flow path 11c, the number of the second fans 221 may not match the number of the provided second outlets 21b, and the second fans 221 are arranged at the positions close to the second outlets 21b in the second heat exchange flow path 21c, without specific limitation.
[0045] In some embodiments, the first housing 11 includes a first bottom plate 111, a first top plate 112, a first side plate 113, a second side plate 114, a third side plate 115 and a fourth side plate 116 that enclose to form the first heat exchange flow path 11c. The first top plate 112 is located above the first bottom plate 111 in the vertical direction. The first side plate 113 is parallel to the first direction X, and the first side plate 113 connects the first bottom plate 111 and the first top plate 112. The second side plate 114 is arranged at one side of the first side plate 113 at an interval along the second direction Y, and the second direction Y is perpendicular to the first direction X. The third side plate 115 is respectively connected to the first side plate 113 and the second side plate 114, and the third side plate 115 is parallel to the second direction Y. The fourth side plate 116 is respectively connected to the first side plate 113 and the second side plate 114, and the fourth side plate 116 is located on the side of the third side plate 115 facing the carrier 50 along the first direction X. The first inlet 11a is arranged on the first side plate 113, and the first outlet 11b is arranged on the fourth side plate 116.
[0046] It can be understood that the first bottom plate 111, the first top plate 112, the first side plate 113, the second side plate 114, the third side plate 115 and the fourth side plate 116 can be detachably connected, or a part of the plates can be integrally formed and the other part can be detachably connected to facilitate the installation of the first heat exchange assembly 12.
[0047] Specifically, the fourth side plate 116 includes a first sub-plate 1161, a third sub-plate 1162, and a second sub-plate 1163 that are sequentially connected along the second direction Y. The first sub-plate 1161 is parallel to the third side plate 115, the first sub-plate 1161 is connected to the first side plate 113, the second sub-plate 1163 is parallel to the third side plate 115, the second sub-plate 1163 is connected to the second side plate 114, the first outlet 11b is provided on the second sub-plate 1163, the distance from the first sub-plate 1161 to the third side plate 115 is greater than the distance from the second sub-plate 1163 to the third side plate 115, the third sub-plate 1162 connects the first sub-plate 1161 and the second sub-plate 1163, the third sub-plate 1162 has a first windward surface 11d facing the first heat exchange channel 11c, and there is a first preset angle Q between the third sub-plate 1162 and the second sub-plate 1163; wherein, the first fan 121 is arranged at a position on the first side plate 113 corresponding to the first inlet 11a, the first cooling member 122 is arranged on the third side plate 115, the first fan 121 can introduce the outside air from the first inlet 11a into the first heat exchange channel 11c, and under the action of the first windward surface 11d, direct the incoming air to the first cooling member 122. Through the arrangement of the third sub-plate 1162, the first windward surface 11d of the third sub-plate 1162 can be opposite to a part of the first inlet 11a, and the extending direction of the first windward surface 11d has an included angle with the extending direction of the first direction X, so that the air introduced from the first inlet 11a along the second direction Y can hit the first windward surface 11d, and under the blocking of the first windward surface 11d, change the flow direction. The setting of the first preset angle Q enables the air with the changed flow direction to hit the first cooling member 122, and finally the air cooled by the first cooling member 122 is ejected from the first outlet 11b to the sheet 60 in the buffer space 401.
[0048] It can be understood that the first windward surface 11d can be set as a plane facing the first heat exchange channel 11c or an arc surface. The first windward surface 11d is used to block the air entering from the first inlet 11a to change the flow path, so that the air hits the first cooling member 122 more concentratedly, which is beneficial to better cooling and temperature reduction of the air in the first heat exchange channel 11c.
[0049] Optionally, the first preset angle Q is between 90° and 180°. So that the air entering from the first inlet 11a can be rebounded by the obtuse angle of the windward surface to the first cooling member 122 located on the third side plate 115, so that the cooled air can hit the sheet 60 more concentratedly from the first outlet 11b at an inclined angle, further improving the cooling efficiency of the sheet 60. In the embodiment of the present disclosure, the first preset angle Q is set to 150°. In other examples, the first preset angle Q can also be set to 120°, 140°, 160°, etc., without specific limitation.
[0050] In some alternative embodiments, the included angle between the second side plate 114 and the third side plate 115 is less than or equal to 90°. That is, the second side plate 114 may be parallel to the first side plate 113, and the included angle between the second side plate 114 and the third side plate 115 is equal to 90°. Or, the extending direction of the second side plate 114 may also intersect with the extending direction of the first side plate 113, and the included angle between the second side plate 114 and the third side plate 115 is less than 90°, such as 80°, 70°, 60°, etc., so that after the air in the first heat exchange channel 11c hits the second side plate 114, the second side plate 114 can rebound the air, and further make the air flow more concentratedly from the first outlet 11b to the sheet 60, further improving the cooling efficiency.
[0051] Figure 6 The figure shows a schematic diagram of a heat exchange system provided by another embodiment of the present disclosure in a buffer space. As Figure 6 , the first housing 11 further includes a wind guide plate 14. The wind guide plate 14 is connected to the side of the second sub-plate 1163 away from the third side plate 115, and the wind guide plate 14 surrounds the first outlet 11b. The wind guide plate 14 is configured to guide the air flowing out from the first outlet 11b to the carrier 50. The wind guide plate 14 encloses a cylindrical structure, so that the cooled cold air exported from the first outlet 11b can be guided along the extending direction of the cylindrical structure to the sheet 60 in the buffer space 401, avoiding the cold air from being blown out of the open buffer space 401, thereby improving the cooling rate of the sheet 60 in the buffer space 401.
[0052] It can be understood that the cylindrical structure formed by the wind guide plate 14 surrounding the first outlet 11b may be, for example, a conical cylindrical structure, or a square conical cylindrical structure, or a circular cylindrical structure, without specific limitation. In the embodiment of the present disclosure, the first housing 11 is a square housing structure with a hollow first heat exchange channel 11c inside, and the wind guide plate 14 is arranged along the four peripheral edges of the second sub-plate 1163 to enclose a square conical cylindrical structure.
[0053] In some embodiments, the first cooling member 122 includes a heat exchange pipeline, the heat exchange pipeline is wound around the side of the third side plate 115 facing the fourth side plate 116, and the heat exchange pipeline is at least arranged in the area where the third side plate 115 is opposite to the second sub-plate 1163 in the first direction X. The heat exchange pipeline includes a water inlet 1221 and a water outlet 1222, and the water inlet 1221 and the water outlet 1222 extend out of the first heat exchange channel 11c to be respectively connected to an external water inlet pipe 4 and a water outlet pipe 5.
[0054] It can be understood that the heat exchange pipeline can be pre-wound into a disc-shaped structure connected end to end, and the disc-shaped structure is fixed by a water-cooled plate bracket 1223 detachably connected to the first base plate 111, and the heat exchange pipeline of the disc-shaped structure is relatively fixedly arranged on the inner wall of the third side plate 115 through the water-cooled plate bracket 1223, so that the heat exchange pipeline has a larger area in the first heat exchange channel 11c. At the same time, the setting of the heat exchange pipeline will not lead to a decrease in the air flow rate of the first heat exchange channel 11c. More air contacts the heat exchange pipeline through the first heat exchange channel 11c, and the heat exchange area is higher, thereby improving the air cooling effect.
[0055] Optionally, the water inlet 1221 and the water outlet 1222 of the heat exchange pipeline can extend from the first top plate 112 to the first heat exchange channel 11c, so as to be respectively connected to the external water inlet pipe 4 and the water outlet pipe 5. In other examples, the water inlet 1221 and the water outlet 1222 of the heat exchange pipeline can also extend from the first heat exchange channel 11c from other positions of the first shell 11 such as the third side plate 115 and the second side plate 114, and can be adaptively selected according to actual conditions without specific limitation.
[0056] It should be emphasized that the heat exchange pipeline can also be set at other positions and can be adaptively adjusted according to the inclination angle of the third sub-plate 1162 and the specific shape of the cross section enclosed by the first heat exchange channel 11c, etc., without specific limitation.
[0057] In addition, the first cooling member 122 may also be configured as an air cooling component of the third side plate 115, such as arranging an air cooling channel in the third side plate 115, and utilizing a fan to circulate the air cooling channel, etc., and utilizing the circulating wind to allow the incoming cold air to carry the heat of the first heat exchange channel 11c, thereby achieving cooling of the air in the first heat exchange channel 11c, without specific limitation.
[0058] Figure 7 Shown is an exploded view of a second heat exchange mechanism provided in an embodiment of the present disclosure.
[0059] like Figure 7 The second heat exchange assembly 22 further includes a second cooling member 222, which is disposed in the second heat exchange channel 21c and is configured to cool the air entering from the second inlet 21a. Thus, the second cooling member 222 disposed in the second heat exchange channel 21c allows the space of the workshop to be cooled air, which is exported from the second outlet 21b to the workshop, thereby preventing the temperature of the workshop from rising.
[0060] Specifically, the second housing 21 includes a second bottom plate 211, a second top plate 212, a fifth side plate 213, a sixth side plate 214, a seventh side plate 215, and an eighth side plate 216 that enclose to form a second heat exchange flow path 21c. The second top plate 212 is located above the second bottom plate 211. The fifth side plate 213 is parallel to the first direction X, and the fifth side plate 213 connects the second bottom plate 211 and the second top plate 212. The sixth side plate 214 is disposed at one side of the fifth side plate 213 at intervals along the second direction Y. The second direction Y is perpendicular to the first direction X. The seventh side plate 215 is connected to the fifth side plate 213 and the sixth side plate 214 respectively, and the seventh side plate 215 is parallel to the second direction Y. The eighth side plate 216 is connected to the fifth side plate 213 and the sixth side plate 214 respectively. The eighth side plate 216 is located on the side of the seventh side plate 215 facing the carrier 50 along the first direction X. The second outlet 21b is disposed on the fifth side plate 213, and the second inlet 21a is disposed on the eighth side plate 216.
[0061] Wherein, the eighth side plate 216 includes a fourth sub-plate 2161. The fourth sub-plate 2161 is parallel to the seventh side plate 215, and the fourth sub-plate 2161 is connected to the fifth side plate 213. A fifth sub-plate 2163 is parallel to the seventh side plate 215, and the fifth sub-plate 2163 is connected to the sixth side plate 214. The second inlet 21a is disposed on the fifth sub-plate 2163. The distance from the fourth sub-plate 2161 to the seventh side plate 215 is greater than the distance from the fifth sub-plate 2163 to the seventh side plate 215. A sixth sub-plate 2162 connects the fourth sub-plate 2161 and the fifth sub-plate 2163. The sixth sub-plate 2162 has a second windward surface 21d facing the second heat exchange flow path 21c. There is a second preset angle S between the sixth sub-plate 2162 and the fifth sub-plate 2163. Wherein, the second fan 221 is disposed at the position of the fifth side plate 213 corresponding to the second outlet 21b, and the second cooling member 222 is disposed on the seventh side plate 215. The second fan 221 can introduce the air in the buffer space 401 from the second inlet 21a into the second heat exchange flow path 21c. The second cooling member 222 cools the incoming air and guides the air to the second outlet 21b under the action of the second windward surface 21d.
[0062] It can be understood that the specific structure of the second heat exchange mechanism 2 can be the same as that of the first heat exchange mechanism 1, except that the rotation direction of the fan is different, so that the air inlet and outlet directions of the heat exchange mechanism and the flow direction in the heat exchange flow path are opposite. More specifically, the second heat exchange mechanism 2 can be mirror-symmetrically arranged with the first heat exchange mechanism 1 in the first direction X. Therefore, the specific structure of the second heat exchange mechanism 2 can refer to the relevant description of the first heat exchange mechanism 1 and will not be elaborated here.
[0063] Optionally, the second heat exchange mechanism 2 can also be set to a structure different from that of the first heat exchange mechanism 1, which will not be elaborated here.
[0064] In some embodiments, the heat exchange system 10 may further include at least one of a first filter member 13 and a second filter member 23. The first filter member 13 is connected to a position of the first housing 11 corresponding to the first inlet 11a, and the first filter member 13 at least covers the first inlet 11a. The first filter member 13 is configured to allow the filtered air to enter the first heat exchange flow path 11c from the first inlet 11a. The second filter member 23 is connected to a position of the second housing 21 corresponding to the second outlet 21b, and the second filter member 23 at least covers the second outlet 21b. The second filter member 23 is configured to allow the air flowing out from the second outlet 21b to flow to the outside after being filtered. The first filter member 13 can be used to filter dust in the outside air, so that the air entering the first heat exchange flow path 11c has a higher cleanliness, and to avoid dust accumulation on the first cooling member 122 and other positions of the first heat exchange flow path 11c, which may affect the use effect of the first heat exchange mechanism 1. When the air derived from the first outlet 11b cools down through the sheet 60, it can not only carry the heat of the sheet 60, but also carry the dust of the sheet 60 into the second inlet 21a. After being filtered by the second filter member 23, the dust can be filtered and discharged into the workshop, ensuring the cleanliness of the buffer space 401 and the workshop at the same time.
[0065] It can be understood that in the embodiments of the present disclosure, the first filter member 13 and the second filter member 23 are respectively arranged at the position of the first inlet 11a of the first heat exchange mechanism 1 and the position of the second outlet 21b of the second heat exchange mechanism 2, so that the buffer space 401, the heat exchange system 10 and the external environment all have a relatively high cleanliness.
[0066] Optionally, the structures of the first filter member 13 and the second filter member 23 may be the same, and may include a multi-layer filter mesh structure arranged at intervals along the second direction Y, or may be set as activated carbon, without specific limitation.
[0067] In some alternative embodiments, when heat exchange systems 10 are arranged in multiple adjacent buffer spaces 401, the first heat exchange mechanism 1 and the second heat exchange mechanism 2 may be repeatedly arranged in each buffer space 401. There is a gap between the first heat exchange mechanism 1 and the second heat exchange mechanism 2 of adjacent buffer spaces 401, or the third side plate 115 and the sixth side plate 214 are fitted together. The first heat exchange mechanism 1 and the second heat exchange mechanism 2 can be fixed together by the same fixing member 3.
[0068] Optionally, the water inlet pipe 4 and the water outlet pipe 5 are provided with multiple branches for connecting multiple first heat exchange mechanisms 1 and multiple second heat exchange mechanisms 2, without detailed description.
[0069] The present disclosure also provides a processing device, such as Figure 1, The processing equipment 100 is arranged in the workshop. The processing equipment 100 may include a conveyor line 30, a reaction equipment 20 and a heat exchange system 10. A buffer area 40 is arranged on one side of the reaction equipment 20. The buffer area 40 can be divided into at least one buffer space 401. The buffer space 401 is used to place a carrier 50 carrying at least one sheet 60. The sheet 60 is placed horizontally or approximately horizontally. A plurality of sheets 60 are arranged at intervals in the vertical direction. The heat exchange system 10 is arranged in at least one buffer space 401 to cool the sheet 60 by circulating air.
[0070] Optionally, the reaction equipment 20 may be, for example, a vertical LPCVD reaction equipment. Reference may be made to the relevant descriptions of the above embodiments and will not be elaborated here.
[0071] Optionally, the heat exchange system 10 may refer to the relevant descriptions of the above embodiments and will not be elaborated here.
[0072] In the embodiments of the present disclosure, if not clearly defined, the connection form may be detachable connection by means of bolts and nuts, screws, buckles, magnetic attraction, etc. In some connections, if there is no special requirement for the detachable mating form, non-detachable connection may be carried out by means of welding, bonding, etc.
[0073] The basic principles of the present disclosure have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, advantages, effects, etc. mentioned in the present disclosure are only examples and not limitations. It cannot be considered that these advantages, advantages, effects, etc. are essential for each embodiment of the present disclosure. In addition, the above specific details are only for the purpose of illustration and easy understanding, rather than limitations. The above details do not limit the present disclosure to necessarily adopt the above specific details to implement.
[0074] The block diagrams of the devices, apparatuses, equipment, and systems involved in the present disclosure are only illustrative examples and do not intend to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any way. Words such as "including", "comprising", "having", etc. are open-ended words, meaning "including but not limited to", and can be used interchangeably with them. The word "or" and "and" used here refer to the word "and / or", and can be used interchangeably with it, unless the context clearly indicates otherwise. The word "such as" used here refers to the phrase "such as but not limited to", and can be used interchangeably with it.
[0075] It should also be noted that in the devices, equipment, and methods of the present disclosure, each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of the present disclosure.
[0076] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of the present disclosure. Thus, the present disclosure is not intended to be limited to the aspects shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
[0077] The above description has been presented for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present disclosure to the forms disclosed herein. Although several example aspects and embodiments have been discussed above, those skilled in the art will recognize some of their variations, modifications, alterations, additions, and subcombinations.
Claims
1. A heat exchange system, characterized in that: Applied to a processing device, the processing device has at least one buffer space, the buffer space is configured to buffer a carrier carrying a plurality of sheets; Wherein, the heat exchange system comprises: A first heat exchange mechanism and a second heat exchange mechanism are arranged in the cache space at intervals along a first direction, the carrier is located between the first heat exchange mechanism and the second heat exchange mechanism, and the first direction is perpendicular to the vertical direction, wherein: The first heat exchange mechanism comprises: A first shell having a first heat exchange channel, wherein the first shell is provided with a first inlet and a first outlet communicating with the first heat exchange channel, wherein the first inlet is communicated with the outside, and the first outlet is communicated with the cache space; a first heat exchange component, disposed in the first heat exchange channel, the first heat exchange component being configured to introduce outside air from the first inlet into the first heat exchange channel, and to cool the air entering the first heat exchange channel and then export the air from the first outlet to the cache space; The second heat exchange mechanism comprises: A second shell has a second heat exchange channel, the second shell is provided with a second inlet and a second outlet communicated with the second heat exchange channel, the second inlet is communicated with the cache space, and the second outlet is communicated with the outside; a second heat exchange component, disposed in the second heat exchange channel, the second heat exchange component being configured to introduce the air in the cache space from the second inlet into the second heat exchange channel, and to export the air from the second outlet to the outside through the second heat exchange channel; The first outlet and the second inlet are relatively arranged on both sides of the carrier along the first direction, and the cooled air discharged from the first outlet can flow to the gap between adjacent sheets and carry the heat of the sheets into the second inlet.
2. The heat exchange system according to claim 1, characterized in that: The first heat exchange component comprises: at least one first fan, disposed at a position of the first heat exchange channel corresponding to the first inlet, the first fan being configured to introduce outside air from the first inlet into the first heat exchange channel and to exhaust it from the first outlet; a first cooling member, disposed in the first heat exchange flow channel, the first cooling member being configured to cool the air before being discharged from the first outlet; The second heat exchange component comprises: At least one second fan is disposed at a position of the second heat exchange channel corresponding to the second outlet, and the second fan is configured to introduce air into the cache space from the second inlet and exhaust it from the second outlet.
3. The heat exchange system according to claim 2, characterized in that: The first housing comprises: First base plate; a first top plate, located above the first bottom plate; A first side plate, parallel to the first direction, the first side plate connecting the first bottom plate and the first top plate; A second side plate, spaced apart at one side of the first side plate along a second direction, wherein the second direction is perpendicular to the first direction; A third side plate, connected to the first side plate and the second side plate respectively, and the third side plate is parallel to the second direction; a fourth side plate, connected to the first side plate and the second side plate respectively, the fourth side plate being located along the first direction on a side of the third side plate facing the carrier, the first bottom plate, the first top plate, the first side plate, the second side plate, the third side plate and the fourth side plate enclosingly forming the first heat exchange flow channel, the first inlet being arranged at the first side plate, and the first outlet being arranged at the fourth side plate; Wherein, the fourth side panel comprises: a first sub-plate, parallel to the third side plate, the first sub-plate being connected to the first side plate; a second sub-plate, parallel to the third side plate, the second sub-plate connected to the second side plate, the first outlet provided at the second sub-plate, the distance from the first sub-plate to the third side plate being greater than the distance from the second sub-plate to the third side plate; a third sub-plate, connecting the first sub-plate and the second sub-plate, the third sub-plate having a first wind shielding surface facing the first heat exchange flow channel, and a first preset angle between the third sub-plate and the second sub-plate; Among them, the first fan is arranged at a position of the first side panel corresponding to the first inlet, and the first cooling member is arranged on the third side panel. The first fan can introduce external air from the first inlet into the first heat exchange channel, and guide the incoming air to the first cooling member under the action of the first wind shield surface.
4. The heat exchange system according to claim 3, characterized in that: The first preset angle is between 90° and 180°.
5. The heat exchange system according to claim 3, characterized in that: An included angle between the second side plate and the third side plate is less than or equal to 90°.
6. The heat exchange system according to claim 3, characterized in that: The first housing further comprises: An air guide plate is connected to a side of the second sub-plate away from the third side plate, and the air guide plate surrounds the first outlet, and is configured to guide the air flowing out of the first outlet to flow toward the carrier.
7. The heat exchange system according to claim 3, characterized in that: The first cooling member comprises: A heat exchange pipeline is arranged around a side of the third side plate toward the fourth side plate, and the heat exchange pipeline is arranged at least in an area of the third side plate opposite to the second sub-plate in the first direction. The heat exchange pipeline includes a water inlet and a water outlet, and the water inlet and the water outlet extend out of the first heat exchange channel to respectively connect to an external water inlet pipe and water outlet pipe.
8. The heat exchange system according to claim 2, characterized in that: The second heat exchange component also includes: a second cooling member, disposed in the second heat exchange flow channel, the second cooling member being configured to cool the air entering from the second inlet; The second housing comprises: Second base plate; a second top plate, located above the second bottom plate; a fifth side plate, parallel to the first direction, the fifth side plate connecting the second bottom plate and the second top plate; a sixth side plate, arranged at intervals on one side of the fifth side plate along a second direction, wherein the second direction is perpendicular to the first direction; a seventh side plate, connected to the fifth side plate and the sixth side plate respectively, and the seventh side plate is parallel to the second direction; an eighth side plate, connected to the fifth side plate and the sixth side plate respectively, the eighth side plate being located along the first direction on a side of the seventh side plate facing the carrier, the second bottom plate, the second top plate, the fifth side plate, the sixth side plate, the seventh side plate and the eighth side plate enclose the second heat exchange flow channel, the second outlet is provided on the fifth side plate, and the second inlet is provided on the eighth side plate; Wherein, the eighth side panel comprises: a fourth sub-board, parallel to the seventh side board, the fourth sub-board being connected to the fifth side board; a fifth sub-plate, parallel to the seventh side plate, the fifth sub-plate connected to the sixth side plate, the second inlet being arranged on the fifth sub-plate, and the distance from the fourth sub-plate to the seventh side plate being greater than the distance from the fifth sub-plate to the seventh side plate; a sixth sub-plate, connecting the fourth sub-plate and the fifth sub-plate, the sixth sub-plate having a second wind shielding surface facing the second heat exchange flow channel, and a second preset angle between the sixth sub-plate and the fifth sub-plate; Among them, the second fan is arranged at a position of the fifth side panel corresponding to the second outlet, and the second cooling member is arranged on the seventh side panel. The second fan can guide the air of the cache space from the second inlet into the second heat exchange channel. The second cooling member cools the incoming air and guides the air to the second outlet under the action of the second wind shield surface.
9. The heat exchange system according to any one of claims 1 to 8, characterized in that: Also includes: a first filter element connected to a position of the first housing corresponding to the first inlet, the first filter element at least covering the first inlet, the first filter element being configured to allow filtered air to enter the first heat exchange channel from the first inlet; and / or, The second filter element is connected to the position of the second shell corresponding to the second outlet. The second filter element at least covers the second outlet. The second filter element is configured to filter the air flowing out of the second outlet and then flow to the outside.
10. A processing equipment, characterized in that: include: At least one buffer space, the buffer space being configured to buffer a carrier carrying a plurality of sheets, the plurality of sheets being arranged at intervals in a vertical direction; At least one heat exchange system according to any one of claims 1 to 9 is arranged in at least one of the cache spaces.