LED packaging structure and LED device

Abstract

The utility model relates to the technical field of LED packaging, and provides an LED packaging structure and an LED device, and the LED packaging structure comprises a substrate assembly, a first LED chip and a second LED chip. Wherein the first LED chip and the second LED chip are adjacently arranged on the front surface of the substrate assembly at intervals, and the front surface of the substrate assembly is provided with a first welding part and a second welding part; the first LED chip and the second LED chip are arranged on the first welding part, the first welding part is provided with a second conductive part, the second conductive part is respectively connected with the first LED chip and the second LED chip through two welding wires, the second welding part is provided with a first conductive part, and the first conductive part is respectively connected with the first LED chip and the second LED chip through two welding wires. According to the utility model, one conductive piece is connected with different LED chips through the bonding wires at the same time, so that the usage amount of the conductive piece is reduced, and the wire bonding efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of LED packaging, and particularly relates to an LED packaging structure and an LED device. Background Art

[0002] An LED (Light Emitting Diode), that is, a light-emitting diode, is a solid-state semiconductor device that can convert electrical energy into visible light. It can directly convert electricity into light and is currently widely used. When manufacturing an LED packaging structure, wire bonding is generally required for the chip. Currently, the steps of the wire bonding process mainly include: first, welding a gold ball and pulling a wire arc at one pole of the LED chip (among the positive and negative poles), then making a fish-tail at the tail of the wire arc to connect to the substrate, and then firing a gold ball through a wire bonder and welding the gold ball to the fish-tail of the wire arc to achieve fixation. In this way, the wire bonding of one pole of the LED chip can be completed, and then the same wire bonding operation is performed on the other pole of the LED chip to achieve the wire bonding of an LED chip. Currently, the wire bonding process is popular, the process is mature, and the reliability is good; however, when wire bonding, gold balls need to be provided at both ends of each wire bond, so the usage amount of gold balls is large, the wire bonding efficiency is low, and the material cost is high. Content of the Utility Model

[0003] The purpose of the utility model is to at least overcome one of the above-mentioned deficiencies of the prior art, and provides an LED packaging structure and an LED device. Without affecting the reliability of the product, the utility model reduces the usage amount of conductive parts, improves the wire bonding efficiency, and reduces the material cost.

[0004] The technical solution of the utility model is: an LED packaging structure, comprising: a substrate assembly, a first LED chip, and a second LED chip; wherein, the first LED chip and the second LED chip are arranged adjacent to each other and spaced apart on the front surface of the substrate assembly, and the front surface of the substrate assembly has a first welding part and a second welding part; a second conductive part is provided on the first welding part, and the second conductive part is respectively connected to the first LED chip and the second LED chip through two wire bonds, a first conductive part is provided on the second welding part, and the first conductive part is respectively connected to the first LED chip and the second LED chip through two wire bonds.

[0005] As a further improvement of the technical solution, the first LED chip is disposed at the first welding portion, and the second LED chip is disposed at the second welding portion; the LED packaging structure includes a first bonding wire, a second bonding wire, a third bonding wire, and a fourth bonding wire; the first bonding wire includes a first end and a second end, and the first end is connected to the first LED chip; the second bonding wire includes a third end and a fourth end, and the third end is connected to the first LED chip; the third bonding wire includes a fifth end and a sixth end, the fifth end is connected to the second LED chip, and the sixth end and the second end of the first bonding wire are fixedly connected to the second welding portion through a first conductive member; the fourth bonding wire includes a seventh end and an eighth end, the seventh end is connected to the second LED chip, and the eighth end and the fourth end of the second bonding wire are fixedly connected to the first welding portion through a second conductive member.

[0006] As a further improvement of the technical solution, the first LED chip and the second LED chip are disposed at the first welding portion; the LED packaging structure includes a first bonding wire, a second bonding wire, a third bonding wire, and a fourth bonding wire; the first bonding wire includes a first end and a second end, and the first end is connected to the first LED chip; the second bonding wire includes a third end and a fourth end, and the third end is connected to the first LED chip; the third bonding wire includes a fifth end and a sixth end, the fifth end is connected to the second LED chip, and the sixth end and the second end of the first bonding wire are fixedly connected to the second welding portion through a first conductive member; the fourth bonding wire includes a seventh end and an eighth end, the seventh end is connected to the second LED chip, and the eighth end and the fourth end of the second bonding wire are fixedly connected to the first welding portion through a second conductive member.

[0007] As a further improvement of the technical solution, the LED packaging structure further includes a third LED chip and a fourth LED chip, the first LED chip and the third LED chip are connected in series and disposed at the first welding portion, and the second LED chip and the fourth LED chip are connected in series and disposed at the second welding portion; the LED packaging structure includes a first bonding wire, a second bonding wire, a third bonding wire, and a fourth bonding wire; the first bonding wire includes a first end and a second end, and the first end is connected to the first LED chip; the second bonding wire includes a third end and a fourth end, and the third end is connected to the third LED chip; the third bonding wire includes a fifth end and a sixth end, the fifth end is connected to the second LED chip, and the sixth end and the second end of the first bonding wire are fixedly connected to the second welding portion through a first conductive member; the fourth bonding wire includes a seventh end and an eighth end, the seventh end is connected to the fourth LED chip, and the eighth end and the fourth end of the second bonding wire are fixedly connected to the first welding portion through a second conductive member.

[0008] As a further improvement of this technical solution, a first connecting portion connected to the second welding portion is provided at the second end of the first bonding wire, a second connecting portion connected to the second welding portion is provided at the sixth end of the third bonding wire, the first connecting portion and the second connecting portion are arranged adjacent to each other, or at least part of the first connecting portion and the second connecting portion are stacked.

[0009] As a further improvement of this technical solution, a third connecting portion connected to the first welding portion is provided at the fourth end of the second bonding wire, a fourth connecting portion connected to the first welding portion is provided at the eighth end of the fourth bonding wire, the third connecting portion and the fourth connecting portion are arranged adjacent to each other, or at least part of the third connecting portion and the fourth connecting portion are stacked.

[0010] As a further improvement of this technical solution, the first welding portion and the second welding portion are respectively located on two sides of the substrate assembly.

[0011] As a further improvement of this technical solution, the first LED chip is disposed on the first welding portion, and the second LED chip is disposed on the second welding portion; the length of the first bonding wire is greater than the length of the third bonding wire; the length of the fourth bonding wire is greater than the length of the second bonding wire.

[0012] As a further improvement of this technical solution, the LED packaging structure may further include a third conductive member, a fourth conductive member, a fifth conductive member, and a sixth conductive member; the third conductive member fixes the first end of the first bonding wire to the first LED chip; the fourth conductive member fixes the third end of the second bonding wire to the first LED chip; the fifth conductive member fixes the fifth end of the third bonding wire to the second LED chip; the sixth conductive member fixes the seventh end of the fourth bonding wire to the second LED chip.

[0013] The present utility model further provides an LED device, including the LED packaging structure described in any one of the above.

[0014] The present utility model provides an LED packaging structure and an LED device. The LED packaging structure includes: a substrate assembly, a first LED chip, and a second LED chip. Among them, the first LED chip and the second LED chip are arranged adjacent to each other and spaced apart on the front surface of the substrate assembly. The front surface of the substrate assembly has a first welding portion and a second welding portion. A second conductive member is provided on the first welding portion, and the second conductive member is connected to the first LED chip and the second LED chip respectively through two bonding wires. A first conductive member is provided on the second welding portion, and the first conductive member is connected to the first LED chip and the second LED chip respectively through two bonding wires. Among them, both the first conductive member and the second conductive member fix two bonding wires at the same time, thereby effectively reducing the use of conductive members. Especially in a dual-core parallel LED packaging structure, the current bonding wire process for it requires 8 conductive members to be fixed at both ends of 4 bonding wires respectively. The present utility model discloses that without affecting the product reliability, one conductive member is connected to different LED chips through bonding wires at the same time, improving the bonding wire efficiency and reducing the material cost. Brief Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0016] Figure 1 is a top view of the LED device provided by the first embodiment of the present utility model;

[0017] Figure 2 is Figure 1 a cross-sectional view taken along line A-A in

[0018] Figure 3 is Figure 1 a cross-sectional view taken along line B-B in

[0019] Figure 4 is Figure 1 a cross-sectional view taken along line C-C in

[0020] Figure 5 is Figure 1 a cross-sectional view taken along line D-D in

[0021] Figure 6 is a top view of the LED device provided by the second embodiment of the present utility model;

[0022] Figure 7 is Figure 6 a cross-sectional view taken along line E-E in

[0023] Figure 8 Yes Figure 1 Cross-sectional view at F-F in the middle;

[0024] Figure 9 Top view of the first bonding wire in the LED device provided by an embodiment of the present invention;

[0025] Figure 10 Front view of the first bonding wire in the LED device provided by an embodiment of the present invention;

[0026] Figure 11 Top view of the first bonding wire and the second bonding wire in the LED device provided by an embodiment of the present invention;

[0027] Figure 12 Top view of the first bonding wire, the second bonding wire and the first conductive member in the LED device provided by an embodiment of the present invention;

[0028] Figure 13 Front view of the first bonding wire, the second bonding wire and the first conductive member in the LED device provided by an embodiment of the present invention;

[0029] Figure 14 Top view of the LED device provided by the third embodiment of the present invention;

[0030] Figure 15 Top view of the LED device (including the first LED chip, the second LED chip and the third LED chip connected in parallel) provided by an embodiment of the present invention. Detailed implementation manners

[0031] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0032] It should be noted that the terms "arranged" and "connected" should be understood in a broad sense. For example, they can be directly arranged and connected, or indirectly arranged and connected through intermediate components and intermediate structures.

[0033] In addition, in the embodiments of the present utility model, if there are terms indicating orientation or positional relationships such as "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., they are based on the orientation or positional relationships shown in the drawings or the conventional placement state or usage state. They are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the structures, features, devices or elements referred to must have a specific orientation or positional relationship, nor must they be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality of" is two or more than two.

[0034] In the specific technical features and each embodiment described in the specific implementation manners, without contradiction, they can be combined in any suitable manner. For example, different embodiments can be formed by combining different specific technical features / embodiments. To avoid unnecessary repetition, various possible combination manners of the specific technical features / embodiments in the present utility model will not be described separately.

[0035] The present utility model provides an LED packaging structure. Please refer to Figures 1 to 15 , the LED packaging structure includes: a substrate assembly 10, a first LED chip 21, and a second LED chip 22; wherein, the first LED chip 21 and the second LED chip 22 are arranged adjacent to each other and spaced apart on the front surface of the substrate assembly 10, and the front surface of the substrate assembly 10 has a first welding portion 11 and a second welding portion 12; a second conductive member 42 is provided on the first welding portion 11, and the second conductive member 42 is connected to the first LED chip 21 and the second LED chip 22 respectively through two bonding wires, a first conductive member 41 is provided on the second welding portion 12, and the first conductive member 41 is connected to the first LED chip 21 and the second LED chip 22 respectively through two bonding wires. The present utility model fixes one end of two adjacent bonding wires with one conductive member at the same time, thereby effectively reducing the use of conductive members. Especially in the LED packaging structure with two chips connected in parallel, currently, the bonding wire process for it requires 8 conductive members to be fixed at both ends of 4 bonding wires respectively. The present utility model discloses that without affecting the product reliability, one conductive member is connected to different LED chips through bonding wires. When there are two LED chips in the LED packaging structure, only 6 conductive members are needed to fix 4 bonding wires, improving the bonding wire efficiency and reducing the material cost.

[0036] For the first welding portion 11 and the second welding portion 12, please refer to Figures 1 to 8, in specific applications, the first welding part 11 and the second welding part 12 can be electrode pads (positive electrode pads or negative electrode pads) or electrode welding areas (positive electrode welding areas or negative electrode welding areas) on the substrate assembly 10, etc., to facilitate the electrode connection between the first LED chip 21 and the second LED chip 22. For example, the first welding part 11 is a negative electrode pad, and the second welding part 12 is a positive electrode pad. Thus, when the first LED chip 21 and the second LED chip 22 are connected to the first welding part 11 and the second welding part 12 through bonding wires, the electrical connection between the first LED chip 21 and the second LED chip 22 can be achieved.

[0037] In practical applications, please refer to Figure 1 , the LED packaging structure may further include an insulating member 13. The insulating member 13 is disposed between the first welding part 11 and the second welding part 12. The insulating member 13 serves as an isolation strip to isolate the positive and negative electrodes and prevent short circuits. Specifically, the insulating member 13 can be an insulating glue or an insulating member 13 formed by curing an insulating liquid.

[0038] For the first LED chip 21 and the second LED chip 22, as the first setting method of the first LED chip 21 and the second LED chip 22, the first LED chip 21 can be disposed on the first welding part 11, and the second LED chip 22 can be disposed on the second welding part 12 (please refer to Figures 1 to 5 ); or, as the second setting method of the first LED chip 21 and the second LED chip 22, both the first LED chip 21 and the second LED chip 22 are disposed on the first welding part 11 (please refer to Figures 6 to 8 ).

[0039] For the bonding wires, in specific applications, it may include a first bonding wire 31 and a second bonding wire 32 respectively connected to both ends of the first LED chip 21, and a third bonding wire 33 and a fourth bonding wire 34 respectively connected to both ends of the second LED chip 22 to achieve the bonding wire connection of the LED chips.

[0040] Preferably, please refer to Figures 1 to 8 , in specific applications, the first LED chip 21 may be provided with a first positive electrode end and a first negative electrode end. The first end 311 of the first bonding wire 31 can be connected to the first positive electrode end, the third end 321 of the second bonding wire 32 can be connected to the first negative electrode end. The second LED chip 22 may be provided with a second positive electrode end and a second negative electrode end. The fifth end 331 of the third bonding wire 33 can be connected to the second positive electrode end, and the seventh end 341 of the fourth bonding wire can be connected to the second negative electrode end, so as to achieve the bonding wire connection between the first LED chip 21 and the second LED chip 22.

[0041] In specific applications, please refer to Figure 1, the length of the first bonding wire 31 can be slightly greater than the shortest distance between the first positive terminal and the first conductive member 41, so that on the basis of realizing that both ends of the first bonding wire 31 are welded to the first positive terminal and the first conductive member 41 at the second welding part 12 respectively, it can be avoided that the length of the first bonding wire 31 is too long and the first bonding wire 31 winds around other bonding wires or components; similarly, the length of the second bonding wire 32 can be slightly greater than the shortest distance between the first negative terminal and the second conductive member 42, so that on the basis of realizing the welding of both ends of the second bonding wire 32, it can be avoided that the length of the second bonding wire 32 is too long and the second bonding wire 32 winds around other bonding wires or components; similarly, the length of the third bonding wire 33 can be slightly greater than the shortest distance between the second positive terminal and the first conductive member 41, so that on the basis of realizing the welding of both ends of the third bonding wire 33, it can be avoided that the length of the third bonding wire 33 is too long and the third bonding wire 33 winds around other bonding wires or components; similarly, the length of the fourth bonding wire 34 can be slightly greater than the shortest distance between the second negative terminal and the second conductive member 42, so that on the basis of realizing the welding of both ends of the fourth bonding wire 34, it can be avoided that the length of the fourth bonding wire 34 is too long and the fourth bonding wire 34 winds around other bonding wires or components.

[0042] Please refer to Figure 4 , Figure 5 , and Figures 9 to 13 , preferably, the second end 312 of the first bonding wire 31 is provided with a first connecting portion 3121 connected to the second welding part 12, the sixth end 332 of the third bonding wire 33 is provided with a second connecting portion 3321 connected to the second welding part 12, the first connecting portion 3121 and the second connecting portion 3321 are arranged adjacent to each other, or the first connecting portion 3121 and the second connecting portion 3321 are at least partially stacked, so as to avoid the first connecting portion 3121 and the second connecting portion 3321 being too far apart, and to avoid the first conductive member 41 being unable to fix the first connecting portion 3121 and the second connecting portion 3321 at the same time.

[0043] Furthermore, the first conductive member 41 fixes and presses the first connecting portion 3121 and the second connecting portion 3321 against the second welding part 12. The first conductive member 41 is arranged above the first connecting portion 3121 and the second connecting portion 3321 and presses on the first connecting portion 3121 and the second connecting portion 3321, so as to make the fixation more firm.

[0044] Preferably, the fourth end 322 of the second bonding wire 32 is provided with a third connecting portion connected to the first welding part 11, the eighth end 342 of the fourth bonding wire 34 is provided with a fourth connecting portion connected to the first welding part 11, the third connecting portion and the fourth connecting portion are arranged adjacent to each other, or the third connecting portion and the fourth connecting portion are at least partially stacked, so as to avoid the third connecting portion and the fourth connecting portion being too far apart, and to avoid affecting the second conductive member 42 from fixing the third connecting portion and the fourth connecting portion.

[0045] Further, the second conductive member 42 fixes and presses the third connecting portion and the fourth connecting portion onto the first welding site 11. The second conductive member 42 is disposed above the third connecting portion and the fourth connecting portion and presses on the third connecting portion and the fourth connecting portion, thereby making the fixation more secure.

[0046] In practical applications, the first connecting portion 3121, the second connecting portion 3321, the third connecting portion, and the fourth connecting portion may be in a fish-tail shape, facilitating the connection of the first bonding wire 31, the second bonding wire 32, the third bonding wire 33, and the fourth bonding wire 34 to the first welding site 11 or the second welding site 12.

[0047] Preferably, refer to Figures 1 to 8 , the first welding site 11 and the second welding site 12 are respectively located on two sides of the substrate assembly 10. The first bonding wire 31 and the third bonding wire 33 may both be disposed close to one side, and the second bonding wire 32 and the fourth bonding wire 34 may be disposed close to the other side. Thus, by reasonably planning the positions and paths of the bonding wires, not only can the entanglement between the bonding wires be avoided, but also the bonding wire material can be saved.

[0048] In a specific application, when the first LED chip 21 is disposed on the first welding site 11 and the second LED chip 22 is disposed on the second welding site 12, the length of the first bonding wire 31 may be greater than the length of the third bonding wire 33. The longer first bonding wire 31 is convenient for connecting the first LED chip 21 to the second welding site 12, and when the first LED chip 21 and the second welding site 12 are misaligned, the longer first bonding wire 31 can also play a certain buffering role and is not easily broken; the length of the fourth bonding wire 34 may be greater than the length of the second bonding wire 32. The longer fourth bonding wire 34 is convenient for connecting the second LED chip 22 to the first welding site 11, and when the second LED chip 22 and the first welding site 11 are misaligned, the longer fourth bonding wire 34 can also play a certain buffering role and is not easily broken.

[0049] Preferably, the first bonding wire 31, the second bonding wire 32, the third bonding wire 33, and the fourth bonding wire 34 may be gold wires or silver wires, which are not easily broken and the bonding wires are more reliable.

[0050] During the bonding wire process, the tail of one bonding wire (the end of the bonding wire far from the LED chip) may be first connected to the bracket (i.e., one bonding wire is welded in a two-bonding without ball mode), and then the tails of another bonding wire connected to the same bracket are disposed adjacent to or at least partially stacked (i.e., another bonding wire is also welded in a two-bonding without ball mode), and then the conductive member is pressed on the tails of the two bonding wires, so that the fixation of the tails of the two bonding wires can be achieved through one conductive member. In practical applications, the bonding wire efficiency can be increased by about 9%.

[0051] For the first conductive member 41 and the second conductive member 42, preferably, the first conductive member 41 and the second conductive member 42 can be spherical, which is convenient for fixing the bonding wires of the first conductive member 41 and the second conductive member 42. Of course, the present invention does not limit the specific shapes of conductive members such as the first conductive member 41 and the second conductive member 42, as long as they can fix the first bonding wire 31, the second bonding wire 32, the third bonding wire 33, and the fourth bonding wire 34. For example, the conductive members such as the first conductive member 41 and the second conductive member 42 can be in the shape of a water droplet, a stepped shape, a columnar shape, or a cubic shape, etc.

[0052] Preferably, the first conductive member 41 and the second conductive member 42 can be metal parts made of metals such as gold or silver or metal compounds, and the fixation is more reliable.

[0053] Preferably, please refer to Figures 4 to 6 The LED packaging structure may further include a third conductive member 43, a fourth conductive member 44, a fifth conductive member 45, and a sixth conductive member 46; the third conductive member 43 fixes the first end 311 of the first bonding wire 31 to the first LED chip 21; the fourth conductive member 44 fixes the third end 321 of the second bonding wire 32 to the first LED chip 21; the fifth conductive member 45 fixes the fifth end 331 of the third bonding wire 33 to the second LED chip 22; the sixth conductive member 46 fixes the seventh end 341 of the fourth bonding wire 34 to the second LED chip. The third conductive member 43, the fourth conductive member 44, the fifth conductive member 45, and the sixth conductive member 46 are used to fix the bonding wires to improve the firmness.

[0054] The specific bonding wire process of the present utility model can be referred to as follows: Please refer to Figure 9 and Figure 10 First, fix the first end 311 of the first bonding wire 31 to the first positive electrode end of the first LED chip 21 through the third conductive member 43, and then connect the second end 312 of the first bonding wire 31 to the second welding part 12 through the first connecting part 3121; Please refer to Figure 11 Then, fix the fifth end 331 of the third bonding wire 33 to the second positive electrode end of the second LED chip 22 through the fifth conductive member 45, and then connect the sixth end 332 of the third bonding wire 33 to the second welding part 12 through the second connecting part 3321, and the first connecting part 3121 and the second connecting part 3321 can be adjacent or at least partially stacked; Please refer to Figure 12 and Figure 13 Finally, press the first conductive member 41 above the first connecting part 3121 and the second connecting part 3321 to realize the bonding of the first bonding wire 31 and the third bonding wire 33.

[0055] It should be noted that the present utility model does not specifically limit the number of LED chips and the connection mode (series or parallel mode) of the LED chips, as long as the use of conductive components can be reduced; that is, in the present utility model, when the tails of the bonding wires of one LED chip (the part far from the connected LED chip) and the tails of the bonding wires of another LED chip are connected to the same welding part and are adjacent, the tails of the two bonding wires can be fixed by the same conductive component to achieve the purpose of reducing the usage amount of conductive components. The following is an example of the LED chip setting of the present utility model:

[0056] The first embodiment:

[0057] Please refer to Figures 1 to 5 , in the present utility model, the first LED chip 21 and the second LED chip 22 of the first embodiment can be connected in parallel, that is, the LED packaging structure can preferably be a two-chip parallel structure. Specifically, the first LED chip 21 can be disposed at the first welding part 11, and the second LED chip 22 can be disposed at the second welding part 12; the LED packaging structure can include a first bonding wire 31, a second bonding wire 32, a third bonding wire 33 and a fourth bonding wire 34; the first bonding wire 31 includes a first end 311 and a second end 312, and the first end 311 is connected to the first LED chip 21; the second bonding wire 32 includes a third end 321 and a fourth end 322, and the third end 321 is connected to the first LED chip 21; the third bonding wire 33 includes a fifth end 331 and a sixth end 332, the fifth end 331 is connected to the second LED chip 22, and the sixth end 332 and the second end 312 of the first bonding wire 31 are fixedly connected to the second welding part 12 through a first conductive component 41; the fourth bonding wire 34 includes a seventh end 341 and an eighth end 342, the seventh end 341 is connected to the second LED chip 22, and the eighth end 342 and the fourth end 322 of the second bonding wire 32 are fixedly connected to the first welding part 11 through a second conductive component 42.

[0058] The second embodiment:

[0059] Please refer to Figures 6 to 8 , the difference between the second embodiment provided by the present utility model and the first embodiment is that: the first LED chip 21 and the second LED chip 22 are disposed at the first welding part 11.

[0060] Specifically, the LED packaging structure includes a first bonding wire 31, a second bonding wire 32, a third bonding wire 33, and a fourth bonding wire 34; the first bonding wire 31 includes a first end 311 and a second end 312, and the first end 311 is connected to the first LED chip 21; the second bonding wire 32 includes a third end 321 and a fourth end 322, and the third end 321 is connected to the first LED chip 21; the third bonding wire 33 includes a fifth end 331 and a sixth end 332, the fifth end 331 is connected to the second LED chip 22, and the sixth end 332 and the second end 312 of the first bonding wire 31 are fixedly connected to the second welding part 12 through a first conductive member 41; the fourth bonding wire 34 includes a seventh end 341 and an eighth end 342, the seventh end 341 is connected to the second LED chip 22, and the eighth end 342 and the fourth end 322 of the second bonding wire 32 are fixedly connected to the first welding part 11 through a second conductive member 42.

[0061] Third Embodiment:

[0062] Please combine Figure 1 with Figure 14 , the difference between the third embodiment provided by the present utility model and the first embodiment is that: the LED packaging structure further includes a third LED chip 23 and a fourth LED chip 24.

[0063] Specifically, the first LED chip 21 and the third LED chip 23 are connected in series and arranged at the first welding part 11, and the second LED chip 22 and the fourth LED chip 24 are connected in series and arranged at the second welding part 12;

[0064] The LED packaging structure includes a first bonding wire 31, a second bonding wire 32, a third bonding wire 33, and a fourth bonding wire 34; the first bonding wire 31 includes a first end 311 and a second end 312, and the first end 311 is connected to the first LED chip 21; the second bonding wire 32 includes a third end 321 and a fourth end 322, and the third end 321 is connected to the third LED chip 23; the third bonding wire 33 includes a fifth end 331 and a sixth end 332, the fifth end 331 is connected to the second LED chip 22, and the sixth end 332 and the second end 312 of the first bonding wire 31 are fixedly connected to the second welding part 12 through a first conductive member 41; the fourth bonding wire 34 includes a seventh end 341 and an eighth end 342, the seventh end 341 is connected to the fourth LED chip 24, and the eighth end 342 and the fourth end 322 of the second bonding wire 32 are fixedly connected to the first welding part 11 through a second conductive member 42.

[0065] Of course, the setting of the LED chips in the present utility model is not limited to the above embodiments. For example, combine Figure 15, the first LED chip 21, the second LED chip 22 and the third LED chip 23 are arranged in parallel on the first welding part 11.

[0066] The present utility model also provides an LED device 200. Please refer to Figures 1 to 8 . The LED device 200 includes an LED packaging structure. By using one conductive member, the present utility model can simultaneously fix one end of two adjacent bonding wires, thereby effectively reducing the use of conductive members. Especially in a dual-core parallel LED packaging structure, the current bonding wire process requires 8 conductive members to be respectively fixed at both ends of 4 bonding wires. The present utility model discloses that one conductive member is connected to different LED chips through bonding wires. When there are two LED chips in the LED packaging structure, only 6 conductive members are needed to fix 4 bonding wires, improving the bonding wire efficiency and reducing the material cost.

[0067] In some embodiments, the LED device 200 may further include a package body 210. The package body 210 is arranged on the front surface (the surface facing the first LED chip 21 and the second LED chip 22) of the first welding part 11 and the second welding part 12, and surrounds the peripheries of the first LED chip 21 and the second LED chip 22 to protect the first LED chip 21 and the second LED chip 22. Preferably, the package body 210 can be made of materials such as plastic or glass.

[0068] In some embodiments, please combine Figure 1 with Figure 2 . The LED device 200 may further include a light-transmitting colloid 220. The package body 210 and the substrate assembly 10 enclose a potting groove. After the first LED chip 21 and the second LED chip 22 are installed, the light-transmitting colloid 220 is cured and arranged in the potting groove and covers the first LED chip 21 and the second LED chip 22 to package the first LED chip 21 and the second LED chip 22.

[0069] Furthermore, the light-transmitting colloid 220 may further have a light-emitting part. When the light emitted by the first LED chip 21 and the second LED chip 22 irradiates the light-emitting part, the light-emitting part undergoes a fluorescence reaction and emits fluorescence. Specifically, the light-emitting part may be composed of a fluorescent glue, and the fluorescent glue may be formed by mixing powder that can produce a fluorescence reaction to the light emitted by the first LED chip 21 and the second LED chip 22 with an adhesive glue.

[0070] The present utility model provides an LED packaging structure and an LED device. The LED packaging structure includes: a substrate assembly 10, a first LED chip 21, and a second LED chip 22. Among them, the first LED chip 21 and the second LED chip 22 are arranged adjacent to each other and spaced apart on the front surface of the substrate assembly 10. The front surface of the substrate assembly 10 has a first welding portion 11 and a second welding portion 12. A second conductive member 42 is provided on the first welding portion 11, and the first conductive member 41 is connected to the first LED chip 21 and the second LED chip 22 respectively through two bonding wires. A first conductive member 41 is provided on the second welding portion 12, and the second conductive member 42 is connected to the first LED chip 21 and the second LED chip 22 respectively through two bonding wires. The present utility model fixes one end of two adjacent bonding wires with one conductive member at the same time, thereby effectively reducing the use of conductive members. Especially in the LED packaging structure with two chips in parallel connection, currently, the bonding wire process for it requires 8 conductive members to be fixed at both ends of 4 bonding wires respectively. The present utility model only needs to use 6 conductive members to fix 4 bonding wires without affecting the product reliability, improving the bonding wire efficiency and reducing the material cost. The above is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modification, equivalent replacement or improvement made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. An LED packaging structure, characterized in that: include: A substrate assembly, a first LED chip and a second LED chip; wherein the first LED chip and the second LED chip are adjacently spaced apart and arranged on the front side of the substrate assembly, and the front side of the substrate assembly has a first welding position and a second welding position; a second conductive member is provided on the first welding position, and the second conductive member is respectively connected to the first LED chip and the second LED chip through two welding wires, and a first conductive member is provided on the second welding position, and the first conductive member is respectively connected to the first LED chip and the second LED chip through two welding wires.

2. The LED packaging structure according to claim 1, characterized in that: The first LED chip is disposed at the first welding position, and the second LED chip is disposed at the second welding position; The LED packaging structure includes a first welding wire, a second welding wire, a third welding wire and a fourth welding wire; the first welding wire includes a first end and a second end, and the first end is connected to the first LED chip; the second welding wire includes a third end and a fourth end, and the third end is connected to the first LED chip; the third welding wire includes a fifth end and a sixth end, and the fifth end is connected to the second LED chip, and the sixth end and the second end of the first welding wire are fixedly connected to the second welding position through a first conductive member; the fourth welding wire includes a seventh end and an eighth end, and the seventh end is connected to the second LED chip, and the eighth end and the fourth end of the second welding wire are fixedly connected to the first welding position through a second conductive member.

3. The LED packaging structure according to claim 1, characterized in that: The first LED chip and the second LED chip are arranged at the first welding position; The LED packaging structure includes a first welding wire, a second welding wire, a third welding wire and a fourth welding wire; the first welding wire includes a first end and a second end, and the first end is connected to the first LED chip; the second welding wire includes a third end and a fourth end, and the third end is connected to the first LED chip; the third welding wire includes a fifth end and a sixth end, and the fifth end is connected to the second LED chip, and the sixth end and the second end of the first welding wire are fixedly connected to the second welding position through a first conductive member; the fourth welding wire includes a seventh end and an eighth end, and the seventh end is connected to the second LED chip, and the eighth end and the fourth end of the second welding wire are fixedly connected to the first welding position through a second conductive member.

4. The LED packaging structure according to claim 1, characterized in that: The LED packaging structure further includes a third LED chip and a fourth LED chip, wherein the first LED chip and the third LED chip are arranged in series at the first welding position, and the second LED chip and the fourth LED chip are arranged in series at the second welding position; The LED packaging structure includes a first welding wire, a second welding wire, a third welding wire and a fourth welding wire; the first welding wire includes a first end and a second end, and the first end is connected to the first LED chip; the second welding wire includes a third end and a fourth end, and the third end is connected to the third LED chip; the third welding wire includes a fifth end and a sixth end, and the fifth end is connected to the second LED chip, and the sixth end is fixedly connected to the second end of the first welding wire at the second welding position through a first conductive member; the fourth welding wire includes a seventh end and an eighth end, and the seventh end is connected to the fourth LED chip, and the eighth end is fixedly connected to the fourth end of the second welding wire at the first welding position through a second conductive member.

5. The LED packaging structure according to any one of claims 2 to 4, characterized in that: The second end of the first welding wire is provided with a first connection portion connected to the second welding position, and the sixth end of the third welding wire is provided with a second connection portion connected to the second welding position. The first connection portion and the second connection portion are arranged adjacent to each other, or the first connection portion and the second connection portion are at least partially stacked.

6. The LED packaging structure according to any one of claims 2 to 4, characterized in that: The fourth end of the second welding wire is provided with a third connection portion connected to the first welding position, and the eighth end of the fourth welding wire is provided with a fourth connection portion connected to the first welding position. The third connection portion and the fourth connection portion are arranged adjacent to each other, or the third connection portion and the fourth connection portion are at least partially stacked.

7. The LED packaging structure according to any one of claims 1 to 4, characterized in that: The first welding position and the second welding position are respectively located at two sides of the substrate assembly.

8. The LED packaging structure according to claim 2 or 4, characterized in that: The first LED chip is disposed at the first welding position, and the second LED chip is disposed at the second welding position; the length of the first welding wire is greater than the length of the third welding wire; and the length of the fourth welding wire is greater than the length of the second welding wire.

9. The LED packaging structure according to claim 2, characterized in that: The LED packaging structure may also include a third conductive member, a fourth conductive member, a fifth conductive member and a sixth conductive member; the third conductive member fixes the first end of the first bonding wire to the first LED chip; the fourth conductive member fixes the third end of the second bonding wire to the first LED chip; the fifth conductive member fixes the fifth end of the third bonding wire to the second LED chip; and the sixth conductive member fixes the seventh end of the fourth bonding wire to the second LED chip.

10. An LED device, characterized in that: The LED packaging structure comprises the LED packaging structure according to any one of claims 1 to 9.

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