Cooling device for laser tin soldering

Abstract

The utility model relates to the technical field of laser tin soldering equipment, and discloses a cooling device for laser tin soldering, which comprises a tin soldering equipment body, a cooling coil is mounted in the tin soldering equipment body, a liquid storage tank is fixed on one side of the tin soldering equipment body, and a delivery pump and a cleaning mechanism are mounted in the liquid storage tank. The cleaning mechanism is located on the outer wall of the cooling coil and comprises a scraping mechanism, a driving mechanism, a moving mechanism and a limiting mechanism. Through the arrangement of the cleaning mechanism, the outer wall of the cooling coil can be cleaned, the situation that heat exchange between the cooling coil and the tin soldering equipment body is reduced by water vapor is avoided, the cooling effect is improved, the temperature control accuracy is improved, and therefore the welding quality is improved; and meanwhile, the problem that in an existing device, due to long-term water vapor accumulation, the outer wall of the cooling coil is corroded or rusted, and then the structure and functions of equipment are easily damaged is solved, and the service life of the cooling coil in the device is greatly prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of laser soldering equipment, in particular to a cooling device for laser soldering. Background Technique

[0002] A cooling device for laser soldering is a system specifically designed to maintain a stable temperature during the laser soldering process. It effectively absorbs and removes the heat generated during the soldering process through cooling coils or other cooling media, thereby ensuring that the welded parts and equipment operate within the optimal temperature range, ensuring good heat exchange efficiency, reliable temperature control, and durability, to avoid soldering quality problems and equipment damage caused by overheating.

[0003] A Chinese patent with the publication number CN216421346U discloses a cooling device for a low-noise laser soldering device. Through the setting of an air-cooling device, an air suction fan is used to suck external cold air into the soldering device body, and then a blower is used to export the heat inside the soldering device body, promoting the air circulation inside the soldering device body, cold and heat exchange, to achieve the effect of heat dissipation and temperature reduction. And through the cooperation of a water-cooling device, through the cooperation of a liquid pumping pump and a cooling coil, the coolant is circulated in the cooling coil, and the coolant is used to take away the heat inside the soldering device body to achieve the effect of heat dissipation. And the heat on the surface of the cooling coil can be taken away by the blower and the air suction fan. Through the cooperation of the air-cooling device and the water-cooling device, the effect of efficient heat dissipation is achieved, and the service life of the soldering device body is improved. However, in the existing device, heat exchange is carried out on the soldering device body through the cooling coil. However, during the heat exchange process, it is difficult to clean the water vapor generated on the outer wall of the cooling coil, resulting in the accumulated water vapor reducing the heat exchange between the cooling coil and the soldering device body, causing the cooling effect to decline, making the temperature control inaccurate, thus affecting the soldering quality. At the same time, the long-term accumulation of water vapor will cause corrosion or rust on the outer wall of the cooling coil, and then easily damage the structure and function of the equipment, greatly reducing the service life of the cooling coil. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a cooling device for laser soldering, which solves the problem in the background technique that it is difficult to clean the water vapor generated on the outer wall of the cooling coil, resulting in the water vapor isolating the heat exchange between the cooling coil and the soldering device body.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions:

[0006] A cooling device for laser soldering, comprising:

[0007] The main body of the soldering equipment, inside which a cooling coil is installed, and a liquid storage tank is fixed on one side of the main body of the soldering equipment. A delivery pump is installed inside the liquid storage tank, and the water outlet end of the delivery pump is connected to the cooling coil;

[0008] A cleaning mechanism, which is located on the outer wall of the cooling coil and is used to clean it. The cleaning mechanism includes a scraping mechanism, a driving mechanism, a moving mechanism and a limiting mechanism. The scraping mechanism is located inside the main body of the soldering equipment and is used to scrape the outer wall of the cooling coil. The driving mechanism is located at the bottom of the scraping mechanism and is used to drive the scraping mechanism to move. The moving mechanism is located on one side of the scraping mechanism and is used to drive the separation between the scraping mechanism and the cooling coil. The limiting mechanism is located on one side of the main body of the soldering equipment and is used to limit the moving mechanism.

[0009] Preferably, the scraping mechanism includes a first cleaning plate and a second cleaning plate arranged inside the main body of the soldering equipment. The first cleaning plate is slidably connected to one side inside the main body of the soldering equipment. Cleaning brushes are installed on the opposite sides of the first cleaning plate and the second cleaning plate, and the cleaning brushes cooperate with the outer wall of the cooling coil. A limiting rod is fixed on one side of the second cleaning plate, and the limiting rod is inserted into one side of the main body of the soldering equipment.

[0010] Preferably, the driving mechanism includes a rack plate fixed to the bottoms of the first cleaning plate and the second cleaning plate. A gear is meshed between the two rack plates. A transmission shaft is installed at the bottom of the gear. The transmission shaft extends to the bottom of the main body of the soldering equipment and is fixed with a rotary knob.

[0011] Preferably, the moving mechanism includes a moving plate fixed to one side of the second cleaning plate. A fixed seat is fixed on one side of the main body of the soldering equipment. A control rod is movably inserted into the fixed seat. The moving plate extends to one side of the main body of the soldering equipment and is inserted into the control rod. An empty slot for the movement of the control rod is opened inside the moving plate. Two fixing plates in contact with the moving plate are fixed to the outer wall of the control rod. A moving slot for the movement of the moving plate is opened on one side of the main body of the soldering equipment.

[0012] Preferably, the limiting mechanism includes a receiving groove opened on one side of the main body of the soldering equipment. An insertion plate is installed inside the receiving groove. A groove body for the insertion of the insertion plate is opened inside the moving slot. A linkage plate is fixed to the top of the insertion plate. A spring is connected between the linkage plate and the receiving groove. A linkage rod is fixed to one side of the linkage plate. The linkage rod extends to one side of the main body of the soldering equipment and is fixed with a control plate.

[0013] Preferably, a water cooling mechanism is provided inside the liquid storage tank. The water cooling mechanism includes two rotating shafts provided inside the liquid storage tank. Refrigeration plates are fixed to the outer walls of the two rotating shafts, and the two rotating shafts extend to the outside of the liquid storage tank and are equipped with belt pulleys. A belt is installed between the two belt pulleys. A drive motor is installed on one side of the liquid storage tank, and the output end of the drive motor is connected to one of the rotating shafts.

[0014] Preferably, heat dissipation holes are provided on both sides of the solder equipment body. An anti-blocking mechanism for preventing blockage is provided on the outer wall of the heat dissipation holes. The anti-blocking mechanism includes two fixing blocks fixed on one side of the solder equipment body. A threaded rod is installed between the two fixing blocks. A moving block is screwed onto the outer surface of the threaded rod. A cleaning seat is fixed to one side of the moving block. A cleaning cotton is installed at the bottom of the cleaning seat. The cleaning cotton corresponds to the heat dissipation hole. A limiting plate is fixed to one side of the cleaning seat, and a fixing rod is inserted into the limiting plate. The fixing rod is installed on one side of the solder equipment body.

[0015] Compared with the prior art, the beneficial effects achieved by the present utility model are as follows:

[0016] 1. Through the setting of the cleaning mechanism, the present utility model can clean the outer wall of the cooling coil, avoid the situation that water vapor reduces the heat exchange between the cooling coil and the solder equipment body, improve the cooling effect, increase the accuracy of temperature control, thereby improving the welding quality. At the same time, it solves the problem that long-term water vapor accumulation in the existing device can cause corrosion or rust on the outer wall of the cooling coil, and thus easily damages the structure and function of the equipment, greatly improving the service life of the cooling coil in the present device;

[0017] 2. Through the setting of the anti-blocking mechanism, the present utility model can scrape and clean the heat dissipation holes, ensure that the air after heat exchange can be effectively discharged, thereby improving the overall heat dissipation efficiency, contributing to maintaining the temperature stability during the laser soldering process. At the same time, keeping the heat dissipation holes unblocked can effectively prevent the cooling system from overheating and reduce equipment failures or welding defects caused by overheating. Description of the Drawings

[0018] Figure 1 It is a schematic structural diagram of the whole of the present utility model;

[0019] Figure 2 It is a schematic structural diagram of the cooling coil of the present utility model;

[0020] Figure 3 It is a cross-sectional view of the solder equipment body of the present utility model;

[0021] Figure 4 It is a schematic structural diagram of the cleaning mechanism of the present utility model;

[0022] Figure 5 It is a schematic structural diagram of the positioning mechanism of the present utility model;

[0023] Figure 6 For the present utility model Figure 5 The enlarged structural diagram at position A in it;

[0024] Figure 7 It is a schematic structural diagram of the anti-blocking mechanism of the present utility model.

[0025] Wherein: 1. Solder equipment body; 2. Liquid storage tank; 3. Cleaning mechanism; 4. Anti-blocking mechanism; 5. Water cooling mechanism; 6. Delivery pump; 7. Cooling coil;

[0026] 31. First cleaning plate; 32. Second cleaning plate; 33. Limiting rod; 34. Moving plate; 35. Fixed plate; 36. Fixed seat; 37. Control rod; 38. Gear; 39. Rack plate; 310. Spring; 311. Control plate; 312. Linking plate; 313. Plug plate;

[0027] 41. Cleaning seat; 42. Cleaning cotton; 43. Moving block; 44. Threaded rod; 45. Fixed rod;

[0028] 51. Driving motor; 52. Refrigeration plate; 53. Belt. Specific embodiments

[0029] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0030] Please refer to Figure 1 , Figure 2 and Figure 3 , a cooling device for laser soldering, comprising:

[0031] The solder equipment body 1, a cooling coil 7 is installed inside the solder equipment body 1, and a liquid storage tank 2 is fixed on one side of the solder equipment body 1. A delivery pump 6 is installed inside the liquid storage tank 2, and the water outlet end of the delivery pump 6 is connected to the cooling coil 7;

[0032] A water cooling mechanism 5 is provided inside the liquid storage tank 2, and the water cooling mechanism 5 includes two rotating shafts arranged inside the liquid storage tank 2. Refrigeration plates 52 are fixed to the outer walls of the two rotating shafts, and the two rotating shafts extend to the liquid storage tank 2 and are installed with belt pulleys. A belt 53 is installed between the two belt pulleys. A driving motor 51 is installed on one side of the liquid storage tank 2, and the output end of the driving motor 51 is connected to one of the rotating shafts.

[0033] Please refer to Figures 3 - 6 , a cleaning mechanism 3, the cleaning mechanism 3 is located on the outer wall of the cooling coil 7 and is used to clean it, the cleaning mechanism 3 includes a scraping mechanism, a driving mechanism, a moving mechanism and a limiting mechanism, the scraping mechanism is located inside the soldering equipment body 1 and is used to scrape the outer wall of the cooling coil 7, the driving mechanism is located at the bottom of the scraping mechanism and is used to drive the scraping mechanism to move, the moving mechanism is located on one side of the scraping mechanism and is used to drive the scraping mechanism and the cooling coil 7 to separate, the limiting mechanism is located on one side of the soldering equipment body 1 and is used to limit the moving mechanism The scraping mechanism includes a first cleaning plate 31 and a second cleaning plate 32 arranged inside the soldering equipment body 1. The first cleaning plate 31 is slidably connected to one side of the soldering equipment body 1. Cleaning brushes are installed on the opposite sides of the first cleaning plate 31 and the second cleaning plate 32. The cleaning brushes cooperate with the outer wall of the cooling coil 7. A limiting rod 33 is fixed on one side of the second cleaning plate 32. The limiting rod 33 is plugged into one side of the soldering equipment body 1. The driving mechanism includes a rack plate 39 fixed at the bottom of the first cleaning plate 31 and the second cleaning plate 32. The two rack plates A gear 38 is meshed between the two parts, and a transmission shaft is installed at the bottom of the gear 38. The transmission shaft extends to the bottom of the soldering equipment body 1 and is fixed with a rotating knob. The moving mechanism includes a moving plate 34 fixed to one side of the second cleaning plate 32, a fixing seat 36 is fixed to one side of the soldering equipment body 1, and a control rod 37 is movably inserted inside the fixing seat 36. The moving plate 34 extends to one side of the soldering equipment body 1 and is inserted with the control rod 37, and an empty slot for the control rod 37 to move is opened inside the moving plate 34, and the outer wall of the control rod 37 is fixed with two movable parts connected to the moving plate 34. The movable plate 34 contacts the fixed plate 35, and a movable groove for the movable plate 34 to move is provided on one side of the soldering equipment body 1. The limiting mechanism includes a storage groove provided on one side of the soldering equipment body 1, and an insert plate 313 is installed inside the storage groove. A groove body for inserting the insert plate 313 is provided inside the movable groove. A linkage plate 312 is fixed on the top of the insert plate 313, a spring 310 is connected between the linkage plate 312 and the storage groove, and a linkage rod is fixed on one side of the linkage plate 312, and the linkage rod extends to one side of the soldering equipment body 1 and is fixed with a control board 311.

[0034] First, pull the control panel 311 to drive the linkage rod to move. The movement of the linkage rod drives the linkage plate 312 to move. The movement of the linkage plate 312 drives the spring 310 to contract. Due to the contraction of the spring 310, the insertion plate 313 moves away from the groove body, so that it enters the storage groove. Subsequently, pull the control rod 37 to drive the two fixed plates 35 to move. The movement of the fixed plates 35 drives the moving plate 34 to move. The movement of the moving plate 34 drives the second cleaning plate 32 to move. The movement of the second cleaning plate 32 drives the rack plate 39 to move. When the rack plate 39 is engaged with the gear 38, release the control panel 311. The elastic force of the spring 310 drives the insertion plate 313 to reset. Through the reset of the insertion plate 313, it is inserted into the groove body, thus forming the positioning function of the moving plate 34;

[0035] Rotate the rotary knob to drive the transmission shaft to start rotating. The rotation of the transmission shaft drives the gear 38 to rotate. The rotation of the gear 38 drives the rack plate 39 to move. The movement of the rack plate 39 drives the first cleaning plate 31 and the second cleaning plate 32 to move towards each other, so that the cleaning brushes move synchronously. Through the movement of the cleaning brushes, the outer wall of the cooling coil 7 can be effectively cleaned, avoiding the situation that water droplets remain on its outer wall during heat exchange, and thus extending the service life of the cooling coil 7.

[0036] Please also refer to Figure 1 and Figure 7 On both sides of the soldering equipment body 1, heat dissipation holes are provided. An anti-blocking mechanism 4 for preventing blockage is arranged on the outer wall of the heat dissipation holes. The anti-blocking mechanism 4 includes two fixed blocks fixed on one side of the soldering equipment body 1. A threaded rod 44 is installed between the two fixed blocks. A moving block 43 is screwed on the outer surface of the threaded rod 44. A cleaning seat 41 is fixed on one side of the moving block 43. A cleaning cotton 42 is installed at the bottom of the cleaning seat 41. The cleaning cotton 42 corresponds to the heat dissipation hole. A limiting plate is fixed on one side of the cleaning seat 41. A fixing rod 45 is inserted into the limiting plate. The fixing rod 45 is installed on one side of the soldering equipment body 1.

[0037] Rotate the threaded rod 44 to drive the moving block 43 to move on its outer wall. The movement of the moving block 43 drives the cleaning seat 41 to move. The movement of the cleaning seat 41 drives the cleaning cotton 42 to move. Through the movement of the cleaning cotton 42, the outer wall of the heat dissipation hole can be effectively scraped. Through the setting of the fixing rod 45, the cleaning seat 41 is more stable during movement and will not easily shake or fall off.

[0038] Although embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A cooling device for laser soldering, characterized in that: include: A soldering equipment body (1), wherein a cooling coil (7) is installed inside the soldering equipment body (1), and a liquid storage tank (2) is fixed to one side of the soldering equipment body (1), wherein a delivery pump (6) is installed inside the liquid storage tank (2), and a water outlet end of the delivery pump (6) is connected to the cooling coil (7); A cleaning mechanism (3), the cleaning mechanism (3) is located on the outer wall of the cooling coil (7) and is used to clean it, the cleaning mechanism (3) comprises a scraping mechanism, a driving mechanism, a moving mechanism and a limiting mechanism, the scraping mechanism is located inside the soldering equipment body (1) and is used to scrape the outer wall of the cooling coil (7), the driving mechanism is located at the bottom of the scraping mechanism and is used to drive the scraping mechanism to move, the moving mechanism is located on one side of the scraping mechanism and is used to drive the scraping mechanism to separate from the cooling coil (7), and the limiting mechanism is located on one side of the soldering equipment body (1) and is used to limit the moving mechanism.

2. A cooling device for laser soldering according to claim 1, characterized in that: The scraping mechanism comprises a first cleaning plate (31) and a second cleaning plate (32) which are arranged inside the soldering equipment body (1); the first cleaning plate (31) is slidably connected to one side inside the soldering equipment body (1); cleaning brushes are installed on opposite sides of the first cleaning plate (31) and the second cleaning plate (32); the cleaning brushes cooperate with the outer wall of the cooling coil (7); a limiting rod (33) is fixed on one side of the second cleaning plate (32); and the limiting rod (33) is plugged into one side of the soldering equipment body (1).

3. A cooling device for laser soldering according to claim 2, characterized in that: The driving mechanism comprises a rack plate (39) fixed at the bottom of the first cleaning plate (31) and the second cleaning plate (32), a gear (38) meshing between the two rack plates (39), a transmission shaft installed at the bottom of the gear (38), the transmission shaft extending to the bottom of the soldering equipment body (1) and fixed with a rotating knob.

4. A cooling device for laser soldering according to claim 2, characterized in that: The moving mechanism comprises a moving plate (34) fixed to one side of the second cleaning plate (32); a fixing seat (36) is fixed to one side of the soldering equipment body (1); a control rod (37) is movably inserted inside the fixing seat (36); the moving plate (34) extends to one side of the soldering equipment body (1) and is inserted into the control rod (37); a slot is provided inside the moving plate (34) for the control rod (37) to move; two fixing plates (35) that abut against the moving plate (34) are fixed to the outer wall of the control rod (37); and a moving slot is provided on one side of the soldering equipment body (1) for the moving plate (34) to move.

5. A cooling device for laser soldering according to claim 4, characterized in that: The limiting mechanism comprises a storage groove provided on one side of a soldering equipment body (1), an inserting plate (313) being installed inside the storage groove, a groove body for inserting the inserting plate (313) being provided inside the movable groove, a linkage plate (312) being fixed on the top of the inserting plate (313), a spring (310) being connected between the linkage plate (312) and the storage groove, a linkage rod being fixed on one side of the linkage plate (312), the linkage rod extending to one side of the soldering equipment body (1) and being fixed with a control plate (311).

6. A cooling device for laser soldering according to claim 1, characterized in that: A water cooling mechanism (5) is arranged inside the liquid storage tank (2), and the water cooling mechanism (5) includes two rotating shafts arranged inside the liquid storage tank (2), and the outer walls of the two rotating shafts are fixed with cooling plates (52), and the two rotating shafts extend to the liquid storage tank (2) and are installed with belt pulleys, and a belt (53) is installed between the two belt pulleys. A driving motor (51) is installed on one side of the liquid storage tank (2), and the output end of the driving motor (51) is connected to one of the rotating shafts.

7. The cooling device for laser soldering according to claim 1, characterized in that: Both sides of the soldering equipment body (1) are provided with heat dissipation holes, and the outer wall of the heat dissipation hole is provided with an anti-clogging mechanism (4) to prevent the heat dissipation hole from being blocked. The anti-clogging mechanism (4) comprises two fixed blocks fixed on one side of the soldering equipment body (1), a threaded rod (44) is installed between the two fixed blocks, a moving block (43) is screwed on the outer surface of the threaded rod (44), a cleaning seat (41) is fixed on one side of the moving block (43), a cleaning cotton (42) is installed on the bottom of the cleaning seat (41), and the cleaning cotton (42) corresponds to the heat dissipation hole, a limiting plate is fixed on one side of the cleaning seat (41), a fixing rod (45) is inserted into the interior of the limiting plate, and the fixing rod (45) is installed on one side of the soldering equipment body (1).

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