Cable copper plating equipment

Abstract

The utility model relates to the technical field of cable copper plating, and discloses cable copper plating equipment which comprises a copper plating tank, one side of the copper plating tank is fixedly connected with a fixing plate, the top of the fixing plate is fixedly connected with a mounting plate through a mortise lock mechanism, a wind-up roller is arranged between the fixing plate and the mounting plate, and the wind-up roller is fixedly connected with the mounting plate. The device comprises a copper plating tank, a guide roller is installed in the copper plating tank, a material supplementing opening is fixedly connected to one side of the copper plating tank, a base is fixedly connected to the bottom of the material supplementing opening, and a blocking plate is movably connected to the top of the base through a lifting mechanism; according to the device, the concentration of electroplating liquid in the copper plating tank can be detected through the concentration detector in the electroplating process, and when the concentration is reduced to a certain value, the concentration detector can automatically add the copper plating liquid into the copper plating tank through the lifting mechanism, so that the situation that the electroplating quality of a cable is affected due to too low concentration can be avoided; and the practicability of the device is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wire copper plating, in particular to a wire copper plating device. Background Technique

[0002] Wires are the carriers of power transmission. Currently, the prices of non-ferrous metals have skyrocketed. Although copper conductors have good performance, they are expensive, and the cost of copper conductors accounts for more than 90% of the total cost of cable materials. In order to ensure the technical indicators of cable copper conductors and significantly reduce the cost of cables, the concept of copper-clad wire has emerged. Copper-clad wire adopts advanced cladding and welding manufacturing technology to concentrically clad high-quality copper tape on the outer surface of core wires such as aluminum rods or steel wires, and form a firm interatomic metallurgical bond between the copper layer and the core wire. Combining two different metal materials into an inseparable whole, it can be drawn and annealed like processing a single metal wire. During the drawing process, copper and aluminum are reduced in diameter proportionally, and the volume ratio of the copper layer remains relatively constant. The current copper plating process is that the core wire is led out by a wire feeding mechanism and then introduced into a copper plating bath. When the core wire passes through the copper plating bath, a direct current electric field is applied to precipitate and reduce the copper ions in the copper plating bath into copper and attach them to the surface of the core wire.

[0003] For example, a Chinese patent with the patent application number 201710906617.3, a wire copper plating device, the wire feeding mechanism of this patent can quickly supplement the second wire reel when the cable wire on the first wire reel is used up, improving production efficiency; in the copper plating mechanism, the roller is connected to a low-voltage direct current power supply through a clamping plate assembly, and the clamping plate assembly has the advantages of not being easily damaged and low cost.

[0004] However, in actual use, the solution concentration inside the copper plating bath of the above patent will gradually decrease with the electroplating time. When the solution concentration is low, the electroplating effect of the wire will deteriorate, thus seriously affecting the electroplating quality of the wire. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a wire copper plating device to solve the problems raised in the background technique.

[0006] The embodiment of the present application provides a wire copper plating device, including a copper plating tank. One side of the copper plating tank is fixedly connected with a fixing plate. The top of the fixing plate is fixedly connected with a mounting plate through a plug locking mechanism. A winding roller is arranged between the fixing plate and the mounting plate. A guiding roller is installed inside the copper plating tank. One side of the copper plating tank is fixedly connected with a feeding port. The bottom of the feeding port is fixedly connected with a base. The top of the base is movably connected with a blocking plate through a lifting mechanism.

[0007] By adopting the above technical solutions, the device can quickly wind and copper plate the wire, thus greatly improving the practicability of the device.

[0008] Optionally, the plug lock mechanism includes slots opened on both sides of the top of the fixed plate and plug plates installed on both sides of the bottom of the mounting plate. A locking groove is opened on one side of the slot, a sliding groove is opened at the bottom of the plug plate, a sliding rod is installed inside the sliding groove, a locking clip is movably connected to the outer surface of the sliding rod, and a locking spring is fixedly connected to the outer surface of the sliding rod between the locking clip and the inner wall of the sliding groove.

[0009] By adopting the above technical solution, the device can quickly fix the winding roller through the plug lock mechanism, thus greatly facilitating the installation and disassembly of the winding roller by the operator, and further greatly improving the practicability of the device.

[0010] Optionally, the lifting mechanism includes a motor and a limit frame installed on the top of the feeding port. The output end of the motor is fixedly connected with a cam disc. One side of the cam disc is hinged with a connecting rod, the other end of the connecting rod is hinged with a lifting rod, and the bottom of the lifting rod penetrates through the limit frame and is fixedly connected with the sealing plate.

[0011] By adopting the above technical solution, during the electroplating process of the device, the concentration detector can detect the concentration of the electroplating solution inside the copper plating tank. When the concentration drops to a certain value, the concentration detector will automatically add copper plating solution into the copper plating tank through the lifting mechanism, thereby avoiding affecting the electroplating quality of the cable due to too low concentration, and further greatly improving the practicability of the device.

[0012] Optionally, the locking clip is an L-shaped elastic plate.

[0013] By adopting the above technical solution, by utilizing the elastic effect of the L-shaped elastic plate, the locking effect of the device is better.

[0014] Optionally, a limit groove adapted to the lifting rod is opened inside the limit frame.

[0015] By adopting the above technical solution, by utilizing the limiting effect of the limit groove, the lifting rod can move more stably.

[0016] Optionally, a concentration detector is fixedly connected to the inner wall of the copper plating tank.

[0017] By adopting the above technical solution, the concentration detector can quickly detect the concentration of the copper plating solution inside the copper plating tank.

[0018] Optionally, support legs are fixedly connected to the four corners of the bottom of the copper plating tank.

[0019] By adopting the above technical solution, by utilizing the cooperative effect of multiple support legs, the stability of the device is stronger.

[0020] Optionally, one side of the copper plating tank is fixedly connected with a controller.

[0021] By adopting the above technical solution, the controller can be used to more conveniently control the electrical appliances inside the device.

[0022] Compared with the prior art, the beneficial effects of the technical solution of this application are as follows:

[0023] By setting a concentration detector, a motor, a cam disk, a connecting rod, a lifting rod, a limiting frame, a base and a plugging plate in the technical solution of this application, the concentration of the electroplating solution inside the copper plating tank can be detected by the concentration detector during the electroplating process of the device. When the concentration drops to a certain value, the concentration detector will automatically add copper plating solution into the copper plating tank through the lifting mechanism, thereby avoiding affecting the electroplating quality of the cable due to too low concentration, and thus greatly improving the practicability of the device.

[0024] By setting an installation plate, a fixing plate, a plug board, a slot, a locking groove, a sliding groove, a sliding rod, a locking clamp block and a locking spring in the technical solution of this application, the device can quickly fix the winding roller through the plugging and locking mechanism, thus greatly facilitating the installation and disassembly of the winding roller by the operator, and thus greatly improving the practicability of the device. Description of the Drawings

[0025] By reading the following detailed description of the non-limiting embodiments with reference to the accompanying drawings, other features, objects and advantages of the present utility model will become more apparent:

[0026] Figure 1 It is a three-dimensional structure diagram of the front of an overall cable copper plating device of the present utility model;

[0027] Figure 2 It is a three-dimensional structure diagram of the back of an overall cable copper plating device of the present utility model;

[0028] Figure 3 It is a three-dimensional structure diagram of the connection part between the installation plate and the plug board in a cable copper plating device of the present utility model;

[0029] Figure 4 It is a three-dimensional structure diagram of the installation plate in a cable copper plating device of the present utility model.

[0030] In the figure: 1, copper plating tank; 2, fixing plate; 3, installation plate; 4, winding roller; 5, guiding roller; 6, concentration detector; 7, feeding port; 8, base; 9, plugging plate; 10, motor; 11, cam disk; 12, connecting rod; 13, lifting rod; 14, limiting frame; 15, plug board; 16, slot; 17, locking groove; 18, sliding groove; 19, sliding rod; 20, locking clamp block; 21, locking spring; 22, support leg; 23, controller. Detailed implementation mode

[0031] Please refer to Figures 1-4 , the present utility model provides a technical solution: a wire and cable copper plating device, including a copper plating tank 1, one side of the copper plating tank 1 is fixedly connected with a fixing plate 2, the top of the fixing plate 2 is fixedly connected with a mounting plate 3 through a plugging and locking mechanism, a winding roller 4 is arranged between the fixing plate 2 and the mounting plate 3, a guiding roller 5 is installed inside the copper plating tank 1, one side of the copper plating tank 1 is fixedly connected with a feeding port 7, the bottom of the feeding port 7 is fixedly connected with a base 8, and the top of the base 8 is movably connected with a plugging plate 9 through a lifting mechanism.

[0032] By adopting the above technical solution, the device can quickly wind and copper-plate the wire and cable, thus greatly improving the practicability of the device.

[0033] In the implementation mode of the present application, as Figures 3-4 shown, the plugging and locking mechanism includes slots 16 opened on both sides of the top of the fixing plate 2 and plug plates 15 installed on both sides of the bottom of the mounting plate 3, a locking groove 17 is opened on one side of the slot 16, a sliding groove 18 is opened at the bottom of the plug plate 15, a sliding rod 19 is installed inside the sliding groove 18, a locking clip 20 is movably connected to the outer surface of the sliding rod 19, and a locking spring 21 is fixedly connected to the outer surface of the sliding rod 19 between the locking clip 20 and the inner wall of the sliding groove 18.

[0034] By adopting the above technical solution, the device can quickly fix the winding roller 4 through the plugging and locking mechanism, thus greatly facilitating the installation and disassembly of the winding roller 4 by the operator, and further greatly improving the practicability of the device.

[0035] In the implementation mode of the present application, as Figures 1-2 shown, the lifting mechanism includes a motor 10 and a limiting frame 14 installed on the top of the feeding port 7, the output end of the motor 10 is fixedly connected with a cam disc 11, one side of the cam disc 11 is hinged with a connecting rod 12, the other end of the connecting rod 12 is hinged with a lifting rod 13, and the bottom of the lifting rod 13 penetrates through the limiting frame 14 and is fixedly connected with the plugging plate 9.

[0036] By adopting the above technical solution, the device can detect the concentration of the electroplating solution inside the copper plating tank 1 through the concentration detector 6 during the electroplating process. When the concentration drops to a certain value, the concentration detector 6 will automatically add copper plating solution into the copper plating tank 1 through the lifting mechanism, thus avoiding affecting the electroplating quality of the wire and cable due to too low concentration, and further greatly improving the practicability of the device.

[0037] In the implementation mode of the present application, as Figure 3 shown, the locking clip 20 is an L-shaped elastic plate.

[0038] By adopting the above technical solution, the elastic effect of the L-shaped elastic plate is utilized to make the locking effect of the device better.

[0039] In the embodiment of the present application, as Figure 2 shown, a limiting groove adapted to the lifting rod 13 is provided inside the limiting frame 14.

[0040] By adopting the above technical solution, the limiting effect of the limiting groove is utilized to make the lifting rod 13 move more stably.

[0041] In the embodiment of the present application, as Figure 1 shown, a concentration detector 6 is fixedly connected to the inner wall of the copper plating tank 1.

[0042] By adopting the above technical solution, the concentration detector 6 can quickly detect the concentration of the copper plating solution inside the copper plating tank 1.

[0043] In the embodiment of the present application, as Figure 1 shown, support legs 22 are fixedly connected to the four corners of the bottom of the copper plating tank 1.

[0044] By adopting the above technical solution, the synergistic effect of the multiple support legs 22 is utilized to make the stability of the device stronger.

[0045] In the embodiment of the present application, as Figure 2 shown, a controller 23 is fixedly connected to one side of the copper plating tank 1.

[0046] By adopting the above technical solution, the controller 23 can more conveniently control the electrical appliances inside the device.

[0047] During use, the operator can wind the cable through the winding roller 4 and the guiding roller 5, and copper-plate the cable with the copper-plating solution inside the copper-plating tank 1 during the winding process. During the copper-plating process, the concentration detector 6 can detect the concentration of the copper-plating solution inside the copper-plating tank 1. When the concentration is low, the concentration detector 6 will start the motor 10 through the controller 23, causing the motor 10 to drive the cam disk 11 to rotate forward. When the cam disk 11 rotates forward, it will drive the lifting rod 13 to slide upward along the limiting frame 14 through the connecting rod 12, so that the lifting rod 13 can drive the sealing plate 9 to move upward, and further enable the feeding port 7 to add the copper-plating solution with a suitable concentration into the copper-plating tank 1. When the concentration inside the copper-plating tank 1 increases to a certain value, the concentration detector 6 will control the motor 10 to reverse through the controller 23 again, and use the above principle to enable the sealing plate 9 to block the feeding port 7, so that the inside of the copper-plating tank 1 can always be in the optimal copper-plating concentration range, thus greatly improving the copper-plating effect of this device. When the winding roller 4 needs to be disassembled, the operator can press the locking clip 20, making it slide along the sliding rod 19 and squeeze the locking spring 21. After the locking clip 20 is separated from the locking groove 17, the operator can then pull out the mounting plate 3 and the insertion plate 15 from the slot 16 at the top of the fixed plate 2. Similarly, the operator can quickly fix the mounting plate 3 to the fixed plate 2, thus greatly facilitating the operator to install and disassemble the winding roller 4, and further greatly improving the practicability of this device.

Claims

1. A cable copper plating device, comprising a copper plating tank (1), characterized in that: A fixing plate (2) is fixedly connected to one side of the copper plating tank (1), a mounting plate (3) is fixedly connected to the top of the fixing plate (2) via a latch mechanism, a winding roller (4) is arranged between the fixing plate (2) and the mounting plate (3), a guide roller (5) is installed inside the copper plating tank (1), a feeding port (7) is fixedly connected to one side of the copper plating tank (1), a base (8) is fixedly connected to the bottom of the feeding port (7), and a blocking plate (9) is movably connected to the top of the base (8) via a lifting mechanism.

2. The cable copper plating equipment according to claim 1, characterized in that: The latch mechanism comprises slots (16) provided on both sides of the top of the fixing plate (2) and plug plates (15) installed on both sides of the bottom of the mounting plate (3), a locking slot (17) being provided on one side of the slot (16), a sliding slot (18) being provided on the bottom of the plug plate (15), a sliding rod (19) being installed inside the sliding slot (18), a locking clamping block (20) being movably connected to the outer surface of the sliding rod (19), and a locking spring (21) being fixedly connected to the outer surface of the sliding rod (19) located between the locking clamping block (20) and the inner wall of the sliding slot (18).

3. The cable copper plating equipment according to claim 1, characterized in that: The lifting mechanism comprises a motor (10) and a limit frame (14) mounted on the top of the feeding port (7); the output end of the motor (10) is fixedly connected to a cam plate (11); a connecting rod (12) is hingedly connected to one side of the cam plate (11); a lifting rod (13) is hingedly connected to the other end of the connecting rod (12); the bottom of the lifting rod (13) passes through the limit frame (14) and is fixedly connected to the blocking plate (9).

4. The cable copper plating equipment according to claim 2, characterized in that: The locking clamp (20) is an L-shaped elastic plate.

5. The cable copper plating equipment according to claim 3, characterized in that: The limiting frame (14) is provided with a limiting groove inside thereof, which is matched with the lifting rod (13).

6. The cable copper plating equipment according to claim 1, characterized in that: A concentration detector (6) is fixedly connected to the inner wall of the copper plating tank (1).

7. The cable copper plating equipment according to claim 1, characterized in that: Support legs (22) are fixedly connected to the four corners of the bottom of the copper plating tank (1).

8. The cable copper plating equipment according to claim 1, characterized in that: A controller (23) is fixedly connected to one side of the copper plating tank (1).

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