A copper plating tank for PCB copper sinking
By employing an upper and lower conductive plate structure and a titanium conductive plate in the copper plating tank of the PCB board, the problem of uneven current distribution was solved, achieving uniform deposition of the copper layer on the circuit board and the stability of the equipment, while reducing rework rate and long-term maintenance costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU TOP CREATION MACHINES
- Filing Date
- 2025-07-18
- Publication Date
- 2026-05-29
AI Technical Summary
Existing copper plating baths used for PCB board copper plating suffer from uneven current distribution, resulting in excessively thin copper layers in some areas and a high rework rate.
Design a copper plating tank for PCB board copper plating, adopting an upper and lower conductive plate structure, with current simultaneously introduced from the upper and lower sides of the circuit board, and using titanium material for the upper and lower conductive plates to ensure uniform current distribution and circuit loop reliability, combined with sealing components and connecting components to ensure current stability and ease of installation.
It achieves uniform current distribution on the circuit board surface and inside the holes, reduces the phenomenon of excessively thin copper layers in some areas, lowers the rework rate, and improves the stability and service life of the equipment through the use of titanium conductive plates.
Smart Images

Figure CN224299418U_ABST