Electronic device

Abstract

The utility model relates to an electronic device. The electronic device includes: a substrate; a circuit layer on the substrate; a light emitting element layer on the circuit layer; and a sensor layer on the light emitting element layer and including: a first sensing electrode including a first pattern and a first bridge pattern electrically connected to the first pattern; a second sensing electrode extending in the first direction and crossing the first sensing electrode; a first electrode extending in a second direction crossing the first direction; and a second electrode including a second pattern and a second bridge pattern electrically connected to the second pattern. One of the first patterns includes a first region overlapping the first electrode; one of the second patterns includes a second region overlapping the second sensing electrode; the first area of the first region is smaller than the second area of the second region.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and benefit of Korean Patent Application No. 10 - 2023 - 0122502, filed on September 14, 2023, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical field

[0003] Aspects of embodiments of the present disclosure relate to an electronic device capable of sensing pen input. Background art

[0004] Multimedia electronic devices such as televisions (TVs), mobile phones, tablet computers, notebooks, navigation systems, or game consoles include a display device for displaying images. In addition, in addition to general input devices such as buttons, keyboards, or mice, the electronic device may also include a sensor layer (e.g., an input sensor) capable of providing a touch - based input method, which allows a user to easily and intuitively input information or commands. The sensor layer can sense user touch or pressure. On the other hand, for users accustomed to inputting information by using a writing tool or for specific applications (e.g., applications for painting or drawing), there may be an increasing demand for the ability to perform fine touch input using a pen.

[0005] The above information disclosed in this background art section is for enhancing the understanding of the background art of the present disclosure, and thus, it may include information that does not constitute prior art. Summary of the utility model

[0006] One or more embodiments of the present disclosure may relate to an electronic device capable of sensing pen input.

[0007] According to one or more embodiments of the present disclosure, an electronic device includes: a substrate; a circuit layer on the substrate and including transistors; a light - emitting element layer on the circuit layer and including light - emitting elements electrically connected to the transistors; and a sensor layer on the light - emitting element layer, and including: a first sensing electrode including a first pattern and a first bridging pattern electrically connected to the first pattern; a second sensing electrode extending in a first direction and crossing the first sensing electrode; a first electrode extending in a second direction crossing the first direction; and a second electrode including a second pattern and a second bridging pattern electrically connected to the second pattern. One of the first patterns includes a first region overlapping with the first electrode; one of the second patterns includes a second region overlapping with the second sensing electrode; and a first area of the first region is smaller than a second area of the second region.

[0008] In an embodiment, the length of the first sensing electrode may be longer than the length of the second sensing electrode, and the length of the first electrode may be longer than the length of the second electrode.

[0009] In an embodiment, the second patterns may be spaced apart from each other in a first direction, and the first electrode may be located therebetween. The first patterns may be spaced apart from each other in a second direction, and the second sensing electrode may be located therebetween. And a maximum width of the first electrode in the first direction may be less than or equal to a maximum width of the second patterns in the second direction.

[0010] In an embodiment, the first bridging pattern, the second patterns, and the first electrode may be located at a first layer, and the second bridging pattern, the first patterns, and the second sensing electrode may be located at a second layer.

[0011] In an embodiment, the second layer may be spaced further apart from the light-emitting element layer than the first layer.

[0012] In an embodiment, the first electrode may include: connection portions spaced apart from each other in a first direction; and pattern portions spaced apart from each other in a second direction, and the connection portions may be located therebetween. The connection portions and the pattern portions may be connected to each other and may be located at the same layer as each other.

[0013] In an embodiment, the second patterns may be spaced apart from each other, and the connection portions may be located therebetween, and the second bridging pattern may overlap with the connection portions.

[0014] In an embodiment, the sensor layer may be configured to operate in a first mode or a second mode. In the first mode, a first driving signal is provided to the first sensing electrode or the second sensing electrode to sense a touch input. In the second mode, a second driving signal is provided to the first electrode or the second electrode to sense a pen input.

[0015] According to one or more embodiments of the present disclosure, an electronic device includes: a substrate; a circuit layer on the substrate and including transistors; a light-emitting element layer on the circuit layer and including light-emitting elements electrically connected to the transistors; and a sensor layer on the light-emitting element layer, and including: a first sensing electrode including a first pattern and a first bridging pattern electrically connected to the first pattern; a second sensing electrode intersecting the first sensing electrode and including a second pattern and a second bridging pattern electrically connected to the second pattern; a first electrode including a third pattern and a third bridging pattern electrically connected to the third pattern; and a second electrode including a fourth pattern and a fourth bridging pattern electrically connected to the fourth pattern. A first width of one of the third patterns is less than a second width of the second electrode. The first width is parallel to a first direction, and the second width is parallel to a second direction intersecting the first direction.

[0016] In an embodiment, the third bridging pattern may have a third width parallel to the first direction, and the first width may be greater than the third width.

[0017] In an embodiment, the second pattern and the second bridging pattern may be connected to each other and may be located at the same layer as each other. The third pattern and the third bridging pattern may be connected to each other and may be located at the same layer as each other.

[0018] In an embodiment, the maximum width of the first electrode in the first direction may be less than the maximum width of the second electrode in the second direction.

[0019] In an embodiment, the fourth patterns may be spaced apart from each other, and the third bridging pattern may be located therebetween, and the fourth bridging pattern may overlap with the third bridging pattern.

[0020] In an embodiment, the first patterns may be spaced apart from each other, and the second bridging pattern may be located therebetween, and the first bridging pattern may overlap with the second bridging pattern.

[0021] In an embodiment, the length of the first sensing electrode may be longer than the length of the second sensing electrode, and the length of the first electrode may be longer than the length of the second electrode.

[0022] In an embodiment, the sensor layer may be configured to operate in a first mode or a second mode. In the first mode, a first driving signal is provided to the first sensing electrode or the second sensing electrode to sense a touch input. In the second mode, a second driving signal is provided to the first electrode or the second electrode to sense a pen input.

[0023] According to one or more embodiments of the present disclosure, an electronic device includes: a substrate; a circuit layer on the substrate and including transistors; a light-emitting element layer on the circuit layer and including light-emitting elements electrically connected to the transistors; and a sensor layer on the light-emitting element layer, and including: a first sensing electrode; a second sensing electrode intersecting the first sensing electrode; a first electrode overlapping the first sensing electrode; and a second electrode overlapping the second sensing electrode. The first sensing electrode includes a first pattern and a first bridging pattern electrically connected to the first pattern; the second electrode includes a second pattern and a second bridging pattern electrically connected to the second pattern; the first electrode, the second pattern, and the first bridging pattern are located at the same layer as each other; the first pattern, the second sensing electrode, and the second bridging pattern are located at the same layer as each other; and the first bridging pattern and the second bridging pattern intersect each other.

[0024] In an embodiment, the second patterns may be spaced apart from each other, and the first electrode and the first bridging pattern may be located therebetween.

[0025] In an embodiment, the first electrode may have an opening defined therein, and the first bridging pattern may overlap the opening.

[0026] In an embodiment, the first patterns may be spaced apart from each other, and the second sensing electrode and the second bridging pattern may be located therebetween.

[0027] In an embodiment, the second sensing electrode may have an opening defined therein, and the second bridging pattern may overlap the opening.

[0028] In an embodiment, the second bridging pattern may be spaced apart further from the light-emitting element layer than the first bridging pattern.

[0029] In an embodiment, the sensor layer may be configured to operate in a first mode or a second mode. In the first mode, a first driving signal is provided to the first sensing electrode or the second sensing electrode to sense a touch input. In the second mode, a second driving signal is provided to the first electrode or the second electrode to sense a pen input.

[0030] According to one or more embodiments of the present disclosure, an electronic device includes: a substrate; a circuit layer on the substrate and including transistors; a light-emitting element layer on the circuit layer and including light-emitting elements electrically connected to the transistors; and a sensor layer on the light-emitting element layer and including: a first sensing electrode including a first pattern and a first bridging pattern electrically connected to the first pattern; a second sensing electrode intersecting the first sensing electrode; a first electrode intersecting the second sensing electrode; and a second electrode including a second pattern and a second bridging pattern electrically connected to the second pattern. The sensor layer has a sensing region defined therein, and the first sensing electrode, the second sensing electrode, the first electrode, and the second electrode are located at the sensing region; a width of the sensing region in a first direction is less than a width of the sensing region in a second direction intersecting the first direction; the first electrode extends in the second direction, and the second electrode extends in the first direction; and a capacitance of a first capacitor defined between one of the first patterns and the first electrode overlapping one of the first patterns is less than a capacitance of a second capacitor defined between one of the second patterns and the second sensing electrode overlapping one of the second patterns.

[0031] In an embodiment, the sensor layer may be configured to operate in a first mode or a second mode. In the first mode, a first driving signal is provided to the first sensing electrode or the second sensing electrode to sense a touch input. In the second mode, a second driving signal is provided to the first electrode or the second electrode to sense a pen input.

[0032] In an embodiment, a length of the first sensing electrode may be longer than a length of the second sensing electrode, and a length of the first electrode may be longer than a length of the second electrode.

[0033] In an embodiment, the first bridging pattern and the second bridging pattern may cross each other.

[0034] In an embodiment, the first bridging pattern, the second pattern, and the first electrode may be located at the first layer, and the second bridging pattern, the first pattern, and the second sensing electrode may be located at the second layer.

[0035] In an embodiment, the second layer may be spaced further apart from the light-emitting element layer than the first layer.

[0036] In an embodiment, the first electrode may have an opening defined therein, and the first bridging pattern may overlap with the opening.

[0037] However, the present disclosure is not limited to the above aspects and features. Additional aspects and features will be set forth in part in the following detailed description with reference to the accompanying drawings, and in part will be obvious from the description, or may be learned by practice of one or more of the presented embodiments of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The above and other aspects and features of the present disclosure will be more clearly understood from the following detailed description of exemplary, non-limiting embodiments with reference to the accompanying drawings.

[0039] Figure 1A is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0040] Figure 1B is a rear perspective view of an electronic device according to an embodiment of the present disclosure.

[0041] Figure 2 is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0042] Figure 3 is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0043] Figure 4 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0044] Figure 5A is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0045] Figure 5B is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0046] Figure 6 is a cross-sectional view of a display panel according to an embodiment of the present disclosure.

[0047] Figure 7It is a diagram showing the operation of an electronic device according to an embodiment of the present disclosure.

[0048] Figure 8 It is a cross-sectional view of a display panel according to an embodiment of the present disclosure.

[0049] Fig. 9 It is a plan view of a sensor layer according to an embodiment of the present disclosure.

[0050] Fig.10 It is an enlarged plan view showing one sensing unit according to an embodiment of the present disclosure.

[0051] Fig.11A It is a plan view showing the first conductive layer of the sensing unit according to an embodiment of the present disclosure.

[0052] Fig. 11B It is a plan view showing the second conductive layer of the sensing unit according to an embodiment of the present disclosure.

[0053] Fig.12 It is according to an embodiment of the present disclosure along Fig.11A and Fig. 11B A cross-sectional view of the sensor layer taken along line I-I'.

[0054] Fig.13A It is Fig.11A An enlarged plan view of the area AA' shown in

[0055] Fig. 13B It is Fig. 11B An enlarged plan view of the area BB' shown in

[0056] Fig.14 It is an enlarged plan view showing one sensing unit according to an embodiment of the present disclosure.

[0057] Fig.15A It is a plan view showing the first conductive layer of the sensing unit according to an embodiment of the present disclosure.

[0058] Fig. 15B It is a plan view showing the second conductive layer of the sensing unit according to an embodiment of the present disclosure.

[0059] Fig.16 It is a block diagram showing the operation of a sensor driver according to an embodiment of the present disclosure.

[0060] Fig.17 It is a timing diagram showing the operation of a sensor driver according to an embodiment of the present disclosure.

[0061] Fig.18A It is a diagram showing the first mode according to an embodiment of the present disclosure.

[0062] Fig.18B It is a diagram showing the first mode according to an embodiment of the present disclosure.

[0063] Fig.19 It is a diagram showing the first mode according to an embodiment of the present disclosure.

[0064] Fig. 20 It is a diagram showing the second mode according to an embodiment of the present disclosure.

[0065] Fig.21A A diagram showing the waveforms of the first signal and the second signal according to an embodiment of the present disclosure.

[0066] Fig.21B A diagram showing the waveforms of the first signal and the second signal according to an embodiment of the present disclosure.

[0067] Fig. 21C A diagram showing the waveforms of the first signal and the second signal according to an embodiment of the present disclosure.

[0068] Fig.22A A table showing the signals provided to the sensor layer according to an embodiment of the present disclosure.

[0069] Fig. 22B A table showing the signals provided to the sensor layer according to an embodiment of the present disclosure.

[0070] Fig.23 It is a diagram showing the second mode according to an embodiment of the present disclosure.

[0071] Fig.24A A table showing the signals provided to the sensor layer according to an embodiment of the present disclosure.

[0072] Fig. 24B A table showing the signals provided to the sensor layer according to an embodiment of the present disclosure.

[0073] Fig.25A It is a diagram showing a pen according to an embodiment of the present disclosure.

[0074] Fig.25B It is a diagram showing a pen according to an embodiment of the present disclosure.

[0075] Fig.25C It is a diagram showing a pen according to an embodiment of the present disclosure.

[0076] Fig.26A It is a diagram showing the operation of a pen according to an embodiment of the present disclosure.

[0077] Fig.26B It is a diagram showing the operation of a pen according to an embodiment of the present disclosure.

[0078] Fig.27A It is a diagram showing the second mode according to an embodiment of the present disclosure.

[0079] Fig.27B It is a diagram showing the second mode based on the sensing unit according to an embodiment of the present disclosure.

[0080] Fig.28A It is a diagram showing the second mode according to an embodiment of the present disclosure.

[0081] Fig.28B It is a diagram showing the second mode according to an embodiment of the present disclosure.

[0082] Fig.29 It is an equivalent circuit diagram of a sensor driver according to an embodiment of the present disclosure.

[0083] Fig. 30A It is a diagram showing an example of the first signal of the first node.

[0084] Fig. 30B It is a diagram showing an example of the second signal of the second node.

[0085] Fig.31A It is a diagram showing the connection relationship between the first switch and the second switch in the first phase period.

[0086] Fig.31B It is a diagram showing the connection relationship between the first switch and the second switch in the second phase period.

[0087] Fig.32 It is a diagram showing the signal measured at the third node.

[0088] Fig.33 It is a diagram showing the signal measured at the fourth node.

[0089] Fig.34A It is a diagram showing the connection relationship between the third switch and the fourth switch in the third phase period.

[0090] Fig.34B It is a diagram showing the connection relationship between the third switch and the fourth switch in the fourth phase period.

[0091] Fig.35 It is a diagram showing the signal measured at the fifth node.

[0092] Fig.36 It is a diagram showing the signal measured at the sixth node.

[0093] Fig.37A It is a diagram showing the current sensed from the first channel.

[0094] Fig.37Bis a graph showing the current obtained from the differential pair of the first channel.

[0095] Fig.37C is a graph showing the absolute values ​​of currents obtained from the differential pair of the first channel.

[0096] Fig.38 is a diagram illustrating a method for recognizing a pen position according to an embodiment of the present disclosure.

[0097] Fig.39A is a diagram illustrating a method for recognizing a pen position according to an embodiment of the present disclosure.

[0098] Fig.39B is a diagram illustrating a method for recognizing a pen position according to an embodiment of the present disclosure.

[0099] Fig.40A is a diagram illustrating the magnitude and direction of an induced current generated at a pen and a first electrode according to an embodiment of the present disclosure.

[0100] Fig.40B is a diagram illustrating the magnitude and direction of an induced current generated at a pen and a first electrode according to an embodiment of the present disclosure.

[0101] FIG. 41A to FIG. 41B , FIG. 42A to FIG. 42B and Fig.43 is a diagram showing a method for measuring the inclination angle and azimuth angle of a pen.

[0102] FIG. 44A to FIG. 44C is a diagram showing a method for measuring the pressure of a pen.

[0103] Fig.45A is an equivalent circuit diagram showing the relationship between one channel and a pen according to a comparative example.

[0104] Fig.45B is an equivalent circuit diagram showing the relationship between one channel and a pen according to a comparative example.

[0105] Fig.46A is an equivalent circuit diagram showing the relationship between one channel and a pen according to an embodiment of the present disclosure.

[0106] Fig.46B is an equivalent circuit diagram showing the relationship between one channel and a pen according to an embodiment of the present disclosure.

[0107] Fig.47 is a graph showing current magnitude according to pen positions with respect to one channel.

[0108] Fig.48A is a diagram illustrating one channel according to an embodiment of the present disclosure.

[0109] Fig.48B It is a diagram showing one channel according to an embodiment of the present disclosure.

[0110] Fig.49A It is an equivalent circuit diagram showing the relationship between one channel and a pen according to an embodiment of the present disclosure.

[0111] Fig.49B It is an equivalent circuit diagram showing the relationship between one channel and a pen according to an embodiment of the present disclosure.

[0112] Fig.50 It is a diagram showing one channel according to an embodiment of the present disclosure.

[0113] Fig.51 It is an equivalent circuit diagram showing the relationship between one channel and a pen according to an embodiment of the present disclosure.

[0114] Fig.52 It is a diagram showing one channel according to an embodiment of the present disclosure.

[0115] Fig.53 It is an equivalent circuit diagram showing the relationship between one channel and a pen according to an embodiment of the present disclosure.

[0116] Fig.54A It is a diagram showing the current amplitude according to the pen position with respect to one channel.

[0117] Fig.54B It is a diagram showing the current amplitude according to the pen position with respect to one channel.

[0118] Fig.55 It is an equivalent circuit diagram showing the relationship between one channel and a pen according to an embodiment of the present disclosure.

[0119] Fig.56A It is a plan view of the first conductive layer of the sensing unit according to an embodiment of the present disclosure.

[0120] Fig.56B It is a plan view of the second conductive layer of the sensing unit according to an embodiment of the present disclosure.

[0121] Fig.57A It is a plan view of the first conductive layer of the sensing unit according to an embodiment of the present disclosure.

[0122] Fig.57B It is a plan view of the second conductive layer of the sensing unit according to an embodiment of the present disclosure.

[0123] Fig.58A It is a plan view of the first conductive layer of the sensing unit according to an embodiment of the present disclosure.

[0124] Fig.58B is a plan view showing a first conductive layer of a sensing unit according to an embodiment of the present disclosure.

[0125] Fig.59 is a diagram showing four channels according to an embodiment of the present disclosure.

[0126] Fig.60 is a diagram showing four channels according to an embodiment of the present disclosure.

[0127] Fig.61 is a diagram showing four channels according to an embodiment of the present disclosure.

[0128] Fig.62A is a diagram showing four channels according to an embodiment of the present disclosure.

[0129] Fig.62B is a diagram showing four second auxiliary electrodes according to an embodiment of the present disclosure.

[0130] Fig.62C is showing Fig.62B a diagram of an equivalent circuit of three of the four second auxiliary electrodes shown in

[0131] Fig.63 is a diagram showing seven channels according to an embodiment of the present disclosure.

[0132] Fig.64 is a diagram showing seven channels according to an embodiment of the present disclosure.

[0133] Fig.65 is a diagram showing seven channels according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0134] Hereinafter, embodiments will be described in more detail with reference to the accompanying drawings, in which like reference numerals denote like elements throughout. However, the present disclosure may be implemented in various different forms and should not be construed as limited to the embodiments shown herein. Instead, these embodiments are provided as examples so that the present disclosure will be thorough and complete, and will fully convey the aspects and features of the present disclosure to those skilled in the art. Thus, processes, elements, and techniques that are not necessary for those of ordinary skill in the art to fully understand the aspects and features of the present disclosure may not be described. Unless otherwise noted, in all the drawings and the written description, like reference numerals denote like elements and thus, redundant descriptions thereof may not be repeated.

[0135] When a particular implementation can be achieved differently, the specific process sequence can be different from the described sequence. For example, two consecutively described processes can be performed simultaneously or substantially simultaneously, or can be performed in an order opposite to the described order.

[0136] In the drawings, for clarity, the relative dimensions, thicknesses, and ratios of elements, layers, and regions may be exaggerated and / or simplified. For ease of explanation, spatial relative terms such as "below", "beneath", "lower", "under", "above", "upper", etc. may be used herein to describe the relationship of one element or feature to another element(s) or feature(s) as shown in the drawings. It will be understood that, in addition to the orientation depicted in the drawings, the spatial relative terms are intended to also encompass different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as "below" or "beneath" or "under" other elements or features will then be oriented "above" the other elements or features. Thus, the exemplary terms "below" and "beneath" can encompass both an orientation above and below. The device may have additional orientations (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein should be interpreted accordingly.

[0137] In the drawings, the DR1 axis, DR2 axis, and DR3 axis are not limited to the three axes of a rectangular coordinate system and can be interpreted in a broader sense. For example, the DR1 axis, DR2 axis, and DR3 axis can be perpendicular to each other or substantially perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0138] It will be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Thus, a first element, first component, first region, first layer, or first portion described below can be referred to as a second element, second component, second region, second layer, or second portion without departing from the spirit and scope of the present disclosure.

[0139] It will be understood that when an element or layer is referred to as being "on", "connected to", or "coupled to" another element or layer, it can be directly on, directly connected to, or directly coupled to the other element or layer, or there can be one or more intervening elements or layers. Similarly, when a layer, region, or element is referred to as being "electrically connected" to another layer, region, or element, it can be directly electrically connected to the other layer, region, or element, and / or can be indirectly electrically connected through one or more intervening layers, regions, or elements therebetween. Further, it will be understood that when an element or layer is referred to as being "between" two elements or layers, it can be the only element or layer between the two elements or layers, or there can also be one or more intervening elements or layers.

[0140] The terms used herein are for the purpose of describing particular embodiments and are not intended to limit the disclosure. As used herein, the singular forms "a" and "an" are intended to also include the plural forms, unless the context clearly indicates otherwise. It will also be understood that when used in this specification, the terms "comprises", "comprising", "includes", "including", "has", "have", and "having" specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. For example, the expression "A and / or B" means A, B, or A and B. Expressions such as "at least one of..." when following a list of elements modify the entire list of elements, rather than individual elements in the list. For example, the expressions "at least one of a, b, and c" and "at least one selected from the group consisting of a, b, and c" mean only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variants thereof.

[0141] As used herein, the terms "substantially", "about", and similar terms are used as approximate terms and not as terms of degree, and are intended to account for the inherent variations in measured or calculated values that would be recognized by a person of ordinary skill in the art. Further, when describing embodiments of the disclosure, the use of "may" refers to "one or more embodiments of the disclosure". As used herein, the terms "use", "is using", and "used" can be considered to be synonymous with the terms "utilize", "is utilizing", and "utilized", respectively.

[0142] As used herein, the terms "portion" and "unit" may refer to a software component or a hardware component that performs a specific function. The hardware component may include, for example, a field programmable gate array (FPGA) or an application specific integrated circuit (ASIC). The software component may refer to executable code in an addressable storage medium and / or data used by the executable code. Thus, the software component may be, for example, an object-oriented software component, a class component, and / or a task component, and may include a process, a function, a property, a procedure, a subroutine, a program code segment, a driver, firmware, microcode, a circuit, data, a database, a data structure, a table, an array, or a variable.

[0143] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will also be understood that terms, such as those defined in a commonly used dictionary, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and / or this specification, and should not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0144] Figure 1A is a perspective view of an electronic device 1000 according to an embodiment of the present disclosure. Figure 1B is a rear perspective view of an electronic device 1000 according to an embodiment of the present disclosure.

[0145] Reference Figure 1A and Figure 1B , the electronic device 1000 may refer to a device that is activated according to an electrical signal. For example, the electronic device 1000 may display an image and may sense an input applied from the outside (e.g., an external input). The external input may be an input of a user. The input of the user may include various suitable types of external inputs, such as a part of the user's body (e.g., a user's finger), a pen PN, light, heat, and / or pressure.

[0146] The electronic device 1000 may include a first display panel DP1 and a second display panel DP2. The first display panel DP1 and the second display panel DP2 may be separate independent panels from each other. The first display panel DP1 may be referred to as the "main display panel", while the second display panel DP2 may be referred to as the "auxiliary display panel" or the "external display panel".

[0147] The first display panel DP1 may include a first display portion DA1-F, and the second display panel DP2 may include a second display portion DA2-F. The size (e.g., area) of the second display panel DP2 may be smaller than the size of the first display panel DP1. The size of the first display portion DA1-F corresponding to the size of the first display panel DP1 may be larger than the size of the second display portion DA2-F corresponding to the size of the second display panel DP2.

[0148] When the electronic device 1000 is unfolded, the first display portion DA1-F may have a plane parallel to or substantially parallel to the first direction DR1 and the second direction DR2. The thickness direction of the electronic device 1000 may be parallel to or substantially parallel to a third direction DR3 that intersects or crosses the first direction DR1 and the second direction DR2. Accordingly, the front surface (e.g., top surface / upper surface) and the rear surface (e.g., bottom surface / lower surface) of various components constituting the electronic device 1000 may be defined with respect to the third direction DR3.

[0149] The first display panel DP1 or the first display portion DA1-F may include a folding region FA to be folded and unfolded, and a plurality of non-folding regions NFA1 and NFA2 that are spaced apart from each other and the folding region FA is interposed therebetween. The second display panel DP2 may overlap with one of the plurality of non-folding regions NFA1 and NFA2. For example, the second display panel DP2 may overlap with the first non-folding region NFA1.

[0150] The display direction of the first image IM1a displayed in a part of the first display panel DP1 (e.g., such as in the second non-folding region NFA2) may be opposite to the display direction of the second image IM2a displayed in the second display panel DP2. For example, the first image IM1a may be displayed in the third direction DR3, and the second image IM2a may be displayed in a fourth direction DR4 opposite to (e.g., contrary to) the third direction DR3.

[0151] In an embodiment of the present disclosure, the folding region FA may be bent around a folding axis that extends in a direction parallel to or substantially parallel to the long side (e.g., long edge) of the electronic device 1000, such as in a direction parallel to or substantially parallel to the second direction DR2. When the electronic device 1000 is folded, the folding region FA may have a desired curvature (e.g., a given or predetermined curvature) and a desired radius of curvature (e.g., a given or predetermined radius of curvature). When the electronic device 1000 is folded, the first non-folding region NFA1 and the second non-folding region NFA2 may face each other. In this case, the electronic device 1000 may be folded inward so that the first display portion DA1-F is not exposed to the outside.

[0152] In an embodiment of the present disclosure, the electronic device 1000 may be externally foldable such that the first display portion DA1-F is exposed to the outside. In an embodiment of the present disclosure, the electronic device 1000 may support both an inward folding operation and an outward folding operation in an unfolded state, but the present disclosure is not limited thereto.

[0153] Figure 1A An example is shown in which one folding area FA is defined in the electronic device 1000, but the present disclosure is not limited thereto. For example, a plurality of folding axes and a plurality of folding areas corresponding to the plurality of folding axes may be defined in the electronic device 1000, and for each of the plurality of folding areas, the electronic device 1000 may be inwardly folded and / or outwardly folded in an unfolded state.

[0154] According to an embodiment of the present disclosure, at least one of the first display panel DP1 and the second display panel DP2 may sense an input of the pen PN even if a digitizer is not included therein. In other words, at least one of the first display panel DP1 and the second display panel DP2 may sense an input of the pen PN without using a digitizer. Therefore, since a digitizer for sensing the pen PN may not be included (for example, may be omitted), an increase in the thickness of the electronic device 1000 due to the digitizer may be prevented or substantially prevented, an increase in the weight of the electronic device 1000 due to the digitizer may be prevented or substantially prevented, and a reduction in the flexibility of the electronic device 1000 due to the digitizer may be prevented or substantially prevented. Accordingly, in some embodiments, both the first display panel DP1 and the second display panel DP2 may be designed to sense the pen PN.

[0155] Figure 2 is a perspective view of an electronic device 1000-1 according to an embodiment of the present disclosure. Figure 3 is a perspective view of an electronic device 1000-2 according to an embodiment of the present disclosure.

[0156] For convenience, Figure 2 an example is shown in which the electronic device 1000-1 is a mobile phone, and the electronic device 1000-1 may include a display panel DP. For convenience, Figure 3 an example is shown in which the electronic device 1000-2 is a notebook computer, and the electronic device 1000-2 may include a display panel DP. Although Figure 3 is a perspective view of the electronic device 1000-2, Figure 3 the coordinate axes included therein are shown based on the display panel DP within the electronic device 1000-2.

[0157] In an embodiment of the present disclosure, the display panel DP may sense various inputs applied from the outside (e.g., external inputs). The external input may be an input from a user. The input from the user may include various suitable types of external inputs, such as a part of the user's body (e.g., the user's finger), a pen PN (e.g., refer to Figure 1A ), light, heat, and / or pressure.

[0158] According to an embodiment of the present disclosure, even if the display panel DP may not include a digitizer, the display panel DP may sense an input of the pen PN. Therefore, since the digitizer for sensing the pen PN may not be included (e.g., may be omitted), an increase in the thickness of the electronic device 1000-1 or 1000-2 due to the digitizer can be prevented, and an increase in the weight of the electronic device 1000-1 or 1000-2 due to the digitizer can be prevented.

[0159] Figure 1A An example in which the electronic device 1000 is a foldable type device is shown in Figure 2 and an example in which the electronic device 1000-1 is a bar type device is shown in

[0160] Figure 4 . However, the present disclosure is not limited thereto. For example, embodiments of the electronic device described in more detail below may be applied to various suitable types of electronic devices, such as a rollable electronic device, a slidable electronic device, and a stretchable electronic device. Figure 4 The cross-sectional view shown in Figure 1A may be a cross-sectional view showing a part of the electronic device 1000 including the first display panel DP1 shown in

[0161] Refer to Figure 4 , the electronic device 1000 may include a first display panel DP1, an upper functional layer, and a lower functional layer. The upper functional layer may include various components disposed on the upper surface of the first display panel DP1, and the lower functional layer may include various components disposed on the lower surface of the first display panel DP1.

[0162] The first display panel DP1 may be a component that generates an image and senses an input applied from the outside (e.g., external input). For example, the first display panel DP1 may include a display layer 100 (e.g., refer to Figure 6 ) and a sensor layer 200 (e.g., refer to Figure 6 ).

[0163] The upper functional layer may include a protective layer PL, a window WD, a shock absorption layer DL, and a first adhesive layer PSA1, a second adhesive layer PSA2, and a third adhesive layer PSA3. However, the components included in the upper functional layer are not limited thereto. At least some of the above components may be omitted according to need or desire, and any other suitable components may also be included in the upper functional layer.

[0164] The protective layer PL may protect the components disposed thereunder. The thickness of the protective layer PL may be from 60 microns to 70 microns, such as 65 microns, for example, but the thickness of the protective layer PL is not limited thereto.

[0165] The protective layer PL may further include a hard coat, an anti-fingerprint layer, etc., to improve chemical resistance and abrasion resistance. For example, a hard coat as a functional layer for improving the use characteristics of the electronic device 1000 may be coated on the protective layer PL. For example, anti-fingerprint characteristics, anti-pollution characteristics, anti-scratch characteristics, etc. may be improved through the hard coat. For example, the thickness of the hard coat may be 5 microns, but the present disclosure is not limited thereto.

[0166] The window WD may be disposed under the protective layer PL. The first adhesive layer PSA1 may be interposed between the window WD and the protective layer PL. The thickness of the first adhesive layer PSA1 may be from 30 microns to 40 microns, such as 35 microns, for example, but the thickness of the first adhesive layer PSA1 is not limited thereto. In an embodiment of the present disclosure, a border pattern may be interposed between the first adhesive layer PSA1 and the protective layer PL.

[0167] The window WD may include an optically transparent insulating material. For example, the window WD may include a glass substrate or a synthetic resin film. The window WD may be a multi-layer structure or a single-layer structure. For example, the window WD may include a plurality of synthetic resin films joined to each other by an adhesive, or may include a glass substrate and a synthetic resin film joined to each other by an adhesive. When the window WD includes a glass substrate (for example, is a glass substrate), the thickness of the window WD may be 80 microns or less, such as 30 microns, for example, but the thickness of the window WD is not limited thereto.

[0168] The shock absorption layer DL may be disposed under the window WD. The second adhesive layer PSA2 may be interposed between the window WD and the shock absorption layer DL. The thickness of the second adhesive layer PSA2 may be from 70 microns to 80 microns, such as 75 microns, for example, but the thickness of the second adhesive layer PSA2 is not limited thereto.

[0169] The impact absorption layer DL can absorb the impact applied toward the first display panel DP1 and can protect the first display panel DP1. The impact absorption layer DL can be manufactured in the form of a stretchable film. For example, the impact absorption layer DL can include a flexible plastic material. The flexible plastic material can be defined as a synthetic resin film. For example, the impact absorption layer DL can include a flexible plastic material such as polyimide or polyethylene terephthalate. The thickness of the impact absorption layer DL can be 18 micrometers to 28 micrometers, such as 23 micrometers for example, but the thickness of the impact absorption layer DL is not limited thereto. In an embodiment of the present disclosure, the impact absorption layer DL can be omitted as needed or desired.

[0170] The third adhesive layer PSA3 can be interposed between the impact absorption layer DL and the first display panel DP1. The thickness of the third adhesive layer PSA3 can be 45 micrometers to 55 micrometers, such as 50 micrometers for example, but the thickness of the third adhesive layer PSA3 is not limited thereto.

[0171] The lower functional layer can include a protective film PF, a plate PLT, a cover layer CVL, a shielding layer MMP, a lower sheet CUS, an insulating film PET, step compensation members ARS1, ARS2, and ARS3, and fourth, fifth, and sixth adhesive layers PSA4, PSA5, and PSA6. However, the components included in the lower functional layer are not limited thereto. At least some of the above components can be omitted as needed or desired, and any other suitable components can also be included in the lower functional layer.

[0172] The protective film PF can be connected to (e.g., attached to or coupled to) the rear surface of the first display panel DP1 through the fourth adhesive layer PSA4. The thickness of the fourth adhesive layer PSA4 can be 20 micrometers to 30 micrometers, such as 25 micrometers for example, but the thickness of the fourth adhesive layer PSA4 is not limited thereto.

[0173] The protective film PF can prevent or substantially prevent the rear surface of the first display panel DP1 from being scratched during the process of manufacturing the first display panel DP1. The protective film PF can be a colored polyimide film. For example, the protective film PF can be an opaque yellow film, but the present disclosure is not limited thereto. The thickness of the protective film PF can be 45 micrometers to 55 micrometers, such as 50 micrometers for example, but the thickness of the protective film PF is not limited thereto.

[0174] The plate PLT can be disposed under the protective film PF. The fifth adhesive layer PSA5 can be interposed between the plate PLT and the protective film PF. The thickness of the fifth adhesive layer PSA5 can be 11 micrometers to 21 micrometers, such as 16 micrometers for example, but the thickness of the fifth adhesive layer PSA5 is not limited thereto.

[0175] The plate PLT may include carbon fiber reinforced plastic (CFRP), metal, or a metal alloy. The plate PLT may support components disposed thereon. The opening P-H may be defined (e.g., formed or provided) in a part of the plate PLT. For example, the plate PLT may include an opening P-H having a shape that penetrates the upper and lower surfaces of the plate PLT. The opening P-H may be defined in a region overlapping with the folding region FA. In a plan view, or in other words, for example, when viewed in the third direction DR3 or the thickness direction of the plate PLT, the opening P-H may overlap with the folding region FA. The shape of the part of the plate PLT may be more easily changed (e.g., more easily folded and unfolded) by the opening P-H. The thickness of the plate PLT may be from 160 micrometers to 180 micrometers, such as 170 micrometers for example, but the thickness of the plate PLT is not limited thereto.

[0176] The cover layer CVL may be attached to the plate PLT. The cover layer CVL may cover the opening P-H of the plate PLT. Thus, the cover layer CVL may prevent or substantially prevent foreign materials from being introduced into the opening P-H. The cover layer CVL may include thermoplastic polyurethane, but the present disclosure is not limited thereto. The thickness of the cover layer CVL may be from 11 micrometers to 21 micrometers, such as 16 micrometers for example, but the thickness of the cover layer CVL is not limited thereto.

[0177] The shielding layer MMP may be disposed under the plate PLT and the cover layer CVL. The sixth adhesive layer PSA6 may be interposed between the shielding layer MMP and the plate PLT. The thickness of the sixth adhesive layer PSA6 may be from 15 micrometers to 25 micrometers, such as 20 micrometers for example, but the thickness of the sixth adhesive layer PSA6 is not limited thereto.

[0178] The shielding layer MMP may include magnetic metal powder. The shielding layer MMP may be referred to as a "ferrite sheet", "magnetic metal powder layer", "magnetic layer", "magnetic circuit layer", or "magnetic path layer". The shielding layer MMP may shield the magnetic field passing through the first display panel DP1. For example, the shielding layer MMP may function in guiding the direction of the magnetic field passing through to any other suitable direction. Thus, the magnetic field reaching the shielding layer MMP may be shielded without leaking to the outside, such as leaking downward to the shielding layer MMP. The thickness of the shielding layer MMP may be from 53 micrometers to 63 micrometers, such as 58 micrometers for example, but the thickness of the shielding layer MMP is not limited thereto.

[0179] The lower sheet CUS may be disposed under the shielding layer MMP. The lower sheet CUS may be a sheet that functions in reflecting the magnetic field toward the shielding layer MMP. The lower sheet CUS may include metal or a metal alloy; for example, the lower sheet CUS may include aluminum, copper, or a copper alloy. The thickness of the lower sheet CUS may be from 15 micrometers to 25 micrometers, such as 20 micrometers for example, but the thickness of the lower sheet CUS is not limited thereto.

[0180] An insulating film PET may be disposed under the lower sheet CUS. The insulating film PET may include polyethylene terephthalate, but the present disclosure is not limited thereto. The insulating film PET may prevent or substantially prevent the introduction of static electricity. For example, the insulating film PET may prevent electrical interference between components disposed above the insulating film PET and components disposed under the insulating film PET. The thickness of the insulating film PET may be from 3 micrometers to 9 micrometers, such as, for example, 6 micrometers, but the thickness of the insulating film PET is not limited thereto.

[0181] The step compensation members ARS1, ARS2, and ARS3 may include a first step compensation member ARS1 attached to the insulating film PET, a second step compensation member ARS2 attached to the shielding layer MMP, and a third step compensation member ARS3 attached to the shielding layer MMP. The thickness of each of the first step compensation member ARS1, the second step compensation member ARS2, and the third step compensation member ARS3 may be determined differently according to the product structure or the placement relationship of the components. For example, the thickness of the first step compensation member ARS1 may be 90 micrometers, the thickness of the second step compensation member ARS2 may be 87 micrometers, and the thickness of the third step compensation member ARS3 may be 87 micrometers, but the thickness of each of the first step compensation member ARS1, the second step compensation member ARS2, and the third step compensation member ARS3 is not limited thereto.

[0182] In an embodiment of the present disclosure, each of the sixth adhesive layer PSA6, the shielding layer MMP, the lower sheet CUS, and the insulating film PET may be divided in a region overlapping with the folding region FA. For example, each of the sixth adhesive layer PSA6, the shielding layer MMP, the lower sheet CUS, and the insulating film PET may be divided into two or more components spaced apart from each other by a gap (e.g., a given or predetermined gap) in a region overlapping with the folding region FA. The gap may be from 0.6 mm to 1.7 mm, but the present disclosure is not limited thereto.

[0183] Figure 5A is a cross-sectional view of an electronic device 1000-1 according to an embodiment of the present disclosure.

[0184] Reference Figure 5A, the electronic device 1000-1 may include a display panel DP, an upper functional layer, and a lower functional layer. The upper functional layer may include a window WDa, an adhesive layer OCA, and an antireflection layer POL. The lower functional layer may include a protective film PFa, a first lower layer CSL, a shielding layer MMP, a second lower layer CUSa, a fingerprint sensor FOD, and a cover layer F-CL. The components included in the upper functional layer and the components included in the lower functional layer are not limited to the above components. At least some of the above components may be omitted as needed or desired, and / or any other suitable components may also be included in the upper functional layer and / or the lower functional layer.

[0185] The window WDa may include an optically transparent insulating material. For example, the window WDa may include a glass substrate or a synthetic resin film, and may have a multi-layer structure or a single-layer structure. For example, the window WDa may be a glass substrate. In this case, the thickness of the window WDa may be from 0.43 mm to 0.53 mm, such as 0.48 mm for example, but the thickness of the window WDa is not limited thereto.

[0186] The antireflection layer POL may be disposed under the window WDa. The adhesive layer OCA may be interposed between the antireflection layer POL and the window WDa. The thickness of the adhesive layer OCA may be from 0.10 mm to 0.20 mm, such as 0.15 mm for example, but the thickness of the adhesive layer OCA is not limited thereto.

[0187] The antireflection layer POL may reduce the reflectivity of external light incident from the outside of the electronic device 1000-1. The antireflection layer POL may include a stretched synthetic resin film. For example, the antireflection layer POL may be realized by dyeing a polyvinyl alcohol (PVA) film with an iodine compound. However, the present disclosure is not limited thereto. For example, the material of the antireflection layer POL is not limited to the above examples. The thickness of the antireflection layer POL may be from 50 microns to 60 microns, such as 55 microns for example, but the thickness of the antireflection layer POL is not limited thereto.

[0188] In an embodiment of the present disclosure, the antireflection layer POL may be omitted. In another embodiment, the antireflection layer POL may be embedded in the display panel DP. In this case, the antireflection layer POL may include a partition layer for blocking light and a plurality of color filters, or may include an optical layer for preventing or substantially preventing reflection and a partition layer for blocking light.

[0189] The protective film PFa may be connected to (e.g., attached to or coupled to) the rear surface of the display panel DP. The thickness of the protective film PFa may be from 83 microns to 93 microns, such as 88 microns for example, but the thickness of the protective film PFa is not limited thereto.

[0190] The first lower layer CSL may be disposed under the protective film PFa. The first lower layer CSL may have a multi-layer structure. For example, the first lower layer CSL may include an embo sheet and a cushion layer. The embo sheet may absorb light passing through the display panel DP. In addition, in order to prevent or substantially prevent the generation of bubbles when the first lower layer CSL is attached to the protective film PFa, the embo sheet may include an embo pattern. The cushion layer may protect the display panel DP from the impact transmitted from under the cushion layer. The impact resistance characteristics of the electronic device 1000-1 may be improved by the cushion layer.

[0191] An opening may be defined in the first lower layer CSL, and a fingerprint sensor FOD may be disposed in the opening. The fingerprint sensor FOD may be attached to the protective film PFa. In an embodiment of the present disclosure, the fingerprint sensor FOD and the opening may be omitted.

[0192] The shielding layer MMP may be disposed under the first lower layer CSL. The shielding layer MMP may shield the magnetic field passing through the display panel DP. Therefore, the magnetic field reaching the shielding layer MMP may be shielded and not leak to the outside, for example, not leak downward from the shielding layer MMP to the outside. The thickness of the shielding layer MMP may be 20 micrometers to 30 micrometers, for example, 25 micrometers, but the thickness of the shielding layer MMP is not limited thereto.

[0193] The second lower layer CUSa may be disposed under the shielding layer MMP. The second lower layer CUSa may include a metal or a metal alloy. For example, the second lower layer CUSa may include aluminum, copper, or a copper alloy. The thickness of the second lower layer CUSa may be 7 micrometers to 17 micrometers, for example, 12 micrometers, but the thickness of the second lower layer CUSa is not limited thereto.

[0194] Openings corresponding to the area where the fingerprint sensor FOD is disposed may be defined in the shielding layer MMP and the second lower layer CUSa. A cover layer F-CL may be disposed in the openings defined in the shielding layer MMP and the second lower layer CUSa, and may cover the opening defined in the first lower layer CSL. In other words, the cover layer F-CL may be attached to the first lower layer CSL to cover the fingerprint sensor FOD. In an embodiment, the cover layer F-CL may include a first cover layer MMP-1 and a second cover layer CUS-1, the first cover layer MMP-1 includes the same material as the shielding layer MMP, and the second cover layer CUS-1 includes the same material as the second lower layer CUSa.

[0195] Figure 5B is a cross-sectional view of an electronic device 1000-1a according to an embodiment of the present disclosure. In Figure 5B , as referred to above Figure 5AComponents that are the same or substantially the same as the described components are represented by the same reference marks / symbols, and thus, redundant descriptions may not be repeated.

[0196] Reference Figure 5B , the electronic device 1000-1a may not include the cover layer F-CL (e.g., reference Figure 5A ). The fingerprint sensor FOD may be covered by the sensing circuit board C-FPC that controls the operation of the fingerprint sensor FOD.

[0197] Openings corresponding to the area where the fingerprint sensor FOD is provided may be defined in the shielding layer MMP and the second lower layer CUSa. The sensing circuit board C-FPC may be disposed in the openings defined in the shielding layer MMP and the second lower layer CUSa, and may cover the openings defined in the first lower layer CSL. For example, the sensing circuit board C-FPC may overlap with the fingerprint sensor FOD and may be connected to (e.g., attached to or coupled to) the first lower layer CSL.

[0198] Figure 6 is a cross-sectional view of the display panel DP according to an embodiment of the present disclosure.

[0199] Reference Figure 6 , the display panel DP may include a display layer 100 and a sensor layer 200.

[0200] The display layer 100 may be a component that generates or substantially generates an image. The display layer 100 may be a light-emitting display layer. For example, the display layer 100 may be an organic light-emitting display layer, an inorganic light-emitting display layer, an organic-inorganic light-emitting display layer, a quantum dot display layer, a micro LED display layer, or a nano LED display layer. The display layer 100 may include a base layer 110, a circuit layer 120, a light-emitting element layer 130, and a packaging layer 140.

[0201] The base layer 110 may be a member that provides a base surface on which the circuit layer 120 is provided. The base layer 110 may be a multi-layer structure or a single-layer structure. The base layer 110 may be implemented with a glass substrate, a metal substrate, a silicon substrate, or a polymer substrate, but the present disclosure is not limited thereto.

[0202] The circuit layer 120 may be disposed on the base layer 110. The circuit layer 120 may include an insulating layer, a semiconductor pattern, a conductive pattern, signal lines, etc. The insulating layer, the semiconductor layer, and the conductive layer may be formed on the base layer 110 by a coating or deposition process, and then the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned by a plurality of lithography processes.

[0203] The light-emitting element layer 130 may be disposed on the circuit layer 120. The light-emitting element layer 130 may include light-emitting elements. For example, the light-emitting element layer 130 may include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, quantum dots, quantum rods, micro LEDs, or nano LEDs.

[0204] The encapsulation layer 140 may be disposed on the light-emitting element layer 130. The encapsulation layer 140 may protect the light-emitting element layer 130 from foreign substances such as moisture, oxygen, and / or dust particles.

[0205] The sensor layer 200 may be disposed on the display layer 100. The sensor layer 200 may sense an external input applied from the outside. The sensor layer 200 may be a sensor integrally formed continuously in the process of manufacturing the display layer 100, or the sensor layer 200 may be an external sensor attached to the display layer 100. The sensor layer 200 may be referred to as a "sensor", an "input sensing layer", an "input sensing panel", or an "electronic device dedicated to sensing input coordinates".

[0206] According to an embodiment of the present disclosure, the sensor layer 200 may sense both an input provided by a passive input device such as a user's body and an input provided by an input device that generates a magnetic field having a suitable resonance frequency (e.g., a given or predetermined resonance frequency). The input device may be referred to as a "pen", an "input pen", a "magnetic pen", a "stylus", or an "electromagnetic resonance pen".

[0207] Figure 7 It is a diagram showing the operation of the electronic device 1000 according to an embodiment of the present disclosure.

[0208] Reference Figure 7 , the electronic device 1000 may include a display layer 100, a sensor layer 200, a display driver 100C (e.g., a first driver circuit), a sensor driver 200C (e.g., a second driver circuit), a main driver 1000C (e.g., a third driver circuit), and a power supply circuit 1000P.

[0209] The sensor layer 200 may sense a first input 2000 or a second input 3000 applied from the outside. Each of the first input 2000 and the second input 3000 may be an input device capable of providing a capacitance change in the sensor layer 200, or may be an input device capable of inducing a current in the sensor layer 200. For example, the first input 2000 may be a passive input device such as a user's body. The second input 3000 may be an input of a pen PN or an input of an RFIC tag. For example, the pen PN may be a passive pen or an active pen.

[0210] In an embodiment of the present disclosure, the pen PN may be a device that generates a magnetic field with a suitable resonance frequency (e.g., a given or predetermined resonance frequency). The pen PN may transmit an output signal based on an electromagnetic resonance method. The pen PN may be referred to as an "input device", "input pen", "magnetic pen", "stylus", or "electromagnetic resonance pen".

[0211] The pen PN may include an RLC resonance circuit, and the RLC resonance circuit may include an inductor L and a capacitor C. In an embodiment of the present disclosure, the RLC resonance circuit may be a variable resonance circuit with a variable resonance frequency. In this case, the inductor L may be a variable inductor, and / or the capacitor C may be a variable capacitor. However, the present disclosure is not limited thereto.

[0212] The inductor L generates a current based on the magnetic field formed in the sensor layer 200. However, the present disclosure is not limited thereto. For example, when the pen PN operates in an active type, even without a magnetic field provided from the outside, the pen PN may generate a current. The generated current is transmitted to the capacitor C. The capacitor C charges the current transmitted from the inductor L and discharges the charged current to the inductor L. Then, the inductor L may form a magnetic field with a resonance frequency. The induced current may flow in the sensor layer 200 through the magnetic field formed by the pen PN, and the induced current may be transmitted to the sensor driver 200C as a received signal (e.g., a sensed signal or a signal).

[0213] The main driver 1000C may control the overall operation of the electronic device 1000. For example, the main driver 1000C may control the operations of the display driver 100C and the sensor driver 200C. The main driver 1000C may include at least one microprocessor. The main driver 1000C may also include a graphics processor. The main driver 1000C may be referred to as an "application processor", "central processing unit", or "main processor".

[0214] The display driver 100C may drive the display layer 100. The display driver 100C may receive image data and control signals from the main driver 1000C. The control signals may include various suitable signals. For example, the control signals may include an input vertical synchronization signal, an input horizontal synchronization signal, a main clock signal, a data enable signal, etc.

[0215] The sensor driver 200C may drive the sensor layer 200. The sensor driver 200C may receive control signals from the main driver 1000C. The control signals may include a clock signal for the sensor driver 200C. In addition, the control signals may further include a mode selection signal for selecting a driving mode of the sensor driver 200C and the sensor layer 200.

[0216] The sensor driver 200C can be implemented with an integrated circuit (IC) and can be electrically connected to the sensor layer 200. For example, the sensor driver 200C can be directly mounted in a suitable area (e.g., a given or predetermined area) of the display panel, or for electrical connection to the sensor layer 200, the sensor driver 200C can be mounted on a separate printed circuit board in a chip - on - film (COF) manner.

[0217] The sensor driver 200C and the sensor layer 200 can operate selectively in a first mode or a second mode. For example, the first mode can be a mode of sensing a touch input (e.g., such as the first input 2000). The second mode can be a mode of sensing an input of a pen PN (e.g., such as the second input 3000). The first mode can be referred to as a "touch sensing mode", while the second mode can be referred to as a "pen sensing mode".

[0218] The switching (e.g., changing, converting, etc.) between the first mode and the second mode can be performed in various suitable ways. For example, the sensor driver 200C and the sensor layer 200 can be driven in the first mode and the second mode in a time - division manner and can sense the first input 2000 and the second input 3000. As another example, the switching between the first mode and the second mode can be performed by a user's selection or by a user's specific action. As another example, one of the first mode and the second mode can be enabled or disabled by activating or deactivating a specific application, or the switching from the first mode to the second mode or from the second mode to the first mode can be performed. As another example, when the sensor driver 200C and the sensor layer 200 operate alternately in the first mode and the second mode, the first mode can be maintained when the first input 2000 is sensed, or the second mode can be maintained when the second input 3000 is sensed.

[0219] The sensor driver 200C can calculate coordinate information of the input based on the signal received from the sensor layer 200 and can provide a coordinate signal including the coordinate information to the main driver 1000C. The main driver 1000C performs an operation corresponding to the user input based on the coordinate signal. For example, the main driver 1000C can drive the display driver 100C so as to display a new application image in the display layer 100.

[0220] The power supply circuit 1000P can include a power management integrated circuit (PMIC). The power supply circuit 1000P can generate a plurality of driving voltages for driving the display layer 100, the sensor layer 200, the display driver 100C, and the sensor driver 200C. For example, the plurality of driving voltages can include a high gate voltage, a low gate voltage, a first driving voltage, a second driving voltage, an initialization voltage, etc., but the present disclosure is not limited thereto.

[0221] Figure 8 It is a cross-sectional view of a display panel DP according to an embodiment of the present disclosure.

[0222] Reference Figure 8 , at least one buffer layer BFL is formed on the upper surface of the base layer 110. The buffer layer BFL can improve the bonding force between the base layer 110 and the semiconductor pattern. The buffer layer BFL can be formed as a multi-layer structure. As another example, the display layer 100 may further include a barrier layer. The buffer layer BFL may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. For example, the buffer layer BFL may include a structure in which a silicon oxide layer and a silicon nitride layer are alternately stacked with each other.

[0223] A semiconductor pattern (e.g., SC, AL, DR, SCL) may be disposed on the buffer layer BFL. The semiconductor pattern (e.g., SC, AL, DR, SCL) may include polysilicon. However, the present disclosure is not limited thereto. For example, the semiconductor pattern (e.g., SC, AL, DR, SCL) may include amorphous silicon, low-temperature polysilicon, or an oxide semiconductor.

[0224] Figure 8 A part of the semiconductor pattern (e.g., SC, AL, DR, SCL) is shown, and the semiconductor pattern (e.g., SC, AL, DR, SCL) may also be disposed in any other suitable area. The semiconductor pattern (e.g., SC, AL, DR, SCL) may be arranged across pixels according to a specific rule. The electrical characteristics of the semiconductor pattern (e.g., SC, AL, DR, SCL) may be determined differently depending on whether it is doped. The semiconductor pattern (e.g., SC, AL, DR, SCL) may include a first region (e.g., SC, DR, SCL) having a relatively high conductivity and a second region AL having a relatively low conductivity. The first region (e.g., SC, DR, SCL) may be doped with an N-type dopant or a P-type dopant. The P-type transistor may include a region doped with a P-type dopant, and the N-type transistor may include a region doped with an N-type dopant. The second region AL may be an undoped region or may be a doped region having a lower concentration than that of the first region (e.g., SC, DR, SCL).

[0225] The conductivity of the first region (e.g., SC, DR, SCL) can be greater than that of the second region AL and can be used as or substantially used as an electrode or a signal line. The second region AL can correspond to or substantially correspond to the active region (e.g., channel) AL of the transistor 100PC. In other words, a part AL of the semiconductor pattern (e.g., SC, AL, DR, SCL) can be the active region AL of the transistor 100PC, another part (e.g., SC, DR) can be the source region SC or the drain region DR of the transistor 100PC, and another part SCL can be the connection electrode or the connection signal line SCL.

[0226] Each pixel can be represented by an equivalent circuit including seven transistors, one capacitor, and a light-emitting element, but the equivalent circuit of the pixel can be modified in various suitable forms. Figure 8 One transistor 100PC and one light-emitting element 100PE included in the pixel are shown as a representative example.

[0227] The source region SC, the active region AL, and the drain region DR of the transistor 100PC can be formed of a semiconductor pattern (e.g., SC, AL, DR, SCL). In a cross-sectional view, the source region SC and the drain region DR can extend in a direction away from each other from the active region AL. Figure 8 A part of the connection signal line SCL formed of a semiconductor pattern (e.g., SC, AL, DR, SCL) is shown. In a plan view, the connection signal line SCL can be connected to the drain region DR of the transistor 100PC.

[0228] The first insulating layer 10 can be provided on the buffer layer BFL. The first insulating layer 10 can commonly overlap multiple pixels and can cover the semiconductor pattern (e.g., SC, AL, DR, SCL). The first insulating layer 10 can be an inorganic layer and / or an organic layer and can have a single-layer structure or a multi-layer structure. The first insulating layer 10 can include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In an embodiment, the first insulating layer 10 can be a single silicon oxide layer. In addition to the first insulating layer 10, the insulating layer of the circuit layer 120 described in more detail below can also be an inorganic layer and / or an organic layer and can have a single-layer structure or a multi-layer structure. The inorganic layer can include at least one of the above materials, but the present disclosure is not limited thereto.

[0229] The gate GT of the transistor 100PC is provided on the first insulating layer 10. The gate GT can be a part of a metal pattern. The gate GT overlaps the active region AL. In the process of doping or reducing the semiconductor pattern (e.g., SC, AL, DR, SCL), the gate GT can act as a mask.

[0230] The second insulating layer 20 may be disposed on the first insulating layer 10 and may cover the gate GT. The second insulating layer 20 may overlap the pixels in common. The second insulating layer 20 may be an inorganic layer and / or an organic layer and may have a single-layer structure or a multi-layer structure. The second insulating layer 20 may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. In an embodiment, the second insulating layer 20 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0231] The third insulating layer 30 may be disposed on the second insulating layer 20. The third insulating layer 30 may have a single-layer structure or a multi-layer structure. In an embodiment, the third insulating layer 30 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0232] The first connection electrode CNE1 may be disposed on the third insulating layer 30. The first connection electrode CNE1 may be connected to the connection signal line SCL through a contact hole CNT-1 that penetrates the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30.

[0233] The fourth insulating layer 40 may be disposed on the third insulating layer 30. The fourth insulating layer 40 may be a single silicon oxide layer. The fifth insulating layer 50 may be disposed on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.

[0234] The second connection electrode CNE2 may be disposed on the fifth insulating layer 50. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 through a contact hole CNT-2 that penetrates the fourth insulating layer 40 and the fifth insulating layer 50.

[0235] The sixth insulating layer 60 may be disposed on the fifth insulating layer 50 and may cover the second connection electrode CNE2. The sixth insulating layer 60 may be an organic layer.

[0236] The light-emitting element layer 130 may be disposed on the circuit layer 120. The light-emitting element layer 130 may include a light-emitting element 100PE. For example, the light-emitting element layer 130 may include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, quantum dots, quantum rods, micro LEDs, or nano LEDs. An example in which the light-emitting element 100PE is an organic light-emitting element will be described in more detail below, but the present disclosure is not limited thereto.

[0237] The light-emitting element 100PE includes a first electrode AE, an emission layer EL, and a second electrode CE.

[0238] The first electrode AE may be disposed on the sixth insulating layer 60. The first electrode AE may be connected to the second connection electrode CNE2 through a contact hole CNT-3 that penetrates the sixth insulating layer 60.

[0239] The pixel defining layer 70 may be disposed on the sixth insulating layer 60 and may cover a part of the first electrode AE. An opening 70-OP is defined in the pixel defining layer 70. The opening 70-OP of the pixel defining layer 70 exposes at least a part of the first electrode AE.

[0240] The first display portion DA1-F (e.g., refer to Figure 1A ) may include an emission region PXA and a non-emission region NPXA adjacent to the emission region PXA. The non-emission region NPXA may surround the emission region PXA (e.g., around its periphery). In an embodiment, the emission region PXA is defined to correspond to a partial region of the first electrode AE exposed by the opening 70-OP.

[0241] The emission layer EL may be disposed on the first electrode AE. The emission layer EL may be disposed in the region defined by the opening 70-OP. In other words, the emission layer EL may be formed independently for each pixel. When the emission layer EL is formed independently for each pixel, each of the emission layers EL may emit light of at least one of blue, red, and green. However, the present disclosure is not limited thereto. For example, the emission layer EL may have an integral shape and may be commonly included in a plurality of pixels. In this case, the emission layer EL may provide blue light or may provide white light.

[0242] The second electrode CE may be disposed on the emission layer EL. The second electrode CE may have an integral shape and may be commonly included in a plurality of pixels.

[0243] In an embodiment of the present disclosure, a hole control layer may be interposed between the first electrode AE and the emission layer EL. The hole control layer may be commonly disposed in the emission region PXA and the non-emission region NPXA. The hole control layer may at least include a hole transport layer and may further include a hole injection layer. An electron control layer may be interposed between the emission layer EL and the second electrode CE. The electron control layer may at least include an electron transport layer and may further include an electron injection layer. The hole control layer and the electron control layer may be commonly formed in a plurality of pixels by using an opening mask or an inkjet process.

[0244] The encapsulation layer 140 may be disposed on the light-emitting element layer 130. The encapsulation layer 140 may include an inorganic layer, an organic layer, and an inorganic layer stacked on each other in sequence, but the layers constituting the encapsulation layer 140 are not limited thereto. The inorganic layer may protect the light-emitting element layer 130 from the effects of moisture and oxygen, and the organic layer may protect the light-emitting element layer 130 from foreign materials such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylic-based organic layer, but the present disclosure is not limited thereto.

[0245] The sensor layer 200 may include a base layer 201, a first conductive layer 202, an intermediate insulating layer 203, a second conductive layer 204, and a cover insulating layer 205.

[0246] The base layer 201 may be an inorganic layer including at least one of silicon nitride, silicon oxynitride, and silicon oxide. As another example, the base layer 201 may be an organic layer including an epoxy resin, an acrylate resin, or an imide-based resin. The base layer 201 may have a single-layer structure, or may have a structure in which a plurality of layers are stacked in the third direction DR3.

[0247] Each of the first conductive layer 202 and the second conductive layer 204 may have a single-layer structure, or may have a structure in which a plurality of layers are stacked in the third direction DR3.

[0248] Each of the first conductive layer 202 and the second conductive layer 204 having a single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or a suitable alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). In addition, the transparent conductive layer may include a conductive polymer such as poly(3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, graphene, etc.

[0249] Each of the first conductive layer 202 and the second conductive layer 204 having a multi-layer structure may include a plurality of metal layers. The metal layer may have, for example, a three-layer structure of titanium / aluminum / titanium. The conductive layer having a multi-layer structure may include at least one metal layer and at least one transparent conductive layer.

[0250] At least one of the intermediate insulating layer 203 and the cover insulating layer 205 may include an inorganic layer. The inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0251] At least one of the intermediate insulating layer 203 and the cover insulating layer 205 may include an organic layer. The organic layer may include at least one of an acrylic-based resin, a methacrylic-based resin, polyisoprene, an ethylene-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a siloxane-based resin, a polyimide-based resin, a polyamide-based resin, and a perylene-based resin.

[0252] Fig. 9 is a plan view of the sensor layer 200 according to an embodiment of the present disclosure. Fig.10 is an enlarged plan view showing one sensing unit SU according to an embodiment of the present disclosure. Fig.11Ais a plan view showing a first conductive layer 202SU of a sensing unit SU according to an embodiment of the present disclosure. Fig. 11B is a plan view showing a second conductive layer 204SU of a sensing unit SU according to an embodiment of the present disclosure. Fig.12 is a cross-sectional view of a sensor layer 200 taken along Fig.11A and Fig. 11B line I-I' according to an embodiment of the present disclosure.

[0253] Referring to Fig. 9 , a sensing region 200A and a peripheral region 200NA adjacent to the sensing region 200A can be defined in the sensor layer 200. The width of the sensing region 200A in a first direction DR1 can be less than the width of the sensing region 200A in a second direction DR2 that intersects the first direction DR1.

[0254] The sensor layer 200 can include a plurality of first electrodes (also referred to as first sensing electrodes) 210, a plurality of second electrodes (also referred to as second sensing electrodes) 220, a plurality of third electrodes 230, and a plurality of fourth electrodes 240 disposed in the sensing region 200A.

[0255] Each of the plurality of first electrodes 210 can cross or intersect with the plurality of second electrodes 220. Each of the plurality of first electrodes 210 can extend in the second direction DR2, and the plurality of first electrodes 210 can be arranged to be spaced apart from each other in the first direction DR1. Each of the plurality of second electrodes 220 can extend in the first direction DR1, and the plurality of second electrodes 220 can be arranged to be spaced apart from each other in the second direction DR2. A sensing unit SU of the sensor layer 200 can refer to a region where one first electrode 210 and one second electrode 220 cross each other. The length of the first electrode 210 can be longer than the length of the second electrode 220.

[0256] In Fig. 9 , six first electrodes 210 and ten second electrodes 220 are shown as examples, and sixty sensing units SU are shown as examples. However, the number of the first electrodes 210 and the number of the second electrodes 220 are not limited thereto.

[0257] Referring to Fig. 9 and Fig.10 , each of the first electrodes 210 can include first partition electrodes 210dv1 and 210dv2. The first partition electrodes 210dv1 and 210dv2 can extend in the second direction DR2 and can be spaced apart from each other in the first direction DR1. The first partition electrodes 210dv1 and 210dv2 can be symmetric with respect to a line extending in the second direction DR2.

[0258] Each of the plurality of second electrodes 220 may include second separated electrodes 220dv1 and 220dv2. The second electrodes 220 may extend in a first direction DR1 and may be spaced apart from each other in a second direction DR2. The second separated electrodes 220dv1 and 220dv2 may be symmetric or substantially symmetric with respect to a line extending in the first direction DR1.

[0259] Reference Fig.10 、 Fig.11A 、 Fig. 11B and Fig.12 and, each of the second separated electrodes 220dv1 and 220dv2 may include a sensing pattern 221 and a bridging pattern 222. The sensing pattern 221 and the bridging pattern 222 may be disposed at different layers from each other (e.g., in different layers or on a layer), and the sensing pattern 221 and the bridging pattern 222 may be electrically connected to each other through a first contact portion CNa. For example, the bridging pattern 222 may be included in a first conductive layer 202SU, and the sensing pattern 221 and the first separated electrodes 210dv1 and 210dv2 may be included in a second conductive layer 204SU. The first conductive layer 202SU may be included in the Figure 8 first conductive layer 202 of Figure 8 and the second conductive layer 204SU may be included in the

[0260] second conductive layer 204 of

[0261] Fig. 9 An example in which one of the third electrodes 230 includes two first auxiliary electrodes 230s is shown in

[0262] The coupling capacitor may be defined between a first electrode 210 and a first auxiliary electrode 230s. In this case, the induced current generated when sensing the pen may be transmitted from the first auxiliary electrode 230s to the first electrode 210 through the coupling capacitor. In other words, the first auxiliary electrode 230s may serve to supplement the signal transmitted from the first electrode 210 to the sensor driver 200C. Therefore, when the phase of the signal induced in the first auxiliary electrode 230s matches the phase of the signal induced in the first electrode 210, the maximum effect can be obtained. Accordingly, the center of each of the first electrodes 210 in the second direction DR2 and the center of each of the corresponding first auxiliary electrodes 230s in the second direction DR2 may overlap with each other. In addition, the center of each of the first electrodes 210 in the first direction DR1 and the center of each of the corresponding first auxiliary electrodes 230s in the first direction DR1 may overlap with each other.

[0263] In an embodiment of the present disclosure, since one third electrode 230 includes two first auxiliary electrodes 230s, one third electrode 230 may correspond to two first electrodes 210 (e.g., overlap therewith). Accordingly, the number of the first electrodes 210 included in the sensor layer 200 may be greater than the number of the third electrodes 230. For example, the number of the first electrodes 210 may be equal to the product of the number of the third electrodes 230 included in the sensor layer 200 and the number of the first auxiliary electrodes 230s included in each of the third electrodes 230. In Fig. 9 the example, the number of the first electrodes 210 may be six (6), the number of the third electrodes 230 may be three (3), and the number of the first auxiliary electrodes 230s included in each of the third electrodes 230 may be two (2).

[0264] Each of the fourth electrodes 240 may be arranged along the second direction DR2. Each of the fourth electrodes 240 may extend in the first direction DR1. In an embodiment of the present disclosure, the fourth electrode 240 may include second auxiliary electrodes (also referred to as second electrodes) 240s1 and 240s2 that are electrically connected to each other. The second auxiliary electrode 240s1 may be referred to as the "2 - first auxiliary electrode 240s1", and the second auxiliary electrode 240s2 may be referred to as the "2 - second auxiliary electrode 240s2".

[0265] The wiring direction of the second auxiliary electrode 240s1 may be different from the wiring direction of the second auxiliary electrode 240s2. In Fig. 9 the example, two fourth electrodes 240 and five second auxiliary electrodes 240s1 or 240s2 included in each of the fourth electrodes 240 are shown as a representative example.

[0266] As used herein, when the wiring directions are said to be different from each other, the connection positions of the electrodes to the traces are different from each other. For example, the connection position where the second auxiliary electrode 240s1 is electrically connected to the fourth trace 240t-1 may be different from the connection position where the second auxiliary electrode 240s2 is electrically connected to the fourth trace 240t-2. The first connection position may correspond to the left end of the second auxiliary electrode 240s1, and the second connection position may correspond to the right end of the second auxiliary electrode 240s2.

[0267] In an embodiment of the present disclosure, the sensor layer 200 may include one fourth electrode. In this case, the fourth electrode may include 10 (ten) second auxiliary electrodes electrically connected in parallel with each other. Fig. 9 The number of the second auxiliary electrodes shown is provided as a representative example, and the number of the second auxiliary electrodes included in the fourth electrode is not limited thereto.

[0268] Fig. 9 An example is shown in which five second auxiliary electrodes 240s1 are electrically connected to each other at the left end and five second auxiliary electrodes 240s2 are electrically connected to each other at the right end. In other words, the ratio of the area of one fourth electrode 240 to the area of another fourth electrode 240, or the ratio of the number of the second auxiliary electrodes included in one fourth electrode 240 to the number of the second auxiliary electrodes included in the other fourth electrode 240 may be 1:1. However, the present disclosure is not limited thereto. For example, the second auxiliary electrode 240s1 and the second auxiliary electrode 240s2 may be different in number from each other.

[0269] In an embodiment of the present disclosure, when each of the fourth electrodes 240 includes the second auxiliary electrodes 240s1 or 240s2 connected in parallel with each other, the area of one fourth electrode 240 can be increased. In addition, the resistance of each of the fourth electrodes 240 can be reduced, and thus, the sensitivity of the sensing of the second input 3000 (e.g., refer to Figure 7 ) can be improved. The length of the first auxiliary electrode 230s may be longer than the length of the second auxiliary electrode 240s1 or 240s.

[0270] The coupling capacitor may be defined between a second electrode 220 and a second auxiliary electrode 240s1. In this case, the induced current generated when sensing the pen can be transmitted from the second auxiliary electrode 240s1 to the second electrode 220 through the coupling capacitor. In other words, the second auxiliary electrode 240s1 may serve to supplement the signal transmitted from the second electrode 220 to the sensor driver 200C. Therefore, when the phases of the signals induced in the second auxiliary electrode 240s1 and the signals induced in the second electrode 220 match each other, the maximum effect can be obtained. Thus, the center of each of the second electrodes 220 in the first direction DR1 and the center of each of the corresponding second auxiliary electrodes 240s1 or 240s2 in the first direction DR1 may overlap with each other (e.g., in the third direction DR3). In addition, the center of each of the second electrodes 220 in the second direction DR2 and the center of each of the corresponding second auxiliary electrodes 240s1 or 240s2 in the second direction DR2 may overlap with each other (e.g., in the third direction DR3).

[0271] Reference Fig. 9 、 Fig.11A and Fig. 11B , each of the first auxiliary electrodes 230s included in the third electrode 230 may include a 3 - first pattern 231 and a 3 - second pattern 232. The 3 - first pattern 231 and the 3 - second pattern 232 may be provided at different layers from each other (e.g., in different layers or on layers), and the 3 - first pattern 231 and the 3 - second pattern 232 may be electrically connected to each other through a second contact portion CNb. The 3 - first pattern 231 may be included in the first conductive layer 202SU, and the 3 - second pattern 232 may be included in the second conductive layer 204SU.

[0272] In an embodiment of the present disclosure, a part of the 3 - first pattern 231 may overlap with a part of each of the first partition electrodes 210dv1 and 210dv2. Therefore, a coupling capacitance may be provided (e.g., formed) between the first electrode 210 and the third electrode 230.

[0273] Reference Fig. 9 、 Fig.11A and Fig. 11B, each of the second auxiliary electrodes 240s1 or 240s2 included in the fourth electrode 240 may include a 4 - first pattern 241, a 4 - second pattern 242, and a 4 - third pattern 243. The 4 - second pattern 242 and the 4 - third pattern 243 may be disposed at the same layer as each other (e.g., in different layers from each other or on a layer), and the 4 - first pattern 241 may be disposed at a layer different from the layer where the 4 - second pattern 242 and the 4 - third pattern 243 are disposed (e.g., in a different layer or on a layer). The 4 - first pattern 241 and the 4 - second pattern 242 may be electrically connected to each other through a third contact portion CNc, and the 4 - first pattern 241 and the 4 - third pattern 243 may be electrically connected to each other through a fourth contact portion CNd. The 4 - second pattern 242 and the 4 - third pattern 243 may be included in the first conductive layer 202SU, and the 4 - first pattern 241 may be included in the second conductive layer 204SU.

[0274] In an embodiment of the present disclosure, a part of the 4 - second pattern 242 may overlap with a part of each of the sensing patterns 221 of each of the second separation electrodes 220dv1 and 220dv2. Accordingly, a coupling capacitance may be provided (e.g., formed) between the second electrode 220 and the fourth electrode 240.

[0275] In an embodiment of the present disclosure, the first conductive layer 202SU may further include dummy patterns DMP. Each of the dummy patterns DMP may be electrically floating or may be electrically grounded. In an embodiment of the present disclosure, the dummy patterns DMP may be omitted as needed or desired. Since the dummy patterns DMP may be disposed in an empty space, the probability that a specific pattern is recognized due to reflection of external light may be reduced. In other words, an electronic device 1000 with improved visibility due to reflection of external light may be provided (e.g., see Figure 1A ).

[0276] The sensor layer 200 may further include a plurality of first traces 210t, a plurality of first pads PD1, a plurality of second traces 220t, and a plurality of second pads PD2 disposed in the peripheral region 200NA (e.g., see Fig. 9 ). The plurality of first traces 210t may be respectively connected to the plurality of first pads PD1 in a one - to - one correspondence. The plurality of second traces 220t may be respectively connected to the plurality of second pads PD2 in a one - to - one correspondence.

[0277] The first trace 210t can be electrically connected to the first electrode 210 in a one-to-one correspondence. Two first separated electrodes 210dv1 and 210dv2 included in one first electrode 210 can be connected to one of the first traces 210t. Each of the first traces 210t can include a plurality of branch portions for connection to two corresponding first separated electrodes 210dv1 and 210dv2. In an embodiment of the present disclosure, the two first separated electrodes 210dv1 and 210dv2 can be connected to each other within the sensing region 200A.

[0278] The second trace 220t can be electrically connected to the second electrode 220 in a one-to-one correspondence. Two second separated electrodes 220dv1 and 220dv2 included in one second electrode 220 can be connected to one of the second traces 220t. Each of the second traces 220t can include a plurality of branch portions for connection to two corresponding second separated electrodes 220dv1 and 220dv2. In an embodiment of the present disclosure, the two second separated electrodes 220dv1 and 220dv2 can be connected to each other within the sensing region 200A.

[0279] The sensor layer 200 may further include a third trace 230rt1, a plurality of third pads PD3, fourth traces 240t-1 and 240t-2, a plurality of fourth pads PD4, a fifth trace 230rt2, and a fifth pad PD5 disposed in the peripheral region 200NA. The third pad PD3 can be connected to the first end and the second end of the third trace 230rt1. The fourth pads PD4 can be connected to the fourth traces 240t-1 and 240t-2 in a one-to-one correspondence. The fifth pad PD5 can be connected to the fifth trace 230rt2 in a one-to-one correspondence.

[0280] The third trace 230rt1 can be electrically connected to at least one of the first auxiliary electrodes 230s. In an embodiment of the present disclosure, the third trace 230rt1 can be electrically connected to all of the first auxiliary electrodes 230s. In other words, the third trace 230rt1 can be electrically connected to all of the third electrodes 230. The third trace 230rt1 can include a first line portion 231t extending in the first direction DR1 and electrically connected to the third electrode 230, a second line portion 232t extending from the first end of the first line portion 231t in the second direction DR2, and a third line portion 233t extending from the second end of the first line portion 231t in the second direction DR2.

[0281] In an embodiment of the present disclosure, the resistance of each of the second line portion 232t and the third line portion 233t may be the same as or substantially the same as the resistance of one of the third electrodes 230. Accordingly, the second line portion 232t and the third line portion 233t may be used as the third electrodes 230, and thus, an effect similar to the effect of disposing the third electrodes 230 in the peripheral region 200NA may be obtained. For example, one of the second line portion 232t and the third line portion 233t and one of the third electrodes 230 may form a coil. Accordingly, a pen close to the peripheral region 200NA may also be sufficiently charged through a loop including the second line portion 232t or the third line portion 233t.

[0282] In an embodiment of the present disclosure, in order to adjust the resistance of the second line portion 232t and the resistance of the third line portion 233t, the width of the second line portion 232t in the first direction DR1 and the width of the third line portion 233t in the first direction DR1 may be changed differently. However, the present disclosure is not limited thereto. For example, the first line portion 231t, the second line portion 232t, and the third line portion 233t may have the same or substantially the same width as each other.

[0283] The fifth traces 230rt2 may be connected to the third electrodes 230 in a one-to-one correspondence. In other words, the number of the fifth traces 230rt2 may correspond to the number of the third electrodes 230. Fig. 9 Three fifth traces 230rt2 are shown as an example.

[0284] In an embodiment of the present disclosure, the fifth traces 230rt2 and the fifth pads PD5 may be omitted as needed or desired, and a charging driving mode for charging the pen may be omitted as needed or desired. In this case, even if no magnetic field is provided from the sensor layer 200, the sensor layer 200 may sense an input of an active pen capable of forming a magnetic field.

[0285] The fourth traces 240t-1 and 240t-2 may be spaced apart from each other, with the sensing region 200A interposed therebetween. The fourth trace 240t-1 may be electrically connected to at least one of the second auxiliary electrodes 240s1. For example, a first end of the second auxiliary electrode 240s1 may be connected to the fourth trace 240t-1. The fourth trace 240t-2 may be electrically connected to at least one of the second auxiliary electrodes 240s2. For example, a second end (opposite to the first end) of the second auxiliary electrode 240s2 may be connected to the fourth trace 240t-2.

[0286] Fig.13A is Fig.11A an enlarged plan view of the region AA' shown in Fig. 13B is Fig. 11BAn enlarged plan view of the region BB' shown in

[0287] Reference Fig.11A 、 Fig. 11B 、 Fig.13A and Fig. 13B , each of the first electrode 210, the second electrode 220, the third electrode 230, the fourth electrode 240, and the dummy pattern DMP may have a mesh structure. Each of the mesh structures may include a plurality of mesh lines. Each of the plurality of mesh lines may have a suitable shape extending in a suitable direction (e.g., a given or predetermined direction), and the plurality of mesh lines may be connected to each other. The shape may have various suitable shapes, such as a straight line, a line with protrusions, or an uneven line. Openings without a mesh structure may be defined (e.g., formed) in each of the first electrode 210, the second electrode 220, the third electrode 230, the fourth electrode 240, and the dummy pattern DMP.

[0288] Fig.13A and Fig. 13B show an example in which the mesh structure includes mesh lines extending in a first crossing direction CDR1 that crosses or intersects the first direction DR1 and the second direction DR2, and mesh lines extending in a second crossing direction CDR2 that crosses or intersects the first crossing direction CDR1. However, the direction in which the mesh lines constituting the mesh structure extend is not limited to Fig.13A and Fig. 13B shown in. For example, the mesh structure may include only mesh lines extending in the first direction DR1 and the second direction DR2, or may include mesh lines extending in the first direction DR1, the second direction DR2, the first crossing direction CDR1, and the second crossing direction CDR2. In other words, the mesh structure can be differently modified into various suitable shapes according to needs or expectations.

[0289] Fig.14 is an enlarged plan view showing a sensing unit SUa according to an embodiment of the present disclosure. Fig.15A is a plan view showing a first conductive layer 202SUa of the sensing unit SUa according to an embodiment of the present disclosure. Fig. 15B is a plan view showing a second conductive layer 204SUa of the sensing unit SUa according to an embodiment of the present disclosure.

[0290] According to Fig.14 、 Fig.15A and Fig. 15B shown in the embodiment, Fig.11AThe dummy pattern DMP shown in [the figure] can be electrically connected to the first electrode 210 or the second electrode 220. For example, the first electrode auxiliary pattern 210au and the second electrode auxiliary pattern 220au can be provided in the first conductive layer 202SUa. The first electrode auxiliary pattern 210au can overlap with the first partition electrodes 210dv1 and 210dv2 and can be electrically connected to the first partition electrodes 210dv1 and 210dv2 through the fifth contact portion CNe. The second electrode auxiliary pattern 220au can overlap with the sensing pattern 221 and can be electrically connected to the sensing pattern 221 through the sixth contact portion CNf.

[0291] Fig.16 is a block diagram showing the operation of the sensor driver 200C according to an embodiment of the present disclosure.

[0292] Referring to Figure 7 and Fig.16 , the sensor driver 200C can be selectively driven under one of a first operation mode DMD1, a second operation mode DMD2, and a third operation mode DMD3.

[0293] The first operation mode DMD1 can be referred to as a "touch and pen standby mode". The second operation mode DMD2 can be referred to as a "touch enabled and pen standby mode". The third operation mode DMD3 can be referred to as a "pen enabled mode". The first operation mode DMD1 can be a mode of waiting for the first input 2000 and the second input 3000. The second operation mode DMD2 can be a mode of sensing the first input 2000 and waiting for the second input 3000. The third operation mode DMD3 can be a mode of sensing the second input 3000.

[0294] In an embodiment of the present disclosure, the sensor driver 200C can be first driven in the first operation mode DMD1. When the first input 2000 is sensed in the first operation mode DMD1, the sensor driver 200C can switch (e.g., change or convert) to the second operation mode DMD2. As another example, when the second input 3000 is sensed in the first operation mode DMD1, the sensor driver 200C can switch (e.g., change or convert) to the third operation mode DMD3.

[0295] In an embodiment of the present disclosure, when a second input 3000 is sensed in the second operation mode DMD2, the sensor driver 200C may switch (e.g., change or transition) to the third operation mode DMD3. When the first input 2000 is released (e.g., not sensed) in the second operation mode DMD2, the sensor driver 200C may switch to the first operation mode DMD1. When the second input 3000 is released (e.g., not sensed) in the third operation mode DMD3, the sensor driver 200C may switch to the first operation mode DMD1.

[0296] Fig.17 is a timing diagram showing the operation of the sensor driver 200C according to an embodiment of the present disclosure.

[0297] Refer to Figure 7 、 Fig.16 and Fig.17 , which shows as an example the operations in the first operation mode DMD1, the second operation mode DMD2, and the third operation mode DMD3 changing with time t.

[0298] In the first operation mode DMD1, the sensor driver 200C may be repeatedly driven in the second mode MD2-d and the first mode MD1-d. During the second mode MD2-d, the sensor layer 200 may be scanned and driven to detect the second input 3000. During the first mode MD1-d, the sensor layer 200 may be scanned and driven to detect the first input 2000. Fig.17 An example is shown in which the sensor driver 200C operates in the first mode MD1-d immediately after (e.g., continuously) the second mode MD2-d, but the order of the first mode MD1-d and the second mode MD2-d is not limited thereto.

[0299] In the second operation mode DMD2, the sensor driver 200C may be repeatedly driven in the second mode MD2-d and the first mode MD1. During the second mode MD2-d, the sensor layer 200 may be scanned and driven to detect the second input 3000. During the first mode MD1, the sensor layer 200 may be scanned and driven to detect the coordinates of the first input 2000.

[0300] In the third operation mode DMD3, the sensor driver 200C may be driven in the second mode MD2. During the second mode MD2, the sensor layer 200 may be scanned and driven to detect the coordinates of the second input 3000. In the third operation mode DMD3, the sensor driver 200C may not operate in the first mode MD1-d or MD1 until the second input 3000 is released (e.g., not sensed).

[0301] Refer to together Fig. 9 In the first mode MD1-d and the first mode MD1, both the third electrode 230 and the fourth electrode 240 can be grounded. Therefore, touch noise introduced through the third electrode 230 and the fourth electrode 240 can be prevented or substantially prevented.

[0302] In the second mode MD2-d and the second mode MD2, the first ends of each of the third electrode 230 and the fourth electrode 240 can be floated. In addition, in the second mode MD2-d and the second mode MD2, the second ends of each of the third electrode 230 and the fourth electrode 240 can be grounded or floated. Therefore, the sensing signals can be compensated maximally through the connection between the first electrode 210 and the third electrode 230 and the connection between the second electrode 220 and the fourth electrode 240.

[0303] Fig.18A is a diagram showing the first mode according to an embodiment of the present disclosure. Fig.18B is a diagram showing the first mode according to an embodiment of the present disclosure.

[0304] Reference Fig.17 , Fig.18A and Fig.18B , the first mode MD1-d of the first operation mode DMD1 and the first mode MD1 of the second operation mode DMD2 can include a self-capacitance detection mode. The self-capacitance detection mode can include a first sub-period and a second sub-period. Fig.18A shows the operation in the first sub-period, and Fig.18B shows the operation in the second sub-period.

[0305] In the self-capacitance detection mode, the sensor driver 200C can output drive signals Txs1 and Txs2 to the first electrode 210 and the second electrode 220 to sense changes in the capacitance of each of the first electrode 210 and the second electrode 220, and calculate the input coordinates based on the sensing results.

[0306] Reference Fig.18A , in the first sub-period (e.g., the first sub-interval), the sensor driver 200C can output the drive signal Txs1 to the first trace 210t. Reference Fig.18B , in the second sub-period (e.g., the second sub-interval), the sensor driver 200C can output the drive signal Txs2 to the second trace 220t. The first sub-period and the second sub-period can be operated separately from each other at different timings. However, the present disclosure is not limited thereto. For example, the first sub-period and the second sub-period can overlap with each other in time. In other words, at the same or substantially the same timing, the sensor driver 200C can output the drive signal Txs1 to the first trace 210t and output the drive signal Txs2 to the second trace 220t.

[0307] The third electrode 230 may be electrically connected to the third trace 230rt1 and the fifth trace 230rt2, and the fourth electrode 240 may be electrically connected to the fourth traces 240t-1 and 240t-2. In the self-capacitance detection mode, both the third electrode 230 and the fourth electrode 240 may be grounded. Accordingly, noise may not be introduced through the third electrode 230 and the fourth electrode 240.

[0308] Fig.19 is a diagram showing a first mode according to an embodiment of the present disclosure.

[0309] Reference Figure 7 、 Fig.17 and Fig.19 , the first mode MD1-d and the first mode MD1 may further include a mutual capacitance detection mode. Fig.19 shows the mutual capacitance detection modes in the first mode MD1-d and the first mode MD1.

[0310] In the mutual capacitance detection mode, the sensor driver 200C may sequentially provide a transmission signal TX to the first electrode 210, and may detect the coordinates of the first input 2000 by using a received signal RX detected through the second electrode 220. For example, the sensor driver 200C may sense a change in the mutual capacitance between the first electrode 210 and the second electrode 220, and may calculate the input coordinates based on the sensing result.

[0311] Fig.19 shows an example in which the transmission signal TX is provided to one first electrode 210 and the received signal RX is output from one second electrode 220. For ease of explanation, in Fig.19 , only one first electrode 210 to which the transmission signal TX is provided is shown hatched. The sensor driver 200C may sense a change in the capacitance between each of the second electrodes 220 and the first electrode 210, and may detect the input coordinates of the first input 2000 based on the sensing result.

[0312] In the mutual capacitance detection mode, both the third electrode 230 and the fourth electrode 240 may be grounded. Accordingly, noise may not be introduced through the third electrode 230 and the fourth electrode 240.

[0313] In each of the first mode MD1-d of the first operation mode DMD1 and the first mode MD1 of the second operation mode DMD2, the sensor layer 200 may alternately repeat the above with reference to Fig.18A 、 Fig.18B and Fig.19The operations described. However, the present disclosure is not limited thereto. For example, in each of the first mode MD1-d and the first mode MD1, the sensor layer 200 may only repeatedly perform the above operations with reference to Fig.19 The operations described. As another example, in the first mode MD1-d, the sensor layer 200 may repeatedly perform only the above operations with reference to Fig.18A , Fig.18B And Fig.19 At least one of the operations described, and in the first mode MD1, the sensor layer 200 may alternately repeat the above operations with reference to Fig.18A , Fig.18B And Fig.19 The operations described.

[0314] Fig. 20 Is a diagram showing a second mode according to an embodiment of the present disclosure. Fig.21A A diagram showing waveforms of a first signal and a second signal according to an embodiment of the present disclosure. Fig.21B A diagram showing waveforms of a first signal and a second signal according to an embodiment of the present disclosure. Fig. 21C A diagram showing waveforms of a first signal and a second signal according to an embodiment of the present disclosure.

[0315] With reference to Fig.17 And Fig. 20 , the second mode MD2 may include a charging drive mode and a pen sensing drive mode. The charging drive mode may include a search charging drive mode and a tracking charging drive mode. Fig. 20 Shows the search charging drive mode.

[0316] With reference to Fig.17 , Fig. 20 And Fig.21A , in the charging drive mode, the sensor driver 200C may apply a first signal SG1 to at least one of the third pad PD3 and the fifth pad PD5, and may apply a second signal SG2 to at least one of the others. The phase of the second signal SG2 may be opposite to the phase of the first signal SG1. For example, the first signal SG1 may be a sine signal.

[0317] Fig. 20 Examples in which the first signal SG1 is applied to one pad and the second signal SG2 is applied to another pad are shown in

[0318] Since the first signal SG1 and the second signal SG2 are applied to at least two pads respectively, a current path can be formed in which a current RFS flows from at least one pad to at least another pad. In addition, since the first signal SG1 and the second signal SG2 are sine signals having phases opposite to each other, the direction of the current RFS can be periodically changed.

[0319] Reference Fig. 20 and Fig.21B , each of the first signal SG1a and the second signal SG2a can be a square wave signal. The phase of the second signal SG2a can be opposite to the phase of the first signal SG1a. Since the first signal SG1a and the second signal SG2a are applied to at least two pads, a current path can be formed in which a current RFS flows from at least one pad to at least another pad. Moreover, since the first signal SG1a and the second signal SG2a are square wave signals having phases opposite to each other, the direction of the current RFS can be periodically changed.

[0320] In Fig.21A and Fig.21B , the first signal SG1 or SG1a and the second signal SG2 or SG2a have opposite phase relationships. Therefore, the noise caused by the first signal SG1 or SG1a in the display layer 100 (e.g., reference Figure 6 ) can be canceled by the noise caused by the second signal SG2 or SG2a, and vice versa. Therefore, a flicker phenomenon may not occur in the display layer 100. Thus, the display quality of the display layer 100 can be improved.

[0321] Reference Fig. 20 and Fig. 21C , the first signal SG1 can be a sine signal. However, the present disclosure is not limited thereto. For example, the first signal SG1 can be a square wave signal. The second signal SG2b can have a constant or substantially constant voltage V (e.g., a given or predetermined constant voltage). For example, the second signal SG2b can have a ground voltage. In other words, the pad to which the second signal SG2b is applied can be considered to be grounded (e.g., connected to ground). Even in this case, a current RFS can flow from at least one pad to at least another pad. In addition, even though at least another pad is grounded, since the first signal SG1 is a sine signal or a square wave signal, the direction of the current RFS can also be periodically changed.

[0322] Refer again to Fig. 20, an example is shown in which a second signal SG2 is provided to a third pad PD3a connected to a third trace 230rt1 and a first signal SG1 is applied to a fifth pad PD5a connected to a third electrode 230. A current RFS may flow through a current path defined by the fifth pad PD5a, a fifth trace 230rt2 connected to the fifth pad PD5a, the third electrode 230, a portion of the third trace 230rt1 connected to the third pad PD3a, and the third pad PD3a. The current path may be in the shape of a coil. Thus, in the charging drive mode of the second mode MD2, the resonant circuit of the pen PN may be charged by the current path.

[0323] According to one or more embodiments of the present disclosure, the current path of the loop coil pattern may be implemented by components included in the sensor layer 200. Thus, the electronic device 1000 (e.g., refer to Figure 1A ) may charge the pen PN by using the sensor layer 200. In other words, since a configuration having a coil for charging the pen PN may not be separately included, an increase in the thickness of the electronic device 1000, an increase in the weight of the electronic device 1000, and a decrease in the flexibility of the electronic device 1000 may not occur.

[0324] In the charging drive mode, the first electrode 210, the second electrode 220, and the fourth electrode 240 may be grounded, may be provided with a constant or substantially constant voltage, or may be electrically floated. For example, the first electrode 210, the second electrode 220, and the fourth electrode 240 may be floated. In this case, the current RFS may not flow to the first electrode 210, the second electrode 220, and the fourth electrode 240.

[0325] Fig.22A A table of signals provided to the sensor layer according to an embodiment of the present disclosure is shown.

[0326] Refer to Figure 7 , Fig. 20 , Fig.21A and Fig.22A , Fig.22AThe table shown in shows signals provided to pads connected to the second line portion 232t, the first charging channel 230ch1, the second charging channel 230ch2, the third charging channel 230ch3, the fourth charging channel 230ch4, the fifth charging channel 230ch5, the sixth charging channel 230ch6, the seventh charging channel 230ch7, the eighth charging channel 230ch8, the ninth charging channel 230ch9, and the tenth charging channel 230ch10 (hereinafter referred to as "230ch1 to 230ch10") and the third line portion 233t or states of the pads in the first time period t1, the second time period t2, the third time period t3, the fourth time period t4, the fifth time period t5, the sixth time period t6, the seventh time period t7, the eighth time period t8, and the ninth time period t9. The first charging channel 230ch1 to the tenth charging channel 230ch10 may be referred to as "first channel to tenth channel", "ten third electrode channels", or "ten third channels".

[0327] The first to tenth charging channels 230 ch1 to 230 ch10 may correspond to the third electrodes 230 , respectively. Fig. 20 2 is shown as an example, but the sensor layer 200 may include three or more third electrodes 230. Therefore, the first to tenth charging channels 230ch1 to 230ch10 may correspond to ten third electrodes 230, respectively.

[0328] Fig.22A The signals shown in the table are signals provided to the sensor layer 200 in the search charge driving mode. Therefore, since there is a state in which the position of the pen PN is not sensed, the first signal SG1 or the second signal SG2 may be provided to all channels included in the sensor layer 200. In other words, the entire area of ​​the sensor layer 200 may be scanned in the search charge driving mode.

[0329] In the second mode MD2, the charging driving mode and the pen sensing driving mode may be repeated alternately (eg, referring to Fig.27A ). For example, during the first time period t1, the sensor layer 200 may operate in the charging driving mode, and then may operate in the pen sensing driving mode. When the pen is not sensed, during the second time period t2, the sensor layer 200 may operate in the charging driving mode again. As another example, when the pen is sensed, the sensor layer 200 may operate in the tracking charging driving mode, which will be referred to below. Fig.23 , Fig.24A and Fig. 24B Describe in more detail.

[0330] During a first time period t1, a second signal SG2 may be provided to a second line portion 232t, and a first signal SG1 may be provided to a third charging channel 230ch3 and a fourth charging channel 230ch4. A third line portion 233t and other remaining charging channels 230ch1, 230ch2, 230ch5, 230ch6, 230ch7, 230ch8, 230ch9, and 230ch10 to which the first signal SG1 and the second signal SG2 are not provided may be floated (e.g., "FL" in the accompanying drawings).

[0331] During a second time period t2, the second signal SG2 may be provided to the second line portion 232t and a first charging channel 230ch1, and the first signal SG1 may be provided to the fourth charging channel 230ch4 and a fifth charging channel 230ch5. Then, during third, fourth, fifth, sixth, seventh, eighth, and ninth time periods t3, t4, t5, t6, t7, t8, and t9, the second signal SG2 and the first signal SG1 may be provided while shifting up to one channel for each time period.

[0332] In an embodiment of the present disclosure, during the remaining time periods except for the first time period t1 in which the second signal SG2 is provided to the second line portion 232t and the ninth time period t9 in which the first signal SG1 is provided to the third line portion 233t, the first signal SG1 may be provided to two channels, and the second signal SG2 may be provided to two channels. When the same signal is provided to multiple channels, the resistance can be effectively reduced. In other words, as the resistance is reduced, the power consumption of the sensor layer 200 can be reduced.

[0333] However, the number of channels to which the first signal SG1 and the second signal SG2 are provided is not limited to the above number. For example, the first signal SG1 may be provided to one channel, and the second signal SG2 may be provided to another channel. As another example, the first signal SG1 may be provided to three or more channels, and the second signal SG2 may be provided to three or more other channels.

[0334] In an embodiment of the present disclosure, a first charging channel 230ch1 and a second charging channel 230ch2 between the second line portion 232t and the third charging channel 230ch3 are shown to be floated during the first time period t1. In other words, an example is shown in which there are two floating channels (hereinafter referred to as "gap channels") between the channel to which the first signal SG1 is provided and the channel to which the second signal SG2 is provided. As the number of gap channels increases, the intensity of the magnetic field formed by the current RFS may increase. Therefore, the number of gap channels may be determined according to the electronic device 1000 (e.g., refer to Figure 1A) varies depending on the usage conditions or the type of pen.

[0335] Fig. 22B Shows a table of signals provided to the sensor layer according to an embodiment of the present disclosure.

[0336] Refer to Fig. 20 、 Fig.21A and Fig. 22B , in the first time period t1, the second signal SG2 can be provided to the second line portion 232t and the first charging channel 230ch1, and the first signal SG1 can be provided to the fourth charging channel 230ch4 and the fifth charging channel 230ch5. The third line portion 233t and the other remaining charging channels 230ch2, 230ch3, 230ch6, 230ch7, 230ch8, 230ch9, and 230ch10 to which the first signal SG1 and the second signal SG2 are not provided can be floated (e.g., "FL" in the reference drawings). Then, in the second time period t2, the third time period t3, the fourth time period t4, the fifth time period t5, the sixth time period t6, and the seventh time period t7, the second signal SG2 and the first signal SG1 can be provided while shifting up to one channel for each time period.

[0337] Compared with Fig.22A the driving operation shown in Fig. 22B the driving operation shown in Fig.22A may not include the operation of providing only the first signal SG1 to the third line portion 233t and the operation of providing only the second signal SG2 to the second line portion 232t. Therefore, the entire area of the sensor layer 200 can be scanned in the first time period t1, the second time period t2, the third time period t3, the fourth time period t4, the fifth time period t5, the sixth time period t6, and the seventh time period t7. In other words, compared with the embodiment described with reference to Fig.22A according to the embodiment described with reference to Fig. 22B the entire area of the sensor layer 200 can be scanned in a relatively short time.

[0338] Fig.23 Is a diagram showing a second mode according to an embodiment of the present disclosure. Fig.23 Shows the tracking charging drive mode of the second mode MD2.

[0339] Refer to Fig.17 and Fig.23 , when the pen PN is sensed in the search charging drive mode, the sensor layer 200 can operate in the tracking charging drive mode. For example, in the tracking charging drive mode, the sensor driver 200C can sequentially output the first signal SG1 and the second signal SG2 to the area overlapping the point where the pen PN is sensed, rather than outputting to the entire area of the sensor layer 200.

[0340] Fig.24A Shows a table of signals provided to a sensor layer according to an embodiment of the present disclosure.

[0341] Reference Fig.23 and Fig.24A , shows the position PN-dt of the pen PN sensed in the previous frame. Fig.24A Shows an example in which the pen PN is sensed in an area overlapping with the fifth charging channel 230ch5 and the sixth charging channel 230ch6. In this case, the sensor driver 200C may provide the first signal SG1 and the second signal SG2 to channels forming a loop overlapping with the fifth charging channel 230ch5 and the sixth charging channel 230ch6.

[0342] In an embodiment of the present disclosure, the sensor driver 200C may provide the first signal SG1 and the second signal SG2 to an area shifted left and right by up to one channel relative to a central loop around the position PN-dt of the pen PN in the previous frame (e.g., around its periphery). In Fig.24A In the second time period t2 shown, the central loop may be provided (e.g., formed) by the third charging channel 230ch3 and the fourth charging channel 230ch4 and the seventh charging channel 230ch7 and the eighth charging channel 230ch8.

[0343] In the first time period t1, the second signal SG2 may be provided to the second charging channel 230ch2 and the third charging channel 230ch3, and the first signal SG1 may be provided to the sixth charging channel 230ch6 and the seventh charging channel 230ch7. In the second time period t2, the second signal SG2 may be provided to the third charging channel 230ch3 and the fourth charging channel 230ch4, and the first signal SG1 may be provided to the seventh charging channel 230ch7 and the eighth charging channel 230ch8. In the third time period t3, the second signal SG2 may be provided to the fourth charging channel 230ch4 and the fifth charging channel 230ch5, and the first signal SG1 may be provided to the eighth charging channel 230ch8 and the ninth charging channel 230ch9.

[0344] Therefore, after the position PN-dt of the pen PN is sensed, channels corresponding to the position PN-dt of the pen PN in the immediately previous frame and driven in the charging drive mode may be restricted. Thus, in the charging drive mode, channels overlapping with areas where the pen is not located may not be driven. Consequently, the efficiency of the charging drive can be improved.

[0345] Fig. 24B Shows a table of signals provided to a sensor layer according to an embodiment of the present disclosure.

[0346] Reference Fig.23 and Fig. 24B show the position PN-dt of the pen PN sensed in the previous frame. An example is shown where the pen PN is sensed in an area overlapping with the fifth charging channel 230ch5 and the sixth charging channel 230ch6. In this case, the sensor driver 200C may provide a first signal SG1 and a second signal SG2 to channels forming a loop overlapping with the fifth charging channel 230ch5 and the sixth charging channel 230ch6. For example, the sensor driver 200C may provide the first signal SG1 and the second signal SG2 to an area shifted left and right by up to two channels with respect to a central loop around the position PN-dt of the pen PN in the previous frame (e.g., around its periphery).

[0347] The example in which three toroidal coils including a central loop are sequentially formed in the tracking charging drive mode has been described above with reference to Fig.24A and the example in which five toroidal coils including a central loop are sequentially formed in the tracking charging drive mode has been described with reference to Fig. 24B However, the present disclosure is not limited thereto. For example, the number of toroidal coils sequentially formed in the tracking charging drive mode may be variously modified according to needs or expectations.

[0348] Fig.25A is a diagram showing a pen PN according to an embodiment of the present disclosure.

[0349] Reference Fig.25A , the pen PN may include a housing PN-H, a nib PN-T, an inductor L, a capacitor C, a resistor R, an elastomer PN-ED, a pressure capacitor C-P, a switch SW-B, and a button capacitor C-B. Except for the switch SW-B connected to the button capacitor C-B, the pen PN may not include active components such as a power source, a transistor, or a diode. The components included in the pen PN are not limited to the above components. At least some of the above components may be omitted according to needs or expectations, and any other suitable components are also included in the pen PN.

[0350] In an embodiment of the present disclosure, the nib PN-T may include a non-conductive material. The nib PN-T may be implemented to protrude outside the housing PN-H. The nib PN-T may be connected to (e.g., attached to or coupled to) the housing PN-H in a removable manner (e.g., removed from the housing PN-H) and may be a replaceable component.

[0351] In an embodiment of the present disclosure, a resistor R, an inductor L, and a capacitor C may be connected in series. Accordingly, the pen PN may be implemented to have a resonance frequency and selectivity as characteristics of an RLC series circuit. In this case, when the sensor layer 200 is driven in a charging drive mode, the frequency of the signal supplied to the sensor layer 200 may correspond to the resonance frequency of the pen PN. The capacitor C, the pressure capacitor C-P, and the button capacitor C-B may be connected in parallel with each other. For example, when the switch SW-B is turned on, the button capacitor C-B may be connected in parallel with the capacitor C.

[0352] In an embodiment of the present disclosure, when the switch SW-B is turned on and off, the button capacitor C-B may be electrically connected to or disconnected from the capacitor C. In other words, the pen PN may be implemented to respond to any other suitable resonance frequency by turning the switch SW-B on and off. For example, a button may be provided on the outer surface of the housing PN-H. When the button is pressed or depressed, the switch SW-B may be turned on, and the button capacitor C-B may be electrically connected to the capacitor C. In this case, the overall capacitance of the pen PN may be increased.

[0353] In an embodiment of the present disclosure, the capacitor C may be implemented by cutting some of a plurality of capacitors connected in parallel. For example, in order to set a target resonance frequency in the process of manufacturing the pen PN, the capacitor C of the pen PN may be tuned by cutting some of the plurality of capacitors.

[0354] In an embodiment of the present disclosure, when a part of the pen tip PN-T is inserted into the housing PN-H by a pen pressure, the area, distance, or area and distance forming the capacitance of the pressure capacitor C-P may be changed. Accordingly, the capacitance of the pressure capacitor C-P may be variable. For example, when a pen pressure is applied to the pen PN, the capacitance of the pressure capacitor C-P may increase. In this case, the resonance frequency of the pen PN may decrease due to the increased capacitance. Then, when the pen pressure is released, the capacitance of the pressure capacitor C-P may be restored to its initial state by the elastomer PN-ED again.

[0355] Fig.25B is a diagram showing a pen PN-1 according to an embodiment of the present disclosure. In Fig.25B which, components that are the same as or substantially the same as those described above with reference to Fig.25A are denoted by the same reference numerals / symbols, and thus, redundant descriptions may not be repeated.

[0356] Compared with the pen PN shown in Fig.25A and Fig.25BThe pen PN-1 shown in the figure may further include a power supply unit (e.g., a power supply) PN-BT and a control unit (e.g., a controller) PN-IC. The power supply unit PN-BT may include a battery or a large-capacity capacitor. The control unit PN-IC may supply power from the power supply unit PN-BT and may adjust the frequency of the signal output from the pen PN-1. For example, in some embodiments, the control unit PN-IC may be implemented as an integrated circuit (IC).

[0357] According to an embodiment of the present disclosure, since the pen PN-1 includes an RLC resonance circuit, a power supply unit PN-BT, and a control unit PN-IC, the pen PN-1 can operate as both an active pen and a passive pen. Therefore, even if a magnetic field cannot be provided from the sensor layer 200, the pen PN-1 can form a magnetic field. Thus, the sensor layer 200 may be able to sense the input of the pen PN-1 that outputs a magnetic field without a charging mode in which a magnetic field is formed. When implementing the pen PN-1 described above with reference to Fig.25B the above description, the fifth trace 230rt2 and the fifth pad PD5 described above with reference to Fig. 9 the above description may be omitted.

[0358] Fig.25C is a diagram showing a pen PN-2 according to an embodiment of the present disclosure.

[0359] Referring to Fig.25C , the pen PN-2 may not include an RLC resonance circuit. For example, the pen PN-2 may include a housing PN-H, an inductor L, a power supply unit PN-BT, and a control unit PN-IC. The power supply unit PN-BT may include a battery or a large-capacity capacitor. The control unit PN-IC may supply power from the power supply unit PN-BT and may adjust the frequency of the signal output from the pen PN-2. For example, in some embodiments, the control unit PN-IC may be implemented as an integrated circuit (IC).

[0360] According to an embodiment of the present disclosure, the pen PN-2 can operate as an active pen. Therefore, even if a magnetic field cannot be provided from the sensor layer 200, the pen PN-2 can form a magnetic field. When implementing the pen PN-2 described above with reference to Fig.25C the above description, the fifth trace 230rt2 and the fifth pad PD5 described above with reference to Fig. 9 the above description may be omitted.

[0361] Fig.26A is a diagram showing the operation of a pen according to an embodiment of the present disclosure. Fig.26B is a diagram showing the operation of a pen according to an embodiment of the present disclosure.

[0362] Referring to Fig. 20 , Figure 25A , Figure 26A andFigure 26B In addition, the second mode MD2 may include a charging cycle MD2-ch and a discharging cycle MD2-dc. The charging cycle MD2-ch may correspond to a charging driving mode, and the discharging cycle MD2-dc may correspond to a pen sensing driving mode.

[0363] During a first time period t1 (e.g., referring to Figure 22A ), the first signal SG1 and the second signal SG2 may be provided to the sensor layer 200. The first time period t1 may correspond to one charging cycle MD2-ch.

[0364] During the first time period t1, the pen PN close to the sensor layer 200 may be charged. For example, the inductor L generates a current based on a magnetic field formed in the sensor layer 200. The generated current is transmitted to the capacitor C. The capacitor C charges the current from the inductor L. Then, the capacitor C may discharge the charged current to the inductor L, and the inductor L may form a magnetic field of a resonant frequency. The time period during which the magnetic field is formed in the pen PN may correspond to the discharging cycle MD2-dc. An induced current may flow in the sensor layer 200 through the magnetic field formed by the pen PN, and the induced current may be transmitted to the sensor driver 200C as a received signal (e.g., a sensing signal or a signal).

[0365] In an embodiment of the present disclosure, the charging driving voltage of the sensor layer 200 may be a sine wave or a square wave, and Figure 26B an example in which the charging driving voltage is a sine wave is shown. The voltage charged in the pen PN or the voltage discharged from the pen PN may be a sine wave.

[0366] Figure 27A is a diagram illustrating a second mode according to an embodiment of the present disclosure. Figure 27B is a diagram illustrating a second mode based on the sensing unit SU according to an embodiment of the present disclosure.

[0367] Referring to Figure 27A and Figure 27B , the second mode may include a charging driving mode and a pen sensing driving mode. Figure 27A and Figure 27B illustrate the pen sensing driving mode. Figure 27B shows a sensing unit SU in which a first induced current Ia, a second induced current Ib, a third induced current Ic, and a fourth induced current Id generated by the pen PN flow.

[0368] In the pen sensing driving mode, the sensor driver 200C may receive a first received signal PRX1 from the first electrode 210 and a second received signal PRX2 from the second electrode 220.

[0369] The RLC resonant circuit of the pen PN can form a magnetic field of the resonant frequency and at the same time discharge the charged charges. A first induced current Ia can be generated in the first electrode 210 by the magnetic field formed in the pen PN, and a second induced current Ib can be generated in the second electrode 220 by the magnetic field. In addition, a third induced current Ic can be generated in the first auxiliary electrode 230s of the third electrode 230 by the magnetic field, and a fourth induced current Id can be generated in the second auxiliary electrode 240s of the fourth electrode 240 by the magnetic field.

[0370] A first coupling capacitor Ccp1 can be formed between the first auxiliary electrode 230s and the first electrode 210, and a second coupling capacitor Ccp2 can be formed between the second auxiliary electrode 240s and the second electrode 220. The third induced current Ic can be transmitted to the first electrode 210 through the first coupling capacitor Ccp1, and the fourth induced current Id can be transmitted to the second electrode 220 through the second coupling capacitor Ccp2.

[0371] The sensor driver 200C can receive a first received signal PRX1a based on the first induced current Ia and the third induced current Ic from the first electrode 210, and can receive a second received signal PRX2a based on the second induced current Ib and the fourth induced current Id from the second electrode 220. The sensor driver 200C can detect the input coordinates of the pen PN based on the first received signal PRX1a and the second received signal PRX2a.

[0372] The sensor driver 200C can receive the first received signal PRX1a from the first electrode 210 and can receive the second received signal PRX2a from the second electrode 220. In this case, the first ends of the third electrode 230 and the fourth electrode 240 can be floated. Therefore, the sensing signal can be compensated to the greatest extent by the connection between the first electrode 210 and the third electrode 230 and the connection between the second electrode 220 and the fourth electrode 240. In addition, the second ends of the third electrode 230 and the fourth electrode 240 can be grounded or floated. Therefore, through the connection between the first electrode 210 and the third electrode 230 and the connection between the second electrode 220 and the fourth electrode 240, the third induced current Ic and the fourth induced current Id can be sufficiently transmitted to the first electrode 210 and the second electrode 220.

[0373] In an embodiment of the present disclosure, the wiring directions of the overlapping electrodes and auxiliary electrodes of the sensor layer 200 can be different from each other. For example, the wiring direction of the first electrode 210 and the wiring direction of the first auxiliary electrode 230s can be different from each other. In addition, the wiring direction of the second electrode 220 and the wiring direction of the second auxiliary electrode 240s can be different from each other. For example, in Figure 27BIn the embodiment, the first electrode 210 and the first trace 210t may be connected to each other at the bottom (e.g., bottom side or edge) of the sensing unit SU (e.g., in or on the bottom side or edge), and the first auxiliary electrode 230s and the third trace 230rt1 may be connected to each other at the top (e.g., top side or edge) (e.g., in or on the top side or edge). The second electrode 220 and the second trace 220t may be connected to each other at the left side (e.g., left side or edge) of the sensing unit SU (e.g., in or on the left side or edge), and the second auxiliary electrode 240s and the fourth trace 240t may be connected to each other at the right side (e.g., right side or edge) of the sensing unit SU (e.g., in or on the right side or edge).

[0374] Figure 28A is a diagram showing a second mode according to an embodiment of the present disclosure.

[0375] refer to Figure 27A , Figure 27B and Figure 28A , 10 first channels 210ch1, 210ch2, 210ch3, 210ch4, 210ch5, 210ch6, 210ch7, 210ch8, 210ch9, and 210ch10 respectively corresponding to the first electrodes 210 are shown as representative examples. The second channels respectively corresponding to the second electrodes 220 may have the same or substantially the same structure as the first channels.

[0376] The sensor driver 200C may include a current transmitter 200C1, a differential driver 200C2, an I / Q demodulator 200C3, and an analog-to-digital converter (ADC) 200C4. The components included in the sensor driver 200C are not limited to the above components. At least some of the above components may be omitted as needed or desired, and any other suitable components may also be included in the sensor driver 200C.

[0377] In an embodiment of the present disclosure, one first channel may be electrically connected to the inverting terminal of the differential driver 200C2, and another first channel may be electrically connected to the non-inverting terminal of the differential driver 200C2. For example, two first channels adjacent to each other may be electrically connected to the same differential driver 200C2. The sensor driver 200C may output a signal corresponding to the subtraction of the signals received from the two first channels adjacent to each other. Therefore, the noise included in the signals received from the two first channels may be removed.

[0378] Figure 28B 2 is a diagram showing a second mode of implementation according to the present disclosure. Figure 28B In the above reference Figure 28AComponents that are the same or substantially the same as the described components are represented by the same reference marks / symbols, and thus, redundant descriptions may not be repeated.

[0379] Reference Figure 28B , one first channel can be electrically connected to the inverting terminal of the differential driver 200C2, and the other first channel can be electrically connected to the non-inverting terminal of the differential driver 200C2. For example, two first channels spaced apart from each other (with "x" first channels interposed therebetween) can be electrically connected to the same differential driver 200C2. For example, "x" can be an integer of 1 or greater.

[0380] Figure 29 is an equivalent circuit diagram of a sensor driver according to an embodiment of the present disclosure.

[0381] Reference Figure 28A and Figure 29 , the sensor driver 200C can include an impedance matching unit (e.g., impedance matching circuit) IM, an offset correction unit (e.g., offset correction circuit) OC, a current conveyor 200C1, an integrator CVA, a low-pass filter LPF, a differential driver 200C2, an I / Q demodulator 200C3, and an analog-to-digital converter 200C4.

[0382] One channel 210chx can be connected to the input terminal IT. The input terminal IT can correspond to a pad electrically connected between the sensor driver 200C and the channel 210chx. For example, the input terminal IT can be the first pad PD1 (e.g., reference Figure 9 ).

[0383] The signal received from the channel 210chx can be provided to the current conveyor 200C1 through the impedance matching unit IM and the offset correction unit OC. The current conveyor 200C1 can include a plurality of input terminals. One input terminal can receive the signal received from the channel 210chx, while the other input terminal can be provided with a reference voltage or can be grounded.

[0384] The current conveyor 200C1 can be applied between the sensor layer 200 and the integrator CVA. In other words, the loads of the sensor layer 200 and the integrator CVA can be separated by the current conveyor 200C1. The current conveyor 200C1 can remove the noise components included in the signal received from the channel 210chx. In addition, a plurality of current conveyors 200C1 can be provided, and the plurality of current conveyors 200C1 can be respectively connected to a plurality of channels.

[0385] In an embodiment of the present disclosure, the current conveyor 200C1 may invert a signal received from a channel. The current conveyor 200C1 may include a non-inverting output terminal and an inverting output terminal. For example, the current conveyor 200C1 corresponding to a differential pair may use a uniform output. As another example, the current conveyor 200C1 corresponding to a differential pair connected to channels having different wiring directions from each other may use a non-uniform output.

[0386] The first channels corresponding to the first electrodes 210 have the same wiring direction as each other. Accordingly, the current conveyor 200C1 corresponding to the differential pair among the current conveyors 200C1 electrically connected to the first electrodes 210 may use a uniform output. Some of the second channels in the second electrode 220 may be wired on the left side of the sensor layer 200, while other channels may be wired on the right side of the sensor layer 200. For example, referring to Figure 18A , five second electrodes 220 provided on the upper portion of the sensor layer 200 may be wired to the right side of the sensor layer 200, and five second electrodes 220 provided on the lower portion of the sensor layer 200 may be wired to the left side of the sensor layer 200. When the wiring directions of the second electrodes 220 for signals to be input to the inverting terminal and the non-inverting terminal of one differential driver 200C2 are different from each other, the output of one current conveyor 200C1 may be output from the non-inverting output terminal, and the output of the other current conveyor 200C1 may be output from the inverting output terminal.

[0387] The integrator CVA may accumulate charges through the current received by the current conveyor 200C1 and may output a voltage corresponding to the accumulated charges. The integrator CVA may include a charging voltage amplifier and a resistor, a capacitor, and a switch connected between the non-inverting terminal and the output terminal of the charging voltage amplifier. For example, the non-inverting terminal of the charging voltage amplifier may receive a signal output from the current conveyor 200C1, and its inverting terminal may be provided with a reference voltage or may be grounded.

[0388] The low-pass filter LPF may be connected to the integrator CVA. The low-pass filter LPF may be a passive low-pass filter including a resistor and a capacitor (e.g., composed of a resistor and a capacitor). The voltage from the low-pass filter LPF may be provided to the differential driver 200C2. The voltage based on the signal provided from the channel 210chx may be transmitted to the second node ND2-z of another channel through the line ND1-L connected to the first node ND1.

[0389] The differential driver 200C2 may include a first differential driver 200C21 and a second differential driver 200C22. Each of the first differential driver 200C21 and the second differential driver 200C22 may receive a voltage based on a signal provided from the channel 210chx, and a voltage based on a signal provided from a first node ND1-y electrically connected to another channel 210chy. The first node ND1-y of the channel 210chy may be connected to the second node ND2 of the channel 210chx.

[0390] The first differential driver 200C21 may include a first differential amplifier DA1, and a resistor, a capacitor, and a switch connected between the non-inverting terminal and the output terminal of the first differential amplifier DA1. The non-inverting terminal of the first differential amplifier DA1 may be connected to a first switch SWI1, and the inverting terminal of the first differential amplifier DA1 may be connected to a second switch SWI2. The connection relationship of the first switch SWI1 and the second switch SWI2 may be controlled based on the phase of the input signal.

[0391] The second differential driver 200C22 may include a second differential amplifier DA2, and a resistor, a capacitor, and a switch connected between the non-inverting terminal and the output terminal of the second differential amplifier DA2. The non-inverting terminal of the second differential amplifier DA2 may be connected to a third switch SWQ1, and the inverting terminal of the second differential amplifier DA2 may be connected to a fourth switch SWQ2. The connection relationship of the third switch SWQ1 and the fourth switch SWQ2 may be controlled based on the phase of the input signal.

[0392] The I / Q demodulator 200C3 may include an in-phase sample-and-hold circuit 200C3I and a quadrature-phase sample-and-hold circuit 200C3Q. The first differential amplifier DA1 may be electrically connected to the in-phase sample-and-hold circuit 200C3I, and the second differential amplifier DA2 may be electrically connected to the quadrature-phase sample-and-hold circuit 200C3Q.

[0393] The analog-to-digital converter 200C4 may include a first analog-to-digital converter 200C4I and a second analog-to-digital converter 200C4Q. The first analog-to-digital converter 200C4I may be electrically connected to the in-phase sample-and-hold circuit 200C3I, and the second analog-to-digital converter 200C4Q may be electrically connected to the quadrature-phase sample-and-hold circuit 200C3Q.

[0394] The first differential amplifier DA1, the in-phase sample-and-hold circuit 200C3I, and the first analog-to-digital converter 200C4I may be referred to as the "in-phase branch IPB". The second differential amplifier DA2, the quadrature-phase sample-and-hold circuit 200C3Q, and the second analog-to-digital converter 200C4Q may be referred to as the "quadrature-phase branch QPB".

[0395] The in-phase branch IPB can integrate the real component of the differential signal, sample the maximum point of the integration result, and convert the sampling result into a digital signal. The quadrature-phase branch QPB can integrate the imaginary component of the differential signal, sample the maximum point of the integration result, and convert the sampling result into a digital signal. Therefore, the code CHD-I (hereinafter referred to as "first data") output from the output terminal OT1 connected to the in-phase branch IPB can have an in-phase amplitude corresponding to channel 210chx. The code CHD-Q (hereinafter referred to as "second data") output from the output terminal OT2 connected to the quadrature-phase branch QPB can have a quadrature-phase amplitude corresponding to channel 210chx.

[0396] Figure 30A is a diagram showing an example of the first signal SSG1 of the first node ND1. Figure 30B is a diagram showing an example of the second signal SSG2 of the second node ND2.

[0397] Reference Figure 29 、 Figure 30A and Figure 30B , the pen PN can be closer to channel 210chx corresponding to the first node ND1. Therefore, the amplitude of the first signal SSG1 can be greater than the amplitude of the second signal SSG2.

[0398] Figure 31A is a diagram showing the connection relationship of the first switch SWI1 and the second switch SWI2 in the first phase period. Figure 31B is a diagram showing the connection relationship of the first switch SWI1 and the second switch SWI2 in the second phase period. Figure 32 is a diagram showing the signal measured at the third node ND3. Figure 33 is a diagram showing the signal measured at the fourth node ND4.

[0399] Reference Figure 29 、 Figure 30A 、 Figure 30B and Figure 31A , in the first phase period, the first switch SWI1 can be connected to the first node ND1, and the second switch SWI2 can be connected to the second node ND2. The first phase period can be from 0 degrees to 180 degrees. For example, the first phase period can be a period in which the phase is 0 degrees or greater and less than 180 degrees. Therefore, in the first phase period, a signal corresponding to subtracting the second signal SSG2 from the first signal SSG1 can be output from the first differential amplifier DA1.

[0400] Reference Figure 29 、 Figure 30A 、 Figure 30B andFigure 31B In the second phase period, the first switch SWI1 can be connected to the second node ND2, and the second switch SWI2 can be connected to the first node ND1. The second phase period can be from 180 degrees to 360 degrees. For example, the second phase period can be a period in which the phase is 180 degrees or greater and less than 360 degrees. Thus, in the second phase period, a signal corresponding to subtracting the first signal SSG1 from the second signal SSG2 can be output from the first differential amplifier DA1.

[0401] Reference Figure 32 The signal SSG-I output from the first differential amplifier DA1 can include a real component. The signal SSG-I can be provided to the in-phase sample and hold circuit 200C3I. The in-phase sample and hold circuit 200C3I can hold the signal SSG-I including the real component.

[0402] Reference Figure 33 shows the signal SSG-IH held by the in-phase sample and hold circuit 200C3I. The first analog-to-digital converter 200C4I can sample the maximum value point MAX-I from the held signal SSG-IH and can convert the sampling result into a digital signal.

[0403] Figure 34A is a diagram showing the connection relationship of the third switch SWQ1 and the fourth switch SWQ2 in the third phase period. Figure 34B is a diagram showing the connection relationship of the third switch SWQ1 and the fourth switch SWQ2 in the fourth phase period. Figure 35 is a diagram showing the signal measured at the fifth node ND5. Figure 36 is a diagram showing the signal measured at the sixth node ND6.

[0404] Reference Figure 29 , Figure 30A , Figure 30B and Figure 34A In the third phase period, the third switch SWQ1 can be connected to the first node ND1, and the fourth switch SWQ2 can be connected to the second node ND2. The third phase period can be from 90 degrees to 270 degrees. For example, the third phase period can be a period in which the phase is 90 degrees or greater and less than 270 degrees. For example, the third phase period can include 180 degrees. Thus, in the third phase period, a signal corresponding to subtracting the second signal SSG2 from the first signal SSG1 can be output from the second differential amplifier DA2.

[0405] Reference Figure 29 , Figure 30A , Figure 30B and Figure 34B, in the fourth phase period, the third switch SWQ1 can be connected to the second node ND2, and the fourth switch SWQ2 can be connected to the first node ND1. The fourth phase period can be from 270 degrees to 90 degrees. For example, the fourth phase period can be a period in which the phase is 270 degrees or greater and less than 90 degrees. For example, the fourth phase period can include 270 degrees to 360 degrees and 0 degrees to 90 degrees. Thus, in the fourth phase period, a signal corresponding to subtracting the first signal SSG1 from the second signal SSG2 can be output from the second differential amplifier DA2.

[0406] Reference Figure 35 , the signal SSG-Q output from the second differential amplifier DA2 can include an imaginary component. The signal SSG-Q can be provided to the quadrature phase sample and hold circuit 200C3Q. The quadrature phase sample and hold circuit 200C3Q can hold the signal SSG-Q including the imaginary component. Reference Figure 36 , a signal SSG-QH held by the quadrature phase sample and hold circuit 200C3Q is shown. The second analog-to-digital converter 200C4Q can sample the maximum value point MAX-Q from the held signal SSG-QH and can convert the sampling result into a digital signal. In an embodiment, the maximum value point MAX-Q can be "0".

[0407] Return reference Figure 29 , the amplitude and phase change can be calculated based on the first data CHD-I output from the first analog-to-digital converter 200C4I and the second data CHD-Q output from the second analog-to-digital converter 200C4Q. For example, the first data CHD-I can be the in-phase amplitude, and the second data CHD-Q can be the quadrature phase amplitude.

[0408] The coordinates or tilt angle of the pen PN can be calculated or determined based on the amplitude, and the pen pressure can be calculated or determined based on the phase change. The amplitude can correspond to the square root of the value obtained by adding the square of the first data CHD-I and the square of the second data CHD-Q, and the phase change can correspond to the arctangent value of the value obtained by dividing the second data CHD-Q by the first data CHD-I.

[0409] Figure 37A is a diagram showing the currents sensed from the first channels 210ch1 to 210ch10. Figure 37B is a diagram showing the currents obtained from the differential pairs of the first channels 210ch1 to 210ch10. Figure 37C is a diagram showing the absolute values of the currents obtained from the differential pairs of the first channels 210ch1 to 210ch10.

[0410] Reference Figure 28A and Figure 37AWhen the positions of the portions where the pen PN is inserted therebetween can be different from each other, the directions of the currents sensed from the first channels 210ch1 to 210ch5 and the first channels 210ch6 to 210ch10 can be different from each other. Accordingly, the direction of the current flowing into the first channels 210ch1 to 210ch5 located on the left with respect to the position of the pen PN can be different from the direction of the current flowing into the first channels 210ch6 to 210ch10 located on the right with respect to the position of the pen PN. Accordingly, the sensor driver 200C can sense the currents flowing in different directions based on the position of the pen PN.

[0411] Reference Figure 37B , such as Figure 28A or Figure 28B shown in, the sensor driver 200C can sense the current by performing differential sensing on channels adjacent to or spaced apart from each other among the first channels 210ch1 to 210ch10. Reference Figure 37C , the sensor driver 200C can obtain absolute data of the current obtained through differential sensing. Figure 37B or Figure 37C The data shown in can be used to process information about the input of the pen PN.

[0412] Figure 38 is a diagram illustrating a method for identifying a pen position according to an embodiment of the present disclosure. Figure 39A is a diagram illustrating a method for identifying a pen position according to an embodiment of the present disclosure. Figure 39B is a diagram illustrating a method for identifying a pen position according to an embodiment of the present disclosure.

[0413] Reference Figure 37B and Figure 38 , points PTM, PTL, and PTR for calculating the position coordinates of the pen PN are selected from the sensed current value diagram. The maximum value PTM of the sensed current value, "n" points PTL located on the left and adjacent to the maximum value PTM, and "n" points PTR located on the right and adjacent to the maximum value PTM can be selected as the points PTM, PTL, and PTR. Here, "n" can be 1 or greater. In Figure 38 , an example in which "n" is equal to 2 is shown.

[0414] Reference Figure 38 and Figure 39A , the X coordinate of the position of the pen PN can be identified from the selected points PTM, PTL, and PTR by using the centroid method.

[0415] Reference Figure 38 and Figure 39B, the X coordinate of the pen PN can be calculated based on the maximum point EV of the trend line obtained by using the selected points PTM, PTL, and PTR. The X coordinate detected from the first electrode 210 and the Y coordinate detected from the second electrode 220 can be corrected based on the tilt angle and azimuth angle described in more detail below.

[0416] Figure 40A is a diagram showing the magnitude and direction of the induced current generated at the pen PN and the first electrode 210 according to an embodiment of the present disclosure. Figure 40B is a diagram showing the magnitude and direction of the induced current generated at the pen PN-tt and the first electrode 210 according to an embodiment of the present disclosure.

[0417] Reference Figure 40A and Figure 40B , when the position of the first electrode 210 relative to the pen PN or PN-tt is on the left, the induced current I-DRa can flow in the direction facing the cross-section (e.g., the second direction DR2). When the position of the first electrode 210 relative to the pen PN or PN-tt is on the right, the induced current I-DRb can flow in the direction away from the cross-section (e.g., the direction away from the second direction DR2).

[0418] Represents Figure 40A and Figure 40B The magnitude of the circle representing the direction of each of the induced currents I-DRa and I-DRb shown in Figure 40A can correspond to the magnitude of each of the induced currents I-DRa and I-DRb. In other words, referring to Figure 40B , as the distance from the pen PN increases, the magnitude of each of the induced currents I-DRa and I-DRb can decrease. When the pen PN is provided in the normal direction on the plane defined by the first electrode 210 without tilting, the magnitudes of the induced currents I-DRa and I-DRb can be horizontally symmetric with respect to the pen PN. Referring to

[0419] Figures 41A to 41B , Figures 42A to 42B and Figure 43 are diagrams showing a method for measuring the tilt angle and azimuth angle of a pen.

[0420] Reference Figure 9 , Figure 41A and Figure 41B , Figure 41A shows a diagram of the magnitude of the sensed current sensed from the first electrode 210, and Figure 41BThe amplitude graph of the sensed current sensed from the second electrode 220 is shown. For example, the first electrode 210 may correspond to the first channel respectively, and the second electrode 220 may correspond to the second channel respectively. The first channel may be sensed differentially, and the second channel may be sensed differentially. In other words, Figure 41A The graph shown in shows the absolute amplitude of the current obtained from the differential pair of the first channel, and Figure 41B The graph shown in shows the absolute amplitude of the current obtained from the differential pair of the second channel. The first channel may be referred to as the "Tx channel", and the second channel may be referred to as the "Rx channel".

[0421] Reference Figure 41A , the first graph GPt represents the absolute amplitude of the sensed current sensed when the pen is not tilted, and the second graph GPt-t represents the absolute amplitude of the sensed current sensed when the pen is tilted. For example, when the pen is not tilted, the first graph GPt may be symmetric or substantially symmetric with respect to the peak point in shape. When the pen is tilted, the first graph GPt may be deformed like the second graph GPt-t.

[0422] Information about the first peak PK1t, the second peak PK2t, and the third peak PK3t and the first area AR1t, the second area AR2t, and the third area AR3t may be obtained based on the second graph GPt-t. The sensor driver 200C (e.g., reference Figure 7 ) may calculate the X-axis tilt angle based on at least some of the first peak PK1t, the second peak PK2t, the third peak PK3t and the first area AR1t, the second area AR2t, and the third area AR3t. The X-axis may be defined as the first direction DR1.

[0423] Reference Figure 41A and Figure 42A , the sensor driver 200C may calculate the X-axis tilt angle AG-xt based on: 1) the ratio of two or more of the first peak PK1t, the second peak PK2t, and the third peak PK3t; 2) each of the first peak PK1t, the second peak PK2t, and the third peak PK3t; 3) the ratio of two or more of the first area AR1t, the second area AR2t, and the third area AR3t; or 4) each of the first area AR1t, the second area AR2t, and the third area AR3t. In an embodiment of the present disclosure, in order to calculate the angle effectively, the sensor driver 200C may further include a look-up table in which the corresponding X-axis tilt angle AG-xt matches the ratio or the target value.

[0424] The sensor driver 200C may calculate or determine "COS(90 degrees - X-axis tilt angle)" based on the X-axis tilt angle AG-xt. The value determined by "COS(90 degrees - X-axis tilt angle)" will hereinafter be referred to as the "first axis value COS-x". In an embodiment of the present disclosure, for effective calculation, the sensor driver 200C may further include a look-up table in which a trigonometric table for calculating the first axis value COS-x is stored.

[0425] Reference Figure 41B and Figure 42B , the third graph GPr-t represents the absolute amplitude of the sensed current sensed from the second electrode 220 when the pen is tilted. The sensor driver 200C may obtain information regarding the first peak PK1r, the second peak PK2r, and the third peak PK3r, and the first area AR1r, the second area AR2r, and the third area AR3r based on the third graph GPr-t. The sensor driver 200C (e.g., reference Figure 7 ) may calculate the Y-axis tilt angle based on at least some of the first peak PK1r, the second peak PK2r, and the third peak PK3r and the first area AR1r, the second area AR2r, and the third area AR3r. The Y-axis may be defined as the second direction DR2.

[0426] The sensor driver 200C may calculate the Y-axis tilt angle AG-yt based on: 1) the ratio of two or more of the first peak PK1r, the second peak PK2r, and the third peak PK3r; 2) each of the first peak PK1r, the second peak PK2r, and the third peak PK3r; 3) the ratio of two or more of the first area AR1r, the second area AR2r, and the third area AR3r; or 4) each of the first area AR1r, the second area AR2r, and the third area AR3r. In an embodiment of the present disclosure, for effective angle calculation, the sensor driver 200C may further include a look-up table in which the corresponding Y-axis tilt angle AG-yt is matched with a ratio or a target value.

[0427] The sensor driver 200C may calculate or determine "COS(90 degrees - Y-axis tilt angle)" based on the Y-axis tilt angle AG-yt. The value determined by "COS(90 degrees - Y-axis tilt angle)" will hereinafter be referred to as the "second axis value COS-y". In an embodiment of the present disclosure, for effective calculation, the sensor driver 200C may further include a look-up table in which a trigonometric table for calculating the second axis value COS-y is stored.

[0428] Reference Figure 42A , Figure 42B and Figure 43, the first axis value COS-x and the second axis value COS-y are respectively marked on the X-axis and the Y-axis. The azimuth angle AG-az of the pen can be calculated or determined based on the first axis value COS-x and the second axis value COS-y. For example, the azimuth angle AG-az can correspond to "arctangent (second axis value / first axis value)". In an embodiment of the present disclosure, for effective calculation, the sensor driver 200C may further include a look-up table in which a trigonometric table for calculating the azimuth angle AG-az is stored.

[0429] Figures 44A to 44C is a diagram showing a method for measuring the pressure of a pen.

[0430] Figure 44A shows the voltage induced in the pen PN-np when no pressure is applied to the pen PN-np. Figure 44B shows the voltage induced in the pen PN-p when pressure is applied to the pen PN-p. The second mode MD2 may include a charging period MD2-ch and a discharging period MD2-dc. In the charging period MD2-ch, the pen PN-p or PN-np close to the sensor layer 200 may be charged. Then, in the discharging period MD2-dc, the pen PN-p or PN-np may be discharged.

[0431] Reference Figure 44A and Figure 44B , the difference between the phase of the pen PN-np when no pressure is applied to the pen PN-np and the phase of the pen PN-p when pressure is applied to the pen PN-p occurs at the point PP. For example, the capacitance of the pressure capacitor C-P in the pen PN (e.g., reference Figure 25A ) may change due to the pen pressure. For example, when pen pressure is applied to the pen PN, the capacitance of the pressure capacitor C-P may increase. In this case, the resonance frequency of the pen PN may decrease due to the increased capacitance.

[0432] Reference Figure 44A , Figure 44B and Figure 44C , the contact threshold CT can be determined based on the phase change according to the pressure. The pressure value PT corresponding to the contact threshold CT can be determined as the contact pressure. Therefore, the region with a phase change less than the contact threshold CT can be determined as (e.g., can be set as) the pen hovering part PHS where the pen PN does not directly contact the electronic device 1000 (e.g., reference Figure 1A ). In addition, the region with a phase change greater than the contact threshold CT can be determined as (e.g., can be set as) the pen contact part PCS where the pen PN directly contacts the electronic device 1000.

[0433] Figure 45AIt is an equivalent circuit diagram showing the relationship between a channel CH-c and a pen PN according to a comparative example. Figure 45B It is an equivalent circuit diagram showing the relationship between a channel CH-c and a pen PN according to a comparative example.

[0434] Reference Figure 45A and Figure 45B ,a channel CH-c may include an electrode 210-c (e.g., may be composed of it) connected to an input terminal IT. The input terminal IT may correspond to a pad electrically connected between the sensor driver 200C and the electrode 210-c.

[0435] Capacitors Cbc1, Cbc2, Cbc3, and Cbc4 are defined in the electrode 210-c. The capacitors Cbc1, Cbc2, Cbc3, and Cbc4 may be referred to as "parasitic capacitors" or "basic capacitors".

[0436] Reference Figure 45A ,when the pen PN approaches the channel CH-c, a first induced electromotive force Vs(t) can be generated in the electrode 210-c by the magnetic field generated by the pen PN. Therefore, an induced current IN-C can be generated in the channel CH-c. Referring together to Figure 29 ,one of the non-inverting terminal and the inverting terminal of the charge voltage amplifier included in the integrator CVA may be electrically connected to the input terminal IT, and the other may be grounded. In this case, the input terminal IT may be considered to be grounded. Therefore, since the opposite end of the capacitor Cbc1 among the capacitors Cbc1, Cbc2, Cbc3, and Cbc4 is grounded, current may not flow into the capacitor Cbc1.

[0437] The induced current IN-C may be proportional to the sum of the capacitances of the capacitors Cbc2, Cbc3, and Cbc4. For example, assuming that the capacitance of each of the capacitors Cbc2, Cbc3, and Cbc4 is Cb, the change of the induced current IN-C with time can be expressed by the following formula.

[0438]

[0439] Reference Figure 45B ,when the pen PN approaches the channel CH-c, an induced current IF-C can be generated in the channel CH-c by the magnetic field generated by the pen PN. Since the opposite ends of each of the first capacitor Cbc1, the second capacitor Cbc2, and the third capacitor Cbc3 among the capacitors Cbc1, Cbc2, Cbc3, and Cbc4 are grounded, current may not flow into the first capacitor Cbc1, the second capacitor Cbc2, and the third capacitor Cbc3. Assuming that the capacitance of the capacitor Cbc4 is Cb, the change of the induced current IF-C with time can be expressed by the following formula.

[0440]

[0441] refer to Figure 45A and Figure 45B , the amplitude of the induced current when the pen PN is located in the area adjacent to the input terminal IT is different from the amplitude of the induced current when the pen PN is located in the area away from the input terminal IT. For example, the signal of the pen PN provided in the area away from the input terminal IT or the sensor driver 200C may be smaller than the signal of the pen PN provided in the area close to the input terminal IT or the sensor driver 200C. In more detail, the amplitude of the induced current IF-C may not be sufficient to sense the pen input.

[0442] Figure 46A is an equivalent circuit diagram showing a relationship between one channel CH and a pen PN according to an embodiment of the present disclosure. Figure 46B is an equivalent circuit diagram showing a relationship between one channel CH and a pen PN according to an embodiment of the present disclosure.

[0443] refer to Figure 9 , Figure 46A and Figure 46B , one channel CH may include a first electrode 210 connected to the input terminal IT, and a first auxiliary electrode 230 s capacitively coupled to the first electrode 210 by the third electrode 230 .

[0444] A plurality of first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 may be defined between the first electrode 210 and the first auxiliary electrode 230s. Capacitors Cbc1, Cbc2, Cbc3, and Cbc4 are defined in the first electrode 210. Capacitors Cbc1, Cbc2, Cbc3, and Cbc4 may be referred to as "parasitic capacitors" or "base capacitors."

[0445] The input terminal IT may correspond to a pad electrically connected between the sensor driver 200C and the first electrode 210. For example, the input terminal IT may correspond to the first pad PD1. The first end of the first auxiliary electrode 230s may be electrically connected to the fifth pad PD5, and the second end of the first auxiliary electrode 230s may be electrically connected to the third trace 230rt1. In an embodiment of the present disclosure, the fifth pad PD5 may be floated, and the third trace 230rt1 may be grounded or may be grounded through a bias capacitor.

[0446] refer to Figure 46A, when the pen PN approaches the channel CH, a first induced electromotive force Vs(t) can be generated in the first electrode 210 by the magnetic field generated by the pen PN, and a second induced electromotive force Va(t) can be generated in the first auxiliary electrode 230s of the third electrode 230 by the magnetic field generated by the pen PN. A first induced current IN-M and a third induced current IN-B can be generated by the first induced electromotive force Vs(t), and a second induced current IN-A can be generated by the second induced electromotive force Va(t). Therefore, the total induced current IN flowing into the input terminal IT can correspond to the sum of the first induced current IN-M, the second induced current IN-A, and the third induced current IN-B.

[0447] For example, assuming that the capacitance of each of the capacitors Cbc1, Cbc2, Cbc3, and Cbc4 is Cb, the change of the first induced current IN-M with time can be expressed by the following formula.

[0448]

[0449] Assuming that the capacitance of each of the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 is Cc, the change of the second induced current IN-A with time can be expressed by the following formula.

[0450]

[0451] In addition, the change of the third induced current IN-B with time can be expressed by the following formula.

[0452]

[0453] The first induced current IN-M can be an induced current from at least some of the capacitors Cbc1, Cbc2, Cbc3, and Cbc4, and can be called an "auxiliary induced current". The first induced current IN-M generated in the first electrode 210 can be called a "first auxiliary induced current", and the first induced current IN-M generated in the second electrode 220 can be called a "second auxiliary induced current". Each of the second induced current IN-A and the third induced current IN-B can be an induced current from at least some of the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14, and can be called a "coupling induced current".

[0454] Reference Figure 46B, when the pen PN approaches the channel CH, a first induced electromotive force Vs(t) can be generated in the first electrode 210 by the magnetic field generated by the pen PN, and a second induced electromotive force Va(t) can be generated in the first auxiliary electrode 230s of the third electrode 230 by the magnetic field generated by the pen PN. Since the opposite ends of each of the capacitors Cbc1, Cbc2, and Cbc3 between the first induced electromotive force Vs(t) and the input terminal IT are grounded, current cannot flow into the capacitors Cbc1, Cbc2, and Cbc3.

[0455] A first induced current IF-M and a third induced current IF-B can be generated by the first induced electromotive force Vs(t), and a second induced current IF-A can be generated by the second induced electromotive force Va(t). Therefore, the total induced current IF flowing into the input terminal IT can correspond to the sum of the first induced current IF-M, the second induced current IF-A, and the third induced current IF-B.

[0456] For example, assuming that the capacitance of each of the capacitors Cbc1, Cbc2, Cbc3, and Cbc4 is Cb, the variation of the first induced current IF-M with time can be expressed by the following equation.

[0457]

[0458] Assuming that the capacitance of each of the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 is Cc, the variation of the second induced current IF-A with time can be expressed by the following equation.

[0459]

[0460] In addition, the variation of the third induced current IF-B with time can be expressed by the following equation.

[0461]

[0462] Figure 47 is a diagram showing the current amplitude according to the pen position for one channel.

[0463] Reference Figure 45A , Figure 45B , Figure 46A , Figure 46B and Figure 47 , the first graph GP1 is a diagram showing the current amplitude of the pen position measured according to the comparative example based on Figure 45A and Figure 45B . The second graph GP2 is a diagram showing the current amplitude of the pen position measured according to the embodiment based on Figure 46A and Figure 46B .

[0464] The first point PP1 can correspond to Figure 45A and Figure 46A the position of the pen PN shown in, while the second point PP2 can correspond to Figure 45B and Figure 46B the position of the pen PN shown in. More specifically, at the second point PP2, a second induced current IF-A and a third induced current IF-B generated in the third electrode 230 can be additionally generated by the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14. Accordingly, compared to the total induced current IF-C according to the comparative example, the total induced current IF can be increased, and the amplitude of the total induced current IF can be sufficient to sense the pen input. In addition, at the first point PP1, compared to the total induced current IN-C according to the comparative example, the total induced current IN can be increased. Accordingly, at the first point PP1 and the second point PP2, the amplitude of each of the total induced currents IN and IF can be guaranteed by up to a certain value (e.g., a given or predetermined value) or a greater value.

[0465] Figure 48A is a diagram showing one channel CH-TX according to an embodiment of the present disclosure. Figure 48B is a diagram showing one channel CH-RX according to an embodiment of the present disclosure.

[0466] Referring to Figure 9 、 Figure 27B and Figure 48A , one first channel CH-TX is shown. For example, the first channel CH-TX may include a first electrode 210 and a first auxiliary electrode 230s overlapping the first electrode 210. For example, when viewed in the third direction DR3 (e.g., in a plan view), the first electrode 210 and the first auxiliary electrode 230s may overlap each other. The first electrode 210 may output a first received signal PRX1a to the sensor driver 200C, and the first auxiliary electrode 230s may be capacitively coupled to the first electrode 210.

[0467] In an embodiment of the present disclosure, in the pen sensing driving mode, the first auxiliary electrode 230s may be electrically connected to the ground (e.g., may be coupled to the ground). For example, a third trace 230rt1 electrically connected to the first auxiliary electrode 230s may be grounded (e.g., may be coupled to the ground). In other words, the third electrode 230 may be directly connected to the ground through the third trace 230rt1.

[0468] The first electrode 210 may be connected to the first trace 210t at the first region AR1, and the first auxiliary electrode 230s may be connected to the third trace 230rt1 at the second region AR2. Each of the first electrode 210 and the first auxiliary electrode 230s may extend in the second direction DR2, and the first region AR1 and the second region AR2 may be spaced apart from each other in the second direction DR2.

[0469] A plurality of first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 may be defined between the first electrode 210 and the first auxiliary electrode 230s. In the pen sensing driving mode, the sensor driver 200C may receive the induced current flowing from the first auxiliary electrode 230s to the first electrode 210 through the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14.

[0470] Reference Figure 9 , Figure 27B and Figure 48B , shows a second channel CH-RX. For example, the second channel CH-RX may include a second electrode 220 and a second auxiliary electrode 240s overlapping the second electrode 220. For example, when observed in the third direction DR3 (e.g., in the plan view), the second electrode 220 and the second auxiliary electrode 240s may overlap each other. The second electrode 220 may output the second received signal PRX2a to the sensor driver 200C, and the second auxiliary electrode 240s may be capacitively coupled to the second electrode 220.

[0471] In an embodiment of the present disclosure, in the pen sensing driving mode, the second auxiliary electrode 240s may be electrically connected to the ground (e.g., may be coupled to the ground). For example, the fourth trace 240t electrically connected to the second auxiliary electrode 240s may be grounded. In other words, the second auxiliary electrode 240s may be directly connected to the ground through the fourth trace 240t.

[0472] The second electrode 220 may be connected to the second trace 220t at the third region AR3, and the second auxiliary electrode 240s may be connected to the fourth trace 240t at the fourth region AR4. Each of the second electrode 220 and the second auxiliary electrode 240s may extend in the first direction DR1, and the third region AR3 and the fourth region AR4 may be spaced apart from each other in the first direction DR1.

[0473] A plurality of second coupling capacitors Ccp21, Ccp22, Ccp23, and Ccp24 may be defined between the second electrode 220 and the second auxiliary electrode 240s. In the pen sensing driving mode, the sensor driver 200C may receive a second current flowing from the second auxiliary electrode 240s to the second electrode 220 through the second coupling capacitors Ccp21, Ccp22, Ccp23, and Ccp24.

[0474] Figure 49A is an equivalent circuit diagram showing the relationship between one channel CH-1 and the pen PN according to an embodiment of the present disclosure. Figure 49B is an equivalent circuit diagram showing the relationship between one channel CH-1 and the pen PN according to an embodiment of the present disclosure.

[0475] Reference Figure 49A and Figure 49B , one channel CH-1 may include a first electrode 210 connected to the input terminal IT and a first auxiliary electrode 230s capacitively coupled to the first electrode 210. A plurality of first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 may be defined between the first electrode 210 and the first auxiliary electrode 230s. The first auxiliary electrode 230s may be electrically connected to the fifth pad PD5 and the third trace 230rt1. In an embodiment of the present disclosure, the fifth pad PD5 may be floated, and the third trace 230rt1 may be grounded.

[0476] Reference Figure 49A , when the pen PN approaches the channel CH-1, a first induced electromotive force Vs(t) may be generated in the first electrode 210 by the magnetic field generated by the pen PN, and a second induced electromotive force Va(t) may be generated in the first auxiliary electrode 230s by the magnetic field generated by the pen PN.

[0477] Each of the first node NC1 and the third node NC3 may have a ground voltage. The voltage of the second node NC2 may be -Vs(t), and the voltage of the fourth node NC4 may be +Va(t). Therefore, a first induced current IN-B1 may be generated by the first induced electromotive force Vs(t), and a second induced current IN-A1 may be generated by the second induced electromotive force Va(t). Therefore, the total induced current IN-1 input to the input terminal IT may correspond to the sum of the first induced current IN-B1 and the second induced current IN-A1. For example, assume that the capacitance of each of the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 is Cc.

[0478] In this case, the change of the first induced current IN-B1 with time may be represented by the following equation.

[0479]

[0480] The change in the second induced current IN-A1 over time can be expressed by the following equation.

[0481]

[0482] Reference Figure 49B , the first induced current IF-B1 can be generated by the first induced electromotive force Vs(t), and the second induced current IF-A1 can be generated by the second induced electromotive force Va(t). Therefore, the total induced current IF-1 input to the input terminal IT can correspond to the sum of the first induced current IF-B1 and the second induced current IF-A1. For example, assume that the capacitance of each of the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 is Cc.

[0483] In this case, the change in the first induced current IF-B1 over time can be expressed by the following equation.

[0484]

[0485] The change in the second induced current IF-A1 over time can be expressed by the following equation.

[0486]

[0487] In an embodiment of the present disclosure, the first induced electromotive force Vs(t) can be the same as or substantially the same as the second induced electromotive force Va(t). In this case, the total induced current IN-1 input to the input terminal IT when the pen PN is close to the input terminal IT can be the same as or substantially the same as the total induced current IF-1 input to the input terminal IT when the pen PN is relatively far from the input terminal IT. For example, each of the first induced electromotive force Vs(t) and the second induced electromotive force Va(t) can be represented by v(t), and each of the total induced currents IN-1 and IF-1 can be represented by the following equation.

[0488]

[0489] Figure 50 FIG. is a diagram showing one channel CH-2 according to an embodiment of the present disclosure. Figure 51 FIG. is an equivalent circuit diagram showing the relationship between one channel CH-2 according to an embodiment of the present disclosure and the pen PN.

[0490] Reference Figure 50 and Figure 51, a first channel CH-2 is shown. For example, the first channel CH-2 may include a first electrode 210 and a first auxiliary electrode 230s capacitively coupled to the first electrode 210. When observed in the third direction DR3 (e.g., in a plan view), the first electrode 210 and the first auxiliary electrode 230s may overlap each other.

[0491] In an embodiment of the present disclosure, in the pen sensing driving mode, a first end of the first auxiliary electrode 230s may be floating, and a second end of the first auxiliary electrode 230s may be electrically connected to ground (e.g., may be coupled to ground). For example, the second end of the first auxiliary electrode 230s may be grounded (e.g., may be coupled to ground) through a bias capacitor Cbias.

[0492] When the pen PN approaches the first channel CH-2, a first induced electromotive force Vs(t) may be generated in the first electrode 210 by a magnetic field generated by the pen PN, and a second induced electromotive force Va(t) may be generated in the first auxiliary electrode 230s by the magnetic field generated by the pen PN. A first induced current IN-B2 may be generated by the first induced electromotive force Vs(t), and a second induced current IN-A2 may be generated by the second induced electromotive force Va(t). Therefore, the total induced current IN-2 input to the input terminal IT may correspond to the sum of the first induced current IN-B2 and the second induced current IN-A2.

[0493] Assume that the capacitance of each of the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 is Cc. Assume that the capacitance of the bias capacitor Cbias is Cbi.

[0494] In this case, the first node NC1a may have a ground voltage, the voltage of the second node NC2a may be -Vs(t), the voltage of the third node NC3a may be represented by the following equation (1), and the voltage of the fourth node NC4a may be represented by the following equation (2).

[0495] Equation (1):

[0496]

[0497] Equation (2):

[0498]

[0499] In an embodiment of the present disclosure, the capacitance of the bias capacitor Cbias may be greater than the capacitance of each of the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14. In this case, the difference between the total induced current input to the input terminal IT when the pen PN is close to the input terminal IT and the total induced current input to the input terminal IT when the pen PN is relatively far from the input terminal IT may not be the same as the difference between the total induced currents described above with reference to Figure 45A and Figure 45B .

[0500] Figure 52 FIG. is a diagram showing a channel CH-3 according to an embodiment of the present disclosure. Figure 53 FIG.

[0500] is an equivalent circuit diagram showing the relationship between a channel CH-3 and the pen PN according to an embodiment of the present disclosure.

[0501] Referring to Figure 52 and Figure 53 , a first channel CH-3 is shown. For example, the first channel CH-3 may include a first electrode 210 and a first auxiliary electrode 230s capacitively coupled to the first electrode 210. When observed in the third direction DR3 (e.g., in a plan view), the first electrode 210 and the first auxiliary electrode 230s may overlap each other.

[0502] The first auxiliary electrode 230s may be electrically connected to a fifth pad PD5 and a third trace 230rt1. In an embodiment of the present disclosure, the fifth pad PD5 may be floating, and the third trace 230rt1 may be grounded. However, the present disclosure is not limited thereto. For example, the third trace 230rt1 may be grounded through a bias capacitor (e.g., may be coupled to ground).

[0503] Capacitors Cbc1, Cbc2, Cbc3, and Cbc4 may be defined in the first electrode 210. The capacitors Cbc1, Cbc2, Cbc3, and Cbc4 may be referred to as "parasitic capacitors" or "basic capacitors". According to an embodiment of the present disclosure, the capacitors Cbc1, Cbc2, Cbc3, and Cbc4 may also be used to make the signal amplitude larger.

[0504] When the pen PN approaches the first channel CH-3, a first induced electromotive force Vs(t) can be generated in the first electrode 210 by the magnetic field generated by the pen PN, and a second induced electromotive force Va(t) can be generated in the first auxiliary electrode 230s by the magnetic field generated by the pen PN. A first induced current IN-M and a third induced current IN-B3 can be generated by the first induced electromotive force Vs(t), and a second induced current IN-A3 can be generated by the second induced electromotive force Va(t). Therefore, the total induced current IN-3 flowing into the input terminal IT can correspond to the sum of the first induced current IN-M, the second induced current IN-A3, and the third induced current IN-B3.

[0505] For example, assume that the capacitance of each of the capacitors Cbc1, Cbc2, Cbc3, and Cbc4 is Cb, and assume that the capacitance of each of the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 is Cc.

[0506] In this case, the variation of the first induced current IN-M with time can be expressed by the following equation.

[0507]

[0508] The variation of the second induced current IN-A3 with time can be expressed by the following equation.

[0509]

[0510] The variation of the third induced current IN-B3 with time can be expressed by the following equation.

[0511]

[0512] Figure 54A is a diagram showing the current amplitude according to the pen position for one channel. Figure 54B is a diagram showing the current amplitude according to the pen position for one channel.

[0513] Reference Figure 52 、 Figure 53 and Figure 54A , because the relative ends of the capacitors existing between the input terminal IT and the pen PN among the capacitors Cbc1, Cbc2, Cbc3, and Cbc4 are grounded (e.g., connected to the ground), current cannot flow. Therefore, when the position of the pen PN moves from the first point PP1 to the second point PP2, the first induced current IN-M can gradually decrease. In addition, the second induced current IN-A3 can gradually increase, and the third induced current IN-B3 can gradually decrease.

[0514] Reference Figure 52 、 Figure 53And Figure 54B When the position of the pen PN moves from the first point PP1 to the second point PP2, the total induced current IN-3 can gradually decrease. However, as described above, the total induced current IN-3 can correspond to the sum of the first induced current IN-M, the second induced current IN-A3, and the third induced current IN-B3, and the magnitude of the total induced current IN-3 at the second point PP2 can be guaranteed by up to a certain value (e.g., a given or predetermined value) or a greater value.

[0515] Figure 55 is an equivalent circuit diagram showing the relationship between a channel CH-4 and a pen according to an embodiment of the present disclosure.

[0516] Reference Figure 55 shows a first channel CH-4. For example, the first channel CH-4 may include a first electrode 210 and a first auxiliary electrode 230s capacitively coupled to the first electrode 210. Compared with the embodiment shown in Figure 52 in Figure 55 a first resistor Rt between the sensor driver 200C and the first electrode 210 and a second resistor Rs of the first electrode 210 are additionally shown.

[0517] Capacitors Cbc1, Cbc2, Cbc3, and Cbc4 may be defined in the first electrode 210. When viewed in the third direction DR3 (e.g., in a plan view), the first electrode 210 and the first auxiliary electrode 230s may overlap each other. A plurality of first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 may be defined between the first auxiliary electrode 230s and the first electrode 210. Hereinafter, the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 may be referred to as "1-first coupling capacitor Ccp11", "1-second coupling capacitor Ccp12", "1-third coupling capacitor Ccp13", and "1-fourth coupling capacitor Ccp14", respectively.

[0518] The first auxiliary electrode 230s may be electrically connected to the third trace 230rt1. In an embodiment of the present disclosure, the first end of the first auxiliary electrode 230s may be floating, and the second end of the first auxiliary electrode 230s (e.g., a portion of the first auxiliary electrode 230s connected to the third trace 230rt1) may be grounded. However, the present disclosure is not limited thereto. For example, the third trace 230rt1 may be grounded through a bias capacitor (e.g., may be coupled to the ground).

[0519] The magnitude of the induced current flowing from the first auxiliary electrode 230s to the first electrode 210 can be proportional to the sum of the capacitances of the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14. Therefore, the capacitances of the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 can be adjusted in various ways as needed or desired.

[0520] In an embodiment of the present disclosure, the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 can have the same or substantially the same capacitance as each other. In this case, the ratio of the capacitances of the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 can be 1:1:1:1.

[0521] In an embodiment of the present disclosure, some of the capacitances of the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 can be different from the other capacitances. For example, in order to enhance the RC delay, the capacitance of the 1 - first coupling capacitor Ccp11, which is the closest to the sensor driver 200C among the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14, can be adjusted to be the largest. For example, the capacitance of the 1 - first coupling capacitor Ccp11 can be greater than the capacitance of the 1 - second coupling capacitor Ccp12. In this case, since the RC delay is reduced, the frequency band that can be used in the sensor layer 200 can be increased.

[0522] When the ratio of the capacitances of the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 is 4:3:2:1, the RC delay can be enhanced by up to about 3% compared to the case where the ratio of the capacitances of the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 is 1:1:1:1. When the ratio of the capacitances of the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 is 10:0:0:0, the RC delay can be enhanced by up to about 11% compared to the case where the ratio of the capacitances of the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 is 1:1:1:1. However, the above ratios of the capacitances are provided as examples, and the present disclosure is not limited thereto.

[0523] Figure 56A is a plan view of the first conductive layer (e.g., the first layer) 202SUb of the sensing unit according to an embodiment of the present disclosure. Figure 56B is a plan view of the second conductive layer (e.g., the second layer) 204SUb of the sensing unit according to an embodiment of the present disclosure.

[0524] Reference Figure 56A and Figure 56B, the first sensing electrode 210-x may include a first sensing pattern (e.g., a pattern) 210-sp and a first bridging pattern 210-bp. The first sensing pattern 210-sp and the first bridging pattern 210-bp may be electrically connected to each other through a first contact portion CNax. The second sensing electrode 220-x may be disposed at the same layer as the layer of the first sensing pattern 210-sp (e.g., in the same layer or on the layer). For example, the first sensing patterns 210-sp may be spaced apart from each other, and the second sensing electrode 220-x may be interposed therebetween. The first bridging pattern 210-bp may be disposed at a layer different from the layer of the second sensing electrode 220-x (e.g., in a different layer or on the layer), and may be insulated from the second sensing electrode 220-x and cross the second sensing electrode 220-x.

[0525] The first auxiliary electrode (e.g., the first electrode) 230-x may be disposed at the same layer as the layer of the first bridging pattern 210-bp (e.g., in the same layer or on the layer). An opening surrounding the first bridging pattern 210-bp (e.g., around its periphery) may be defined in the first auxiliary electrode 230-x. The first auxiliary electrode 230-x may overlap with the first sensing pattern 210-sp. For example, one of the first sensing patterns 210-sp may include a first region overlapping with the first auxiliary electrode 230-x. Accordingly, a coupling capacitor (e.g., a first capacitor) may be defined between the first sensing electrode 210-x (e.g., one of the first sensing patterns 210-sp) and the first auxiliary electrode 230-x.

[0526] The second auxiliary electrode (e.g., the second electrode) 240-x may include a second sensing pattern (e.g., a pattern) 240-sp and a second bridging pattern 240-bp. The second sensing pattern 240-sp and the second bridging pattern 240-bp may be electrically connected to each other through a second contact portion CNbx. The first auxiliary electrode 230-x may be disposed at the same layer as that of the second sensing pattern 240-sp (e.g., in the same layer or on the layer). For example, the second sensing patterns 240-sp may be spaced apart from each other, and the first auxiliary electrode 230-x may be interposed therebetween. The second auxiliary electrode 240-x may overlap with the second sensing electrode 220-x. For example, one of the second sensing patterns 240-sp may include a second region that overlaps with the second sensing electrode 220-x. Accordingly, a coupling capacitor (e.g., a second capacitor) may be defined between the second sensing electrode 220-x and the second auxiliary electrode 240-x (e.g., one of the second sensing patterns 240-sp). In some embodiments, the area of the first region (e.g., the first area) may be less than (e.g., smaller than) the area of the second region (e.g., the second area). Accordingly, in some embodiments, the capacitance of the first capacitor may be less than the capacitance of the second capacitor. The second bridging pattern 240-bp may be disposed at a layer different from that of the first auxiliary electrode 230-x (e.g., in a different layer or on the layer), and may be insulated from and cross the first auxiliary electrode 230-x. The maximum width WT-a of the first auxiliary electrode 230-x in the first direction DR1 may be less than or equal to the maximum width WT-b of the second auxiliary electrode 240-x or the second sensing pattern 240-sp in the second direction DR2.

[0527] In an embodiment of the present disclosure, the first conductive layer 202SUb may include a first bridging pattern 210-bp, a first auxiliary electrode 230-x, and a second sensing pattern 240-sp. The second conductive layer 204SUb may include a first sensing pattern 210-sp, a second sensing electrode 220-x, and a second bridging pattern 240-bp. In addition, in an embodiment of the present disclosure, the first conductive layer 202SUb may further include dummy patterns DMP. Each of the dummy patterns DMP may be electrically floating or may be electrically grounded. In an embodiment of the present disclosure, the dummy patterns DMP may be omitted as needed or desired.

[0528] In some embodiments, as Figure 56AAs shown, the first auxiliary electrode (e.g., the first electrode) 230-x may include a pattern (or a pattern portion) at opposite ends of the first bridging pattern 210-bp in the second direction DR2 and connecting portions (or bridging patterns) spaced apart from each other in the first direction DR1, and the connecting portions are located between the pattern portions and between the second sensing patterns 240-sp. The connecting portions and the pattern portions are connected to each other and are located at the same layer as each other, and each of the patterns of the first auxiliary electrode 230-x may have a width parallel to or substantially parallel to the first direction DR1. In some embodiments, the width of each of the patterns of the first auxiliary electrode 230-x may be less than the width WT-b of the second auxiliary electrode 240-x or the second sensing pattern 240-sp parallel to or substantially parallel to the second direction DR2. The patterns of the first auxiliary electrode 230-x may be connected to each other via at least one bridging pattern that extends parallel to or substantially parallel to the first bridging pattern 210-bp. For example, as Figure 56A shown, the patterns of the first auxiliary electrode 230-x may be connected to each other by two bridging patterns located at opposite sides of the first bridging pattern 210-bp in the first direction DR1. However, the present disclosure is not limited thereto, and in some embodiments, the bridging pattern of the first auxiliary electrode 230-x may overlap with the first bridging pattern 210-bp. For example, in some embodiments, the first bridging pattern 210-bp may overlap with the opening of the bridging pattern of the first auxiliary electrode 230-x. The width of the bridging pattern of the first auxiliary electrode 230-x in the first direction DR1 may be less than the width of the pattern of the first auxiliary electrode 230-x in the first direction DR1.

[0529] In some embodiments, as Figure 56B shown, the second sensing electrode 220-x may include a pattern at opposite ends of the second bridging pattern 240-bp in the first direction DR1, and the patterns of the second sensing electrode 220-x may be connected to each other via at least one bridging pattern that extends parallel to or substantially parallel to the second bridging pattern 240-bp, and the patterns of the second sensing electrode 220-x and the bridging pattern are located at the same layer as each other. For example, as Figure 56B shown, the patterns of the second sensing electrode 220-x may be connected to each other by two bridging patterns located at opposite sides of the second bridging pattern 240-bp in the second direction DR2.

[0530] Figure 57A is a plan view of a first conductive layer (e.g., a first layer) 202SUc of a sensing unit according to an embodiment of the present disclosure. Figure 57B is a plan view of a second conductive layer (e.g., a second layer) 204SUc of a sensing unit according to an embodiment of the present disclosure.

[0531] Reference Figure 57A and Figure 57B ,the first sensing electrode 210-xa may include a first sensing pattern (e.g., a pattern) 210-sp, a first bridging pattern 210-bp, and a first electrode auxiliary pattern 210-aux. The first sensing pattern 210-sp and the first bridging pattern 210-bp may be electrically connected to each other through a first contact portion CNax. The first sensing pattern 210-sp and the first electrode auxiliary pattern 210-aux may be electrically connected to each other through a third contact portion CNcx.

[0532] The second sensing electrode 220-xa may include a second sensing pattern (e.g., a pattern) 220-sp, a second bridging pattern 220-bp, and a second electrode auxiliary pattern 220-aux. The second sensing pattern 220-sp and the second bridging pattern 220-bp may be electrically connected to each other through a fourth contact portion CNdx. The second sensing pattern 220-sp and the second electrode auxiliary pattern 220-aux may be electrically connected to each other through a fifth contact portion CNex.

[0533] The first auxiliary electrode (e.g., the first electrode) 230-x may be electrically connected to a third auxiliary pattern 230-aux. For example, the first auxiliary electrode 230-x and the third auxiliary pattern 230-aux may be disposed at different layers from each other (e.g., in or on different layers from each other), and the first auxiliary electrode 230-x and the third auxiliary pattern 230-aux may be electrically connected to each other through a sixth contact portion CNfx.

[0534] The second auxiliary electrode (e.g., the second electrode) 240-xa may include a third sensing pattern (e.g., a pattern) 240-spa and a third bridging pattern 240-bpa. The third sensing pattern 240-spa may be referred to as an "auxiliary pattern", and the third bridging pattern 240-bpa may be referred to as an "auxiliary bridging pattern". The third sensing pattern 240-spa and the third bridging pattern 240-bpa may be electrically connected to each other through a second contact portion CNbx. The third bridging pattern 240-bpa may be in the shape of a line extending in a first direction DR1, and the third sensing patterns 240-spa may be spaced apart from each other in the first direction DR1. The second sensing patterns 220-sp may be spaced apart from each other, and the third bridging pattern 240-bpa may be interposed therebetween.

[0535] In an embodiment of the present disclosure, the first conductive layer 202SUc may include a first bridging pattern 210-bp, a first electrode auxiliary pattern 210-aux, a second bridging pattern 220-bp, a second electrode auxiliary pattern 220-aux, a first auxiliary electrode 230-x, and a third sensing pattern 240-spa. The second conductive layer 204SUc may include a first sensing pattern 210-sp, a second sensing pattern 220-sp, a third auxiliary pattern 230-aux, and a third bridging pattern 240-bpa.

[0536] Figure 58A is a plan view of a first conductive layer (e.g., a first layer) 202SUd of a sensing unit according to an embodiment of the present disclosure. Figure 58B is a plan view of a first conductive layer (e.g., a first layer) 202SUe of a sensing unit according to an embodiment of the present disclosure.

[0537] Reference Figure 55 、 Figure 56A 、 Figure 58A and Figure 58B , at least some of the capacitances of the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 may be different from the other capacitances. For example, in order to enhance the RC delay, the capacitance of the 1-first coupling capacitor Ccp11, which is the closest to the sensor driver 200C among the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14, may be adjusted to be the largest. For example, the capacitance of the 1-first coupling capacitor Ccp11 may be greater than the capacitance of the 1-second coupling capacitor Ccp12. In addition, the capacitance of the 1-second coupling capacitor Ccp12 may be greater than the capacitance of the 1-fourth coupling capacitor Ccp14. In this case, since the RC delay is reduced, the frequency band that can be used in the sensor layer 200 may be increased.

[0538] Reference Figure 56A 、 Figure 58A and Figure 58B , the widths WT-a, WT-Wa, and WT-Na of the first auxiliary electrodes 230-x, 230-xW, and 230-xN may be different from each other. Figure 58A and Figure 58B The portions 230-xW and 230-xN shown in Figure 56A may be a portion of the first auxiliary electrode 230-x shown in

[0539] Hereinafter, Figure 56A the portion of the first auxiliary electrode 230-x shown inFigure 58A the partial 230-xW shown in Figure 58B and the partial 230-xN shown in can be respectively referred to as the "first part", the "second part", and the "third part". The second part 230-xW can be the part of the first auxiliary electrode 230-x closest to the first region AR1 (e.g., refer to Figure 55 ), and the third part 230-xN can be the part of the first auxiliary electrode 230-x closest to the second region AR2.

[0540] According to an embodiment of the present disclosure, since the widths WT-a, WT-Wa, and WT-Na of the first part 230-x, the second part 230-xW, and the third part 230-xN are implemented differently, the capacitances of the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 can be implemented differently. The width WT-Na of the third part 230-xN can be the smallest, and the width WT-Wa of the second part 230-xW can be the largest. The width WT-a of the first part 230-x can be between the width WT-Na of the third part 230-xN and the width WT-Wa of the second part 230-xW. For example, Figure 56A the first conductive layer 202SUb shown in can be included in the sensing unit forming the 1-2 coupling capacitor Ccp12, Figure 58A the first conductive layer 202SUd shown in can be included in the sensing unit forming the 1-1 coupling capacitor Ccp11, and Figure 58B the first conductive layer 202SUe shown in can be included in the sensing unit forming the 1-4 coupling capacitor Ccp14.

[0541] According to an embodiment of the present disclosure, when adjusting the widths WT-a, WT-Wa, and WT-Na of the first auxiliary electrodes 230-x, 230-xW, and 230-xN, the widths WT-b, WT-Wb, and WT-Nb of the second sensing patterns 240-sp, 240-spW, and 240-spN can also be adjusted to correspond to the adjusted widths of the first auxiliary electrodes 230-x, 230-xW, and 230-xN. Hereinafter, Figure 56A the part of the second sensing pattern 240-sp shown in Figure 58A the partial 240-spW shown in Figure 58BThe portions 240-spN shown in are respectively referred to as the "fourth portion", the "fifth portion", and the "sixth portion". For example, the width WT-Nb of the sixth portion 240-spN adjacent to the third portion 230-xN may be the smallest, and the width WT-Wb of the fifth portion 240-spW adjacent to the second portion 230-xW may be the largest. The width WT-b of the fourth portion 240-sp adjacent to the first portion 230-x may be between the width WT-Nb of the sixth portion 240-spN and the width WT-Wb of the fifth portion 240-spW.

[0542] The dummy patterns DMP, DMPa, and DMPb may have different shapes from each other to correspond to the shapes of the first auxiliary electrodes 230-x, 230-xW, and 230-xN and the shapes of the second sensing patterns 240-sp, 240-spW, and 240-spN.

[0543] In an embodiment of the present disclosure, regardless of how the widths WT-a, WT-Wa, and WT-Na of the first auxiliary electrodes 230-x, 230-xW, and 230-xN are adjusted, Figure 56A , Figure 58A and Figure 58B all of the second sensing patterns 240-sp, 240-spW, and 240-spN shown in may have Figure 56A the shape of the second sensing pattern 240-sp shown in.

[0544] Figure 59 is a diagram showing four channels CH-RX according to an embodiment of the present disclosure.

[0545] Referring to Figure 9 and Figure 59 , each of the four channels CH-RX may include a corresponding second electrode 220 and a corresponding second auxiliary electrode 240s. The second trace 220t may be electrically connected to the second electrode 220 in a one-to-one correspondence. The four second auxiliary electrodes 240s may be connected to the fourth trace 240t. Accordingly, the four second auxiliary electrodes 240s may be electrically connected to each other. The fourth trace 240t may be grounded (e.g., may be coupled to ground).

[0546] In an embodiment of the present disclosure, the fourth trace 240t may be spaced apart from the second trace 220t, and the channel CH-RX may be interposed therebetween. In other words, the region where one of the second electrodes 220 constituting one channel CH-RX outputs a signal to the sensor driver 200C and the region where one of the second auxiliary electrodes 240s is grounded (e.g., connected to the ground) may be in opposite directions (e.g., may face away from each other). In this case, in the pen sensing driving mode, the sensor driver 200C may additionally receive an induced current flowing from the second auxiliary electrode 240s to the second electrode 220 through the coupling capacitor Ccp. Therefore, the amplitude of the signal received from the second electrode 220 may become larger. Thus, regardless of the distance between the input terminal and the region where the pen input is provided, the sensor driver 200C can stably receive signals from the electrodes.

[0547] Figure 60 FIG. is a diagram showing four channels CH-RXa according to an embodiment of the present disclosure.

[0548] Reference Figure 60 , the second electrode group 220G may include a first separated electrode 220-SP1 and a second separated electrode 220-SP2 that are spaced apart from each other in the first direction DR1 and electrically separated from each other. The first separated electrode 220-SP1 and the second separated electrode 220-SP2 may be respectively referred to as "first sub-electrode 220-SP1" and "second sub-electrode 220-SP2". The second auxiliary electrode 240s-g may overlap with the second electrode group 220G. The second auxiliary electrode 240s-g may include a first auxiliary separated electrode 240-SP1 and a second auxiliary separated electrode 240-SP2. One channel CH-RXa may be defined to include one of the separated electrodes 220-SP1 or 220-SP2 and one of the auxiliary separated electrodes 240-SP1 or 240-SP2.

[0549] The first separated electrode 220-SP1 may overlap with the first auxiliary separated electrode 240-SP1. An example is shown in which the first separated electrode 220-SP1 and the first auxiliary separated electrode 240-SP1 are spaced apart from each other in the second direction DR2 to show the coupling capacitor Ccp defined between the first separated electrode 220-SP1 and the first auxiliary separated electrode 240-SP1, but the first separated electrode 220-SP1 and the first auxiliary separated electrode 240-SP1 may overlap with each other in the third direction DR3. In addition, the second separated electrode 220-SP2 and the second auxiliary separated electrode 240-SP2 may overlap with each other in the third direction DR3.

[0550] The second traces 220ta and 220tb may include a first separated trace 220ta connected to the first separated electrode 220-SP1 and a second separated trace 220tb connected to the second separated electrode 220-SP2. The first separated trace 220ta and the second separated trace 220tb may be spaced apart from each other, and the first separated electrode 220-SP1 and the second separated electrode 220-SP2 are interposed therebetween.

[0551] The fourth trace 240ta may be electrically connected to the first auxiliary separated electrode 240-SP1 and the second auxiliary separated electrode 240-SP2, and may be grounded (e.g., may be coupled to ground). In an embodiment of the present disclosure, the fourth trace 240ta may be disposed between the first auxiliary separated electrode 240-SP1 and the second auxiliary separated electrode 240-SP2.

[0552] Figure 61 FIG. is a diagram showing four channels CH-RXb according to an embodiment of the present disclosure.

[0553] Reference Figure 61 , the second electrode group 220G may include a first separated electrode 220-SP1 and a second separated electrode 220-SP2 that are spaced apart from each other and electrically separated from each other in the first direction DR1. The second auxiliary electrode 240s may overlap with the second electrode group 220G. In other words, one second auxiliary electrode 240s may overlap with both the first separated electrode 220-SP1 and the second separated electrode 220-SP2. One channel CH-RXb may be defined as including a part of one separated electrode and one second auxiliary electrode 240s.

[0554] The first separated electrode 220-SP1 and the second separated electrode 220-SP2 may overlap with one second auxiliary electrode 240s. An example is shown in which the first separated electrode 220-SP1, the second separated electrode 220-SP2, and one second auxiliary electrode 240s are spaced apart from each other in the second direction DR2 to show a coupling capacitor Ccp defined between the first separated electrode 220-SP1, the second separated electrode 220-SP2, and one second auxiliary electrode 240s, but the first separated electrode 220-SP1 and the second separated electrode 220-SP2 may overlap with one second auxiliary electrode 240s in the third direction DR3.

[0555] The second traces 220ta and 220tc may include a first separated trace 220ta connected to the first separated electrode 220 - SP1 and a second separated trace 220tc connected to the second separated electrode 220 - SP2. The first separated trace 220ta and the second separated trace 220tc may be spaced apart from each other, and the first separated electrode 220 - SP1 is interposed therebetween. The second separated trace 220tc may be disposed between the first separated electrode 220 - SP1 and the second separated electrode 220 - SP2.

[0556] The fourth trace 240tb may be electrically connected to the second auxiliary electrode 240s and may be grounded (e.g., may be coupled to ground). In an embodiment of the present disclosure, the fourth trace 240tb and the second separated trace 220tc may be spaced apart from each other, and the second separated electrode 220 - SP2 is interposed therebetween. In addition, the fourth trace 240tb and the first separated trace 220ta may be spaced apart from each other, and the first separated electrode 220 - SP1 and the second separated electrode 220 - SP2 are interposed therebetween.

[0557] Figure 62A FIG. is a diagram showing four channels CH - RX according to an embodiment of the present disclosure. Figure 62B FIG. is a diagram showing four second auxiliary electrodes according to an embodiment of the present disclosure. Figure 62C FIG. shows Figure 62B an equivalent circuit of three of the four second auxiliary electrodes shown in

[0558] Referring to Figure 9 and Figure 62A , each of the four channels CH - RX may include a corresponding second electrode 220 and a corresponding second auxiliary electrode 240s. The second traces 220t may be electrically connected to the second electrodes 220 in a one - to - one correspondence. The second auxiliary electrodes 240s may be electrically connected to the fourth traces 240ct. In an embodiment of the present disclosure, the fourth pad PD4 may be omitted.

[0559] Referring to Figure 62A , Figure 62B and Figure 62C , the second auxiliary electrodes 240s may include second auxiliary electrodes 240s21, 240s22, 240s23, and 240s24. The second auxiliary electrodes 240s21, 240s22, 240s23, and 240s24 may be electrically connected to each other through the fourth traces 240ct. Each of the second auxiliary electrodes 240s21, 240s22, 240s23, and 240s24 may be electrically connected to ground (e.g., may be coupled to ground) through a capacitor Cp - t.

[0560] The capacitor Cp-t associated with one of the second auxiliary electrodes 240s21, 240s22, 240s23, and 240s24, such as 240s21, can correspond to the parasitic capacitors Cp of the other remaining second auxiliary electrodes 240s22, 240s23, and 240s24 among the second auxiliary electrodes 240s21, 240s22, 240s23, and 240s24. For example, assuming that the capacitance of each of the parasitic capacitors Cp is Cp, the capacitance of the capacitor Cp-t can correspond to "12 × Cp".

[0561] In Figure 62A 、 Figure 62B and Figure 62C the second auxiliary electrode 240s is described in more detail, but the same or substantially the same configuration can be applied to the first auxiliary electrode 230s. For example, referring to Figure 9 the first auxiliary electrodes 230s can be electrically connected to each other. For example, in the embodiment of Figure 9 the first auxiliary electrodes 230s can be electrically connected to each other through the first line portion 231t. The opposite ends of the first line portion 231t can be floated. For example, the second line portion 232t and the third line portion 233t can be omitted, or the pads connected to the second line portion 232t and the third line portion 233t can be floated. In this case, each of the first auxiliary electrodes 230s can be electrically connected to the ground through a given capacitor, and the given capacitor can correspond to the parasitic capacitors of the other remaining first auxiliary electrodes except for the corresponding one auxiliary electrode.

[0562] Figure 63 FIG. is a diagram showing seven channels according to an embodiment of the present disclosure.

[0563] Referring to Figure 63 three first channels CH-TX and four second channels CH-RX are shown as representative examples. The first channels CH-TX can be arranged along the first direction DR1, and each of the first channels CH-TX can extend in the second direction DR2. The second channels CH-RX can be arranged along the second direction DR2, and each of the second channels CH-RX can extend in the first direction DR1.

[0564] The first trace 210t can be electrically connected to the first channel CH-TX respectively. The third trace 230rt1 can be electrically connected to the first channel CH-TX. More specifically, the first trace 210t can be connected to the first electrode 210 included in the first channel CH-TX in a one-to-one correspondence, and the third trace 230rt1 can be connected to the first auxiliary electrode 230s included in the first channel CH-TX. The first trace 210t and the third trace 230rt1 can be spaced apart from each other, and the first electrode 210 and the first auxiliary electrode 230s are interposed therebetween.

[0565] The second traces 220t1 and 220t2 can be electrically connected to the second channel CH-RX respectively. The fourth traces 240t1 and 240t2 can be electrically connected to the second channel CH-RX. More specifically, the second traces 220t1 and 220t2 can be connected to the second electrode 220 included in the second channel CH-RX in a one-to-one correspondence, and the fourth traces 240t1 and 240t2 can be connected to the second auxiliary electrode 240s included in the second channel CH-RX.

[0566] In an embodiment of the present disclosure, the second traces 220t1 and 220t2 can be spaced apart from each other, and the second electrode 220 and the second auxiliary electrode 240s are interposed therebetween. The fourth traces 240t1 and 240t2 can be spaced apart from each other, and the second electrode 220 and the second auxiliary electrode 240s are interposed therebetween. Some of the second traces 220t1 among the second traces 220t1 and one of the fourth traces 240t1 among the fourth traces 240t1 and 240t2 can be spaced apart from each other, and the second electrode 220 and the second auxiliary electrode 240s are interposed therebetween. The remaining second traces 220t2 among the second traces 220t1 and 220t2 and the other fourth trace 240t2 among the fourth traces 240t1 and 240t2 can be spaced apart from each other, and the second electrode 220 and the second auxiliary electrode 240s are interposed therebetween.

[0567] The fourth trace 240t1 can be disposed between the remaining second trace 220t2 and the second electrode 220. Some of the second traces 220t1 can be disposed between the other fourth trace 240t2 and the second electrode 220.

[0568] Figure 64 is a diagram showing seven channels according to an embodiment of the present disclosure.

[0569] Reference Figure 64, the first trace 210t can be electrically connected to the first channel CH-TX respectively. The third trace 230rt1 can be electrically connected to the first channel CH-TX. More specifically, the first trace 210t can be connected to the first electrode 210 included in the first channel CH-TX one by one, and the third trace 230rt1 can be connected to the first auxiliary electrode 230s included in the first channel CH-TX. The first trace 210t and the third trace 230rt1 can be spaced apart from each other, with the first electrode 210 and the first auxiliary electrode 230s interposed therebetween.

[0570] The second traces 220t1 and 220t2 can be electrically connected to the second channel CH-RX respectively. The fourth trace 240bt can be electrically connected to the second channel CH-RX. More specifically, the second traces 220t1 and 220t2 can be connected to the second electrode 220 included in the second channel CH-RX one by one, and the fourth trace 240bt can be connected to the second auxiliary electrode 240s included in the second channel CH-RX one by one.

[0571] In an embodiment of the present disclosure, the fourth trace 240bt can be electrically connected to the third trace 230rt1. In the pen sensing driving mode, the third trace 230rt1 can be grounded (e.g., can be coupled to the ground).

[0572] Figure 65 is a diagram showing seven channels according to an embodiment of the present disclosure.

[0573] Reference Figure 65 , the sensor layer 200 may further include a plurality of fifth traces 230rt2 connected to the first auxiliary electrode 230s one by one. The third trace 230rt1 can be connected to the first end of the first auxiliary electrode 230s one by one, and the fifth trace 230rt2 can be connected to the second end of the first auxiliary electrode 230s one by one.

[0574] In the charging driving mode, the sensor driver 200C can apply a first signal SG1 to at least one of a plurality of pads connected to the third trace 230rt1 and the fifth trace 230rt2, and apply a second signal SG2 to at least another one of them. For example, the sensor driver 200C may include a first switch SSW1 and a second switch SSW2. For example, the sensor driver 200C can transmit the first signal SG1 to the first switch SSW1, and can transmit the second signal SG2 to the second switch SSW2. Each of the first signal SG1 and the second signal SG2 can be a sine signal or a square wave signal. In addition, the phase of the second signal SG2 can be opposite to the phase of the first signal SG1.

[0575] The first end of the third trace 230rt1 can be electrically connected to the first terminal SND1a and the second terminal SND2a, and the second end of the third trace 230rt1 can be electrically connected to the third terminal SND3a and the fourth terminal SND4a. Each of the fifth traces 230rt2 can be electrically connected to the fifth terminal SND1b and the sixth terminal SND2b.

[0576] The first switch SSW1 can be electrically connected to at least one of the first terminal SND1a, the third terminal SND3a, and the fifth terminal SND1b. The second switch SSW2 can be electrically connected to at least one of the second terminal SND2a, the fourth terminal SND4a, and the sixth terminal SND2b. More specifically, the sensor driver 200C can be electrically connected in various suitable ways within the range of implementing the current path of the loop coil pattern.

[0577] According to one or more of the above embodiments, a touch input and a pen input can be sensed by using a sensor layer. Thus, since a separate component (e.g., a digitizer) for sensing a pen may not be included in the electronic device, problems caused by the addition of the digitizer, such as an increase in the thickness of the electronic device, an increase in the weight of the electronic device, and a decrease in the flexibility of the electronic device, may not occur. In addition, the wiring directions of the electrodes and the auxiliary electrodes that overlap each other in the sensor layer can be different from each other. In the pen sensing driving mode, the auxiliary electrode can be grounded (e.g., can be coupled to the ground), or can be electrically connected to any other suitable auxiliary electrode adjacent thereto. In this case, an induced current can be transmitted from the auxiliary electrode to the electrode. Therefore, the amplitude of the signal received from the electrode can become larger. Thus, a sensor driver that can stably receive a signal from the electrode can be provided regardless of the distance between the input terminal and the area where the pen input is provided.

[0578] The above are descriptions of some embodiments of the present disclosure and should not be construed as limitations thereof. Although some embodiments have been described, those skilled in the art will readily understand that various modifications can be made to the embodiments without departing from the spirit and scope of the present disclosure. It will be understood that unless otherwise described, the description of features or aspects within each embodiment will generally be considered applicable to other similar features or aspects in other embodiments. Thus, as will be apparent to those of ordinary skill in the art, unless otherwise specifically stated, the features, characteristics, and / or elements described in connection with a particular embodiment can be used alone or in combination with features, characteristics, and / or elements described in connection with other embodiments. Therefore, it will be understood that the above is an illustration of various exemplary embodiments and should not be construed as limited to the specific embodiments disclosed herein, and various modifications to the disclosed embodiments and other exemplary embodiments are intended to be included within the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: substrate; a circuit layer on the substrate and including transistors; a light emitting element layer on the circuit layer and including a light emitting element electrically connected to the transistor; as well as A sensor layer is on the light emitting element layer and comprises: a first sensing electrode including a first pattern and a first bridge pattern electrically connected to the first pattern; a second sensing electrode extending in the first direction and crossing the first sensing electrode; a first electrode extending in a second direction intersecting the first direction; and a second electrode including a second pattern and a second bridge pattern electrically connected to the second pattern, in: One of the first patterns includes a first region overlapping the first electrode, One of the second patterns includes a second region overlapping the second sensing electrode, and A first area of ​​the first region is smaller than a second area of ​​the second region.

2. The electronic device according to claim 1, characterized in that: The length of the first sensing electrode is longer than the length of the second sensing electrode, and The length of the first electrode is longer than that of the second electrode.

3. The electronic device according to claim 1, characterized in that: The second patterns are spaced apart from each other in the first direction, and the first electrode is located between the second patterns, The first patterns are spaced apart from each other in the second direction, and the second sensing electrodes are located between the first patterns, and A maximum width of the first electrode in the first direction is less than or equal to a maximum width of the second pattern in the second direction.

4. The electronic device according to claim 1, characterized in that: The first bridge pattern, the second pattern, and the first electrode are located at a first layer, and The second bridge pattern, the first pattern and the second sensing electrode are located at the second layer.

5. The electronic device according to claim 4, characterized in that: The second layer is spaced further away from the light emitting element layer than the first layer.

6. The electronic device according to claim 1, characterized in that: The first electrode comprises: connecting portions spaced apart from each other in the first direction; and pattern portions spaced apart from each other in the second direction, and the connecting portion is located between the pattern portions, and The connection portion and the pattern portion are connected to each other and are located at the same layer as each other.

7. The electronic device according to claim 6, characterized in that: The second patterns are spaced apart from each other, and the connecting portion is located between the second patterns, and Wherein, the second bridging pattern overlaps with the connecting portion.

8. The electronic device according to claim 1, characterized in that: The sensor layer is configured to operate in the following modes: a first mode, in which a first driving signal is provided to the first sensing electrode or the second sensing electrode to sense a touch input; or A second mode is provided in which a second driving signal is provided to the first electrode or the second electrode to sense a pen input.

9. An electronic device, characterized in that: include: substrate; a circuit layer on the substrate and including transistors; a light emitting element layer on the circuit layer and including a light emitting element electrically connected to the transistor; as well as A sensor layer is on the light emitting element layer and comprises: a first sensing electrode including a first pattern and a first bridge pattern electrically connected to the first pattern; a second sensing electrode crossing the first sensing electrode and including a second pattern and a second bridge pattern electrically connected to the second pattern; a first electrode including a third pattern and a third bridge pattern electrically connected to the third pattern; and a second electrode including a fourth pattern and a fourth bridge pattern electrically connected to the fourth pattern, wherein a first width of one of the third patterns is smaller than a second width of the second electrode, and The first width is parallel to a first direction, and the second width is parallel to a second direction crossing the first direction.

10. The electronic device according to claim 9, characterized in that: The third bridge pattern has a third width parallel to the first direction, and the first width is greater than the third width.

11. The electronic device according to claim 9, characterized in that: The second pattern and the second bridge pattern are connected to each other and are located at the same layer as each other, and The third pattern and the third bridge pattern are connected to each other and are located at the same layer as each other.

12. The electronic device according to claim 9, characterized in that: A maximum width of the first electrode in the first direction is smaller than a maximum width of the second electrode in the second direction.

13. The electronic device according to claim 9, characterized in that: The fourth patterns are spaced apart from each other, and the third bridge pattern is located between the fourth patterns, and Wherein, the fourth bridge pattern overlaps with the third bridge pattern.

14. The electronic device according to claim 9, characterized in that: The first patterns are spaced apart from each other, and the second bridge pattern is located between the first patterns, and Wherein, the first bridge pattern overlaps with the second bridge pattern.

15. The electronic device according to claim 9, characterized in that: The length of the first sensing electrode is longer than the length of the second sensing electrode, and The length of the first electrode is longer than that of the second electrode.

16. The electronic device according to claim 9, characterized in that: The sensor layer is configured to operate in the following modes: a first mode, in which a first driving signal is provided to the first sensing electrode or the second sensing electrode to sense a touch input; or A second mode is provided in which a second driving signal is provided to the first electrode or the second electrode to sense a pen input.

17. An electronic device, characterized in that: include: substrate; a circuit layer on the substrate and including transistors; a light emitting element layer on the circuit layer and including a light emitting element electrically connected to the transistor; as well as A sensor layer is on the light emitting element layer and comprises: a first sensing electrode; a second sensing electrode, crossing the first sensing electrode; a first electrode overlapping the first sensing electrode; and a second electrode, overlapping with the second sensing electrode, in: The first sensing electrode includes a first pattern and a first bridge pattern electrically connected to the first pattern, The second electrode includes a second pattern and a second bridge pattern electrically connected to the second pattern, The first electrode, the second pattern and the first bridge pattern are located at the same layer, The first pattern, the second sensing electrode, and the second bridge pattern are located at the same layer, and The first bridge pattern and the second bridge pattern cross each other.

18. The electronic device according to claim 17, characterized in that: The second patterns are spaced apart from each other, and the first electrode and the first bridge pattern are located between the second patterns.

19. The electronic device according to claim 17, characterized in that: The first electrode has an opening defined therein, and Wherein, the first bridging pattern overlaps with the opening.

20. The electronic device according to claim 17, characterized in that: The first patterns are spaced apart from each other, and the second sensing electrodes and the second bridge patterns are located between the first patterns.

21. The electronic device according to claim 17, characterized in that: The second sensing electrode has an opening defined therein, and Wherein, the second bridge pattern overlaps with the opening.

22. The electronic device according to claim 17, characterized in that: The second bridge pattern is spaced further away from the light emitting element layer than the first bridge pattern.

23. The electronic device according to claim 17, characterized in that: The sensor layer is configured to operate in the following modes: a first mode, in which a first driving signal is provided to the first sensing electrode or the second sensing electrode to sense a touch input; or A second mode is provided in which a second driving signal is provided to the first electrode or the second electrode to sense a pen input.

24. An electronic device, characterized in that: include: substrate; a circuit layer on the substrate and including transistors; a light emitting element layer on the circuit layer and including a light emitting element electrically connected to the transistor; as well as A sensor layer is on the light emitting element layer and comprises: a first sensing electrode including a first pattern and a first bridge pattern electrically connected to the first pattern; a second sensing electrode, crossing the first sensing electrode; A first electrode intersecting the second sensing electrode; and a second electrode including a second pattern and a second bridge pattern electrically connected to the second pattern, in: The sensor layer has a sensing region defined therein, the first sensing electrode, the second sensing electrode, the first electrode, and the second electrode being located at the sensing region, The width of the sensing region in the first direction is smaller than the width of the sensing region in the second direction intersecting the first direction, The first electrode extends in the second direction, and the second electrode extends in the first direction, and A capacitance of a first capacitor defined between one of the first patterns and the first electrode overlapping the one of the first patterns is smaller than a capacitance of a second capacitor defined between one of the second patterns and the second sensing electrode overlapping the one of the second patterns.

25. The electronic device according to claim 24, characterized in that: The sensor layer is configured to operate in the following modes: a first mode, in which a first driving signal is provided to the first sensing electrode or the second sensing electrode to sense a touch input; or A second mode is provided in which a second driving signal is provided to the first electrode or the second electrode to sense a pen input.

26. The electronic device according to claim 24, characterized in that: The length of the first sensing electrode is longer than the length of the second sensing electrode, and The length of the first electrode is longer than that of the second electrode.

27. The electronic device according to claim 24, characterized in that: The first bridge pattern and the second bridge pattern cross each other.

28. The electronic device according to claim 27, characterized in that: The first bridge pattern, the second pattern, and the first electrode are located at a first layer, and The second bridge pattern, the first pattern and the second sensing electrode are located at the second layer.

29. The electronic device according to claim 28, characterized in that The second layer is spaced further away from the light emitting element layer than the first layer.

30. The electronic device according to claim 27, characterized in that The first electrode has an opening defined therein, and the first bridge pattern overlaps the opening.

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