Metal spraying device for thin film capacitor production

Abstract

The utility model relates to the technical field of capacitor metal spraying, and solves the problem of waste of metal powder caused by repeated coverage of twice spraying when the spraying area of a spray head is smaller than the position to be sprayed of a capacitor. The metal spraying device comprises a base body and a spraying end installed on the base body, a shielding piece is installed on one side of the spraying end, the shielding piece gradually covers or exposes a capacitor relative to the spraying end in the vertical direction, the base body comprises an end cover and a top cover arranged at the lower end of the end cover, and the spraying end is installed on the base body. A piece containing table is arranged at the lower end of the top cover, a capacitor containing cavity is formed in the piece containing table, the shielding piece is installed at the lower end of the spraying end and comprises a shielding plate installed in the piece containing table, a pushing piece used for pushing the shielding plate to move is installed at the position, connected with the shielding plate, of the bottom of the piece containing table, and the diameter of the capacitor containing cavity is matched with the outer diameter of the shielding plate. And a piece placing plate matched with the inner diameter of the baffle plate is arranged in the capacitor accommodating cavity.

Description

Technical Field

[0001] The utility model relates to the technical field of capacitor spraying with gold, in particular to a gold spraying device for the production of thin film capacitors. Background Art

[0002] The gold spraying device for thin film capacitors with the publication number of CN213303926U discloses a gold spraying machine, a turntable is installed below the gold spraying machine, a plurality of fixed seats are evenly installed along the circumference of the turntable, a rotating seat is sleeved on the fixed seat, a limiting mechanism is installed between the rotating seat and the fixed seat, a friction ring is installed outside the rotating seat, a driving motor is installed on one side of the turntable, and a transmission shaft is installed at the output end of the driving motor.

[0003] However, when the spraying area of the nozzle is smaller than the position to be sprayed on the capacitor, that is, spraying overlap occurs during the second spraying, resulting in a problem of spraying area coverage, thus forming a repeated coverage of the two sprayings and causing waste of metal powder. Summary of the Utility Model

[0004] Aiming at the deficiencies of the prior art, the utility model provides a gold spraying device for the production of thin film capacitors, which solves the problem of repeated coverage of the two sprayings and waste of metal powder when the spraying area of the nozzle is smaller than the position to be sprayed on the capacitor.

[0005] To achieve the above object, the utility model provides the following technical solution: A gold spraying device for the production of thin film capacitors, including a base body and a spraying end installed on the base body, characterized in that: A shielding member is installed on one side of the spraying end, and the shielding member gradually covers or exposes the capacitor along the vertical direction relative to the spraying end;

[0006] The base body includes an end cover and a top cover placed at the lower end of the end cover. A component placing table is arranged at the lower end of the top cover, and a capacitor accommodating cavity is arranged on the component placing table;

[0007] The shielding member is installed at the lower end of the spraying end. The shielding member includes a shielding plate installed in the component placing table, and a top pushing member for pushing the shielding plate to move is installed at the position where the bottom of the component placing table is connected to the shielding plate. The capacitor accommodating cavity is adapted to the outer diameter of the shielding plate, and a component placing plate adapted to the inner diameter of the shielding plate is arranged in the capacitor accommodating cavity. The component placing plate is supported by an extension rod extending downward.

[0008] In one of the embodiments, the spraying end includes a spraying placement bin installed between the top cover and the component placing table. A nozzle is installed in the spraying placement bin, and the length of the nozzle protruding outward is less than the difference between the inner diameter of the spraying placement bin and the outer diameter of the shielding plate;

[0009] The spraying placement bin is connected to the shielding plate through a connecting plate, and the connecting plate is slidably connected to the shielding plate.

[0010] In one of the embodiments, a fixed distance is maintained between the end cap and the component placing table through a support rod. A driving member for driving the top cover to rotate is installed on the bottom plate of the end cap, and the spraying placement bin is fixed to the top cover.

[0011] In one of the embodiments, a middle plate is rotatably installed on the bottom wall of the component placing table, and a pushing member is installed on the middle plate to form a rotation base.

[0012] In one of the embodiments, the extension trajectory of the middle plate is offset from that of the support rod.

[0013] In one of the embodiments, the height of the component placing plate is equal to the thickness value of the connecting plate.

[0014] Compared with the prior art, the present utility model provides a gold spraying device for the production of thin film capacitors, having the following beneficial effects:

[0015] In the technical solution disclosed by the present utility model, by arranging a shielding member at the lower end of the spraying end, the position of the capacitor that is larger than the spraying area of the nozzle is covered by the shielding member. On the one hand, it can avoid the aimless spread of the metal material on the capacitor structure during gold spraying, causing pollution to the spraying position. On the other hand, when switching the spraying position, it can cover the position that has been sprayed, thereby reducing the repeated coverage of the metal material at the spraying connection and enhancing the adhesion degree of the gold spraying metal on a single area of the capacitor.

[0016] By setting the spraying end and the shielding member to rotate synchronously in the present utility model, the spraying process is always restricted by the shielding plate, so that the shielding of the overflowing nozzle spraying area can be effectively controlled, and the adhesion degree of the gold spraying metal on a single area of the capacitor is enhanced. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present application, and constitute a part of the present application. The schematic embodiments and descriptions thereof are used to explain the present application and do not constitute an improper limitation to the present application. In the drawings:

[0018] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0019] Figure 2 is a schematic diagram of the base structure of the present utility model;

[0020] Figure 3 is a schematic diagram of the structure of the spraying end and the shielding member of the present utility model;

[0021] Figure 4 is a schematic diagram of the capacitor accommodation cavity structure of the present utility model.

[0022] In the figure: 1. Substrate; 11. End cap; 12. Top cover; 13. Component placement table; 14. Capacitor accommodation cavity; 15. Support rod; 2. Spraying end; 21. Spraying placement bin; 22. Nozzle; 23. Connecting plate; 3. Shielding member; 31. Shielding plate; 32. Pushing member; 33. Component placement plate; 34. Extension rod; 35. Middle plate. Detailed implementation mode

[0023] The following will be combined with the drawings and embodiments to elaborate in detail on the implementation mode of the present application, so as to fully understand the implementation process of how the present application uses technical means to solve technical problems and achieve technical effects and implement accordingly.

[0024] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to the present utility model.

[0025] Figures 1-4 For an embodiment of the present utility model, when the inventor was performing gold spraying on a capacitor, a problem of adjusting the area of the nozzle 22 during the gold spraying operation occurred, that is, the spraying area of the nozzle 22 could not adapt to the area to be sprayed of all capacitors when the thickness was constant. Subsequently, a search was conducted on existing patents. Among them, the patent with the publication number CN213303926U disclosed a gold spraying device for thin film capacitors. The technical solution described therein can perform continuous gold spraying on capacitors. However, when the spraying area of the nozzle 22 is smaller than the position to be sprayed on the capacitor, that is, spraying overlap occurs during the second spraying, resulting in a problem of spraying area coverage, thus forming repeated coverage of the two sprays and causing waste of metal powder. The above-mentioned problem generated by the inventor was not solved by the above-mentioned solution. Furthermore, the inventor elaborated a solution, that is, a gold spraying device for the production of thin film capacitors, which uses a shielding member 3 arranged at the lower end of the spraying end 2 to cover the position of the capacitor where the area is larger than the spraying area of the nozzle 22. On the one hand, it can avoid the aimless spread of metal materials on the capacitor structure during gold spraying, causing pollution to the unsprayed position. On the other hand, it can cover the position that has been sprayed when switching the spraying position, reduce the repeated coverage of metal materials at the spraying connection, and enhance the adhesion degree of the sprayed gold on a single area of the capacitor.

[0026] A gold spraying device for thin film capacitor production described in this solution specifically sets a base body 1 and a spraying end 2 installed on the base body 1 for spraying metal materials on the capacitor. One end of the spraying end 2 is installed with a shielding member 3. The shielding member 3 gradually covers or exposes the capacitor along the vertical direction relative to the spraying end 2, thereby shielding the area where the gold spraying device operates and avoiding secondary coverage of metal materials.

[0027] The base body 1 includes an end cover 11 and a top cover 12 placed at the lower end of the end cover 11. A component placing table 13 is arranged at the lower end of the top cover 12. Both the end cover 11 and the top cover 12 rotate relatively. A capacitor accommodating cavity 14 is arranged on the component placing table 13. The end cover 11 and the component placing table 13 are supported by a support rod 15. The support rod 15 is fixedly installed with both the end cover 11 and the component placing table 13, that is, it has a supporting effect on the end cover 11 and maintains the distance between the end cover 11 and the component placing table 13. A driving member for driving the top cover 12 to rotate is installed on the bottom plate of the end cover 11. In this specific embodiment, the driving member is a driving motor, and the free end of the driving motor is connected to the center of the top cover 12, thereby causing the top cover 12 to rotate self - sufficiently.

[0028] The shielding member 3 is installed at the lower end of the spraying end 2 and includes a shielding plate 31 installed in the component placing table 13. A top - pushing member 32 for pushing the shielding plate 31 to move is installed at the position where the bottom of the component placing table 13 is connected to the shielding plate 31. The top - pushing member 32 is specifically an electric cylinder in this embodiment. The diameter of the capacitor accommodating cavity 14 is adapted to the outer diameter of the shielding plate 31. A component placing plate 33 adapted to the inner diameter of the shielding plate 31 is arranged in the capacitor accommodating cavity 14. The component placing plate 33 obtains a supporting force through an extension rod 34 extending downward. The height of the component placing plate 33 is equal to the thickness value of the connecting plate 23. A middle - placed plate 35 is rotatably installed on the bottom wall of the component placing table 13, and the pushing member is installed on the middle - placed plate 35 to form a rotation basis. The middle - placed plate 35 is arranged in a staggered manner with the extension track of the support rod 15, so that the component placing table 13 supported by the support rod 15 always remains stationary when the shielding plate 31 rotates.

[0029] The spraying end 2 includes a spraying installation bin 21 installed between the top cover 12 and the component placing table 13. The spraying installation bin 21 is fixed on the top cover 12. A spray head 22 is installed in the spraying installation bin 21. The length by which the spray head 22 protrudes outward is less than the difference between the inner diameter of the spraying installation bin 21 and the outer diameter of the shielding plate 31. The spray head 22 is laid on the inner wall of the spraying installation bin, and its arrangement track is linear. Both the spraying installation bin 21 and the shielding plate 31 are semi-circularly arranged. The spraying installation bin 21 and the shielding plate 31 are connected by a connecting plate 23, and the connecting plate 23 is slidably connected to the shielding plate 31. A connecting column protrudes from the connecting plate 23 and extends on the surface of the connecting plate 23. An inner groove is formed in the connecting plate 23 to establish the sliding basis of the connecting column. When the shielding plate 31 moves up and down under the push of a pushing member, the connecting plate 23 can slide on the shielding plate 31 and always maintain its connection with the shielding plate 31. On the other hand, the connection between the connecting plate 23 and the shielding plate 31 can be used to cause the connecting plate 23 to drive the shielding plate 31 to rotate synchronously when the spraying installation bin 21 rotates, thereby generating a state where the spraying end 2 and the shielding member 3 rotate synchronously, so that the spraying process is always restricted by the shielding plate 31, and thus the shielding of the spraying area overflowing from the spray head 22 can be effectively controlled, enhancing the adhesion degree of the sprayed metal on a single area of the capacitor.

[0030] The control mode of the present invention is automatically controlled by a controller. The control circuit of the controller can be realized by simple programming of those skilled in the art. The provision of power also belongs to the common knowledge in this field. And the present invention mainly aims to protect mechanical devices, so the control mode and circuit connection of the present invention will not be further explained in detail.

[0031] It should be noted that in this article, the term "comprise", "include" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements but also includes other elements not explicitly listed, or further includes elements inherent to such process, method, article or device.

[0032] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A gold spraying device for producing thin film capacitors, comprising a substrate (1) and a spraying end (2) mounted on the substrate (1), characterized in that: A shielding member (3) is installed on one side of the spraying end (2), and the shielding member (3) gradually covers or exposes the capacitor in a vertical direction relative to the spraying end (2); The base (1) comprises an end cover (11) and a top cover (12) disposed at the lower end of the end cover (11); a mounting platform (13) is disposed at the lower end of the top cover (12); and a capacitor accommodating cavity (14) is disposed on the mounting platform (13); The shielding member (3) is installed at the lower end of the spraying end (2), and the shielding member (3) comprises a shielding plate (31) installed in the mounting platform (13). A pushing member (32) for pushing the shielding plate (31) to move is installed at the bottom of the mounting platform (13) where the shielding plate (31) is connected. The capacitor accommodating cavity (14) is adapted to the outer diameter of the shielding plate (31). A mounting plate (33) adapted to the inner diameter of the shielding plate (31) is arranged in the capacitor accommodating cavity (14), and the mounting plate (33) is supported by an extension rod (34) extending downward.

2. A gold spraying device for film capacitor production according to claim 1, characterized in that: The spraying end (2) comprises a spraying placement chamber (21) installed between the top cover (12) and the mounting platform (13), a spray head (22) being installed in the spraying placement chamber (21), and a length of the spray head (22) protruding outward is less than the difference between the inner diameter of the spraying placement chamber (21) and the outer diameter of the shielding plate (31); The spray placement chamber (21) and the shielding plate (31) are connected via a connecting plate (23), and the connecting plate (23) and the shielding plate (31) are slidably connected.

3. The gold spraying device for producing film capacitors according to claim 1, characterized in that: The end cover (11) and the mounting platform (13) are maintained at an existing distance by a support rod (15); a driving member for driving the top cover (12) to rotate is installed on the bottom plate of the end cover (11); and the spray placement bin (21) is fixed on the top cover (12).

4. The gold spraying device for producing film capacitors according to claim 3, characterized in that: A middle plate (35) is rotatably mounted on the bottom wall of the component placement platform (13), and a pusher is mounted on the middle plate (35) to form a rotation base.

5. The gold spraying device for producing film capacitors according to claim 4, characterized in that: The middle plate (35) and the extension track of the support rod (15) are arranged in a staggered manner.

6. The gold spraying device for producing film capacitors according to claim 1, characterized in that: The height of the mounting plate (33) is equal to the thickness of the connecting plate (23).

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