Chip mounting head convenient to adjust and die bonder

Abstract

The utility model discloses a chip mounting head convenient to adjust and a die bonder. The chip mounting head comprises a rotating mechanism, a chip mounting mechanism and a lifting mechanism, the rotating mechanism comprises a horizontal rotating motor, the chip mounting mechanism comprises a fixed frame, a core shaft supporting cylinder, an air bearing, a chip mounting head shaft core and a suction nozzle assembly, the chip mounting head shaft core is rotationally connected with the core shaft supporting cylinder through the air bearing, and an annular elastic piece set is arranged at the second end of the chip mounting head shaft core; the lifting mechanism comprises a first direction shaft vertical plate, a first direction shaft sliding block and a first direction shaft motor. The chip mounting head shaft core is horizontally rotated through the horizontal rotating motor, and undamped rotation is carried out through the air bearing; the lifting distance of the suction nozzle assembly is accurately controlled through the first direction shaft motor; and the acting force generated when the suction nozzle assembly adsorbs the wafer chip is buffered through the annular elastic piece set, so that the damage probability of the wafer chip is reduced, and the chip pickup device can be widely applied to the technical field of chip pickup.

Description

Technical Field

[0001] The utility model relates to the technical field of chip picking, in particular to a patch head and a die bonder with convenient adjustment. Background Art

[0002] A chip bonding device, also known as a die bonder and a wafer mounter, is a chip packaging device. The patch head is driven by a driving structure such as a linear motor in the die bonder, so as to pick up and press-fit the wafer chip.

[0003] At present, the patch heads of die bonders on the market basically use linear guides or crossed roller guides as the guides, which have a certain amount of friction, and the control accuracy of the lifting distance is relatively low. Moreover, when the chip nozzle adsorbs the wafer chip, it is easy to damage the wafer chip. Summary of the Utility Model

[0004] In view of this, the purpose of the embodiments of the present utility model is to provide a patch head and a die bonder with convenient adjustment, which can improve the control accuracy of the lifting distance of the patch head and reduce the damage probability of the wafer chip during adsorption.

[0005] In a first aspect, the embodiments of the present utility model provide a patch head with convenient adjustment, including: a rotation mechanism, a patching mechanism, and a lifting mechanism;

[0006] The rotation mechanism includes a horizontal rotation motor. The patching mechanism includes a fixed frame, a core shaft support cylinder, an air bearing, a patch head core shaft, and a nozzle assembly. The patch head core shaft is rotationally connected to the core shaft support cylinder through the air bearing. The nozzle assembly is fixedly connected to the first end of the patch head core shaft. An annular elastic sheet group is arranged at the second end of the patch head core shaft. The annular elastic sheet group is used to absorb the acting force along the direction of the patch head core shaft after deformation. The core shaft support cylinder is fixedly connected to the fixed frame. The horizontal rotation motor is fixed on the fixed frame and is rotationally connected to the patch head core shaft;

[0007] The lifting mechanism includes a first-direction shaft vertical plate, a first-direction shaft slider, and a first-direction shaft motor. The first-direction shaft motor is used to drive the first-direction shaft slider to move along the first-direction shaft on the first-direction shaft vertical plate. The first-direction shaft slider is fixedly connected to the fixed frame. The first-direction shaft motor is arranged on the fixed frame.

[0008] Optionally, a slide rail is arranged on the first-direction shaft vertical plate. The first surface of the first-direction shaft slider is slidably connected to the slide rail. The second surface of the first-direction shaft slider is fixedly connected to the fixed frame.

[0009] Optionally, the nozzle assembly includes a vacuum nozzle, a docking pipe, and a docking nozzle. The vacuum nozzle is communicated with the docking nozzle through the docking pipe, and the docking nozzle is used for adsorbing a wafer chip.

[0010] Optionally, the vacuum nozzle is connected to a vacuum pump through an adsorption pipe.

[0011] Optionally, the nozzle assembly further includes a fixed sleeve. An adsorption shaft is arranged inside the fixed sleeve, and the adsorption pipe, the vacuum nozzle, and the docking pipe are arranged inside the adsorption shaft.

[0012] Optionally, a flat spring is arranged at the first end of the adsorption shaft. The flat spring is used for buffering the acting force of the adsorption shaft on the first direction axis. A docking nozzle and a docking chassis are arranged at the second end of the adsorption shaft. The docking chassis is provided with a docking through hole, and the docking nozzle is located inside the docking through hole.

[0013] Optionally, an air bearing sleeve is further arranged inside the fixed sleeve. The adsorption shaft is arranged inside the air bearing sleeve, and an air film is arranged between the air bearing sleeve and the adsorption shaft.

[0014] Optionally, a pressure sensor is arranged between the flat spring and the adsorption shaft.

[0015] Optionally, a ceramic heater is arranged on the vacuum nozzle.

[0016] In a second aspect, an embodiment of the present utility model provides a die bonder, including the above-mentioned patch head with convenient adjustment.

[0017] Implementing the embodiments of the present utility model includes the following beneficial effects: The embodiments of the present utility model provide a pick - and - place head that is convenient to adjust, including: a rotating mechanism, a pick - and - place mechanism, and a lifting mechanism; the rotating mechanism includes a horizontal rotating motor, the pick - and - place mechanism includes a fixed frame, a core shaft support cylinder, an air bearing, a pick - and - place head core shaft, and a nozzle assembly. The pick - and - place head core shaft is rotatably connected to the core shaft support cylinder through the air bearing. The nozzle assembly is fixedly connected to the first end of the pick - and - place head core shaft. A ring spring group is arranged at the second end of the pick - and - place head core shaft. The ring spring group is used to absorb the acting force along the direction of the pick - and - place head core shaft after deformation. The core shaft support cylinder is fixedly connected to the fixed frame. The horizontal rotating motor is fixed on the fixed frame and is rotatably connected to the pick - and - place head core shaft; the lifting mechanism includes a first - direction shaft vertical plate, a first - direction shaft slider, and a first - direction shaft motor. The first - direction shaft motor is used to drive the first - direction shaft slider to move along the first - direction shaft on the first - direction shaft vertical plate. The first - direction shaft slider is fixedly connected to the fixed frame, and the first - direction shaft motor is arranged on the fixed frame. By horizontally rotating the pick - and - place head core shaft through the horizontal rotating motor, performing non - damped rotation through the air bearing, and synchronously rotating the nozzle assembly through the pick - and - place head core shaft, the adsorbed wafer chip can be rotated; by driving the first - direction shaft slider to move along the first - direction shaft on the first - direction shaft vertical plate through the first - direction shaft motor, the nozzle assembly can be driven to move on the first - direction shaft, and the lifting distance of the nozzle assembly can be accurately controlled; and the acting force along the direction of the pick - and - place head core shaft is absorbed by the ring spring group, thereby buffering the acting force when the nozzle assembly adsorbs the wafer chip, and reducing the damage probability of the wafer chip. Description of the Drawings

[0018] Figure 1 is a schematic structural diagram of a pick - and - place head that is convenient to adjust provided by the embodiments of the present utility model;

[0019] Figure 2 is a cross - sectional view of a pick - and - place head that is convenient to adjust provided by the embodiments of the present utility model.

[0020] Reference numerals: horizontal rotating motor 1, horizontal motor base 2, first - direction shaft motor 3, core shaft support cylinder 4, nozzle assembly 5, fixed sleeve 6, slide rail 7, first - direction shaft slider 8, fixed frame 9, first - direction shaft base 10, first - direction shaft vertical plate 11, constant - force spring 12, outer ring of deep - groove ball bearing 13, air bearing 14, pick - and - place head core shaft 15. Detailed Embodiments

[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0022] In the embodiments of the present invention, words such as "exemplary" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present invention should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific manner.

[0023] Hereinafter, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present invention, unless otherwise stated, the meaning of "a plurality" is two or more.

[0024] In a first aspect, with reference to Figure 1 , the embodiments of the present invention provide a pick-and-place head that is convenient to adjust, including: a rotation mechanism, a pick-and-place mechanism, and a lifting mechanism;

[0025] The rotation mechanism includes a horizontal rotation motor 1. The pick-and-place mechanism includes a fixed frame 9, a mandrel support cylinder 4, an air bearing 14, a pick-and-place head mandrel 15, and a nozzle assembly 5. The pick-and-place head mandrel 15 is rotatably connected to the mandrel support cylinder 4 through the air bearing 14. The nozzle assembly 5 is fixedly connected to the first end of the pick-and-place head mandrel 15. A ring spring group is provided at the second end of the pick-and-place head mandrel 15. The ring spring group is used to absorb the acting force along the direction of the pick-and-place head mandrel 15 after deformation. The mandrel support cylinder 4 is fixedly connected to the fixed frame 9. The horizontal rotation motor 1 is fixed on the fixed frame 9 and is rotatably connected to the pick-and-place head mandrel 15;

[0026] The lifting mechanism includes a first-direction shaft vertical plate 11, a first-direction shaft slider 8, and a first-direction shaft motor 3. The first-direction shaft motor 3 is used to drive the first-direction shaft slider 8 to move along the first-direction shaft on the first-direction shaft vertical plate 11. The first-direction shaft slider 8 is fixedly connected to the fixed frame 9. The first-direction shaft motor 3 is provided on the fixed frame 9.

[0027] Specifically, the pick-and-place head in the embodiments of the present invention mainly includes a rotation mechanism, a pick-and-place mechanism, and a lifting mechanism. The pick-and-place mechanism is rotated by the rotation mechanism, and the pick-and-place mechanism is lifted by the lifting mechanism, so as to accurately control the pick-and-place mechanism to adsorb the wafer chip. The pick-and-place mechanism specifically includes a fixed frame 9, a core shaft support cylinder 4, an air bearing 14, a pick-and-place head core shaft 15, and a nozzle assembly 5. The pick-and-place head core shaft 15 is rotatably connected to the core shaft support cylinder 4 through the air bearing 14. The nozzle assembly 5 is fixedly connected to the first end of the pick-and-place head core shaft 15. The horizontal rotation motor 1 is connected to the fixed frame 9 through a horizontal motor base 2 on the fixed frame 9 to rotate the pick-and-place head core shaft 15 on the 360-degree rotatable fixed frame 9. The pick-and-place head core shaft 15 is rotatably connected to the core shaft support cylinder 4 through the air bearing 14, so as to realize the non-damping rotation of the pick-and-place head core shaft 15 and the precise rotation of the nozzle assembly 5. By moving the pick-and-place head core shaft up and down in the air bearing 14 and the elastic deformation of the annular spring group at the top of the pick-and-place head core shaft in the vertical direction (i.e., along the direction of the pick-and-place head core shaft 15), the reaction force of the chip on the nozzle assembly 5 is absorbed, the contact force between the nozzle assembly 5 and the chip is controlled, and the chip picking rate is improved; and the miniaturized air bearing 14 is used to replace the guide rail. While achieving precise control, two-way vacuum and one-way positive pressure air paths are added to the structure of the air bearing 14, so as to realize adsorbing the chip with one path and adsorbing the nozzle assembly 5 with the other path, thereby realizing the function of automatically switching the nozzle head of the nozzle assembly 5. The lifting mechanism includes a first-direction shaft vertical plate 11, a first-direction shaft slider 8, and a first-direction shaft motor 3. The first-direction shaft vertical plate 11 is specifically a Z-direction shaft vertical plate. A Z-direction slider (i.e., the first-direction shaft slider 8) is arranged on the front vertical surface of the Z-direction shaft vertical plate. The fixed frame 9 is fixedly arranged on the Z-direction slider, so that the first-direction shaft motor 3 drives the first-direction shaft slider 8 to move along the first-direction axis on the first-direction shaft vertical plate 11, and further drives the nozzle assembly 5 to move on the first-direction axis to complete the lifting. The first-direction shaft motor 3 is specifically connected to the fixed frame 9 through a first-direction shaft base 10.

[0028] In some alternative embodiments, a slide rail 7 is arranged on the first-direction shaft vertical plate 11. The first surface of the first-direction shaft slider 8 is slidably connected to the slide rail 7, and the second surface of the first-direction shaft slider 8 is fixedly connected to the fixed frame 9.

[0029] Specifically, a slide rail 7 of the first-direction axis is arranged on one side of the first-direction shaft vertical plate 11 facing the pick-and-place mechanism. The first surface of the first-direction shaft slider 8 is slidably connected to the slide rail 7, and the second surface of the first-direction shaft slider 8 is fixedly connected to the fixed frame 9, so that the first-direction shaft motor 3 drives the first-direction shaft slider 8 to slide along the first-direction axis on the slide rail 7.

[0030] In some alternative embodiments, the nozzle assembly 5 includes a vacuum nozzle, a docking pipe, and a docking nozzle. The vacuum nozzle is communicated with the docking nozzle through the docking pipe, and the docking nozzle is used for adsorbing a wafer chip.

[0031] In some alternative embodiments, the vacuum nozzle is connected to a vacuum pump through an adsorption pipe.

[0032] In some alternative embodiments, the nozzle assembly 5 further includes a fixed sleeve 6. An adsorption shaft is arranged inside the fixed sleeve 6, and the adsorption pipe, the vacuum nozzle, and the docking pipe are arranged inside the adsorption shaft.

[0033] In some alternative embodiments, a flat spring is arranged at the first end of the adsorption shaft. The flat spring is used for buffering the acting force of the adsorption shaft on the first direction axis. A docking nozzle and a docking chassis are arranged at the second end of the adsorption shaft. The docking chassis is provided with a docking through hole, and the docking nozzle is located inside the docking through hole.

[0034] In some alternative embodiments, an air bearing sleeve is further arranged inside the fixed sleeve 6. The adsorption shaft is arranged inside the air bearing sleeve, and an air film is arranged between the air bearing sleeve and the adsorption shaft.

[0035] Specifically, referring to Figure 2 , the fixed sleeve 6 is connected to the core shaft support cylinder 4. On the upper end surface of the core shaft support cylinder 4, an outer ring 13 of a deep groove ball bearing is fixedly connected. An adsorption shaft is arranged inside the fixed sleeve 6. At the same time, an adsorption pipe, a vacuum nozzle, and a docking pipe are arranged inside the adsorption shaft. The top end of the adsorption shaft is fixedly connected to the center of the flat spring. Then, a docking nozzle and a docking chassis are arranged at the bottom end of the adsorption shaft. A docking through hole is arranged at the center of the docking chassis, and the docking nozzle is located inside the docking through hole. After that, the docking nozzle is communicated with the adsorption pipe. A vacuum nozzle and a docking pipe are arranged on the chip suction head. The docking pipe is communicated with the docking nozzle by using the vacuum nozzle, so that the inner wall of the docking through hole is closely attached to the outer wall of the docking pipe. Finally, the connecting pipe is communicated with the docking through hole.

[0036] When the chip needs to be adsorbed and bonded, the adsorption shaft is moved to align with the chip suction head, and the docking nozzle and the docking pipe are closely connected and communicated. At this time, the docking through-hole is only communicated with the connecting pipe. Then, the vacuum pump extracts the air in the docking through-hole through the connecting pipe, and uses the internal and external air pressure difference of the docking through-hole to fix the chip suction head at the bottom end of the adsorption shaft. After that, the chip placement mechanism is moved to align the vacuum suction nozzle with the chip. The vacuum pump provides suction force to the vacuum suction nozzle through the adsorption pipe to suck up the chip. At the same time, the horizontal rotation motor drives the adsorption shaft to rotate by rotating the fixed chassis, so as to realize the adjustment of the chip angle. Finally, the chip placement mechanism is moved directly above the substrate, and the chip is placed on the surface of the substrate coated with glue, and the chip is pressed and fixed at the same time. During the pressing process, the flat spring buffers the adsorption shaft to avoid pressing the chip to damage due to excessive pressure. The automatic adsorption and bonding of the wafer chip are realized, the production efficiency and the bonding quality of the wafer chip are improved. At the same time, the chip placement mechanism is equipped with chip suction heads with multiple different types of vacuum suction nozzles, and the vacuum suction nozzles can be switched by replacing the chip suction heads, so that the adsorption and bonding of different types of wafer chips can be realized. In order to improve the buffering ability of the chip placement mechanism when adsorbing and bonding the chip, an air floating bushing is arranged on the chip placement mechanism. Since there is an air film between the air floating bushing and the adsorption shaft, the friction between the adsorption shaft and the air floating bushing is avoided.

[0037] In some alternative embodiments, a pressure sensor is disposed between the flat spring and the adsorption shaft.

[0038] In some alternative embodiments, a ceramic heater is disposed on the vacuum suction nozzle.

[0039] Specifically, referring to Figure 2 , in order to obtain the pressure value of the adsorption shaft on the chip, a pressure sensor is disposed on the chip placement mechanism, and the pressure sensor is located between the flat spring and the adsorption shaft to realize obtaining the pressure value of the adsorption shaft on the chip. In order to enable the vacuum suction nozzle to heat up when bonding the chip, a ceramic heater is disposed on the vacuum suction nozzle, and a conductive copper column is disposed in the suction head chassis. The conductive copper column is connected to the ceramic heater through an electric wire. When the conductive copper column is electrified, the ceramic heater can generate heat and transfer the heat to the adsorption plate, so that the temperature of the bonded chip can reach the process requirement to heat and accelerate curing.

[0040] In some alternative embodiments, in order to achieve the lifting movement and control of the chip placement mechanism, a displacement sensor is added to the first square-axis slider to monitor the position in real time. At the same time, the drive control module is electrically connected to the lifting mechanism and the pressure sensor respectively. The lifting mechanism is used to control the lifting height of the wafer chip placement mechanism, and the control module is used to receive the signal from the pressure sensor. For example, when the lifting mechanism needs to control the chip placement mechanism to adsorb or bond the chip, the lifting mechanism drives the wafer chip placement mechanism to descend. When the vacuum suction nozzle presses against the chip, the adsorption shaft is pushed upward to press against the pressure sensor. When the pressure received by the pressure sensor reaches the preset value, the pressure sensor sends a signal, and the control module controls the lifting mechanism to stop descending. The setting of the air bearing sleeve can reduce the influence of the outside world on the adsorption shaft, making the pressure of the adsorption shaft pressing against the pressure sensor closer to the pressure of the adsorption shaft pressing against the chip, so that the pressure on the chip can be adjusted in real time through the cooperation of the pressure sensor and the control module, thereby improving the bonding quality of the chip and reducing the damage rate of the chip during the bonding process. At the same time, in order to improve the pressure control accuracy, a constant force spring 12 is added inside to balance the self-weight of the balance module and improve the pressure accuracy.

[0041] Implementing the embodiments of the present utility model includes the following beneficial effects: The embodiments of the present utility model provide a pick-and-place head that is convenient to adjust, including: a rotating mechanism, a pick-and-place mechanism, and a lifting mechanism; the rotating mechanism includes a horizontal rotating motor 1, the pick-and-place mechanism includes a fixed frame 9, a mandrel support cylinder 4, an air bearing 14, a pick-and-place head mandrel 15, and a nozzle assembly 5. The pick-and-place head mandrel 15 is rotatably connected to the mandrel support cylinder 4 through the air bearing 14. The nozzle assembly 5 is fixedly connected to the first end of the pick-and-place head mandrel 15. A ring spring group is provided at the second end of the pick-and-place head mandrel 15. The ring spring group is used to absorb the acting force along the direction of the pick-and-place head mandrel 15 after deformation. The mandrel support cylinder 4 is fixedly connected to the fixed frame 9. The horizontal rotating motor 1 is fixed on the fixed frame 9 and is rotatably connected to the pick-and-place head mandrel 15. The lifting mechanism includes a first-direction shaft vertical plate 11, a first-direction shaft slider 8, and a first-direction shaft motor 3. The first-direction shaft motor 3 is used to drive the first-direction shaft slider 8 to move along the first-direction shaft on the first-direction shaft vertical plate 11. The first-direction shaft slider 8 is fixedly connected to the fixed frame 9. The first-direction shaft motor 3 is arranged on the fixed frame 9. By horizontally rotating the pick-and-place head mandrel 15 through the horizontal rotating motor 1, performing non-damping rotation through the air bearing 14, and synchronously rotating the nozzle assembly 5 through the pick-and-place head mandrel 15, the adsorbed wafer chip is rotated; by driving the first-direction shaft slider 8 to move along the first-direction shaft on the first-direction shaft vertical plate 11 through the first-direction shaft motor 3, the nozzle assembly 5 is driven to move on the first-direction shaft, and the lifting distance of the nozzle assembly 5 is accurately controlled; and the acting force along the direction of the pick-and-place head mandrel 15 is absorbed by the ring spring group, so as to buffer the acting force when the nozzle assembly 5 adsorbs the wafer chip, and reduce the damage probability of the wafer chip.

[0042] In a second aspect, the embodiments of the present utility model provide a die bonder, including the above-mentioned pick-and-place head that is convenient to adjust.

[0043] It can be seen that the content in the above-mentioned pick-and-place head embodiments is applicable to the die bonder embodiments of the present utility model. The functions specifically realized by the die bonder embodiments of the present utility model are the same as those of the above-mentioned pick-and-place head embodiments, and the beneficial effects achieved are also the same as those of the above-mentioned pick-and-place head embodiments.

[0044] In the description of this specification, the description referring to the term "in a specific embodiment" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representation of the above-mentioned term does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0045] The above is a specific description of the preferred embodiment of the present utility model. However, the present utility model is not limited to the described embodiment. Those skilled in the art can make various equivalent deformations or substitutions without departing from the spirit of the present utility model, and these equivalent deformations or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A patch head with convenient adjustment, characterized in that: include: Rotating mechanism, patch mechanism and lifting mechanism; The rotating mechanism includes a horizontal rotating motor, and the patch mechanism includes a fixed frame, a core shaft supporting cylinder, an air bearing, a patch head shaft core and a suction nozzle assembly, the patch head shaft core is rotationally connected to the core shaft supporting cylinder through the air bearing, the suction nozzle assembly is fixedly connected to the first end of the patch head shaft core, the second end of the patch head shaft core is provided with an annular spring sheet group, the annular spring sheet group is used to absorb the force along the direction of the patch head shaft core after deformation, the core shaft supporting cylinder is fixedly connected to the fixed frame, and the horizontal rotating motor is fixed on the fixed frame and rotationally connected to the patch head shaft core; The lifting mechanism includes a first direction axis vertical plate, a first direction axis slider and a first direction axis motor. The first direction axis motor is used to drive the first direction axis slider to move along the first direction axis on the first direction axis vertical plate. The first direction axis slider is fixedly connected to the fixed frame, and the first direction axis motor is arranged on the fixed frame.

2. The easy-to-adjust patch head according to claim 1, characterized in that: A slide rail is disposed on the first direction axis vertical plate, a first surface of the first direction axis slider is slidably connected to the slide rail, and a second surface of the first direction axis slider is fixedly connected to the fixed frame.

3. The easy-to-adjust patch head according to claim 1, characterized in that: The nozzle assembly comprises a vacuum nozzle, a docking pipe and a docking nozzle. The vacuum nozzle is connected to the docking nozzle through the docking pipe, and the docking nozzle is used for adsorbing wafer chips.

4. The easy-to-adjust patch head according to claim 3, characterized in that: The vacuum suction nozzle is connected with a vacuum pump through an adsorption pipeline.

5. The easy-to-adjust patch head according to claim 4, characterized in that: The suction nozzle assembly also includes a fixed sleeve, a suction shaft is arranged inside the fixed sleeve, and the suction pipe, the vacuum suction nozzle and the docking pipe are arranged inside the suction shaft.

6. The easy-to-adjust patch head according to claim 5, characterized in that: A planar spring is provided at the first end of the adsorption shaft, and the planar spring is used to buffer the force of the adsorption shaft on the first direction axis. A docking suction nozzle and a docking chassis are provided at the second end of the adsorption shaft. The docking chassis is provided with a docking through hole, and the docking suction nozzle is located in the docking through hole.

7. The easy-to-adjust patch head according to claim 5, characterized in that: An air-floating sleeve is also arranged inside the fixed sleeve, the adsorption shaft is arranged inside the air-floating sleeve, and an air film is arranged between the air-floating sleeve and the adsorption shaft.

8. The easy-to-adjust patch head according to claim 6, characterized in that: A pressure sensor is arranged between the planar spring and the adsorption shaft.

9. The easy-to-adjust patch head according to claim 3, characterized in that: The vacuum suction nozzle is provided with a ceramic heater.

10. A die bonding machine, characterized in that: The invention comprises the easily adjustable patch head as described in any one of claims 1 to 9.

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