Wafer processing film reversing device

Abstract

The utility model discloses a film pouring device for wafer processing. The film pouring device comprises a platform with supporting legs, a vacuum chuck of which the vacuum degree is controlled by a one-way air valve is arranged on the upper surface of the platform, and vacuum suction holes are uniformly formed in the vacuum chuck; a circle of clamping groove concentric with the vacuum suction cup is formed in the radial outer ring of the vacuum suction cup, and a film expanding ring is arranged in the clamping groove. A steel ring which is positioned through a pin and fixed through a magnet is arranged on the radial outer ring of the clamping groove, and the steel ring and the vacuum chuck are concentric; and a heating ring of which the heating temperature is controlled by a temperature controller is arranged on the lower side of the vacuum chuck. According to the utility model, the vacuum chuck is used for fixing the wafer needing to be subjected to film reversing, so that uniform stress of the wafer can be ensured while film deformation is avoided; the steel ring and the membrane expanding ring can be concentric through the pin and the clamping groove; the vacuum chuck is used for fixing and the film is torn along the direction parallel to the plane of the vacuum chuck, so that the completeness of the inverted film can be ensured; and glue residues can be effectively avoided through heating of the vacuum chuck.

Description

Technical Field

[0001] The utility model relates to the technical field of automation equipment, in particular to a wafer processing film inversion device. Background Art

[0002] In the process of semiconductor manufacturing, multiple chips (or called DIE, usually with some tiny circuit elements and transistors on this chip) are simultaneously manufactured on the same silicon wafer. Therefore, it is necessary to cut the wafer to separate individual chips. The currently relatively mature wafer cutting technology is the SDBG hidden cutting technology, that is, a protective film is pasted on the front side before cutting, and then laser hidden cutting is performed from the back side. After hidden cutting, back grinding is carried out, then the protective film on the front side is peeled off, and a cutting adhesive film is pasted on the back side. Finally, film expansion is carried out based on the cutting adhesive film to separate multiple chips from each other to achieve segmentation, etc.

[0003] In the actual processing of the wafer, when pasting the protective film on the front side and performing back hidden cutting, the outer ring of the protective film needs to be fixed with a steel ring. When pasting the cutting adhesive film on the back side for film expansion, the outer ring of the cutting adhesive film is pressed by an expanding film ring. Therefore, in the whole process, it is necessary to realize film inversion between the steel ring and the expanding film ring. The existing technology usually directly tears off the original protective film on the front side manually or by using an auxiliary jig and pastes the cutting adhesive film on the back side of the wafer to achieve film inversion. This method has the following disadvantages:

[0004] 1. When tearing off the protective film on the front side, due to the stickiness of the glue, it is easy to deform the protective film, affecting the use in subsequent processes;

[0005] 2. Directly tearing the protective film easily causes uneven stress on the wafer and fragmentation, and then some DIEs are taken away with the protective film and cannot be transferred to the new film, resulting in incomplete film inversion;

[0006] 3. When tearing off the cutting adhesive film on the back side, there will be glue residue on the DIE. Summary of the Utility Model

[0007] The technical problem to be solved by the utility model is to overcome the existing defects and provide a wafer processing film inversion device, including a platform with legs;

[0008] The upper surface of the platform is provided with a vacuum chuck whose vacuum degree is controlled by a one-way air valve, and the vacuum chuck is evenly provided with vacuum suction holes;

[0009] A circle of grooves concentric with the vacuum chuck is arranged on the radial outer circle of the vacuum chuck, and an expanding film ring is arranged in the grooves;

[0010] A steel ring positioned by a pin and fixed by a magnet is arranged on the radial outer circle of the groove, and the steel ring is concentric with the vacuum chuck;

[0011] A heating coil controlled by a temperature controller is provided on the lower side of the vacuum chuck.

[0012] Wherein: The platform is provided with a notch corresponding to the card slot to facilitate the taking and placing of the film expanding ring.

[0013] Wherein: A roll of film is also provided on the upper surface of the platform through a bracket. For a specific wafer, after being fixed by a vacuum chuck, the roll of film can be covered and compacted with a rubber roller, and tearing off the roll of film can effectively remove surface dirt; for a wafer that has completed film expansion, the roll of film can be covered and compacted with a rubber roller to achieve the purpose of protecting the wafer.

[0014] Wherein: A cutting groove is also provided on the upper surface of the platform to achieve a flush cut of the roll of film.

[0015] Compared with the prior art, the utility model has the following advantages:

[0016] 1. Using a vacuum chuck to fix the wafer that needs to be inverted, while avoiding film deformation, it can ensure uniform stress on the wafer.

[0017] 2. The concentricity of the steel ring and the film expanding ring can be ensured through the pin and the card slot.

[0018] 3. Using a vacuum chuck to fix and tearing the film in a direction parallel to the plane of the vacuum chuck can ensure the integrity of the inverted film.

[0019] 4. Heating through the vacuum chuck can effectively avoid glue residue. Description of the Drawings

[0020] Figure 1-2 It is a three-dimensional structural schematic diagram of the utility model.

[0021] The numbers in the figure represent: 10. Platform; 11. Leg; 12. Vacuum chuck; 121. Vacuum suction hole; 13. One-way air valve; 14. Card slot; 15. Film expanding ring; 16. Pin; 17. Magnet; 18. Steel ring; 19. Notch; 20. Bracket; 21. Roll of film; 22. Cutting groove; 23. Temperature controller; 24. Wafer. Detailed Embodiments

[0022] Next, the technical solutions in the embodiments of the utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the utility model.

[0023] Embodiment 1:

[0024] Please refer to Figure 1-2, a wafer processing film - inverting device provided in Embodiment 1 includes a platform 10 with legs 11; on the upper surface of the platform 10, there is a vacuum chuck 12 whose vacuum degree is controlled by a one - way air valve 13. The vacuum chuck 12 is evenly provided with vacuum suction holes 121; a circle of clamping grooves 14 concentric with the vacuum chuck 12 is arranged on the radial outer circle of the vacuum chuck 12. An expanding film ring 15 is arranged in the clamping groove 14, and the platform 10 is provided with a notch 19 corresponding to the clamping groove 14 to facilitate the taking and placing of the expanding film ring 15; on the radial outer circle of the clamping groove 14, there is a steel ring 18 positioned by a pin 16 and fixed by a magnet 17, and the steel ring 18 is concentric with the vacuum chuck 12; below the vacuum chuck 12, there is a heating coil whose heating temperature is controlled by a temperature controller 23.

[0025] When performing film - inverting for wafer 24 processing in Embodiment 1, the vacuum chuck 12 is used to fix the wafer 24 to be film - inverted, which can avoid film deformation and ensure uniform stress on the wafer 24; through the pin 16 and the clamping groove 14, it can be ensured that the steel ring 14 and the expanding film ring 15 are concentric; using the vacuum chuck 12 to fix and tear the film in a direction parallel to the plane of the vacuum chuck 12 can ensure the integrity of film - inverting; heating the vacuum chuck 12 through the heating coil can effectively avoid glue residue.

[0026] Embodiment 2:

[0027] Based on Embodiment 1, in this Embodiment 2, a film roll 21 is further arranged on the upper surface of the platform 10 through a bracket 20. For a specific wafer 24, after being fixed by the vacuum chuck 12, the film roll can be covered and compacted with a rubber roller. Tearing off the film roll can effectively remove surface dirt; for the wafer 24 that has completed film expansion, the film roll can be covered and compacted with a rubber roller to achieve the purpose of protecting the wafer 24; a cutting groove 22 is also arranged on the upper surface of the platform 10 to achieve a flush cut of the film roll 21.

[0028] The above are only the embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. All equivalent structural or equivalent process transformations made by using the content of the specification and drawings of the present utility model, or directly or indirectly applied in other related technical fields, are similarly included in the patent protection scope of the present utility model.

Claims

1. A wafer processing film inversion device, characterized in that: comprising a platform (10) having legs (11); The upper surface of the platform (10) is provided with a vacuum suction cup (12) whose vacuum degree is controlled by a one-way air valve (13), and vacuum suction holes (121) are evenly arranged on the vacuum suction cup (12); The radial outer ring of the vacuum suction cup (12) is provided with a circle of clamping grooves (14) which are concentric with the vacuum suction cup (12), and a film expansion ring (15) is provided in the clamping groove (14); The radial outer ring of the clamping groove (14) is provided with a steel ring (18) positioned by a pin (16) and fixed by a magnet (17), and the steel ring (18) is concentric with the vacuum suction cup (12); A heating coil whose heating temperature is controlled by a temperature controller (23) is arranged on the lower side of the vacuum suction cup (12).

2. The wafer processing film inversion device according to claim 1, characterized in that: The platform (10) is provided with a notch (19) corresponding to the clamping slot (14) to facilitate the taking and placing of the membrane expansion ring (15).

3. The wafer processing film inversion device according to claim 1, characterized in that: The upper surface of the platform (10) is also provided with a roll film (21) via a bracket (20).

4. The wafer processing film inversion device according to claim 3, characterized in that: The upper surface of the platform (10) is also provided with a cutting groove (22) to achieve flush cutting of the rolled film (21).

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