Heat dissipation structure of chip and vehicle

Abstract

The utility model relates to the technical field of chip heat dissipation, in particular to a heat dissipation structure of a chip and a vehicle. The heat dissipation structure of the chip provided by the utility model comprises the components of a PCB which is provided with the chip; the cooling device is connected with the PCB, and the cooling device is suitable for absorbing heat generated by the chip; the heat conduction device is movably connected to the cooling device, the heat conduction device at least comprises a high heat conduction piece, and the high heat conduction piece abuts against the chip; the elastic piece is connected between the heat conduction device and the cooling device; when the heat conduction device abuts against the chip, the elastic piece generates elastic deformation, and under the elastic force effect of the elastic piece, the heat conduction device tends to move towards the direction of the chip. According to the heat dissipation structure of the chip and the vehicle provided by the utility model, the heat dissipation effect of the chip can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip heat dissipation, in particular to a heat dissipation structure of a chip and a vehicle. Background Art

[0002] With the development of vehicle intelligence, the computing power of vehicle ECU chips is getting stronger and stronger. Correspondingly, the power consumption of ECU chips is also getting larger and larger, and the heat dissipation problem of ECU chips has become a difficult problem in the field.

[0003] In the related art, to solve the heat dissipation problem of ECU chips, the heat dissipation structure of the chip includes a water-cooled plate, and a flow channel structure is arranged inside the water-cooled plate, and a cooling medium can flow in the flow channel structure. The chip can conduct the generated heat to the water-cooled plate, and the heat is dissipated by the outflow of the cooling medium.

[0004] Due to the existence of assembly errors, the contact between the chip and the water-cooled plate cannot be guaranteed to be complete contact. To make up for the assembly error, a relatively thick thermal interface material is coated on the surface of the chip. The thermal interface material is a flexible material with thermal conductivity. The water-cooled plate presses on the thermal interface material on the surface of the chip, causing a certain elastic deformation of the thermal interface material, thereby ensuring the complete contact between the water-cooled plate and the thermal interface material.

[0005] However, due to the obvious thermal resistance characteristics of the thermal interface material, there is a large thermal resistance on the heat conduction path from the chip to the water-cooled plate, which in turn leads to poor heat dissipation of the chip. Therefore, how to improve the heat dissipation effect of the chip has become an important technical problem to be solved by those skilled in the art. Summary of the Utility Model

[0006] In view of this, the utility model provides a heat dissipation structure of a chip and a vehicle, which can improve the heat dissipation effect of the chip.

[0007] In a first aspect, the utility model can provide a heat dissipation structure of a chip, including:

[0008] A PCB board provided with a chip;

[0009] A cooling device connected to the PCB board, and the cooling device is adapted to absorb the heat generated by the chip;

[0010] A heat conduction device movably connected to the cooling device, the heat conduction device at least includes a high thermal conductivity member, and the high thermal conductivity member abuts against the chip;

[0011] An elastic member connected between the heat conduction device and the cooling device;

[0012] Wherein, when the heat conduction device is in contact with the chip, the elastic member undergoes elastic deformation, and under the elastic force of the elastic member, the heat conduction device has a tendency to move towards the chip.

[0013] According to the heat dissipation structure of the chip provided by the present invention, the high thermal conductivity member has a plate-like structure. The area of the first surface of the high thermal conductivity member is a, the second surface of the chip corresponds to the first surface, and the area of the second surface is b, where a > b.

[0014] According to the heat dissipation structure provided by the present invention, the heat conduction device further includes:

[0015] A first thermal interface layer disposed between the high thermal conductivity member and the cooling device.

[0016] According to the heat dissipation structure of the chip provided by the present invention, the area of the surface of the first thermal interface layer corresponding to the high thermal conductivity member is c, where c > b.

[0017] According to the heat dissipation structure of the chip provided by the present invention, a second thermal interface layer is disposed on the surface of the chip corresponding to the high thermal conductivity member. The thickness of the second thermal interface layer is less than the thickness of the first thermal interface layer, and the high thermal conductivity member is in contact with the second thermal interface layer.

[0018] According to the heat dissipation structure of the chip provided by the present invention, one of the cooling device and the high thermal conductivity member is provided with a guide post, and the other is provided with a guide hole that slidably cooperates with the guide post.

[0019] According to the heat dissipation structure of the chip provided by the present invention, the guide post is disposed on the cooling device, and the guide hole is disposed on the high thermal conductivity member; a limiting member is disposed at the end of the guide post, and the limiting member is used to prevent the high thermal conductivity member from separating from the guide post.

[0020] According to the heat dissipation structure of the chip provided by the present invention, both the guide post and the guide hole are provided in multiple numbers and are in one-to-one cooperation.

[0021] According to the heat dissipation structure of the chip provided by the present invention, multiple elastic members are provided, and each of the elastic members is distributed at different positions between the cooling device and the high thermal conductivity member.

[0022] According to the heat dissipation structure of the chip provided by the present invention, the material of the high thermal conductivity member is graphene, carbon fiber or pure copper;

[0023] and / or, the high thermal conductivity member is a heat pipe.

[0024] According to the heat dissipation structure of the chip provided by the present utility model, the thickness of the second thermal interface layer is less than or equal to 0.05 millimeters.

[0025] In a second aspect, the present utility model provides a vehicle, including the heat dissipation structure of the chip as described in any one of the above.

[0026] Beneficial effects:

[0027] In the technical solution provided by the present utility model, after the chip conducts heat to the heat conduction device, the heat is then conducted to the cooling device, which absorbs the heat and dissipates it into the environment. In this solution, an elastic member is provided between the heat conduction device and the cooling device, and the elastic member acts on the heat conduction device. When the chip is pressed against the high thermal conductivity member, the elastic member can undergo elastic deformation. Under the elastic force of the elastic member, the heat conduction device can always be pressed tightly against the chip, ensuring that the heat generated by the chip can be seamlessly conducted to the heat conduction device, reducing the thermal resistance. The elastic member can compensate for a certain installation tolerance through its elastic deformation. In this solution, on the basis of compensating for the installation tolerance between the heat conduction device and the chip by setting the elastic member to ensure seamless docking between the heat conduction device and the chip, the heat conduction device at least includes one high thermal conductivity member, and the thermal resistance of the high thermal conductivity member is less than that of the thermal interface material. The high thermal conductivity member is in contact with the chip, ensuring a good heat conduction effect and thus ensuring the heat dissipation effect of the chip. Description of the drawings

[0028] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in related technologies, the following will briefly introduce the drawings required for use in the description of the specific embodiments or related technologies. Obviously, the following drawings are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0029] Figure 1 It is a schematic diagram of the heat dissipation structure of the chip according to an embodiment of the present utility model.

[0030] Description of the reference numerals:

[0031] 10. PCB board; 11. Cooling device; 111. Liquid cooling channel; 112. Guide post; 113. Limiting member; 12. Chip; 121. Second thermal interface layer; 13. High thermal conductivity member; 14. First thermal interface layer; 15. Elastic member. Specific embodiments

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0033] In the related art, a relatively thick thermal interface material is coated on the heat dissipation surface of the chip. The water-cooling plate is pressed against the thermal interface material on the chip, and the installation tolerance between the water-cooling plate and the chip is compensated by the elastic deformation of the thermal interface material. However, the thermal resistance of the thermal interface material is relatively large. In the related art, in order to compensate for the installation tolerance between the chip and the water-cooling plate, the thickness of the thermal interface material is also relatively large, resulting in poor heat dissipation effect of the chip.

[0034] In view of this, as Figure 1 shown, this embodiment provides a heat dissipation structure for a chip, including a PCB board 10, a cooling device 11, a heat conduction device, and an elastic member 15.

[0035] Among them, the PCB board 10 is provided with a chip 12, and the cooling device 11 is connected to the PCB board 10 and is adapted to absorb the heat generated by the chip 12. In some embodiments, the cooling device 11 can adopt a water-cooling plate, that is, a liquid cooling channel 111 for the coolant to flow through is provided inside the plate-shaped body, and the plate-shaped body can be made of materials with good thermal conductivity such as aluminum and copper. The cooling device 11 and the PCB board 10 can be connected by means of screws, rivets, snap connections, etc. The cooling device 11 and the chip 12 are arranged face to face correspondingly, and the heat generated by the chip 12 can be absorbed by the coolant in the water-cooling plate, and the heat is dissipated to the environment by the coolant. In other embodiments, the cooling device 11 can also be other structures, for example, it can be an air-cooled radiator, a heat pipe radiator, etc.

[0036] The heat conduction device is movably connected to the cooling device 11, and the heat conduction device includes at least one high thermal conductivity member 13, and the high thermal conductivity member 13 abuts against the chip 12. In some embodiments, the high thermal conductivity member 13 can adopt a plate-shaped structure, which is arranged in the space between the cooling device 11 and the chip 12. The high thermal conductivity member 13 has excellent thermal conductivity characteristics, and the specific material can adopt graphene, carbon fiber or pure copper. Or in other embodiments, the high thermal conductivity member 13 can also adopt a vapor chamber. A vapor chamber is a highly efficient and uniform heat conduction device, and its specific structure can refer to the structure of the vapor chamber in the related art, which will not be elaborated here. The heat conduction device is movably connected to the cooling device 11. Specifically, the heat conduction device has freedom in the direction of approaching or departing from the chip 12, and the freedom in the other directions is limited.

[0037] The elastic member 15 is connected between the heat conducting device and the cooling device. In some embodiments, the elastic member 15 is installed between the high heat conducting member 13 and the cooling device 11, with one end connected to the high heat conducting member 13 and the other end connected to the cooling device 11. The elastic member 15 acts on the high heat conducting member 13 and can support the high heat conducting member 13.

[0038] During installation, the high heat conducting member 13 is pressed tightly against the chip 12, that is, the high heat conducting member 13 abuts against the chip 12. Under the pressure exerted by the chip 12 on the high heat conducting member 13, the high heat conducting member 13 moves towards the cooling device 11 against the elastic force of the elastic member 15. At the same time, the elastic member 15 undergoes elastic deformation. Under the elastic force of the elastic member 15, the high heat conducting member 13 has a tendency to move towards the chip 12. Moreover, the elastic member 15 acts on the high heat conducting member 13 and maintains close contact between the high heat conducting member 13 and the chip 12 by generating elastic deformation. This design can ensure that even if the chip 12 undergoes a small displacement due to temperature changes or mechanical vibrations, the high heat conducting member 13 can still continuously and effectively abut against the chip 12, thereby maintaining efficient heat transfer.

[0039] In this embodiment, the chip 12 conducts heat to the heat conducting device and then to the cooling device 11. After being absorbed by the cooling device 11, the heat is dissipated into the environment. After assembling the heat conducting device, the cooling device 11, the elastic member 15, and the PCB board together, under the elastic force of the elastic member 15, the high heat conducting member 13 of the heat conducting device can always be pressed tightly against the chip 12, ensuring that the heat generated by the chip 12 can be seamlessly conducted to the high heat conducting member 13, reducing the thermal resistance. The elastic member 15 can compensate for a certain installation tolerance through its elastic deformation. In this embodiment, on the basis of compensating for the installation tolerance between the heat conducting device and the chip 12 by setting the elastic member 15 to ensure seamless docking between the heat conducting device and the chip 12, the heat conducting device includes at least one high heat conducting member 13, the thermal resistance of the high heat conducting member 13 is less than the thermal resistance of the thermal interface material, and the high heat conducting member 13 abuts against the chip 12, ensuring a good heat conducting effect, and further ensuring the heat dissipation effect of the chip 12.

[0040] In a further embodiment, the high heat conducting member 13 has a plate-like structure. For example, it can be a square plate-like, circular plate-like, polygonal or oval plate-like structure, etc. The heat conductivity of the high heat conducting member 13 is higher than that of the thermal interface material, that is, the thermal resistance of the high heat conducting member 13 is less than the thermal resistance of the thermal interface material. In this embodiment, the area of the first surface of the high heat conducting member 13 is a, the second surface of the chip 12 corresponds to the first surface of the high heat conducting member 13, and the area of the second surface of the chip 12 is b, where a > b. That is, among the two corresponding surfaces of the high heat conducting member 13 and the chip 12 that correspond to each other, the area of the high heat conducting member 13 is larger than the area of the chip 12.

[0041] With such a setting, a larger contact area can be created between the high thermal conductivity component 13 and the chip 12, improving the heat transfer efficiency from the chip 12 to the high thermal conductivity component 13. In addition, even if the surface heat distribution of the chip 12 is uneven, due to the large contact area between the high thermal conductivity component 13 and the chip 12, the high thermal conductivity component 13 can more effectively disperse the heat to the entire surface and then transfer it to the cooling device 11. Moreover, when there are minor changes in the size or position of the chip 12, the larger contact area can provide better fault tolerance, ensuring the continuity and stability of heat transfer.

[0042] In a further embodiment, the heat conduction device further includes a first heat conduction interface layer 14, which is disposed between the high thermal conductivity component 13 and the cooling device 11. The first heat conduction interface layer 14 is made of a heat conduction interface material, which is a material commonly used in IC packaging and electronic heat dissipation. Its main function is to fill the micro voids and uneven holes on the surface generated when two materials are joined or in contact, reduce the heat transfer contact thermal resistance, and improve the heat dissipation performance of the device. The first heat conduction interface layer 14 can use silicone as the base material, add auxiliary materials such as metal oxides, and be synthesized through a special process.

[0043] The first heat conduction interface layer 14 disposed between the high thermal conductivity component 13 and the cooling device 11 has a certain flexibility and can generate adaptive deformation. Under the combined action of the elastic member 15 and the first heat conduction interface layer 14, the installation tolerance can be effectively compensated. With such a setting, even if the thickness of the first heat conduction interface layer 14 is relatively smaller than that of the heat conduction interface material in the related art, under the combined action of the elastic member 15 and the first heat conduction interface layer 14, the installation tolerance can still be compensated. When the first heat conduction interface layer 14 is relatively thin, its thermal resistance is small, which can ensure that the heat generated by the chip 12 is fully conducted to the cooling device 11, improving the heat dissipation effect of the chip 12. Moreover, different from the related art, in this embodiment, the first heat conduction interface layer 14 is disposed between the high thermal conductivity component 13 and the cooling device 11, and the heat conduction area of the high thermal conductivity component 13 and the first heat conduction interface layer 14 can be designed to be relatively large, thereby also improving the heat dissipation effect.

[0044] In a further embodiment, the area of the surface of the first heat conduction interface layer 14 corresponding to the high thermal conductivity component 13 is c, where c > b, that is, the area of the surface of the first heat conduction interface layer 14 corresponding to the high thermal conductivity component 13 is larger than the area of the second surface of the chip 12.

[0045] Since the area c of the first thermal interface layer 14 is larger than the area b of the second surface of the chip 12, more regions on the high thermal conductivity member 13 can be in close contact with the first thermal interface layer 14. This large-area contact not only reduces the contact thermal resistance but also provides more heat transfer channels, thereby improving the heat transfer efficiency from the chip 12 to the high thermal conductivity member 13 and then to the cooling device 11. When the heat distribution on the surface of the chip 12 is uneven, the first thermal interface layer 14 with a larger area helps to better disperse and balance this heat. The first thermal interface layer 14 and the high thermal conductivity member 13 can effectively transfer heat from the high-temperature region of the chip 12 to the low-temperature region and evenly distribute it across the entire interface, thereby reducing the formation of hot spots and the sharp change in temperature gradient.

[0046] In a further embodiment, a second thermal interface layer 121 is provided on the surface of the chip 12 corresponding to the high thermal conductivity member 13. The thickness of the second thermal interface layer 121 is smaller than the thickness of the first thermal interface layer 14, and the high thermal conductivity member 13 abuts against the second thermal interface layer 121. In some embodiments, the material of the second thermal interface layer 121 is the same as that of the first thermal interface layer 14, and it can be specifically compounded on the surface of the chip 12 through a compounding process, and the thickness of the second thermal interface layer 121 is much smaller than the thickness of the first thermal interface layer 14.

[0047] With such a setting, since the second thermal interface layer 121 is directly located between the chip 12 and the high thermal conductivity member 13, its relatively thin thickness reduces the material layer that needs to be penetrated during the heat transfer process, thereby reducing the thermal resistance. This helps heat to be transferred from the chip 12 to the high thermal conductivity member 13 faster, thereby improving the heat transfer efficiency of the entire heat dissipation structure. The second thermal interface layer 121 usually has excellent thermal conductivity and filling properties, and can fill the tiny gaps between the surface of the chip 12 and the high thermal conductivity member 13 to form a tight thermal contact. This tight thermal contact reduces the interface thermal resistance and ensures that heat can pass through smoothly. The surface of the chip 12 may be uneven due to manufacturing processes, material properties, or wear during use. The relatively thin second thermal interface layer 121 can better adapt to these uneven surfaces, ensuring effective contact with the high thermal conductivity member 13, thereby improving the heat dissipation effect.

[0048] In addition, the combined use of the first thermal interface layer 14 and the second thermal interface layer 121 provides double protection for the heat dissipation structure. Even when the performance of the first thermal interface layer 14 deteriorates due to aging, contamination, or damage, the second thermal interface layer 121 can still maintain a certain heat transfer capacity to ensure the normal heat dissipation of the chip 12.

[0049] In a further embodiment, in order to facilitate the assembly of the cooling device 11 and the high thermal conductivity member 13, a guide post 112 is provided on one of the cooling device 11 and the high thermal conductivity member 13, and a guide hole that is slidably engaged with the guide post 112 is provided on the other.

[0050] For example, in one embodiment, the guide post 112 can be provided on the cooling device 11. The guide post 112 is provided on the corresponding surface of the cooling device 11 and the high thermal conductivity member 13. The guide post 112 and the cooling device 11 can be of an integral structure, specifically, it can be a casting integral structure, a welding integral structure, etc. The cross-section of the guide post 112 can be circular or square. Correspondingly, a guide hole is provided on the high thermal conductivity member 13, and the guide hole is adapted to the guide post 112. When the guide hole is sleeved on the outer periphery of the guide post 112, the high thermal conductivity member 13 can slide along the guide post 112.

[0051] With such a setting, under the cooperation of the guide post 112 and the guide hole, the high thermal conductivity member 13 only has the freedom to move relatively closer to or farther away from the cooling device 11, while the degrees of freedom in other directions are restricted. During assembly, the chip 12 and the high thermal conductivity member 13 are pressed tightly. Under the action of the pressure, the elastic force of the elastic member 15 is overcome, and the high thermal conductivity member 13 can displace along the guide post 112 in the direction close to the cooling device 11. At the same time, the elastic force of the elastic member 15 acts on the high thermal conductivity member 13, causing the high thermal conductivity member 13 to have a tendency to move along the guide post 112 in the direction of the chip 12.

[0052] In a further embodiment, the guide post 112 is provided on the cooling device 11, and the guide hole is provided on the high thermal conductivity member 13. And a limiting member 113 is provided at the end of the guide post 112, and the limiting member 113 is used to limit the separation of the high thermal conductivity member 13 from the guide post 112. That is, in order to prevent the high thermal conductivity member 13 from accidentally separating from the guide post 112 under the action of an external force, the limiting member 113 is particularly provided at the end of the guide post 112. The limiting member 113 plays a role of safety locking, ensuring that during normal use, the high thermal conductivity member 13 is always connected to the guide post 112 and will not fall off due to vibration or other external factors, thereby ensuring the stability and reliability of the heat dissipation structure.

[0053] In some embodiments, the limiting member 113 can be a screw. The guide post 112 is provided with a threaded hole adapted to the screw. After the high thermal conductivity member 13 is sleeved on the guide post 112, the screw is tightened on the guide post 112. The diameter of the nut of the screw is larger than the diameters of the guide post 112 and the guide hole, and the nut of the screw can play a limiting role on the high thermal conductivity member 13. Of course, in other embodiments, the limiting member 113 can also be a pin with a cap, etc.

[0054] Through the sliding fit of the guide post 112 and the guide hole, the relative position between the cooling device 11 and the high thermal conductivity member 13 can be flexibly adjusted to meet different heat dissipation requirements or compensate for the thermal expansion difference caused by temperature changes. The design of the limiting member 113 effectively prevents the situation of accidental separation, improving the stability and durability of the entire heat dissipation structure.

[0055] In a further embodiment, both the guide posts 112 and the guide holes are provided in plurality and are in one-to-one correspondence and cooperation. The plurality of guide posts 112 can be distributed at different positions of the cooling device 11. For example, when the surface of the cooling device 11 corresponding to the high thermal conductivity member 13 is rectangular, guide posts 112 can be respectively provided at the four corner positions of the rectangle, and the high thermal conductivity member 13 is correspondingly provided with four guide holes, which are in one-to-one cooperation with the guide posts 112. The four corner positions are the most critical support points in the rectangular structure. By providing the guide posts 112 at these positions, it can be ensured that the high thermal conductivity member 13 can maintain a stable position and posture when subjected to various forces (such as gravity, thermal stress, etc.), and prevent tilting or offset.

[0056] With such a setting, the design of the plurality of guide posts 112 makes the contact force distribution between the cooling device 11 and the high thermal conductivity member 13 more uniform. During the heat conduction process, this uniform force application helps to reduce the thermal resistance and improve the heat conduction efficiency. In a working environment with a large temperature change, both the cooling device 11 and the high thermal conductivity member 13 may undergo a certain degree of thermal expansion or contraction. Through the guidance of the plurality of guide posts 112, this thermal deformation can be effectively controlled and compensated, reducing problems such as poor contact or stress concentration caused by deformation.

[0057] In a further embodiment, a plurality of elastic members 15 are provided, and the respective elastic members 15 are distributed at different positions between the cooling device 11 and the high thermal conductivity member 13. In some embodiments, the elastic member 15 can specifically be a compression spring, and both ends of the compression spring are respectively fixedly connected to the cooling device 11 and the high thermal conductivity member 13, which can be specifically realized by means such as hook connection and welding.

[0058] Due to factors such as temperature change and vibration in the working environment, the contact between the cooling device 11 and the high thermal conductivity member 13 may be affected. The distribution of the plurality of elastic members 15 can provide uniform support and buffering at different positions, ensuring that the contact between the two always remains stable. This stability helps to prevent problems such as an increase in thermal resistance or uneven heat transfer caused by poor contact. Moreover, different working environments have different requirements for the heat dissipation structure. For example, in a working environment with high temperature, high vibration or high impact, a single elastic member 15 may not meet the requirements. The distribution of the plurality of elastic members 15 can be adjusted and optimized according to the specific working environment to provide better adaptability and reliability. In addition, during the heat conduction process, the cooling device 11 and the high thermal conductivity member 13 may undergo thermal expansion or contraction due to temperature change. If only a few elastic members 15 are relied on to support and fix the positional relationship between the two, stress concentration phenomena may occur. The distribution of the plurality of elastic members 15 can disperse these stresses over a wider area, thereby reducing the impact of stress concentration on the heat dissipation structure.

[0059] In some embodiments, the material of the high thermal conductivity component 13 can be graphene, carbon fiber, or pure copper. As possible choices, graphene, carbon fiber, and pure copper all have excellent thermal conductivity and can effectively transfer heat from the heat source to the heat dissipation device.

[0060] Among them, graphene is a two-dimensional material composed of a single layer of carbon atoms, with extremely high thermal conductivity and excellent mechanical properties. Its unique structure enables heat to be rapidly transferred within graphene, so graphene is widely used in fields that require efficient heat dissipation. As the material of the high thermal conductivity component 13, graphene can significantly improve the performance of the heat dissipation structure.

[0061] Carbon fiber is a microcrystalline graphite material obtained by carbonizing and graphitizing organic fibers. Carbon fiber has high axial strength and modulus, low density, a small coefficient of thermal expansion, and good thermal conductivity. In the heat dissipation structure, the carbon fiber high thermal conductivity component 13 can withstand higher temperatures and pressures while maintaining stable heat conduction performance.

[0062] Pure copper is a traditional heat-conducting material with excellent electrical and thermal conductivity. In the field of heat dissipation, pure copper high thermal conductivity component 13 is widely used due to its low cost and good processability.

[0063] In addition, in other embodiments, the high thermal conductivity component 13 can also be a heat pipe. A heat pipe is an efficient heat conduction element. Inside it, the liquid working medium is evenly distributed on the plate surface through a capillary structure. When heated by the heat source, the liquid working medium quickly evaporates and condenses and flows back in the condensation area, thus achieving rapid heat transfer and distribution. The heat pipe can effectively solve the problem of local hot spots and improve the overall heat dissipation efficiency.

[0064] In a further embodiment, the thickness of the second thermal conductive interface layer 121 is less than or equal to 0.05 mm. For example, the thickness of the second thermal conductive interface layer 121 can be 0.03 mm, 0.04 mm, 0.05 mm, etc.

[0065] The thinner the thickness of the second thermal conductive interface layer 121, the smaller the thermal resistance it generates. In this embodiment, when the thickness of the second thermal conductive interface layer 121 is controlled within 0.05 mm or below, the loss of heat passing through this interface layer can be significantly reduced, enabling heat to be transferred from the chip 12 to the high thermal conductivity component 13 more efficiently. And since the thickness of the second thermal conductive interface layer 121 is relatively thin, the first thermal conductive interface layer 14 and the elastic member 15 mainly bear the role of compensating for the installation tolerance.

[0066] The embodiment of the present utility model further provides a vehicle, including the heat dissipation structure of the chip described in any of the above embodiments. In some embodiments, the chip 12 may be an ECU chip of the vehicle. In other embodiments, the chip 12 may also be an MCU chip (micro control unit) or an SOC chip (system on chip) of the vehicle, etc.

[0067] With such a setting, the vehicle provided in this embodiment can improve the heat dissipation effect of the chip 12. The derivation process of this beneficial effect is generally similar to the derivation process of the beneficial effect brought by the heat dissipation structure of the above chip 12, and will not be elaborated here.

[0068] Although the embodiments of the present utility model have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present utility model, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A heat dissipation structure of a chip, characterized in that: include: A PCB board (10) provided with a chip (12); A cooling device (11) connected to the PCB board (10), the cooling device (11) being suitable for absorbing heat generated by the chip (12); A heat conduction device, movably connected to the cooling device (11), the heat conduction device comprising at least one high heat conduction member (13), and the high heat conduction member (13) abuts against the chip (12); An elastic member (15) connected between the heat conducting device and the cooling device; Wherein, when the heat conducting device is in a state of being pressed against the chip (12), the elastic member (15) undergoes elastic deformation, and under the elastic force of the elastic member (15), the heat conducting device has a tendency to move toward the chip (12).

2. The heat dissipation structure of the chip according to claim 1, characterized in that: The high thermal conductivity member (13) is a plate-shaped structure, the area of ​​a first surface of the high thermal conductivity member (13) is a, the second surface of the chip (12) corresponds to the first surface, the area of ​​the second surface is b, wherein a>b.

3. The heat dissipation structure of the chip according to claim 2, characterized in that: The heat conducting device further comprises: A first heat-conducting interface layer (14) is arranged between the high heat-conducting component (13) and the cooling device (11).

4. The heat dissipation structure of the chip according to claim 3, characterized in that: The area of ​​the surface of the first thermally conductive interface layer (14) corresponding to the high thermally conductive component (13) is c, wherein c>b.

5. The heat dissipation structure of the chip according to claim 3, characterized in that: A second thermally conductive interface layer (121) is provided on the surface of the chip (12) corresponding to the high thermally conductive component (13); the thickness of the second thermally conductive interface layer (121) is less than the thickness of the first thermally conductive interface layer (14); and the high thermally conductive component (13) is in abutment with the second thermally conductive interface layer (121).

6. The heat dissipation structure of the chip according to claim 1, characterized in that: One of the cooling device (11) and the high thermal conductivity member (13) is provided with a guide column (112), and the other is provided with a guide hole that slidably cooperates with the guide column (112).

7. The heat dissipation structure of the chip according to claim 6, characterized in that: The guide column (112) is arranged on the cooling device (11), and the guide hole is arranged on the high thermal conductivity component (13); a limiting component (113) is arranged at the end of the guide column (112), and the limiting component (113) is used to limit the high thermal conductivity component (13) from disengaging from the guide column (112).

8. The heat dissipation structure of the chip according to claim 6, characterized in that: The guide posts (112) and the guide holes are both provided in plurality and matched with each other in a one-to-one correspondence.

9. The heat dissipation structure of the chip according to claim 8, characterized in that: The elastic member (15) is arranged in plurality, and each of the elastic members (15) is distributed at a different position between the cooling device (11) and the high thermal conductivity member (13).

10. The heat dissipation structure of a chip according to claim 1, characterized in that: The material of the high thermal conductivity member (13) is graphene, carbon fiber or pure copper; And / or, the high thermal conductivity member (13) is a heat spreader.

11. The heat dissipation structure of a chip according to claim 5, characterized in that: The thickness of the second thermal conductive interface layer (121) is less than or equal to 0.05 mm.

12. A vehicle, characterized in that: A heat dissipation structure for a chip comprising any one of claims 1-11.

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