Anti-static vocoder chip

Abstract

The utility model relates to the technical field of chip anti-static, and discloses an anti-static vocoder chip which comprises a chip unit, the outer side of the chip unit is fixedly connected with a mounting frame, the four sides of the mounting frame are all connected with connecting pieces, the lower side of the chip unit is provided with a chip mounting mechanism used for mounting the chip unit, and the chip mounting mechanism is provided with a connecting piece. According to the utility model, through the plurality of groups of metal wire ropes, the upper cover plate and the heat dissipation table, an electrostatic magnetic field formed around the chip unit can be resisted and defended, and the problem of unstable working performance caused by interference of the electrostatic magnetic field of the chip can be solved; in addition, the metal wire rope is connected with the PCB butt joint plate and additionally serves as a grounding pin, and the anti-static capacity of the chip can be further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip anti-static technology, in particular to a vocoder chip capable of preventing static electricity. Background Technique

[0002] Static electricity can cause irreversible damage to semiconductors and integrated circuits, which is mainly reflected in the following aspects. Static electricity adsorption will cause the chip to adsorb impurities such as dust and fluff, reducing the performance and reliability of the chip. Static electricity discharge will damage the internal circuit of the chip, resulting in the chip being unable to work properly or even being damaged. ESD may break down the oxide layer, gate, diode, and transistor inside the chip, thus affecting the normal performance of the chip.

[0003] Most existing chips can reduce the resistance during ESD discharge by increasing the number of grounding and power supply pins of the chip, helping to better disperse the ESD energy, thereby reducing the damage to the chip. However, this method can only prevent and control the static electricity generated by the chip itself. The electromagnetic environment of the space where the chip is located is complex. If the external changes form a static electromagnetic field, it may directly interfere with the normal operation of the chip, resulting in the malfunction of the chip. Based on this, a vocoder chip capable of preventing static electricity is proposed. Content of the Utility Model

[0004] To solve the technical problem of chip anti-static, the utility model provides a vocoder chip capable of preventing static electricity.

[0005] The utility model is realized by adopting the following technical scheme: A vocoder chip capable of preventing static electricity, including a chip unit, an installation frame is fixedly connected to the outside of the chip unit, connecting pieces are connected to all four sides of the installation frame, a chip installation mechanism for installing the chip unit is arranged on the lower side of the chip unit, and a chip protection mechanism for protecting the chip unit is arranged on the upper side of the chip unit.

[0006] As a further improvement of the above scheme, the chip installation mechanism includes a PCB docking board fixedly connected to the lower sides of the four connecting pieces together, and the lower side of the chip unit is connected to the PCB docking board.

[0007] As a further improvement of the above scheme, the chip protection mechanism includes an upper cover plate fixedly connected to the upper sides of the four connecting pieces together, a heat dissipation platform is fixedly connected to the upper side of the upper cover plate, the upper cover plate and the heat dissipation platform are used to protect the chip unit from the interference of the static electromagnetic field, a heat dissipation groove mechanism for cooling by increasing the heat dissipation area is arranged on the heat dissipation platform, and a fixing mechanism for fixing the upper cover plate and the PCB docking board is arranged between the upper cover plate and the PCB docking board.

[0008] As a further improvement of the above solution, the heat dissipation groove mechanism includes a plurality of ventilation grooves opened on the lower side of the heat dissipation table. The plurality of ventilation grooves are distributed in a linear array, and the plurality of ventilation grooves communicate with both sides of the heat dissipation table, facilitating the dissipation of heat through the ventilation grooves to the outside.

[0009] As a further improvement of the above solution, the connecting member includes a plurality of lower fixing plates fixedly connected to the lower side of the PCB docking board, and a plurality of upper fixing plates fixedly connected to the lower side of the upper cover plate. Each upper fixing plate is paired with each lower fixing plate, and a metal wire rope is spirally inserted between each pair of the upper fixing plate and the lower fixing plate. The metal wire ropes on each side are connected to the mounting frame on the same side.

[0010] As a further improvement of the above solution, the fixing mechanism includes four card seats arranged between the upper cover plate and the PCB docking board. The four card seats are respectively located at the corresponding four corners of the upper cover plate and the PCB docking board.

[0011] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0012] 1. Through multiple groups of metal wire ropes, the upper cover plate and the heat dissipation table, the present utility model can resist and defend the static electromagnetic field formed around the chip unit, which helps to solve the problem of unstable working performance caused by the interference of the chip static electromagnetic field. In addition, the metal wire rope is connected to the PCB docking board and additionally acts as a grounding pin, which can further increase the anti-static ability of the chip.

[0013] 2. Through multiple groups of metal wire ropes, the mounting frame and the ventilation grooves, when a large amount of heat is generated when the chip unit works, on the one hand, the heat is dissipated to the outside through the ventilation grooves, and on the other hand, the heat is conducted to the metal wire ropes through the mounting frame. Utilizing the structural feature of the relatively large surface area of the metal wire rope itself, the effect of increasing the heat dissipation area can be formed, and the heat dissipation pressure of the chip unit can be shared. Description of the Drawings

[0014] Figure 1 is the front view of an anti-static vocoder chip provided by the present utility model;

[0015] Figure 2 is Figure 1 the first exploded structural schematic diagram of

[0016] Figure 3 is Figure 1 the second exploded structural schematic diagram of

[0017] Main Symbol Description:

[0018] 1. PCB docking board; 2. Connector; 3. Card holder; 4. Upper cover plate; 5. Heat dissipation table; 6. Ventilation groove; 7. Chip unit; 8. Installation frame; 9. Lower fixing plate; 10. Upper fixing plate; 11. Wire rope. Detailed implementation manner

[0019] Next, in combination with the accompanying drawings and the detailed implementation manner, the present utility model will be further described. It should be noted that, on the premise of no conflict, the following-described embodiments or technical features can be arbitrarily combined to form new embodiments.

[0020] Embodiment:

[0021] Please refer to Figures 1 - 3 , A vocoder chip capable of preventing static electricity in this embodiment includes a chip unit 7. An installation frame 8 is fixedly connected to the outside of the chip unit 7. Connectors 2 are connected to all four sides of the installation frame 8. A chip installation mechanism for installing the chip unit 7 is provided below the chip unit 7, and a chip protection mechanism for protecting the chip unit 7 is provided above the chip unit 7.

[0022] Please refer to Figure 1 As shown, the chip installation mechanism includes a PCB docking board 1 fixedly connected to the lower sides of the four connectors 2 together, and the lower side of the chip unit 7 is connected to the PCB docking board 1.

[0023] Please refer to Figure 1 As shown, the chip protection mechanism includes an upper cover plate 4 fixedly connected to the upper sides of the four connectors 2 together. A heat dissipation table 5 is fixedly connected to the upper side of the upper cover plate 4. The upper cover plate 4 and the heat dissipation table 5 are used to protect the chip unit 7 from interference by static electromagnetic fields. A heat dissipation groove mechanism for cooling by increasing the heat dissipation area is provided on the heat dissipation table 5. A fixing mechanism for fixing the upper cover plate 4 and the PCB docking board 1 is provided between the upper cover plate 4 and the PCB docking board 1. The heat dissipation table 5 protrudes from the surface of the upper cover plate 4, which is beneficial to ventilation and heat dissipation.

[0024] Please refer to Figure 3 As shown, the heat dissipation groove mechanism includes a plurality of ventilation grooves 6 opened on the lower side of the heat dissipation table 5. The plurality of ventilation grooves 6 are arranged in a linear array. The plurality of ventilation grooves 6 communicate with both sides of the heat dissipation table 5, facilitating the dissipation of heat through the ventilation grooves 6 to the outside. It should be noted that in this embodiment, the groove shape of the ventilation groove 6 is wavy, which can increase the heat dissipation area.

[0025] Please refer to Figure 3As shown, the connecting member 2 includes a plurality of lower fixing plates 9 fixedly connected to the lower side of the PCB docking plate 1, and a plurality of upper fixing plates 10 fixedly connected to the lower side of the upper cover plate 4. Each upper fixing plate 10 is paired with each lower fixing plate 9, and a wire rope 11 is spirally inserted between each pair of upper and lower fixing plates 10. The wire ropes 11 on each side are connected to the mounting frame 8 on the same side. It should be particularly noted that the wire rope 11 is made of multiple strands of copper wire twisted in this embodiment. The diameter of the copper wire is extremely thin, which can have the effects of grounding and heat dissipation at the same time.

[0026] Please refer to Figure 2 As shown, the fixing mechanism includes four card seats 3 arranged between the upper cover plate 4 and the PCB docking plate 1. The four card seats 3 are respectively located at the corresponding four corners of the upper cover plate 4 and the PCB docking plate 1.

[0027] The implementation principle of an anti-static vocoder chip in the embodiment of the present application is as follows: The staff installs this chip on the required circuit board through the PCB docking plate 1, and fixedly connects the card seat 3 to the PCB docking plate 1 and the upper cover plate 4 through screws. When the chip unit 7 works and a static electromagnetic field is formed in the complex electromagnetic space around, the wire rope 11 and the upper cover plate 4 and the heat dissipation table 5 form an anti-static barrier, which can effectively resist the interference of the static electromagnetic field. In addition, when the chip unit 7 generates heat during operation, the generated heat can be discharged from the ventilation slot 6 on the one hand, and on the other hand, heat transfer can be carried out through the wire rope 11 in contact with the mounting frame 8. Utilizing the characteristic of the large surface area of the wire rope 11, the heat dissipation area is increased, and the heat dissipation performance of the chip is improved.

[0028] The above implementation manners are only the preferred implementation manners of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention belong to the protection scope required by the present invention.

Claims

1. A vocoder chip capable of preventing static electricity, comprising a chip unit (7), characterized in that: The outer side of the chip unit (7) is fixedly connected to a mounting frame (8), the four sides of the mounting frame (8) are connected to connecting pieces (2), the lower side of the chip unit (7) is provided with a chip mounting mechanism for mounting the chip unit (7), and the upper side of the chip unit (7) is provided with a chip protection mechanism for protecting the chip unit (7).

2. The anti-static vocoder chip according to claim 1, characterized in that: The chip mounting mechanism comprises a PCB docking plate (1) which is fixedly connected to the lower sides of the four connecting members (2), and the lower side of the chip unit (7) is connected to the PCB docking plate (1).

3. The anti-static vocoder chip according to claim 2, characterized in that: The chip protection mechanism comprises an upper cover plate (4) fixedly connected to the upper sides of the four connecting members (2); a heat sink (5) is fixedly connected to the upper side of the upper cover plate (4); the upper cover plate (4) and the heat sink (5) are used to protect the chip unit (7) from interference by an electrostatic magnetic field; a heat sink mechanism for reducing temperature by increasing the heat dissipation area is provided on the heat sink (5); and a fixing mechanism for fixing the upper cover plate (4) and the PCB docking plate (1) is provided between the upper cover plate (4) and the PCB docking plate (1).

4. The anti-static vocoder chip according to claim 3, characterized in that: The heat dissipation slot mechanism comprises a plurality of ventilation slots (6) opened on the lower side of the heat dissipation platform (5), wherein the plurality of ventilation slots (6) are distributed in a linear array, and the plurality of ventilation slots (6) are connected to both sides of the heat dissipation platform (5) to facilitate heat dissipation to the outside through the ventilation slots (6).

5. The anti-static vocoder chip according to claim 3, characterized in that: The connecting member (2) comprises a plurality of lower fixing plates (9) fixedly connected to the lower side of the PCB docking plate (1), and a plurality of upper fixing plates (10) fixedly connected to the lower side of the upper cover plate (4), each of the upper fixing plates (10) being arranged in pairs with each of the lower fixing plates (9), and a metal wire rope (11) being spirally inserted between each pair of the upper fixing plates (10) and the lower fixing plates (9), and the metal wire rope (11) on each side is connected to the installation frame (8) on the same side.

6. The anti-static vocoder chip according to claim 3, characterized in that: The fixing mechanism comprises four card seats (3) arranged between the upper cover plate (4) and the PCB docking plate (1), and the four card seats (3) are respectively located at four corresponding corners of the upper cover plate (4) and the PCB docking plate (1).

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