Heat dissipation structure of printed circuit board

Abstract

The utility model relates to a heat dissipation structure of a printed circuit board, which comprises a printed circuit board main body, the printed circuit board main body comprises a component arrangement area and a heat dissipation area, and the heat dissipation area is an area except the component arrangement area; the heat dissipation area comprises a plurality of rows of heat dissipation units, each row of heat dissipation units comprises a plurality of heat dissipation mechanisms, the heat dissipation mechanisms are arranged at intervals, and each heat dissipation mechanism penetrates through the printed circuit board body in the thickness direction of the printed circuit board body. According to the printed circuit board, the heat dissipation efficiency is improved, air circulation in the printed circuit board can be ensured, more heat generated by components in the printed circuit board in the working process can be discharged, the good heat dissipation performance of the printed circuit board can be achieved, and the working stability of the printed circuit board is improved.

Description

Technical Field

[0001] This application relates to the technical field of circuit boards, and particularly to a heat dissipation structure for a printed circuit board. Background Art

[0002] A printed circuit board, also known as a PCB (Printed Circuit Board), is an important carrier for the physical support and signal transmission of electronic components. Among them, electronic components generate heat during operation, and the generated heat is transferred to the PCB board. However, the existing PCB main boards often have poor heat dissipation. Therefore, under the premise of long-term operation of electronic components, the temperature of the PCB main board will be too high, which will reduce the working stability of the PCB main board. Utility Model Content

[0003] In order to solve the problems of the prior art, this application provides a technical solution for a heat dissipation structure of a printed circuit board. That is, this application sets multiple heat dissipation mechanisms in the heat dissipation area of the printed circuit board main body, and the heat dissipation mechanisms penetrate the printed circuit board main body along the thickness direction of the printed circuit board main body. In this way, while using multiple heat dissipation mechanisms to increase the surface area of the printed circuit board and improve the heat dissipation efficiency, the multiple heat dissipation mechanisms that penetrate the printed circuit board main body along the thickness direction of the printed circuit board main body can ensure the air circulation in the printed circuit board, and further discharge more heat generated by the components in the printed circuit board during operation. Thus, good heat dissipation performance of the printed circuit board can be achieved to improve the working stability of the printed circuit board.

[0004] This application provides a heat dissipation structure for a printed circuit board. The heat dissipation structure of the printed circuit board includes a printed circuit board main body. The printed circuit board main body includes a component layout area and a heat dissipation area, and the heat dissipation area is the area other than the component layout area;

[0005] The heat dissipation area includes multiple rows of heat dissipation units. A single row of heat dissipation units includes multiple heat dissipation mechanisms. The multiple heat dissipation mechanisms are arranged at intervals, and each heat dissipation mechanism penetrates the printed circuit board main body along the thickness direction of the printed circuit board main body.

[0006] Further, the heat dissipation mechanism includes a heat dissipation through hole;

[0007] The heat dissipation through hole penetrates the printed circuit board main body along the thickness direction of the printed circuit board main body.

[0008] Further, the heat dissipation mechanism includes a heat dissipation through hole and a heat conducting member;

[0009] The heat conducting member is in a sheet structure, and the heat conducting member in the sheet structure is attached to the inner wall of the heat dissipation through hole. The heat dissipation through hole attached with the heat conducting member penetrates through the printed circuit board main body along the thickness direction of the printed circuit board main body.

[0010] Further, the through hole diameters corresponding to the plurality of heat dissipation through holes are completely the same, partially the same, or completely different.

[0011] Further, components are provided in the component arrangement area, and the through hole diameter corresponding to the heat dissipation through hole in the heat dissipation mechanism gradually decreases along the direction away from the components.

[0012] Further, the plurality of heat dissipation mechanisms in the single-row heat dissipation unit are arranged in sequence along the length direction of the printed circuit board main body, and the distance between the plurality of heat dissipation mechanisms in the single-row heat dissipation unit is equal or gradually decreases along the direction away from the components in the component arrangement area.

[0013] Further, the cross-sectional shape of the heat dissipation mechanism along the length direction of the printed circuit board main body is circular, quadrilateral, or triangular.

[0014] Further, the heat conducting member completely covers the inner wall of the heat dissipation through hole.

[0015] Further, the material of the heat conducting member is metal.

[0016] Further, the material of the heat conducting member is copper, aluminum, or iron.

[0017] Implementing the present application has the following beneficial effects:

[0018] In the present application, by providing a plurality of heat dissipation mechanisms in the heat dissipation area of the printed circuit board main body and making the heat dissipation mechanisms penetrate through the printed circuit board main body along the thickness direction of the printed circuit board main body, while increasing the surface area of the printed circuit board and improving the heat dissipation efficiency by using the plurality of heat dissipation mechanisms, it is also possible to ensure the air circulation in the printed circuit board through the plurality of heat dissipation mechanisms penetrating through the printed circuit board main body along the thickness direction of the printed circuit board main body, thereby discharging more heat generated by the components in the printed circuit board during operation, and thus achieving good heat dissipation performance of the printed circuit board to improve the working stability of the printed circuit board. Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and those of ordinary skill in the art can also obtain other drawings without creative efforts based on these drawings.

[0020] Figure 1 A top - view structural schematic diagram of a heat dissipation structure for a printed circuit board provided by an embodiment of the present application;

[0021] Figure 2 Another top - view structural schematic diagram of a heat dissipation structure for a printed circuit board provided by an embodiment of the present application;

[0022] Figure 3 A three - dimensional structural schematic diagram of a heat dissipation mechanism provided by an embodiment of the present application;

[0023] Among them, the corresponding reference numerals in the figure are: 1 - printed circuit board main body; 2 - heat dissipation mechanism; 21 - heat dissipation through - hole; 22 - heat conducting member; 3 - component. Detailed implementation manners

[0024] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present application.

[0025] It should be noted that in the present application, unless otherwise clearly defined and limited, terms such as "installation", "connection", "connection", "fixation" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or communication with each other; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0026] Hereinafter, the embodiments will be described with reference to the drawings, and the drawings do not limit the disclosed content recorded in the claims in any way.

[0027] Please refer to Figures 1 to 3 , and the following will Figures 1 to 3 describe in detail a heat dissipation structure for a printed circuit board provided by an embodiment of the present application.

[0028] The embodiment of the present application provides a heat dissipation structure for a printed circuit board, as Figures 1 to 3As shown, specifically, the printed circuit board heat dissipation structure includes a printed circuit board main body 1. Among them, the printed circuit board main body 1 includes a component layout area and a heat dissipation area, and the heat dissipation area is the area other than the component layout area; the heat dissipation area includes multiple rows of heat dissipation units, and a single row of heat dissipation units includes multiple heat dissipation mechanisms 2. There is a gap between the multiple heat dissipation mechanisms 2, and each heat dissipation mechanism 2 penetrates the printed circuit board main body 1 along the thickness direction of the printed circuit board main body 1.

[0029] In the embodiment of the present application, by arranging multiple heat dissipation mechanisms 2 in the heat dissipation area of the printed circuit board main body 1 and penetrating the heat dissipation mechanisms 2 along the thickness direction of the printed circuit board main body 1, so as to utilize the multiple heat dissipation mechanisms 2 to increase the surface area of the printed circuit board and improve the heat dissipation efficiency. At the same time, through the multiple heat dissipation mechanisms 2 penetrating the printed circuit board main body 1 along the thickness direction of the printed circuit board main body 1, the air circulation in the printed circuit board can be ensured, and further, more heat generated by the components in the printed circuit board during operation can be discharged, so that good heat dissipation performance of the printed circuit board can be achieved, and the working stability of the printed circuit board can be improved.

[0030] In a specific embodiment, as Figure 2 and Figure 3 shown, the heat dissipation area includes multiple rows of heat dissipation units, and each row of heat dissipation units includes multiple heat dissipation mechanisms 2. Among them, the sizes of the multiple heat dissipation mechanisms 2 included in each row of heat dissipation units can be the same to ensure uniform heat dissipation of the printed circuit board. In another embodiment, the sizes of the multiple heat dissipation mechanisms 2 included in each row of heat dissipation units can also be different. Specifically, the size of the heat dissipation mechanism 2 close to the component 3 is large, and the size of the heat dissipation mechanism 2 far from the component 3 is small, so as to enhance the heat dissipation effect around the component 3, and thus the overall heat dissipation performance of the printed circuit board can be improved on the premise of ensuring the stability of the printed circuit board.

[0031] In actual applications, the component layout area is used to carry the component 3. That is to say, the component 3 can be arranged in the component layout area, as Figure 1 and Figure 2 shown, the number of component layout areas is multiple, and the number of components 3 is also multiple. Among them, one component 3 is arranged in each component layout area. It should be noted that multiple components 3 can also be arranged in each component layout area (not shown in the figure). Specifically, 2 components 3, 3 components 3 or 4 components 3 etc. can be arranged in each component layout area. Therefore, the number of components 3 arranged in each component layout area is not specifically limited.

[0032] In some embodiments, the heat dissipation area is the area other than the component layout area, as Figure 1 and Figure 2As shown in the figure, the heat dissipation area is the area other than the area where the components 3 are arranged. That is to say, the area where the heat dissipation mechanism 2 is located is the heat dissipation area. Further, the printed circuit board main body 1 also includes a wiring area. Therefore, the heat dissipation area is the area other than the component arrangement area and the wiring area. That is, in the printed circuit board main body 1, the idle area except for the area where the components 3 are arranged and the area where the traces are arranged is the heat dissipation area. Furthermore, by arranging a plurality of heat dissipation mechanisms 2 in the heat dissipation area, while ensuring the normal operation of the components 3 and the traces, the heat dissipation efficiency of the printed circuit board can be improved, so as to improve the working stability of the printed circuit board.

[0033] In an alternative embodiment, the heat dissipation mechanism 2 includes heat dissipation through holes 21, wherein the heat dissipation through holes 21 penetrate the printed circuit board main body 1 along the thickness direction of the printed circuit board main body 1.

[0034] Specifically, by providing a plurality of heat dissipation through holes 21 that penetrate the printed circuit board main body 1 along the thickness direction of the printed circuit board main body 1, while increasing the surface area of the printed circuit board and improving the heat dissipation efficiency, the air circulation in the printed circuit board can be ensured. Furthermore, more heat generated by the components in the printed circuit board during operation can be discharged, so as to achieve good heat dissipation performance of the printed circuit board and improve the working stability of the printed circuit board.

[0035] In actual applications, since the heat dissipation through holes 21 penetrate the printed circuit board main body 1 along the thickness direction of the printed circuit board main body 1, the surface area of the printed circuit board is increased, and thus the heat dissipation performance of the printed circuit board can be improved. At the same time, the heat dissipation through holes 21 can enable the air circulation in the printed circuit board, and further, more heat generated by the components in the printed circuit board during operation can be discharged, so that the printed circuit board has good heat dissipation performance.

[0036] In another alternative embodiment, as Figures 1 to 3 shown, the heat dissipation mechanism 2 includes heat dissipation through holes 21 and heat conducting members 22; wherein, the heat conducting members 22 are in a sheet structure, and the heat conducting members 22 in the sheet structure are attached to the inner walls of the heat dissipation through holes 21, and the heat dissipation through holes 21 attached with the heat conducting members 22 penetrate the printed circuit board main body 1 along the thickness direction of the printed circuit board main body 1.

[0037] In the embodiments of the present application, by attaching the heat conducting members 22 in the sheet structure to the inner walls of the heat dissipation through holes 21, so as to utilize a plurality of heat dissipation through holes 21 attached with the heat conducting members 22, while increasing the surface area of the printed circuit board and improving the heat dissipation efficiency, ensuring the air circulation, and further discharging more heat, so as to achieve good heat dissipation performance of the printed circuit board and improve the working stability of the printed circuit board.

[0038] Specifically, the heat-conducting member 22 can be a sheet-like structure with heat-conducting properties. Therefore, by fitting the sheet-like heat-conducting member 22 to the inner wall of the heat-dissipating through-hole 21, while increasing the surface area of the printed circuit board, the heat-dissipating effect can be further improved by utilizing the heat-conducting property of the heat-conducting member 22.

[0039] In some embodiments, the air flow direction in the printed circuit board can be referred to Figure 3 the arrow direction in

[0040] In an alternative embodiment, the through-hole diameters corresponding to the plurality of heat-dissipating through-holes 21 are all the same, partially the same, or all different.

[0041] In some embodiments, as Figure 1 shown, the through-hole diameters corresponding to the plurality of heat-dissipating through-holes 21 are all the same, thereby ensuring that the printed circuit board can achieve uniform heat dissipation.

[0042] In other embodiments, as Figure 2 shown, the through-hole diameters corresponding to the plurality of heat-dissipating through-holes 21 are partially the same. Specifically, the through-hole diameters corresponding to the plurality of heat-dissipating through-holes 21 gradually decrease in the direction away from the component 3, thereby dissipating more heat generated by the component 3 to avoid the occurrence of excessive local heat on the printed circuit board.

[0043] In other embodiments, the through-hole diameters corresponding to the plurality of heat-dissipating through-holes 21 are all different (not shown in the figure) to achieve different heat-dissipating effects for different heat-generating regions, thereby ensuring the overall heat-dissipating effect of the printed circuit board.

[0044] In an alternative embodiment, the heat-conducting member 22 completely covers the inner wall of the heat-dissipating through-hole 21.

[0045] Furthermore, by completely covering the inner wall of the heat-dissipating through-hole 21 with the heat-conducting member 22, the heat-dissipating effect of the printed circuit board can be maximally achieved.

[0046] In another alternative embodiment, the heat-conducting member 22 can also partially cover the inner wall of the heat-dissipating through-hole 21.

[0047] Furthermore, by partially covering the inner wall of the heat-dissipating through-hole 21 with the heat-conducting member 22, different degrees of heat-dissipating effects can be achieved.

[0048] In an alternative embodiment, the material of the heat-conducting member 22 is metal. In a specific embodiment, the material of the heat-conducting member 22 is copper, aluminum, or iron.

[0049] Preferably, the material of the heat conducting member 22 is copper. Then, the sheet-like copper is attached to the inner wall of the heat dissipation through hole 21 to achieve a good heat dissipation effect, and thus the stability of the printed circuit board can be ensured.

[0050] In an alternative embodiment, a component 3 is provided in the component layout area, and the through hole diameter corresponding to the heat dissipation through hole 21 in the heat dissipation mechanism 2 gradually decreases in a direction away from the component 3.

[0051] In the embodiment of the present application, by gradually decreasing the through hole diameter corresponding to the heat dissipation through hole 21 in the heat dissipation mechanism 2 in a direction away from the component 3, the heat dissipation effect around the component 3 can be improved, and thus the printed circuit board can further have good heat dissipation performance.

[0052] It should be noted that the component 3 generates heat during operation, and the generated heat is transferred to the printed circuit board. Then, by increasing the heat dissipation effect around the component 3, the overall heat dissipation capacity of the printed circuit board can be improved.

[0053] In an alternative embodiment, multiple heat dissipation mechanisms 2 in the single-row heat dissipation unit are arranged in sequence along the length direction of the printed circuit board main body 1, and the distance between the multiple heat dissipation mechanisms 2 in the single-row heat dissipation unit is equal or gradually decreases in a direction away from the component 3 in the component layout area.

[0054] In the embodiment of the present application, by making the distance between the multiple heat dissipation mechanisms 2 equal or gradually decrease in a direction away from the component 3 in the component layout area, the stability of the printed circuit board can be ensured.

[0055] In an alternative embodiment, the cross-sectional shape of the heat dissipation mechanism 2 along the length direction of the printed circuit board main body 1 is circular, quadrilateral or triangular.

[0056] Preferably, as Figures 1 to 3 shown, the cross-sectional shape of the heat dissipation mechanism 2 along the length direction of the printed circuit board main body 1 is circular.

[0057] The above embodiments of the present application have the following beneficial effects:

[0058] In the present application, by providing multiple heat dissipation mechanisms in the heat dissipation area of the printed circuit board main body and penetrating the printed circuit board main body along the thickness direction of the printed circuit board main body, while increasing the surface area of the printed circuit board and improving the heat dissipation efficiency by the multiple heat dissipation mechanisms, the air circulation in the printed circuit board can be ensured through the multiple heat dissipation mechanisms penetrating the printed circuit board main body along the thickness direction of the printed circuit board main body. Furthermore, more heat generated by the components in the printed circuit board during operation can be discharged, so that good heat dissipation performance of the printed circuit board can be achieved, and the stability of the printed circuit board during operation can be improved.

[0059] The structure shown in this embodiment is only a partial structure related to the solution of this application, and does not constitute a limitation on the device to which the solution of this application is applied. The specific device may include more or fewer components than those shown, or combine some components, or have a different arrangement of components. It should be understood that the methods, devices, etc. disclosed in this embodiment can be implemented in other ways.

[0060] The above is only a specific implementation manner of this application, but the protection scope of this application is not limited thereto. Any person skilled in the art within the technical scope disclosed in this application can easily think of changes or substitutions, which should all be covered within the protection scope of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

1. A heat dissipation structure of a printed circuit board, characterized in that: It comprises a printed circuit board body (1), the printed circuit board body (1) comprising a component arrangement area and a heat dissipation area, the heat dissipation area being an area other than the component arrangement area; The heat dissipation area comprises a plurality of rows of heat dissipation units, a single row of heat dissipation units comprises a plurality of heat dissipation mechanisms (2), the plurality of heat dissipation mechanisms (2) are arranged at intervals, and each of the heat dissipation mechanisms (2) penetrates the printed circuit board body (1) along the thickness direction of the printed circuit board body (1).

2. The heat dissipation structure of a printed circuit board according to claim 1, characterized in that: The heat dissipation mechanism (2) comprises a heat dissipation through hole (21); The heat dissipation through hole (21) penetrates the printed circuit board body (1) along the thickness direction of the printed circuit board body (1).

3. The heat dissipation structure of a printed circuit board according to claim 1, characterized in that: The heat dissipation mechanism (2) comprises a heat dissipation through hole (21) and a heat conducting member (22); The heat conducting member (22) is a sheet-like structure, the heat conducting member (22) having a sheet-like structure is fitted with the inner wall of the heat dissipation through hole (21), and the heat dissipation through hole (21) fitted with the heat conducting member (22) penetrates the printed circuit board body (1) along the thickness direction of the printed circuit board body (1).

4. The heat dissipation structure of a printed circuit board according to claim 2 or 3, characterized in that: The diameters of the through holes corresponding to the plurality of heat dissipation through holes (21) are completely the same, partially the same, or completely different.

5. The heat dissipation structure of a printed circuit board according to claim 1, characterized in that: Components (3) are arranged in the component arrangement area, and the diameter of the through holes corresponding to the heat dissipation through holes (21) in the heat dissipation mechanism (2) gradually decreases in a direction away from the components (3).

6. The heat dissipation structure of a printed circuit board according to claim 1, characterized in that: The plurality of heat dissipation mechanisms (2) in the single-row heat dissipation unit are arranged in sequence along the length direction of the printed circuit board body (1), and the spacing between the plurality of heat dissipation mechanisms (2) in the single-row heat dissipation unit is equal or gradually decreases in a direction away from the components (3) in the component arrangement area.

7. The heat dissipation structure of a printed circuit board according to claim 1, characterized in that: The cross-sectional shape of the heat dissipation mechanism (2) along the length direction of the printed circuit board body (1) is circular, quadrilateral or triangular.

8. The heat dissipation structure of a printed circuit board according to claim 3, characterized in that: The heat conducting member (22) completely covers the inner wall of the heat dissipating through hole (21).

9. The heat dissipation structure of a printed circuit board according to claim 3, characterized in that: The material of the heat conducting element (22) is metal.

10. The heat dissipation structure of a printed circuit board according to claim 9, characterized in that: The material of the heat conducting member (22) is copper, aluminum or iron.

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