Limiting structure for assembly of heat dissipation module
By setting up positioning columns and locking parts on the PCB module, and using the restricted positioning and locking connection of the elastic parts, the positioning problem in the automatic assembly of the heat dissipation module is solved, and efficient and precise assembly and fixation are achieved, avoiding the risks of high labor costs and increased weight.
Patent Information
- Application Number
- CN202422091198.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-27
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-08-27
AI Technical Summary
During the automatic assembly of the heat dissipation module, problems such as the heat dissipation module and the center of the screw hole are easily deviated, resulting in the screw being froze or unable to assemble. The existing positioning methods are at risk of high labor costs, low production efficiency or high cost and increasing weight.
A heat dissipation module assembly and positioning structure is designed, including PCB module, heat dissipation module and locking member. By setting positioning columns and locking members on the PCB module, the positioning and locking connection of the elastic parts are used to ensure the correct positioning and fixed assembly of the heat dissipation module.
The effective assembly of the heat dissipation module is achieved, ensuring the accuracy and efficiency of assembly, avoiding the problems of high labor costs and increased weight, and solving the short circuit risk caused by copper plate extension.
Smart Images
Figure CN223053336U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation module assembly, in particular to a positioning and limiting structure for heat dissipation module assembly. Background Technique
[0002] Factory automated assembly is an irresistible development trend of modern automated factories. Automated assembly not only liberates manpower but also greatly improves the production and assembly efficiency. However, currently, during the automated assembly of heat dissipation modules, phenomena such as heat dissipation module offset and offset of the center of the screw hole are likely to occur, resulting in problems such as screw head damage or inability to assemble. Therefore, the positioning and limiting of heat dissipation module assembly are still a major problem in factory automated assembly. In heat dissipation module assembly factories, the commonly used positioning methods for heat dissipation module assembly are manual pre-locking or making the BLOCK (block) larger to achieve positioning and limiting functions. However, the former positioning method has problems such as high labor costs and low production and assembly efficiency, and does not conform to factory automated assembly. For the latter positioning method, there are also problems of high costs. Moreover, the current development trend of electronic products is to pursue lighter weight, and making the BLOCK larger will result in a heavier weight. Moreover, when there are high components below the BLOCK that plays a limiting role, there is a risk of short circuit easily due to touching the components, posing quality hazards to the product.
[0003] Therefore, it is necessary to provide a positioning and limiting structure for heat dissipation module assembly that can effectively ensure the assembly of heat dissipation modules, without increasing the area of the module copper plate, and solving the short-circuit risk brought by the extension of the copper plate to increase the area. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a positioning and limiting structure for heat dissipation module assembly that can effectively ensure the assembly of heat dissipation modules, without increasing the area of the module copper plate, and solving the short-circuit risk brought by the extension of the copper plate to increase the area.
[0005] To achieve the above purpose, the utility model provides a positioning and limiting structure for heat dissipation module assembly, including a PCB module, a heat dissipation module, and a locking member. The PCB module is provided with positioning posts. The positioning posts include a first positioning portion and a second positioning portion formed by narrowing and extending from the upper end of the first positioning portion. The lower end of the first positioning portion is connected to the PCB module, and the second positioning portion is provided with a positioning hole. The heat dissipation module is arranged on the PCB module, and an elastic member is provided on the heat dissipation module. The elastic member is sleeved on the second positioning portion. The locking member includes a cap portion and a locking connection portion arranged in sequence from top to bottom. The lower end of the cap portion is provided with a limiting groove surrounding the locking connection portion. By inserting the locking connection portion into the positioning hole, the second positioning portion is inserted into the limiting groove, and the cap portion presses the elastic member.
[0006] Preferably, the second positioning portion and the first positioning portion are in a stepped structure.
[0007] Preferably, the second positioning portion and the first positioning portion are coaxially arranged.
[0008] Preferably, the locking connection portion is threadedly connected to the positioning hole.
[0009] Preferably, a limiting hole is provided on the elastic member, and the second positioning portion passes through the limiting hole.
[0010] Preferably, a skirt is convexly provided on the outer periphery of the lower end of the cap portion. During the process of inserting the locking connection portion into the positioning hole, the skirt presses the elastic member.
[0011] Preferably, the depth of the limiting groove in the vertical direction is equal to the downward pressing stroke of the elastic member.
[0012] Preferably, the PCB module includes a PCB body and a connecting member. The PCB body is provided with a through mounting hole. The connecting member is connected to the bottom surface of the PCB body. The lower end of the first positioning portion is connected to the connecting member, and the first positioning portion passes through the mounting hole.
[0013] Preferably, the lower end of the positioning hole passes downward through the first positioning portion and penetrates to the connecting member.
[0014] Preferably, a CPU component is provided on the top surface of the PCB body, and the heat dissipation module is attached to the CPU component.
[0015] Compared with the prior art, the heat dissipation module assembly limiting and positioning structure of the present invention sets a positioning post on the PCB module. The positioning post includes a first positioning portion and a second positioning portion formed by narrowing and extending from the upper end of the first positioning portion, so that the elastic member on the heat dissipation module can be sleeved on the second positioning portion, thereby limiting and positioning the elastic member on the heat dissipation module, ensuring that the connection between the elastic member on the heat dissipation module and the positioning post is not eccentric, guaranteeing the effective assembly of the heat dissipation module. At the same time, the present invention also sets a locking member. The locking member includes a cap portion and a locking connection portion. By inserting the locking connection portion into the positioning hole, the second positioning portion is inserted into the limiting groove of the cap portion, and the cap portion presses the elastic member downward, causing the elastic member to undergo elastic deformation and providing a downward force to the heat dissipation module, so that the heat dissipation module is closely attached to the PCB module and realizes the fixed assembly of the heat dissipation module. The assembly positioning method is simple and convenient, without increasing the area of the module copper plate, and solves the short-circuit risk brought by the increased area of the copper plate extension. Description of the Drawings
[0016] Figure 1It is a three-dimensional structure diagram of the assembly limit positioning structure of the heat dissipation module of the present utility model.
[0017] Figure 2 It is a front view of the assembly limit positioning structure of the heat dissipation module of the present utility model.
[0018] Figure 3 It is Figure 2 A cross-sectional view of the assembly limit positioning structure of the heat dissipation module shown.
[0019] Figure 4 It is Figure 3 An enlarged view of part A in
[0020] Figure 5 It is a structure diagram of the assembly limit positioning structure of the heat dissipation module of the present utility model when the locking member is not connected. Specific embodiments
[0021] In order to elaborate in detail the technical content and structural features of the present utility model, the following further description is made in conjunction with the embodiments and with reference to the drawings.
[0022] Please refer to Figures 1 to 5 , the assembly limit positioning structure 100 of the heat dissipation module of the present utility model includes a PCB module 1, a heat dissipation module 2 and a locking member 3. The PCB module 1 is provided with a positioning post 11. The positioning post 11 includes a first positioning portion 111 and a second positioning portion 112 formed by narrowing and extending from the upper end of the first positioning portion 111. The lower end of the first positioning portion 111 is connected to the PCB module 1, and the second positioning portion 112 is provided with a positioning hole 113. The heat dissipation module 2 is arranged on the PCB module 1, and an elastic member 21 is provided on the heat dissipation module 2. The elastic member 21 is sleeved on the second positioning portion 112. The locking member 3 includes a cap portion 31 and a locking connection portion 32 arranged in sequence from top to bottom. The lower end of the cap portion 31 is provided with a limiting groove 311 surrounding the locking connection portion 32. By inserting the locking connection portion 32 into the positioning hole 113, the second positioning portion 112 is inserted into the limiting groove 311, and the cap portion 31 presses the elastic member 21.
[0023] In the present utility model, the elastic member 21 on the heat dissipation module 2 is sleeved on the second positioning portion 112 of the positioning post 11, so as to limit the positioning of the elastic member 21 on the heat dissipation module 2, ensure that the connection between the elastic member 21 on the heat dissipation module 2 and the positioning post 11 is not eccentric, and ensure the effective assembly of the heat dissipation module 2. At the same time, the present utility model also sets the locking member 3. By inserting the locking connection portion 32 of the locking member 3 into the positioning hole 113, the second positioning portion 112 is inserted into the limiting groove 311 of the cap portion 31, and the cap portion 31 presses the elastic member 21 downward, so that the elastic member 21 undergoes elastic deformation and provides a downward force to the heat dissipation module 2, thereby making the heat dissipation module 2 closely fit with the PCB module 1.
[0024] Please refer to Figures 1 to 5 , in one embodiment, the number of the positioning posts 11 and the locking members 3 is both two. The two positioning posts 11 are spaced apart on the PCB module 1, and the two positioning posts 11 respectively pass through both ends of the elastic member 21. Before the locking connection portion 32 of the locking member 3 is inserted into the positioning hole 113, both ends of the elastic member 21 are not deformed, and both ends of the elastic member 21 are in a horizontal state relative to the middle portion; when the locking connection portion 32 of the locking member 3 is inserted into the positioning hole 113, the cap portions 31 of the locking members 3 on the left and right sides respectively press down both ends of the elastic member 21, so that both ends of the elastic member 21 are stressed and bent downward relative to the middle portion, and the elastic member 21 will conduct the force to the heat dissipation module 2 connected to the middle portion thereof, thereby providing a downward force to the heat dissipation module 2, and further enabling the heat dissipation module 2 to be closely attached to the PCB module 1. However, the number of the positioning posts 11 and the locking members 3 is not limited thereto.
[0025] Please refer to Figure 4 and Figure 5 , in one embodiment, the second positioning portion 112 and the first positioning portion 111 form a stepped structure. However, it is not limited thereto. For example, the second positioning portion 112 may also be a frustum structure with a gradually decreasing diameter relative to the first positioning portion 111. Further, the second positioning portion 112 and the first positioning portion 111 are coaxially arranged.
[0026] Please refer to Figure 4 , in one embodiment, the locking connection portion 32 is threadedly connected to the positioning hole 113. However, it is not limited thereto. For example, the locking connection portion 32 and the positioning hole 113 may also be connected in a snap-fit manner.
[0027] Please refer to Figure 2 and Figure 4 , in one embodiment, a limiting hole 211 is provided on the elastic member 21, and the second positioning portion 112 passes through the limiting hole 211.
[0028] Please refer to Figure 4 and Figure 5 , in one embodiment, a skirt 312 is convexly provided on the outer periphery of the lower end of the cap portion 31. During the process of inserting the locking connection portion 32 into the positioning hole 113, the skirt 312 presses the elastic member 21, so that the elastic member 21 undergoes elastic deformation and provides a downward force to the heat dissipation module 2, thereby enabling the heat dissipation module 2 to be closely attached to the PCB module 1.
[0029] Please refer to Figure 4 and Figure 5, in an embodiment, the depth of the limiting groove 311 in the up-and-down direction is equal to the downward pressing stroke of the elastic member 21. When the second positioning portion 112 of the positioning post 11 starts to be inserted into the limiting groove 311 of the locking member 3, the skirt 312 on the cap portion 31 of the locking member 3 starts to squeeze the elastic member 21 downward, so that the heat dissipation module 2 is closely attached to the PCB module 1. When the second positioning portion 112 is inserted to the deepest position of the limiting groove 311 and abuts against the cap portion 31 of the locking member 3, the skirt 312 on the cap portion 31 squeezes the elastic member 21 to the lowest position downward. Therefore, the depth of the limiting groove 311 in the up-and-down direction is equal to the downward pressing stroke of the elastic member 21. When it is necessary to adjust the pressure between the heat dissipation module 2 and the PCB module 1, within the range not exceeding the limit of the second positioning portion 112 of the positioning post 11, only the locking member 3 with different depths of the limiting groove 311 needs to be replaced. Among them, the greater the downward pressing stroke, the greater the contact pressure between the heat dissipation module 2 and the PCB module 1, and vice versa.
[0030] Please refer to Figure 2 and Figure 3 , in an embodiment, the PCB module 1 includes a PCB body 12 and a connecting member 13. The PCB body 12 is provided with a through mounting hole. The connecting member 13 is connected to the bottom surface of the PCB body 12. The lower end of the first positioning portion 111 is connected to the connecting member 13, and the first positioning portion 111 passes through the mounting hole. Specifically, the PCB body 12 is provided with a plurality of mounting holes. The number of the positioning posts 11 is the same as and corresponds to the number of the mounting holes one by one. The limiting holes 211 of the elastic members 21 are respectively sleeved on the second positioning portions 112 of the positioning posts 11. More specifically, please refer to Figure 3 and Figure 4 , in an embodiment, the lower end of the positioning hole 113 passes through the first positioning portion 111 downward and penetrates to the connecting member 13. However, this is not limited thereto. For example, the positioning hole 113 may also be only opened on the second positioning portion 112 of the positioning post 11.
[0031] Please continue to refer to Figure 2 and Figure 3 , further, a CPU component 121 is provided on the top surface of the PCB body 12. The heat dissipation module 2 is attached to the CPU component 121. When the locking connection portion 32 of the locking member 3 is inserted into the positioning hole 113, the second positioning portion 112 is inserted into the limiting groove 311 of the cap portion 31, and the cap portion 31 squeezes the elastic member 21 downward, so that the elastic member 21 undergoes elastic deformation and provides a downward force to the heat dissipation module 2, thereby making the heat dissipation module 2 closely attached to the CPU component 121 of the PCB module 1.
[0032] Combined with Figures 1 to 5 , the specific working principle of the heat dissipation module assembly limiting structure 100 of the present utility model is as follows:
[0033] During assembly, the heat dissipation module 2 is first placed above the PCB module 1. The elastic member 21 on the PCB module 1 is sleeved on the second positioning portion 112 of the positioning post 11 through the limiting hole 211, thereby realizing the positioning function of the heat dissipation module 2. The locking member 3 is locked in the positioning hole 113 of the positioning post 11. During the locking process, the locking connection portion 32 of the locking member 3 is inserted into the positioning hole 113, so that the second positioning portion 112 is inserted into the limiting groove 311 of the cap portion 31, and the cap portion 31 presses the elastic member 21 downward, causing the elastic member 21 to undergo elastic deformation and providing a downward force to the heat dissipation module 2, so that the heat dissipation module 2 is closely attached to the CPU component 121 of the PCB module 1, and the fixed assembly of the heat dissipation module 2 is realized.
[0034] In summary, the positioning structure 100 for assembling the heat dissipation module of the present utility model is provided with a positioning post 11 on the PCB module 1. The positioning post 11 includes a first positioning portion 111 and a second positioning portion 112 formed by narrowing and extending from the upper end of the first positioning portion 111, so that the elastic member 21 on the heat dissipation module 2 can be sleeved on the second positioning portion 112, thereby positioning the elastic member 21 on the heat dissipation module 2, ensuring that the connection between the elastic member 21 on the heat dissipation module 2 and the positioning post 11 is not eccentric, guaranteeing the effective assembly of the heat dissipation module 2. At the same time, the present utility model also provides a locking member 3. The locking member 3 includes a cap portion 31 and a locking connection portion 32. By inserting the locking connection portion 32 into the positioning hole 113, the second positioning portion 112 is inserted into the limiting groove 311 of the cap portion 31, and the cap portion 31 presses the elastic member 21 downward, causing the elastic member 21 to undergo elastic deformation and providing a downward force to the heat dissipation module 2, so that the heat dissipation module 2 is closely attached to the PCB module 1, and the fixed assembly of the heat dissipation module 2 is realized. The assembly positioning method is simple and convenient, without increasing the area of the module copper plate, solving the short-circuit risk brought by the increased area of the copper plate extension, and having a wider application scenario. Secondly, by adopting the positioning structure 100 for assembling the heat dissipation module of the present utility model, there is no need for manual pre-locking or increasing the BLOCK to make positioning and limiting features as in the prior art, reducing the cost of the heat dissipation module 2. There is no need to extend the BLOCK to make positioning and limiting features as in the prior art, and the heat dissipation module 2 can be made lighter. Moreover, the positioning structure 100 for assembling the heat dissipation module of the present utility model meets the positioning accuracy requirements for automated assembly, and can improve the assembly efficiency; when it is necessary to adjust the stroke of the elastic member 21 of the heat dissipation module 2, it can be achieved by replacing the locking member 3 with different limiting heights and depths, reducing the mold repair cost.
[0035] The above-disclosed are only the preferred examples of the present utility model, and the scope of rights of the present utility model cannot be limited thereby. Therefore, equivalent changes made according to the claims of the present utility model all fall within the scope covered by the present utility model.
Claims
1. A heat dissipation module assembly limiting structure, characterized in that: include: A PCB module, wherein a positioning column is provided on the PCB module, wherein the positioning column comprises a first positioning portion and a second positioning portion extending from an upper end of the first positioning portion by narrowing, wherein a lower end of the first positioning portion is connected to the PCB module, and a positioning hole is provided on the second positioning portion; A heat dissipation module, which is arranged on the PCB module and is provided with an elastic member, and the elastic member is sleeved on the second positioning portion; The locking piece comprises a cap body portion and a locking connection portion which are sequentially arranged from top to bottom, and a limiting groove arranged around the locking connection portion is provided at the lower end of the cap body portion; the locking connection portion is inserted into the positioning hole so that the second positioning portion is inserted into the limiting groove, and the cap body portion squeezes the elastic piece.
2. The heat dissipation module assembly limiting structure according to claim 1, characterized in that: The second positioning portion and the first positioning portion are in a step structure.
3. The heat dissipation module assembly limiting structure according to claim 1, characterized in that: The second positioning portion is coaxially arranged with the first positioning portion.
4. The heat dissipation module assembly limiting structure according to claim 1, characterized in that: The locking connection portion is threadedly connected to the positioning hole.
5. The heat dissipation module assembly limiting structure according to claim 1, characterized in that: The elastic member is provided with a limiting hole, and the second positioning portion is penetrated in the limiting hole.
6. The heat dissipation module assembly limiting structure according to claim 1, characterized in that: A skirt is convexly provided on the outer periphery of the lower end of the cap body, and during the process of inserting the locking connection portion into the positioning hole, the skirt presses the elastic member.
7. The heat dissipation module assembly limiting structure according to claim 1, characterized in that: The depth of the limiting groove in the up-down direction is equal to the downward pressing stroke of the elastic member.
8. The heat dissipation module assembly limiting structure according to claim 1, characterized in that: The PCB module includes a PCB body and a connecting piece. The PCB body is provided with a through mounting hole. The connecting piece is connected to the bottom surface of the PCB body. The lower end of the first positioning portion is connected to the connecting piece, and the first positioning portion is passed through the mounting hole.
9. The heat dissipation module assembly limiting structure according to claim 8, characterized in that: The lower end of the positioning hole passes downward through the first positioning portion and penetrates the connecting member.
10. The heat dissipation module assembly limiting structure according to claim 8, characterized in that: A CPU component is arranged on the top surface of the PCB body, and the heat dissipation module is attached to the CPU component.