LED lamp bead structure

Abstract

The utility model discloses an LED lamp bead structure, which comprises a substrate and a die bonding part arranged on the substrate, the die bonding part comprises a plurality of die bonding sub-parts arranged in sequence, the die bonding sub-parts are respectively used for bearing LED chips with different light emitting colors, and the substrate is provided with a through hole; wherein the die bonding sub-part comprises two bonding pads located on one side of the substrate and two corresponding pins located on the other side of the substrate and extending out through the through holes, the pins are in conductive connection with electroplating leads, specifically, the front die bonding area and the back pin area are connected through the through holes, the electroplating leads of a front circuit are omitted, and under the same flip chip size, the front die bonding area and the back pin area are connected through the through holes. Compared with the prior art, the lamp bead can be designed to be smaller in size, more lamp beads can be placed on the same unit area, the definition is improved, meanwhile, electroplated leads are placed at the pins and finally removed through the cutting technology, the overall ink color of the lamp bead is improved, the air tightness of the lamp bead is improved, the display consistency effect is good, in addition, a plurality of pins are designed on the back, and the anti-collision capacity of the lamp bead is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED, in particular to an LED lamp bead structure. Background Art

[0002] With the continuous progress of technology and the advent of the digital age, as an advanced display technology, the LED display screen leads the innovation trend in the display field with its unique charm and excellent performance. It not only shows extensive application value in the fields of indoor and outdoor advertising, information release, stage performance, etc., but also shows great development potential in emerging fields such as smart cities, intelligent transportation, and virtual reality.

[0003] An LED display screen is a display screen that controls the display mode of semiconductor light-emitting diodes to display various information such as text, graphics, images, animations, market conditions, videos, and video signals. It integrates microelectronics technology, computer technology, and information processing, and has the advantages of bright colors, wide dynamic range, high brightness, high definition, low working voltage, low power consumption, long life, impact resistance, and stable and reliable operation. Therefore, the key component LED lamp of the LED display screen becomes more important, and the requirements for LED lamp beads are also getting higher and higher. Especially in terms of the size of the LED lamp beads, the performance of the lamp beads, the light-emitting angle, the anti-collision ability, and the brightness requirements are higher. It is precisely because of these requirements that optimization and improvement are needed in all aspects of the LED lamp beads.

[0004] At present, the lamp bead structure of the display CHIP MIP LED uses a flat BT substrate as a bracket. The substrate is divided into a front circuit, a back circuit, and a base material. The front circuit is used to bond the light-emitting chip and achieve electrical interconnection. The back circuit is used to weld with the PCB of the LED display module. The front and back circuits are connected and conducted. It should be noted that there are many electroplated leads for conducting the chip in the front and back circuits. Due to the existence of the electroplated leads, the size of the lamp beads cannot be reduced, and because the electroplated material of the electroplated leads is gold, the whole lamp bead is yellowish, affecting the overall ink color of the lamp bead. Water vapor is also easy to penetrate along the electroplated leads, affecting the airtightness of the lamp bead, and also affecting the heat dissipation of the lamp bead. In addition, four pins are arranged on the back of the lamp bead. Since the size of the lamp bead itself is not very large, the anti-collision ability of the lamp bead with four pins is poor, and it is easy to cause lamp collision during the later installation of the display screen, affecting the display effect. Summary of the Utility Model

[0005] Based on this, the purpose of the present utility model is to provide an LED lamp bead structure, aiming to improve the airtightness, anti-collision ability, and ink color consistency of the LED lamp beads.

[0006] To achieve the above object, the present utility model provides the following technical solution: An LED lamp bead structure, comprising a substrate and a die bonding portion provided on the substrate, the die bonding portion including a plurality of die bonding sub-portions arranged in sequence, each of the die bonding sub-portions being respectively used for carrying LED chips of different emitting colors, and the substrate being provided with through holes;

[0007] Wherein, the die bonding sub-portion includes two bonding pads located on one side of the substrate, and two corresponding leads extending out through the through holes on the other side of the substrate, the leads being electrically connected to the electroplating leads, the anode of the LED chip being electrically connected to one of the bonding pads in the die bonding sub-portion, and the cathode of the LED chip being electrically connected to the other bonding pad in the corresponding die bonding sub-portion.

[0008] By adopting the above technical solution, including a substrate and a die bonding portion provided on the substrate, the die bonding portion includes a plurality of die bonding sub-portions arranged in sequence, each die bonding sub-portion being respectively used for carrying LED chips of different emitting colors, the substrate is provided with through holes; wherein, the die bonding sub-portion includes two bonding pads located on one side of the substrate, and two corresponding leads extending out through the through holes on the other side of the substrate, the leads being electrically connected to the electroplating leads, the anode of the LED chip being electrically connected to one of the bonding pads in the die bonding sub-portion, and the cathode of the LED chip being electrically connected to the other bonding pad in the corresponding die bonding sub-portion. Specifically, the lamp bead structure is optimized, the front die bonding area and the back lead area are connected through through holes, the front circuit electroplating leads are cancelled, and the electroplating leads are placed at the connection place of the back leads. Under the same flip chip size, it can be designed into a smaller size lamp bead, and more lamp beads can be placed in the same unit area, improving the clarity. At the same time, the electroplating leads are placed at the leads, and finally removed through the cutting process, improving the overall ink color of the lamp bead and the airtightness of the lamp bead, with a good display effect. In addition, multiple leads are designed on the back leads to improve the anti-collision ability of the lamp bead.

[0009] Further, the die bonding portion is located in the middle area of the substrate.

[0010] Further, the anode and cathode of the LED chip are electrically connected to the corresponding bonding pads through solder paste.

[0011] Further, the number of both the bonding pads and the leads is six.

[0012] Further, the side of the substrate with the LED chip is coated with encapsulating glue.

[0013] Further, the area of each lead region is larger than the area of the corresponding electroplating lead region.

[0014] Further, the shape of the lead is rectangular.

[0015] Further, a notch is provided at one end of any of the pins away from the electroplating lead for serving as a marking point.

[0016] Further, the material of the substrate is a BT resin substrate material. Description of the Drawings

[0017] Figure 1 is a top view schematic diagram of the LED lamp bead structure of the present utility model;

[0018] Figure 2 is a top view schematic diagram of the LED lamp bead structure with an LED chip of the present utility model;

[0019] Figure 3 is a bottom view schematic diagram of the LED lamp bead structure of the present utility model;

[0020] Figure 4 is a side view schematic diagram of the LED lamp bead structure with an LED chip of the present utility model;

[0021] Figure 5 is a schematic diagram of cutting the electroplating lead.

[0022] In the figure: 1. Substrate; 2. Pad; 3. Through hole; 4. Pin; 5. LED chip; 6. Encapsulating glue; 7. Electroplating lead; 8. Notch. Detailed Embodiments

[0023] To facilitate the understanding of the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present utility model are given in the drawings. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present utility model more thorough and comprehensive.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be a middle element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present utility model belongs. The terms used in the description of the present utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0026] The embodiments of the present utility model will be described below according to its overall structure.

[0027] An LED lamp bead structure, as Figures 1 to 5 shown, includes a substrate 1 and a die bonding part disposed on the substrate 1. The material of the substrate 1 is a BT resin substrate material. In the embodiments of the present invention, the die bonding part is located in the middle area of the substrate 1. The die bonding part includes a plurality of die bonding sub-parts arranged in sequence. Each die bonding sub-part is respectively used to carry LED chips 5 of different emission colors. The substrate 1 is provided with through holes 3;

[0028] Wherein, the die bonding sub-part includes two pads 2 located on one side of the substrate 1, and two corresponding leads 4 extending from the pads 2 through the through holes 3 and located on the other side of the substrate 1. The leads 4 are electrically connected to the electroplated leads 7. The anode of the LED chip 5 is electrically connected to one of the pads 2 in the die bonding sub-part, and the cathode of the LED chip 5 is electrically connected to the other pad 2 in the corresponding die bonding sub-part. It should be noted that the two pads 2 in each die bonding sub-part have a certain distance between them on the premise of ensuring electrode alignment with the LED chip 5 to prevent short circuit of the solder paste connection between the cathode and the anode.

[0029] It should be noted that the area of each lead 4 is larger than the area of the corresponding electroplated lead 7. The shape of the lead 4 is rectangular, and a notch 8 is provided at one end of any lead 4 away from the electroplated lead 7 for use as a marking point.

[0030] In addition, the anode and cathode of the LED chip 5 are electrically connected to the corresponding pads 2 through solder paste.

[0031] In some preferred embodiments of the present invention, the number of both the pads 2 and the leads 4 is six. It can be understood that three LED chips 5 emitting different colors of light can be installed on one substrate 1. Exemplarily, a red light chip, a green light chip, and a blue light chip are installed on the substrate 1 from top to bottom in sequence.

[0032] In order to seal and protect the LED chip 5, the side of the substrate 1 having the LED chip 5 is coated with encapsulation glue 6.

[0033] It should be noted that in the actual production process, the LED lamp bead structure is not prepared separately, but is uniformly batch-prepared on an integral substrate. The adjacent LED lamp bead structures prepared on an integral substrate are connected by electroplated leads 7, and the electroplated leads 7 can also be removed through a cutting process. Since the electroplated leads 7 are only arranged on the back side, compared with the prior art, on the one hand, the number of electroplated leads 7 is reduced, and on the other hand, there are no electroplated leads 7 in the working area of the LED chip 5, so the LED light emission will not be affected by the color of the electroplated lead 7 material. At the same time, water vapor will not penetrate into the LED light-emitting area along the electroplated leads 7, thereby improving the overall ink color of the lamp beads and the airtightness of the lamp beads, and showing a good consistent effect.

[0034] In summary, an LED lamp bead structure proposed by the present utility model includes a substrate and a die bonding portion provided on the substrate. The die bonding portion includes a plurality of die bonding sub-portions arranged in sequence, and each die bonding sub-portion is respectively used to carry LED chips of different light-emitting colors. The substrate is provided with through holes; wherein, the die bonding sub-portion includes two bonding pads located on one side of the substrate, and two corresponding pins extending out through the through holes on the other side of the substrate. The pins are electrically connected to the electroplated leads. The anode of the LED chip is electrically connected to one of the bonding pads in the die bonding sub-portion, and the cathode of the LED chip is electrically connected to the other bonding pad in the corresponding die bonding sub-portion. Specifically, the lamp bead structure is optimized. The front die bonding area and the back pin area are connected through through holes, and the front circuit electroplated leads are cancelled. The electroplated leads are placed at the connection place of the back pins. Under the same flip-chip size, it can be designed into a smaller-size lamp bead, and more lamp beads can be placed on the same unit area, improving the clarity. At the same time, the electroplated leads are placed at the pins and finally removed through a cutting process, improving the overall ink color of the lamp beads and the airtightness of the lamp beads, and showing a good consistent effect. In addition, multiple pins are designed for the back pins to improve the anti-collision ability of the lamp beads.

[0035] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0036] The above-described embodiments merely represent several implementation manners of the present utility model. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several variations and improvements can still be made, and these all fall within the protection scope of the present utility model. Therefore, the protection scope of the patent of the present utility model shall be subject to the appended claims.

Claims

1. An LED lamp bead structure, characterized in that: It comprises a substrate and a crystal-fixing part arranged on the substrate, wherein the crystal-fixing part comprises a plurality of crystal-fixing sub-parts arranged in sequence, each of the crystal-fixing sub-parts is used to carry LED chips of different luminous colors, and the substrate is provided with a through hole; Among them, the crystal fixing sub-section includes two soldering pads located on one side of the substrate, and two corresponding pins located on the other side of the substrate and extending through the through hole, the pins are conductively connected to the electroplated leads, the anode of the LED chip is conductively connected to one of the soldering pads in the crystal fixing sub-section, and the cathode of the LED chip is conductively connected to another soldering pad in the corresponding crystal fixing sub-section.

2. The LED lamp bead structure according to claim 1, characterized in that: The die-bonding portion is located in a middle area of ​​the substrate.

3. The LED lamp bead structure according to claim 2, characterized in that: The anode and cathode of the LED chip are conductively connected to the corresponding pads through solder paste.

4. The LED lamp bead structure according to claim 3, characterized in that: The number of the pads and the number of the pins are both six.

5. The LED lamp bead structure according to claim 4, characterized in that: The substrate with the LED chip is encapsulated by a packaging adhesive.

6. The LED lamp bead structure according to claim 5, characterized in that: The area of ​​each pin is larger than the area of ​​the corresponding electroplated lead.

7. The LED lamp bead structure according to claim 6, characterized in that: The pin is in a rectangular shape.

8. The LED lamp bead structure according to claim 7, characterized in that: One end of any of the pins away from the electroplated lead is provided with a notch for serving as a marking point.

9. The LED lamp bead structure according to claim 1, characterized in that: The material of the substrate is BT resin substrate material.

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