Semiconductor refrigeration system, intelligent cabin and HUD

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Through semiconductor refrigeration technology combined with temperature, current and condensation detection circuits, real-time monitoring and control of TEC modules, the thermal reliability problems of smart cockpits and HUDs are solved, the stability of the system and the long life of the LEDs are achieved, and the car warranty requirements are met.

CN223058955UActive Publication Date: 2025-07-04CHONGQING LILONG ZHONGBAO INTELLIGENT TECH CO LTD

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Patent Information

Application Number: CN202422330258.X
Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner
Filing Date: 2024-09-24
Publication Date: 2025-07-04
Estimated Expiration: 2034-09-24

AI Technical Summary

Technical Problem

The existing smart cockpit and HUD's refrigeration systems have poor reliability and poor heat dissipation effects, which affects the system's stability and service life. The HUD's white LED light emitting unit has a yellow color after aging at high temperature, which cannot meet the car warranty requirements.

Method used

The semiconductor refrigeration technology is adopted to monitor the load state in real time through temperature, current and condensation detection circuits, and the MCU controls the TEC module for heating or cooling to keep the system working within the appropriate temperature range to avoid overheating or overcooling.

Benefits of technology

It improves the stability and reliability of the refrigeration system, extends the service life of the smart cockpit and HUD, ensures that the LED light emitting unit works normally in high temperature environments, and meets the car quality assurance requirements.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a semiconductor refrigeration system, an intelligent cabin and an HUD, comprising an MCU, a temperature detection circuit, a condensation detection circuit, a current detection circuit, a drive circuit and a TEC module. The temperature detection circuit is used for collecting a temperature signal of a load and transmitting the temperature signal to the MCU; the condensation detection circuit is used for collecting a condensation signal of a load and transmitting the condensation signal to the MCU; the current detection circuit is used for collecting a current signal of a load and transmitting the current signal to the MCU; and the driving circuit is used for driving the TEC module to work according to the PWM wave modulation signal output by the MCU.

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Description

Technical Field

[0001] The utility model relates to the technical field of vehicles, and particularly relates to a semiconductor refrigeration system, an intelligent cockpit, and a HUD. Background Art

[0002] With the digital transformation of the automotive industry, intelligent cockpits and HUDs have become key components in the transformation of the automotive industry from traditional fuel vehicles to the era of intelligent vehicles. With the development of technology, this requires intelligent cockpit SoCs (System-on-a-Chip, integrating all systems on a single chip) to have higher integration and computing power to support large-scale sensor data processing, AI algorithms, and application software services, which usually means higher power consumption and heat generation. Also, since power consumption and heat generation are directly related to the reliability and user experience of the intelligent cockpit, an effective refrigeration system becomes crucial.

[0003] Semiconductor refrigeration is a new refrigeration technology based on thermoelectric refrigeration materials. In recent years, with the increasingly serious environmental problems, semiconductor refrigeration technology has become a research hotspot due to its characteristics of no refrigerant and environmental friendliness. Semiconductor refrigeration technology has advantages such as no mechanical moving parts, stable operation without noise, and compact structure. Although there are disadvantages such as low refrigeration efficiency, high cost per unit refrigeration capacity, and complex processing technology, with the increasing emphasis on the environment, its application fields are constantly expanding, the market demand is increasing, and the development prospect is broad.

[0004] As Figure 1 shown, the current mainstream configuration of intelligent cockpits on the market is still the scheme of adding a heat dissipation structure with a metal shell and a heat dissipation fan outside the cockpit SoC, connecting the cockpit SoC and the metal shell through a thermal interface material to achieve heat transfer; however, this scheme has poor heat dissipation effect and low reliability, and is prone to failure and difficult to maintain in the harsh on-vehicle environment.

[0005] And the HUD needs to use white light LED light-emitting units, and there is a problem that the color of the white light LED light-emitting units turns yellow after high-temperature aging, which usually occurs after 2 - 3 years according to the actual working environment, not meeting the situation of the 5-year vehicle warranty. Summary of the Invention

[0006] Aiming at the technical problem of poor reliability of the refrigeration system in the prior art, the utility model proposes a refrigeration system applied to HUDs and cockpits, which can achieve the refrigeration effect, increase the system stability, and extend the product life by using the characteristic of the semiconductor refrigeration technology that the contact surface temperature can be reduced below the ambient temperature.

[0007] To achieve the above object, the utility model provides the following technical solutions:

[0008] A semiconductor refrigeration system includes an MCU, and also includes a temperature detection circuit, a condensation detection circuit, a current detection circuit, a drive circuit, and a TEC module;

[0009] The temperature detection circuit is used to collect the temperature signal of the load and transmit it to the MCU; the condensation detection circuit is used to collect the condensation signal of the load and transmit it to the MCU; the current detection circuit is used to collect the current signal of the load and transmit it to the MCU; the drive circuit is used to drive the TEC module to work according to the PWM wave modulation signal output by the MCU.

[0010] Preferably, the model of the MCU includes but is not limited to S32K312.

[0011] Preferably, an LC filter circuit is also arranged between the drive circuit and the TEC module.

[0012] Preferably, the drive circuit adopts an H-bridge drive circuit.

[0013] Preferably, the temperature detection circuit includes a first operational amplifier U1:

[0014] The first voltage terminal is connected to one end of the first resistor, and the other end of the first resistor is respectively connected to one end of the second resistor and one end of the third resistor. The other end of the second resistor is grounded; the other end of the third resistor is connected to the positive input terminal of U1, the negative input terminal of U1 is connected to one end of the fourth resistor, and the other end of the fourth resistor is connected in parallel with the output terminal of U1 and then connected to one end of the fifth resistor. The other end of the fifth resistor and one end of the first capacitor are connected in parallel and then connected to the MCU; the other end of the first capacitor is grounded.

[0015] Preferably, the current detection circuit includes a second operational amplifier U2:

[0016] The current acquisition terminal is respectively connected to one end of the sixth resistor and the positive input terminal of U2, and the other end of the sixth resistor is grounded; the negative input terminal of U2 is respectively connected to one end of the seventh resistor and one end of the eighth resistor, and the other end of the seventh resistor is grounded; the other end of the eighth resistor and the output terminal of U2 are connected in parallel and then connected to one end of the ninth resistor. The other end of the ninth resistor and one end of the second capacitor are connected in parallel and then connected to the MCU, and the other end of the second capacitor is grounded.

[0017] Preferably, the condensation detection circuit includes a condensate water sensor U3 and a third operational amplifier U4:

[0018] The second voltage terminal is connected to one end of the tenth resistor. The other end of the tenth resistor is respectively connected to one end of the eleventh resistor and one end of U3, and the other end of U3 is grounded. The other end of the eleventh resistor is connected to the positive input terminal of U4. The negative input terminal of U4 is connected to one end of the twelfth resistor. The other end of the twelfth resistor is connected in parallel with the output terminal of U4 and then connected to one end of the thirteenth resistor. The other end of the thirteenth resistor and one end of the third capacitor are connected in parallel and then connected to the MCU. The other end of the third capacitor is grounded.

[0019] The present invention also provides an intelligent cockpit, and a semiconductor refrigeration system is applied to the SoC of the intelligent cockpit.

[0020] The present invention also provides a HUD, and a semiconductor refrigeration system is applied to the LED of the HUD.

[0021] In summary, due to the adoption of the above technical solutions, compared with the prior art, the present invention has at least the following beneficial effects:

[0022] By setting up real-time feedback of temperature monitoring, condensation detection and current acquisition, the MCU in the present invention anticipates temperature changes in advance, controls the TEC module to refrigerate or heat, and always keeps the cockpit SOC or HUD working in a suitable temperature range, avoiding overcooling and overheating, and prolonging the service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the existing refrigeration system.

[0024] Figure 2 It is a schematic diagram of a semiconductor refrigeration system according to an exemplary embodiment of the present invention.

[0025] Figure 3 It is a schematic diagram of the temperature detection circuit according to an exemplary embodiment of the present invention.

[0026] Figure 4 It is a schematic diagram of the current detection circuit according to an exemplary embodiment of the present invention.

[0027] Figure 5 It is a schematic diagram of the condensation detection circuit according to an exemplary embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0028] The present invention will be further described in detail below in conjunction with the embodiments and the specific implementation manners. However, it should not be understood that the scope of the above-mentioned subject matter of the present invention is limited to the following embodiments. All technologies implemented based on the content of the present invention belong to the scope of the present invention.

[0029] In the description of the present utility model, it should be understood that the orientation or positional relationships indicated by the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.

[0030] As Figure 2 shown, the present utility model provides a semiconductor refrigeration system, which includes an MCU and a load (SoC or HUD). A temperature detection circuit, a condensation detection circuit, a current detection circuit, a drive circuit and a TEC (Thermo Electric Cooler) module are also arranged between the MCU and the load (SoC or HUD).

[0031] In this embodiment, the temperature detection circuit is used to collect the temperature signal of the SoC (or HUD) and transmit it to the MCU; the condensation detection circuit is used to collect the condensation signal of the SoC (or HUD) and transmit it to the MCU; the current detection circuit is used to collect the current signal of the SoC (or HUD) and transmit it to the MCU; the drive circuit is used to drive the TEC module to start working (heating or refrigerating) according to the PWM modulation signal output by the MCU.

[0032] In this embodiment, the model of the MCU can be S32K312.

[0033] In this embodiment, the working principle of a refrigeration system applied to HUD and cockpit is as follows:

[0034] The temperature detection circuit transmits the collected temperature signal of the SoC (or HUD) to the MCU. The MCU compares the temperature signal with the temperature threshold and adjusts the output of the first PWM wave modulation signal to the drive circuit, thereby driving the TEC module to start working and controlling heating or refrigerating.

[0035] When there is an increase in the power consumption of the cockpit SOC (or HUD) and a sudden change in current, the current detection circuit transmits the collected current signal of the SoC to the MCU. The MCU predicts the temperature change trend according to the current signal (which belongs to the prior art), adjusts the output of the second PWM wave modulation signal to the drive circuit, thereby driving the TEC module to start working and controlling heating or refrigerating.

[0036] When the condensation detection circuit detects that condensation forms water dew in the cockpit (or HUD), it transmits the condensation signal to the MCU. The MCU adjusts the output of the third PWM wave modulation signal to the drive circuit, thereby driving the TEC module to start working, reducing the power of the TEC module, and reducing the temperature difference on the cooling surface of the TEC until the moisture decreases and returns to the normal state (no condensation phenomenon).

[0037] In this embodiment, it is a conventional control method in the art for the MCU to adjust the PWM wave modulation signal to control the operation of the TEC module through the existing fuzzy algorithm (PID regulation).

[0038] In this embodiment, as Figure 3 shown, the temperature detection circuit includes an operational amplifier U1:

[0039] The first voltage terminal VCC1 is connected to one end of the first resistor R1. The other end of the first resistor R1 is respectively connected to one end of the second resistor R2 and one end of the third resistor R3. The other end of the second resistor R2 is grounded; the other end of the third resistor R3 is connected to the non-inverting input terminal of U1. The inverting input terminal of U1 is connected to one end of the fourth resistor R4. The other end of the fourth resistor R4 is connected in parallel with the output terminal of U1 and then connected to one end of the fifth resistor R5. The other end of the fifth resistor R5 and one end of the first capacitor C1 are connected in parallel and then connected to the temperature signal input terminal of the MCU; the other end of the first capacitor C1 is grounded. The working principle is that the second resistor R2 samples the temperature, converts the temperature signal into a voltage signal, and after conditioning by the operational amplifier U1, it is input to the MCU, thereby realizing temperature acquisition.

[0040] In this embodiment, as Figure 4 shown, the current detection circuit includes an operational amplifier U2:

[0041] The current output terminal of the SoC (the acquisition terminal of the current detection circuit) is respectively connected to one end of the sixth resistor R6 and the non-inverting input terminal of U2. The other end of the sixth resistor R6 is grounded; the inverting input terminal of U2 is respectively connected to one end of the seventh resistor R7 and one end of the eighth resistor R8. The other end of the seventh resistor R7 is grounded; the other end of the eighth resistor R8 is connected in parallel with the output terminal of U2 and then connected to one end of the ninth resistor R9. The other end of the ninth resistor R9 and one end of the second capacitor C2 are connected in parallel and then connected to the current signal input terminal of the MCU. The other end of the second capacitor C2 is grounded. The working principle is to collect the current signal of the cockpit SoC, convert it into a voltage signal, input it to the MCU, and perform real-time power consumption monitoring, temperature prediction, and forward feedback to avoid large fluctuations in the temperature of the SoC.

[0042] In this embodiment, as Figure 5 shown, the condensation detection circuit includes a condensation water sensor U3 and an operational amplifier U4:

[0043] The second voltage terminal VCC2 is connected to one end of the tenth resistor R10. The other end of the tenth resistor R10 is respectively connected to one end of the eleventh resistor R11 and one end of the condensate water sensor U3. The other end of the condensate water sensor U3 is grounded. The other end of the eleventh resistor R11 is connected to the positive-phase input terminal of U4. The negative-phase input terminal of U4 is connected to one end of the twelfth resistor R12. The other end of the twelfth resistor R12 is connected in parallel with the output terminal of U4 and then connected to one end of the thirteenth resistor R13. The other end of the thirteenth resistor R13 and one end of the third capacitor C3 are connected in parallel and then connected to the condensate signal input terminal of the MCU. The other end of the third capacitor C3 is grounded. The working principle is as follows: The condensate signal on the cooling surface of the SoC is collected by the condensate water sensor U3, converted into a voltage signal, input into the MCU, and monitored in real time to adjust the temperature difference, so as to avoid a large amount of condensate water and affect the safety performance.

[0044] In this embodiment, the drive circuit is an existing H-bridge drive circuit, so it will not be elaborated here.

[0045] In this embodiment, an existing LC filter circuit is also provided between the drive circuit and the TEC module to achieve smooth filtering of the drive signal and avoid generating noise.

[0046] In this embodiment, the refrigeration system can be applied to the SoC in the intelligent cockpit, and can be quickly reduced to 45°C within 10S in an environment of 85°C, so as to reduce the heat dissipation loss and provide a relatively stable working environment.

[0047] In this embodiment, the refrigeration system can be applied to HUD products.

[0048] If the TFT technology is adopted, the HUD needs to use a white light LED lighting unit, and there is a problem that the color turns yellow after high-temperature aging of the white light LED lighting unit, which usually occurs after 2-3 years according to the actual working environment, and does not meet the 5-year quality guarantee of automobiles. The refrigeration system of the present invention can still ensure that the LED temperature is lower than 60°C when the ambient temperature is 80°C, ensuring the working life of the LED.

[0049] If the DLP technology is adopted, the HUD is more sensitive to temperature and needs to use three R, G, and B light-emitting LEDs to mix and generate a white light source. However, the RGB optoelectronic conversion characteristics are also different at different temperatures, so it is necessary to perform high and low temperature white balance calibration work at -40 to 85°C; however, this operation cannot be achieved on the production line, so it is currently a difficult problem in the industry for HUD using DLP technology. The refrigeration system of the present invention can keep the temperature constant in a range such as 0°C to 50°C, then this problem can be avoided from another path.

[0050] Those of ordinary skill in the art can understand that the above embodiments are specific examples for implementing the present utility model, and in actual applications, various changes can be made to it in form and details without departing from the spirit and scope of the present utility model.

Claims

1. A semiconductor refrigeration system, including an MCU, characterized in that, It also includes a temperature detection circuit, a condensation detection circuit, a current detection circuit, a drive circuit, and a TEC module; The temperature detection circuit is used to collect the temperature signal of the load and transmit it to the MCU; the condensation detection circuit is used to collect the condensation signal of the load and transmit it to the MCU; the current detection circuit is used to collect the current signal of the load and transmit it to the MCU; the drive circuit is used to drive the TEC module to work according to the PWM wave modulation signal output by the MCU.

2. The semiconductor refrigeration system according to claim 1, characterized in that The model of the MCU includes but is not limited to S32K312.

3. A semiconductor refrigeration system according to claim 1, characterized in that, An LC filter circuit is also provided between the drive circuit and the TEC module.

4. A semiconductor refrigeration system according to claim 1, characterized in that, The drive circuit adopts an H-bridge drive circuit.

5. A semiconductor refrigeration system according to claim 1, characterized in that, The temperature detection circuit includes a first operational amplifier (U1): The first voltage terminal is connected to one end of the first resistor, and the other end of the first resistor is respectively connected to one end of the second resistor and one end of the third resistor. The other end of the second resistor is grounded; the other end of the third resistor is connected to the non-inverting input terminal of (U1), the inverting input terminal of (U1) is connected to one end of the fourth resistor, and the other end of the fourth resistor is connected in parallel with the output terminal of (U1) and then connected to one end of the fifth resistor. The other end of the fifth resistor and one end of the first capacitor are connected in parallel and then connected to the MCU; the other end of the first capacitor is grounded.

6. A semiconductor refrigeration system according to claim 1, characterized in that, The current detection circuit includes a second operational amplifier (U2): The current acquisition terminal is respectively connected to one end of the sixth resistor and the non-inverting input terminal of (U2), and the other end of the sixth resistor is grounded; the inverting input terminal of (U2) is respectively connected to one end of the seventh resistor and one end of the eighth resistor, and the other end of the seventh resistor is grounded; the other end of the eighth resistor and the output terminal of (U2) are connected in parallel and then connected to one end of the ninth resistor. The other end of the ninth resistor and one end of the second capacitor are connected in parallel and then connected to the MCU, and the other end of the second capacitor is grounded.

7. A semiconductor refrigeration system according to claim 1, characterized in that, The condensation detection circuit includes a condensation water sensor (U3) and a third operational amplifier (U4): The second voltage terminal is connected to one end of the tenth resistor, and the other end of the tenth resistor is respectively connected to one end of the eleventh resistor and one end of (U3). The other end of (U3) is grounded; the other end of the eleventh resistor is connected to the non-inverting input terminal of (U4), the inverting input terminal of (U4) is connected to one end of the twelfth resistor, and the other end of the twelfth resistor is connected in parallel with the output terminal of (U4) and then connected to one end of the thirteenth resistor. The other end of the thirteenth resistor and one end of the third capacitor are connected in parallel and then connected to the MCU; the other end of the third capacitor is grounded.

8. An intelligent cockpit, characterized in that, A semiconductor refrigeration system according to any one of claims 1-7 is applied to the SoC of the intelligent cockpit.

9. A HUD, characterized in that, A semiconductor refrigeration system according to any one of claims 1-7 is applied to the LED of the HUD.