Multi-group switching type feeding assembly and continuous silicon wafer testing instrument
By designing multiple sets of switched loading components and feeding mechanisms, and using rotating motors and micro-air pumps to achieve automated loading and fixing, the problem of slow artificial loading speed in silicon wafer testing instruments is solved, and the testing efficiency and stability are improved.
Patent Information
- Application Number
- CN202421837795.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-07-31
AI Technical Summary
When comparative tests of multiple groups of silicon wafers, existing silicon wafer testing instruments require staff to manually move different groups of silicon wafers to the conveyor belt, resulting in slowing down the test speed and affecting working efficiency.
A multi-group switching feeding assembly is designed, including a feeding mechanism and a feeding mechanism, and a rotating motor drives the feeding barrel to rotate and a micro-air pump to generate negative pressure suction, so as to realize automatic feeding and fixing silicon wafers to avoid falling.
It improves the working efficiency and stability of the silicon wafer test instrument, ensures smooth loading and fixing of the silicon wafer, avoids falling, and improves the testing speed and practicality.
Smart Images
Figure CN223059975U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafer testing instruments, in particular to a multi-group switching type feeding assembly and a continuous silicon wafer testing instrument. Background Technique
[0002] Silicon wafers are important materials for manufacturing integrated circuits. Through means such as photolithography and ion implantation on silicon wafers, various semiconductor devices can be fabricated. Silicon wafers are processed from silicon ingots. Through specialized processes, millions of transistors can be etched on silicon wafers, which are widely used in the manufacture of integrated circuits. Chips made of silicon wafers have amazing computing power, so they are widely used in various industrial productions and the computer field. At the same time, the development of science and technology continuously promotes the development of semiconductors. With the development of technologies such as automation and computers, during the production process of silicon wafers, the silicon wafers after photolithography need to be subjected to quality inspection. In order to improve the inspection efficiency, a multi-group switching type feeding assembly and a continuous silicon wafer testing instrument are often required for testing.
[0003] Regarding the above related technologies, the applicant believes that when the device is working, the silicon wafers to be tested are placed on the conveyor belt, and the conveyor belt is used to move the silicon wafers to the lower part of the silicon wafer tester for testing. When the device is testing, it is necessary to compare multiple groups of silicon wafers, and it is necessary for the staff to move different groups of silicon wafers to the conveyor belt, which slows down the testing speed of the device and affects the working efficiency of the device. Content of the Utility Model
[0004] The purpose of the utility model is to provide a multi-group switching type feeding assembly and a continuous silicon wafer testing instrument to solve the problem that the staff needs to move different groups of silicon wafers to the conveyor belt as mentioned in the above background technique, which slows down the testing speed of the device.
[0005] To achieve the above purpose, the utility model provides the following technical solutions: On the one hand, the utility model provides a multi-group switching type feeding assembly, including a test bench and a feeding mechanism. The feeding mechanism is arranged at one end of the top of the test bench far from the inner center. The feeding mechanism includes a support plate arranged at one end of the top of the test bench far from the inner center, a connecting rod arranged at one end of the support plate close to the center point inside the test bench, a rotating motor arranged at the top of the connecting rod, a rotating rod arranged at the output end of the rotating motor, a feeding cylinder arranged at the bottom of the rotating rod, feeding grooves uniformly opened inside the feeding cylinder, an electric push rod arranged below one end inside the feeding groove, and a baffle plate arranged at the output end of the electric push rod.
[0006] By adopting the above technical solution, the rotation of the feeding cylinder can be driven by the work of the rotating motor, so that the silicon wafers in different feeding grooves can fall into the inner part of the feeding mechanism, effectively improving the working efficiency of the device.
[0007] Preferably, the feeding mechanism also includes observation windows evenly arranged on the outside of the feeding barrel, a protective cover arranged above the inside of the feeding trough, and a handle arranged on the top of the protective cover. The outside of the protective cover is evenly provided with external threads, and a threaded groove matching the protective cover is opened above the inside of the observation window, and the protective cover and the observation window are connected by threads.
[0008] By adopting the above technical solution, the protective cover can be conveniently fixed, thereby conveniently protecting the inside of the feeding chute.
[0009] Preferably, the feeding mechanism also includes a fixed rod arranged inside the feeding trough and below one end away from the electric push rod, a spring sleeved on the outside of the fixed rod, a movable plate slidably arranged on the outside of the fixed rod, and a limiting rod arranged on one end of the movable plate close to the baffle plate.
[0010] By adopting the above technical solution, the second to last silicon wafer in the loading chute can be limited to avoid multiple silicon wafers from slipping out of the loading chute as much as possible.
[0011] Preferably, four groups of the feeding troughs are provided, and the feeding troughs are symmetrically distributed about the rotating rod.
[0012] By adopting the above technical solution, different groups of silicon wafers can be stored conveniently.
[0013] On the other hand, the utility model provides a continuous silicon wafer testing instrument, including the above-mentioned multi-group switching loading assembly, the continuous silicon wafer testing instrument also includes a feeding mechanism, the feeding mechanism is arranged at the bottom end of the test bench, the feeding mechanism includes an electric guide rail arranged at the bottom end of the test bench, a sliding block arranged on the electric guide rail, a fixed plate arranged at the top of the sliding block, an air suction groove opened inside the fixed plate, air suction ports evenly opened at the top of the air suction groove, a micro air pump arranged at one end of the fixed plate and an air suction pipe arranged at the input end of the micro air pump, and the end of the air suction pipe away from the micro air pump penetrates into the interior of the air suction groove.
[0014] By adopting the above technical solution, the micro air pump can generate suction, so that a negative pressure space is formed inside the suction groove, which makes it easier to fix the silicon wafer on the fixed plate and avoids the silicon wafer from falling when moving.
[0015] Preferably, bases are arranged around the bottom end of the test bench, and anti-slip pads are arranged at the bottom ends of the bases.
[0016] By adopting the above technical solution, the stability of the device during operation is effectively improved.
[0017] Preferably, a silicon wafer tester is provided in the middle of one side of the top of the test bench, and a display screen is provided at one end of the top of the test bench close to the silicon wafer tester.
[0018] By adopting the above technical solution, the silicon wafer can be tested, and the test results can be displayed on the display screen.
[0019] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0020] 1. By providing a feeding mechanism, a support plate, a feeding cylinder, a connecting rod, a feeding groove, a rotating rod, a rotating motor, a protective cover, an observation window, a grip, a baffle plate, an electric push rod and a feeding mechanism, the rotation of the feeding cylinder can be driven by the operation of the rotating motor, so that the silicon wafers in different feeding grooves can fall into the feeding mechanism, effectively improving the working efficiency of the device;
[0021] 2. By providing a feeding mechanism, a fixing plate, a sliding block, an electric guide rail, a suction groove, a suction pipe, a micro air pump and a suction port, the operation of the micro air pump can generate suction force, so that a negative pressure space is formed inside the suction groove, facilitating the fixation of the silicon wafer on the fixing plate and minimizing the risk of the silicon wafer falling during movement, effectively improving the practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 is a schematic three-dimensional structure diagram of the whole of the present utility model;
[0023] Figure 2 is a schematic front view structure diagram of the whole of the present utility model;
[0024] Figure 3 is a schematic three-dimensional structure diagram of the feeding cylinder of the present utility model;
[0025] Figure 4 is of the present utility model Figure 3 is an enlarged structure diagram at A in the present utility model;
[0026] Figure 5 is a schematic internal structure diagram of the feeding cylinder of the present utility model
[0027] Figure 6 is of the present utility model Figure 5 is an enlarged structure diagram at B in the present utility model
[0028] Figure 7 is a schematic internal structure diagram of the fixing plate of the present utility model.
[0029] In the figure: 1. Loading mechanism; 101. Support plate; 102. Loading cylinder; 103. Connecting rod; 104. Loading chute; 105. Rotating rod; 106. Rotating motor; 107. Protective cover; 108. Observation window; 109. Handle; 110. Baffle plate; 111. Electric push rod; 112. Fixed rod; 113. Spring; 114. Movable plate; 115. Limiting rod; 2. Test bench; 3. Base; 4. Feeding mechanism; 401. Fixed plate; 402. Sliding block; 403. Electric guide rail; 404. Suction groove; 405. Suction pipe; 406. Micro air pump; 407. Suction port; 5. Display screen; 6. Wafer tester. Detailed implementation manners
[0030] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
[0031] Embodiment 1
[0032] Please refer to Figures 1 to 7, the present utility model provides a technical solution: a multi-group switching type feeding component and a continuous silicon wafer testing instrument, including a testing table 2 and a feeding mechanism 1. The feeding mechanism 1 is arranged at one end of the top of the testing table 2 away from the inner center. The feeding mechanism 1 includes a support plate 101 arranged at one end of the top of the testing table 2 away from the inner center, and the support plate 101 can improve the bearing capacity; a connecting rod 103 arranged at one end of the support plate 101 close to the center point inside the testing table 2, a rotating motor 106 arranged at the top of the connecting rod 103, a rotating rod 105 arranged at the output end of the rotating motor 106, a feeding cylinder 102 arranged at the bottom of the rotating rod 105. By the operation of the rotating motor 106, the feeding cylinder 102 can be driven to rotate through the transmission of the rotating rod 105. Feeding grooves 104 are evenly arranged inside the feeding cylinder 102. There are four groups of feeding grooves 104, and the feeding grooves 104 are symmetrically distributed with respect to the rotating rod 105, which can facilitate the storage of silicon wafers of different groups; an electric push rod 111 arranged below one end inside the feeding groove 104, a baffle plate 110 arranged at the output end of the electric push rod 111. By the operation of the electric push rod 111, the baffle plate 110 can be driven to move, and the feeding groove 104 can be opened to discharge the silicon wafers inside different feeding grooves 104; the feeding mechanism 1 further includes observation windows 108 evenly arranged outside the feeding cylinder 102, which can facilitate the staff to observe the silicon wafers inside the feeding cylinder 102; a protective cover 107 arranged above the inside of the feeding groove 104 and a handle 109 arranged at the top of the protective cover 107. External threads are evenly arranged on the outside of the protective cover 107, and a thread groove matching the protective cover 107 is opened above the inside of the observation window 108. The protective cover 107 and the observation window 108 are connected by threads, which can facilitate the fixation of the protective cover 107 and thus facilitate the protection of the inside of the feeding groove 104.
[0033] Embodiment 2
[0034] The feeding mechanism 1 further includes a fixing rod 112 arranged below one end of the feeding groove 104 away from the electric push rod 111, and the fixing rod 112 can provide bearing capacity. A spring 113 sleeved outside the fixing rod 112, a movable plate 114 slidably arranged outside the fixing rod 112, and a limiting rod 115 arranged at one end of the movable plate 114 close to the baffle plate 110. When the electric push rod 111 is operated to drive the baffle plate 110 to move, the elasticity of the spring 113 can be used to push the limiting rod 115 to move into the feeding groove 104, and the second-to-last silicon wafer inside the feeding groove 104 can be limited, trying to avoid multiple silicon wafers from sliding out of the feeding groove 104. When the baffle plate 110 closes the inside of the feeding groove 104, the baffle plate 110 is used to push the movable plate 114 to move, so that the limiting rod 115 cancels the limitation on the silicon wafer, and the silicon wafer falls onto the baffle plate 110.
[0035] Embodiment III
[0036] Another embodiment provided by the present utility model: A continuous silicon wafer testing instrument includes any one of the above-mentioned multi-group switching feeding components. The continuous silicon wafer testing instrument further includes: a feeding mechanism 4, which can facilitate the movement of silicon wafers; the feeding mechanism 4 is arranged at the bottom end inside the testing table 2. The feeding mechanism 4 includes an electric guide rail 403 arranged at the bottom end inside the testing table 2, a sliding block 402 arranged on the electric guide rail 403. The electric guide rail 403 and the sliding block 402 are prior arts and will not be elaborated here; a fixing plate 401 arranged at the top end of the sliding block 402, and the fixing plate 401 can support the silicon wafer; a suction groove 404 opened inside the fixing plate 401, suction ports 407 evenly opened at the top end of the suction groove 404, a micro air pump 406 arranged at one end of the fixing plate 401. By the operation of the micro air pump 406, suction can be generated, so that a negative pressure space is formed inside the suction groove 404, and the silicon wafer on the fixing plate 401 is fixed through the suction ports 407, and the falling of the silicon wafer during movement is avoided as much as possible. An air suction pipe 405 arranged at the input end of the micro air pump 406, and one end of the air suction pipe 405 away from the micro air pump 406 penetrates into the inside of the suction groove 404, which can facilitate the transmission of suction force.
[0037] Embodiment IV
[0038] Base 3 is arranged around the bottom end of the testing table 2, and the base 3 can support the testing table 2; anti-slip pads are arranged at the bottom ends of the base 3, effectively improving the stability of the device during operation; in the middle part of one side of the top end of the testing table 2, a silicon wafer tester 6 is arranged, and at one end of the top end of the testing table 2 close to the silicon wafer tester 6, a display screen 5 is arranged. The silicon wafer tester 6 and the display screen 5 are electrically connected. The silicon wafer can be tested by the silicon wafer tester 6, and the test results can be displayed through the display screen 5.
[0039] Working principle: First, open the protective cover 107, and silicon wafers of different groups can be placed into the inside of different feeding grooves 104. When the device works, by the operation of the rotating motor 106, the feeding cylinder 102 can be driven to rotate through the transmission of the rotating rod 105, and one of the feeding grooves 104 is moved to the inside of the fixing plate 401. By the operation of the electric push rod 111, the baffle plate 110 can be driven to move, and the feeding groove 104 can be opened, so that the silicon wafers inside different feeding grooves 104 can fall onto the fixing plate 401, facilitating the feeding of silicon wafers of different groups, and thus effectively improving the working efficiency of the device;
[0040] Secondly, the micro air pump 406 can generate suction force, so that a negative pressure space is formed inside the suction groove 404, and the silicon wafer on the fixing plate 401 is fixed through the suction port 407 to avoid the silicon wafer from falling when moving, which effectively improves the practicality of the device;
[0041] Finally, by utilizing the operation of the electric guide rail 403, the fixed plate 401 can be driven to move through the sliding block 402, and the silicon wafer on the fixed plate 401 can be moved to the bottom of the silicon wafer tester 6. The silicon wafer can be tested using the silicon wafer tester 6, and the test results can be displayed on the display screen 5.
[0042] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A multi-group switching type feeding component, characterized in that: Including: A test bench (2); A loading mechanism (1), the loading mechanism (1) is arranged at one end of the top of the test bench (2) far from the inner center. The loading mechanism (1) includes a support plate (101) arranged at one end of the top of the test bench (2) far from the inner center, a connecting rod (103) arranged at one end of the support plate (101) close to the inner center point of the test bench (2), a rotating motor (106) arranged at the top of the connecting rod (103), a rotating rod (105) arranged at the output end of the rotating motor (106), a loading cylinder (102) arranged at the bottom end of the rotating rod (105), loading grooves (104) evenly arranged inside the loading cylinder (102), an electric push rod (111) arranged below one end inside the loading groove (104), and a baffle plate (110) arranged at the output end of the electric push rod (111).
2. The multi-group switching type feeding component according to claim 1, characterized in that: The loading mechanism (1) further includes observation windows (108) evenly arranged outside the loading cylinder (102), a protective cover (107) arranged above the inside of the loading groove (104), and a handle (109) arranged at the top of the protective cover (107). External threads are evenly arranged on the outside of the protective cover (107), and a thread groove matching the protective cover (107) is opened above the inside of the observation window (108). The protective cover (107) is threadedly connected with the observation window (108).
3. A multi-group switching type feeding component according to claim 1, characterized in that: The loading mechanism (1) further includes a fixed rod (112) arranged below one end inside the loading groove (104) far from the electric push rod (111), a spring (113) sleeved outside the fixed rod (112), a movable plate (114) slidably arranged outside the fixed rod (112), and a limiting rod (115) arranged at one end of the movable plate (114) close to the baffle plate (110).
4. A multi-group switching type feeding component according to claim 1, characterized in that: There are four groups of the loading grooves (104), and the loading grooves (104) are symmetrically distributed about the rotating rod (105).
5. A continuous silicon wafer testing instrument, characterized in that, Including the multi-group switching type loading component according to any one of claims 1-4, the continuous silicon wafer testing instrument further includes: A feeding mechanism (4), the feeding mechanism (4) is arranged at the bottom end inside the test bench (2). The feeding mechanism (4) includes an electric guide rail (403) arranged at the bottom end inside the test bench (2), a sliding block (402) arranged on the electric guide rail (403), a fixing plate (401) arranged at the top of the sliding block (402), a suction groove (404) opened inside the fixing plate (401), suction ports (407) evenly opened at the top of the suction groove (404), a micro air pump (406) arranged at one end of the fixing plate (401), and a suction pipe (405) arranged at the input end of the micro air pump (406). One end of the suction pipe (405) far from the micro air pump (406) penetrates into the inside of the suction groove (404).
6. The continuous silicon wafer testing instrument according to claim 5, characterized in that: Anti-slip pads are arranged at the bottom ends of the bases (3) which are arranged around the bottom end of the test bench (2).
7. A continuous silicon wafer testing instrument according to claim 5, characterized in that: In the middle part on one side of the top end of the test bench (2), a silicon wafer tester (6) is provided, and at one end of the top end of the test bench (2) close to the side of the silicon wafer tester (6), a display screen (5) is provided.