Silicon wafer blanking device and silicon wafer processing system

Abstract

The utility model discloses a silicon wafer blanking device and a silicon wafer processing system, the silicon wafer blanking device comprises a base, a transportation mechanism and a liquid removing structure, the base is provided with a placing surface, the placing surface is used for placing a carrier for bearing a silicon wafer, the transportation mechanism is arranged on the base, the transportation mechanism is configured to transport the carrier, the liquid removing structure is arranged on the base, and the liquid removing structure is arranged on the base. The liquid removing structure is configured to remove liquid on the carrier and the silicon wafer. By adopting the scheme of the utility model, the placing surface of the base can bear the carrier, the transportation mechanism can realize the transportation of the carrier, and the liquid removing device is arranged on the base, so that the carrier can remove liquid on the carrier and the silicon wafer while being transported on the base, the condition that the carrier and the silicon wafer carry the liquid is reduced, the finished product quality of the silicon wafer is improved, and the production cost is reduced. Moreover, the drying time of the carrier on the drying groove does not need to be prolonged to prevent the carrier and the silicon wafer from carrying liquid, and the liquid is removed by utilizing the transportation time of the carrier on the base, so that the overall processing efficiency of the silicon wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaics, and in particular to a silicon wafer blanking device and a silicon wafer processing system. Background Art

[0002] In the photovoltaic industry, silicon wafers usually need to be cleaned and dried after processing. For example, in the alkali polishing process, silicon wafers are carried by a flower basket. After the flower basket passes through the main chemical tank, it needs to be washed in a water tank and then dried in a drying tank. In the related art, in order to reduce the overall processing time of silicon wafers and improve the output of silicon wafers, it is necessary to reduce the drying time of the flower basket and silicon wafers in the drying tank. However, due to insufficient drying time of the flower basket and silicon wafers in the drying tank, the flower basket and silicon wafers may carry liquid, which in turn affects the finished product quality of the silicon wafers. Summary of the Utility Model

[0003] An embodiment of the utility model discloses a silicon wafer blanking device and a silicon wafer processing system, which can remove the liquid on the carrier and the silicon wafer while transporting the carrier, reduce the occurrence of liquid-carrying on the carrier and the silicon wafer, and thus improve the finished product quality of the silicon wafer.

[0004] To achieve the above object, in a first aspect, the utility model discloses a silicon wafer blanking device, including:

[0005] A base having a placement surface for placing a carrier for carrying silicon wafers;

[0006] A transport mechanism disposed on the base and configured to transport the carrier; and

[0007] A liquid removal structure disposed on the base and configured to remove the liquid on the carrier and the silicon wafer.

[0008] As an optional implementation manner, in the embodiment of the first aspect of the utility model, the liquid removal structure includes a liquid absorption component disposed on the base and configured to adsorb the liquid on the carrier and the silicon wafer, and / or;

[0009] The liquid removal structure includes a blowing component disposed on the base and configured to blow air to the carrier and the silicon wafer.

[0010] As an optional implementation manner, in the embodiment of the first aspect of the utility model, when the liquid removal structure includes the liquid absorption component, the liquid absorption component is disposed on one side of the base, and a liquid absorption channel is provided on the placement surface and extends to one side of the base and communicates with the liquid absorption component.

[0011] As an alternative embodiment, in the embodiment of the first aspect of the present utility model, when the liquid removing structure includes a blowing component, the silicon wafer blanking device further includes a ventilation component disposed on the base. The ventilation component includes two supporting portions and a connecting portion. The two supporting portions extend along the height direction of the base to be located above the placement surface, and the two supporting portions are spaced apart. The two ends of the connecting portion are respectively connected to the two supporting portions. The connecting portion is provided with air holes, and the air holes are communicated with the blowing component. The air holes are configured to blow air towards the carrier and the silicon wafer.

[0012] As an alternative embodiment, in the embodiment of the first aspect of the present utility model, the two supporting portions are rotatably connected to the base to adjust the angle of the air holes relative to the placement surface.

[0013] As an alternative embodiment, in the embodiment of the first aspect of the present utility model, a liquid drainage groove is provided on the placement surface, and the liquid drainage groove is used to receive the liquid on the carrier and the silicon wafer.

[0014] As an alternative embodiment, in the embodiment of the first aspect of the present utility model, the number of the liquid removing structures is multiple, and the multiple liquid removing structures are spaced apart along the transportation direction of the transportation mechanism and are disposed on the base.

[0015] As an alternative embodiment, in the embodiment of the first aspect of the present utility model, along the transportation direction of the transportation mechanism, the placement surface has multiple stations, and the multiple liquid removing structures are respectively arranged corresponding to the multiple stations. The silicon wafer blanking device further includes multiple bearing components, and the multiple bearing components are respectively disposed at each station. The bearing components are used to bear the carrier, and the transportation mechanism is configured to transport the carrier to different bearing components.

[0016] As an alternative embodiment, in the embodiment of the first aspect of the present utility model, the multiple stations include a loading station, a weighing station, and a blanking station. The transportation mechanism is configured to sequentially transport the carrier at the loading station to the weighing station and the blanking station;

[0017] The loading station is configured to receive the carrier, the weighing station is configured to detect the weight of the carrier and the silicon wafer, and the blanking station is configured to supply the carrier for blanking.

[0018] In a second aspect, the present utility model further discloses a silicon wafer processing system, including a drying device and the silicon wafer blanking device as described in the first aspect above. The drying device is used to dry the silicon wafer, and the silicon wafer blanking device is disposed downstream of the drying device.

[0019] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0020] The wafer blanking device and the wafer processing system provided by the embodiments of the present utility model. The placement surface of the base can carry the carrier, and the transportation mechanism can realize the transportation of the carrier. By arranging a liquid removal device on the base, the liquid on the carrier and the wafer can be removed while the carrier is being transported on the base, reducing the occurrence of liquid-carrying on the carrier and the wafer, thereby improving the finished product quality of the wafer. In addition, by using the wafer blanking device of the present application, there is no need to increase the drying time of the carrier in the drying tank to avoid liquid-carrying on the carrier and the wafer. Instead, the liquid is removed during the time when the carrier is being transported on the base, improving the overall processing efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1 It is a schematic three-dimensional structure diagram of the wafer blanking device and the carrier disclosed in the first aspect of the embodiments of the present application;

[0023] Figure 2 It is a schematic three-dimensional structure diagram of the wafer blanking device disclosed in the first aspect of the embodiments of the present application;

[0024] Figure 3 It is a schematic three-dimensional structure diagram of the ventilation component disclosed in the first aspect of the embodiments of the present application;

[0025] Figure 4 It is a schematic three-dimensional structure diagram of the ventilation component from another perspective disclosed in the first aspect of the embodiments of the present application;

[0026] Figure 5 It is a schematic structure diagram of the transportation mechanism disclosed in the first aspect of the embodiments of the present application;

[0027] Figure 6 It is a schematic three-dimensional structure diagram of the wafer processing system disclosed in the second aspect of the embodiments of the present application.

[0028] Icons: 1. Wafer blanking device; 10. Base; 100. Placing surface; 101. Liquid suction channel; 101a. Blind hole; 101b. Main channel; 102. Drainage groove; 103. Loading station; 104. Weighing station; 105. Blanking station; 106. Slide groove; 11. Transport mechanism; 110. Sliding member; 111. Lifting member; 12. Liquid removal structure; 120. Liquid suction component; 121. Blowing component; 13. Ventilation component; 130. Support portion; 131. Connection portion; 132. Air hole; 133. Ventilation groove; 14. Carrying component; 2. Wafer processing system; 20. Drying device; 3. Carrier. Detailed implementation manners

[0029] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] Next, the technical solutions of the present invention will be further described in conjunction with the embodiments and the accompanying drawings.

[0031] Please refer to Figure 1 , the first aspect of the embodiment of the present invention provides a wafer blanking device 1. The wafer blanking device 1 includes a base 10, a transport mechanism 11 and a liquid removal structure 12. The base 10 has a placing surface 100 for placing a carrier 3 for carrying wafers. The transport mechanism 11 is provided on the base 10 and is configured to transport the carrier 3. The liquid removal structure 12 is provided on the base 10 and is configured to remove the liquid on the carrier 3 and the wafer.

[0032] For the wafer blanking device 1 provided in the first aspect of the embodiment of the present invention, the placing surface 100 of the base 10 can carry the carrier 3, and the transport mechanism 11 can realize the transportation of the carrier 3. By providing a liquid removal device on the base 10, the liquid on the carrier 3 and the wafer can be removed while the carrier 3 is being transported on the base 10, reducing the occurrence of the situation where the carrier 3 and the wafer carry liquid, thereby improving the finished product quality of the wafer. In addition, by using the wafer blanking device 1 of the present application, there is no need to increase the drying time of the carrier 3 in the drying tank to avoid the carrier 3 and the wafer carrying liquid, but the liquid is removed by using the time when the carrier 3 is transported on the base 10, improving the overall processing efficiency of the wafer.

[0033] Optionally, the liquid removal structure 12 may include any one or more of a liquid suction component 120, a blowing component 121, an adsorption cotton, etc., and can be specifically selected according to actual situations. The following will give examples for illustration.

[0034] In one example, the liquid removing structure 12 includes a liquid absorbing member 120. The liquid absorbing member 120 is disposed on the base 10 and is configured to adsorb the liquid on the carrier 3 and the silicon wafer. By providing the adsorbing member, the liquid on the carrier 3 and the silicon wafer can be sucked away by the adsorbing force, without directly contacting the carrier 3 and the silicon wafer, and the transportation of the carrier 3 and the silicon wafer will not be affected.

[0035] Optionally, the liquid absorbing member 120 can be a vacuum adsorption device or a negative pressure fan, etc., and can be specifically selected according to the actual situation, and is not specifically limited in this embodiment.

[0036] In another example, the liquid removing structure 12 includes a blowing member 121. The blowing member 121 is disposed on the base 10 and is configured to blow air to the carrier 3 and the silicon wafer. By providing the blowing member 121, the liquid on the carrier 3 and the silicon wafer can be blown away by the gas blown out by the blowing member 121, without directly contacting the carrier 3 and the silicon wafer, and the transportation of the carrier 3 and the silicon wafer will not be affected.

[0037] Optionally, the blowing member 121 can be a positive pressure fan or a bellows, etc., and can be specifically selected according to the actual situation, and is not specifically limited in this embodiment.

[0038] Optionally, heated gas (such as heated nitrogen) can also be introduced into the blowing member 121, and the liquid on the carrier 3 and the silicon wafer is evaporated by high temperature, further improving the liquid removing effect on the carrier 3 and the silicon wafer.

[0039] In still another example, as Figure 1 shown, the liquid removing structure 12 includes a liquid absorbing member 120 and a blowing member 121. The liquid absorbing member 120 is disposed on the base 10 and is configured to adsorb the liquid on the carrier 3 and the silicon wafer. The blowing member 121 is disposed on the base 10 and is configured to blow air to the carrier 3 and the silicon wafer.

[0040] In this way, by simultaneously providing the liquid absorbing member 120 and the blowing member 121, the liquid absorbing member 120 and the blowing member 121 can be respectively disposed on two opposite sides of the carrier 3. For example, the liquid absorbing member 120 is disposed in the base 10, and the blowing member 121 is disposed above the placement surface 100. When the carrier 3 is transported on the base 10, the liquid absorbing member 120 is located below the carrier 3, and the blowing member 121 is located above the carrier 3. The adsorption direction of the liquid absorbing member 120 is the same as the blowing direction of the blowing member 121, and the liquid removing efficiency for the carrier 3 and the silicon wafer is relatively high through the cooperation of the liquid absorbing member 120 and the blowing member 121.

[0041] Please refer to Figure 2, in some embodiments, when the liquid removing structure 12 includes a liquid absorbing component 120, the liquid absorbing component 120 is disposed on one side of the base 10, and a liquid absorbing channel 101 is provided on the placement surface 100. The liquid absorbing channel 101 extends to one side of the base 10 and communicates with the liquid absorbing component 120.

[0042] In this way, by providing the liquid absorbing channel 101 on the placement surface 100, both ends of the liquid absorbing channel 101 communicate with the placement surface 100 and the liquid absorbing component 120 respectively. The liquid absorbing component 120 can adsorb the liquid on the carrier 3 and the silicon wafer through the liquid absorbing channel 101, so that the position of the liquid absorbing component 120 can be flexibly set, avoiding the setting of the liquid absorbing component 120 from blocking the transportation of the carrier 3 on the base 10.

[0043] Optionally, the liquid absorbing component 120 can be disposed beside the base 10, or the liquid absorbing component 120 can be disposed inside the base 10, which can be specifically selected according to the actual situation and is not specifically limited in this embodiment.

[0044] Optionally, the liquid absorbing channel 101 can be a through hole, multiple through holes or a pipeline on the base 10, etc., which can be specifically selected according to the actual situation and is not specifically limited in this embodiment.

[0045] In some embodiments, the liquid absorbing channel 101 includes a plurality of blind holes 101a and a main channel 101b. The plurality of blind holes 101a are spaced apart on the placement surface 100. One end of the main channel 101b communicates with the plurality of blind holes 101a, and the other end of the main channel 101b penetrates to one side of the base 10 and communicates with the liquid absorbing component 120.

[0046] In this way, by providing a plurality of blind holes 101a, the plurality of blind holes 101a can all communicate with the liquid absorbing component 120 through the main channel 101b. The liquid absorbing component 120 generates an adsorption force at the positions where the plurality of blind holes 101a are located, so as to adsorb the liquid at different positions of the carrier 3 and the silicon wafer, thereby improving the uniformity of liquid removal from the carrier 3 and the silicon wafer, and further reducing the occurrence of the situation that the carrier 3 and the silicon wafer carry liquid.

[0047] Please refer to Figures 2 to 4 , where Figure 1In the figure, the dashed line between the ventilation component 13 and the blowing component 121 indicates that the ventilation component 13 is in communication with the blowing component 121. In some embodiments, when the liquid removing structure 12 includes the blowing component 121, the silicon wafer blanking device 1 further includes a ventilation component 13 disposed on the base 10. The ventilation component 13 includes two support portions 130 and a connecting portion 131. The two support portions 130 extend along the height direction of the base 10 to be located above the placement surface 100, and the two support portions 130 are spaced apart. The two ends of the connecting portion 131 are respectively connected to the two support portions 130. The connecting portion 131 is provided with air holes 132, and the air holes 132 are in communication with the blowing component 121. The air holes 132 are configured to blow air toward the carrier 3 and the silicon wafer.

[0048] In this way, by providing the two support portions 130, the connecting portion 131 is located above the placement surface 100 and has a certain distance from the connecting portion 131 in the height direction, so that the air holes 132 provided on the connecting portion 131 are located above the carrier 3 and the silicon wafer. The air holes 132 of the connecting portion 131 can blow air downward, so that the direction in which the liquid on the carrier 3 and the silicon wafer is blown off is the same as the direction of gravity, which is beneficial to removing the liquid on the carrier 3 and the silicon wafer. At the same time, the blowing component 121 only needs to be in communication with the air holes 132, and there is no need to be disposed above the placement surface 100, so that the position of the blowing component 121 can be flexibly set, avoiding the situation that the setting of the blowing component 121 blocks the transportation of the carrier 3 on the base 10.

[0049] Optionally, both the support portion 130 and the connecting portion 131 can be rod-shaped structures or strip-shaped structures, etc., and can be specifically selected according to actual situations, and are not specifically limited in this embodiment.

[0050] Optionally, the number of the air holes 132 can be one or more, and can be specifically selected according to actual situations, and is not specifically limited in this embodiment. When the number of the air holes 132 is multiple, an air ventilation groove 133 can be provided on the connecting portion 131, so that the multiple air holes 132 are all in communication with the air ventilation groove 133. The blowing component 121 only needs to be in communication with the air ventilation groove 133 to be in communication with the multiple air holes 132 at the same time, so that the blowing component 121 blows air toward the carrier 3 and the silicon wafer through the multiple air holes 132 at the same time, thereby improving the uniformity of liquid removal from the carrier 3 and the silicon wafer, and further reducing the occurrence of the situation that the carrier 3 and the silicon wafer carry liquid.

[0051] Optionally, the blowing component 121 can be disposed beside the base 10, or the blowing component 121 can be disposed inside the base 10, and can be specifically selected according to actual situations, and is not specifically limited in this embodiment.

[0052] In some embodiments, the two support portions 130 are rotatably connected to the base 10 to adjust the angle of the air holes 132 relative to the placement surface 100.

[0053] In this way, by rotating the support portion 130, the angle of the air holes 132 relative to the placement surface 100 can be adjusted, thereby adjusting the direction of blowing air onto the carrier 3 and the silicon wafer, and this angle can be adjusted according to the liquid removal effect, so that the blowing component 121 has a better liquid removal effect.

[0054] Optionally, the rotation of the support portion 130 can be manually adjusted or a motor can be provided to drive the support portion 130 to rotate. Specifically, it can be selected according to the actual situation and is not specifically limited in this embodiment. When a motor is provided, the angle of the air holes 132 relative to the placement surface 100 can be adjusted while the blowing component 121 is working, so that blowing air is applied to different angles of the carrier 3 and the silicon wafer, further improving the liquid removal effect.

[0055] Please refer to Figure 2 again. In some embodiments, a liquid drainage groove 102 is provided on the placement surface 100, and the liquid drainage groove 102 is used to receive the liquid on the carrier 3 and the silicon wafer. In this embodiment, the liquid drainage groove 102 extends along the moving direction of the carrier 3.

[0056] In this way, by providing the liquid drainage groove 102, the liquid dropped from the carrier 3 and the silicon wafer can be received, preventing liquid from accumulating on the placement surface 100 and affecting the normal operation of other components of the silicon wafer blanking device 1 (such as the transportation mechanism 11).

[0057] In some embodiments, the liquid drainage groove 102 is communicated with at least one of the plurality of blind holes 101a, so that the liquid dropped on the liquid drainage groove 102 can also be sucked away by the liquid suction component 120, and the liquid on the liquid drainage groove 102 can be drained in time.

[0058] Optionally, the number of the liquid removal structures 12 can be one or more, which can be specifically selected according to the actual situation and is not specifically limited in this embodiment.

[0059] In some embodiments, the number of the liquid removal structures 12 is multiple, and the multiple liquid removal structures 12 are arranged on the base 10 at intervals along the transportation direction of the transportation mechanism 11. By arranging multiple liquid removal structures 12 at intervals along the transportation direction of the transportation structure, the carrier 3 can pass through multiple liquid removal structures 12 for liquid removal during the transportation on the base 10, reasonably utilizing the transportation time of the carrier 3 on the base 10, so that the liquid on the carrier 3 and the silicon wafer can be removed more thoroughly.

[0060] Optionally, when the number of the liquid removal structures 12 is multiple, it can be that the number of the liquid suction components 120 is multiple, or the number of the blowing components 121 is multiple, or it can also be that the numbers of both the liquid suction components 120 and the blowing components 121 are multiple. Specifically, it can be selected according to the actual situation and is not specifically limited in this embodiment.

[0061] In some embodiments, along the transportation direction of the transportation mechanism 11, the placement surface 100 has a plurality of workstations, and a plurality of liquid removal structures 12 are respectively arranged corresponding to the plurality of workstations. The silicon wafer blanking device 1 further includes a plurality of bearing components 14, and the plurality of bearing components 14 are respectively arranged at each workstation. The bearing component 14 is used to bear the carrier 3, and the transportation mechanism 11 is configured to transport the carrier 3 to different bearing components 14.

[0062] Since a plurality of workstations (such as a loading workstation 103 and an unloading workstation 105 for loading and unloading the carrier 3 on the base 10) are usually required to be arranged on the placement surface 100, by arranging a plurality of bearing components 14 on the placement surface 100, the bearing component 14 can bear the carrier 3, which is convenient for positioning the carrier 3 at each workstation. At the same time, during the loading and unloading process of the carrier 3 in the silicon wafer blanking device 1, the carrier 3 will have a certain residence time at each workstation. By arranging the bearing component 14 at each workstation, the liquid on the carrier 3 and the silicon wafer can be removed by using the residence time of the carrier 3 at the workstation. While ensuring the liquid removal effect on the carrier 3 and the silicon wafer, fewer liquid removal structures 12 can be arranged.

[0063] Optionally, the bearing component 14 can be a V-shaped block or a supporting arm, etc., which can be specifically selected according to the actual situation and is not specifically limited in this embodiment.

[0064] Optionally, among the plurality of workstations, a loading workstation 103, a weighing workstation 104, and an unloading workstation 105 can be included. The transportation mechanism 11 is configured to transport the carrier 3 on the loading workstation 103 to the weighing workstation 104 and the unloading workstation 105 in sequence; the loading workstation 103 is configured to receive the carrier 3, the weighing workstation 104 is configured to detect the weight of the carrier 3 and the silicon wafer, and the unloading workstation 105 is configured to supply the carrier 3 for unloading.

[0065] In this way, the loading workstation 103 can receive the carrier 3, and a device such as a robotic arm can place the carrier 3 on the loading workstation 103. The transportation mechanism 11 transports the carrier 3 on the loading workstation 103 to the weighing workstation 104. The weighing workstation 104 can detect the weight of the carrier 3 and the silicon wafer, so as to be able to inspect the processing situation of the silicon wafer in the previous process (such as the reaction process in the chemical tank). Then, the transportation mechanism 11 transports the carrier 3 on the weighing workstation 104 to the unloading workstation 105, and the unloading workstation 105 can supply a device such as a robotic arm to unload the carrier 3. In addition, since the liquid on the carrier 3 and the silicon wafer is further removed in the silicon wafer blanking device 1, the influence of the weight of the liquid on the weight of the carrier 3 and the silicon wafer can be further reduced, and the accuracy of the inspection of the weighing workstation 104 can be improved.

[0066] Optionally, a pressure sensor (not shown) can be arranged between the bearing component 14 at the weighing workstation 104 and the placement surface 100 to detect the weight of the carrier 3 and the silicon wafer.

[0067] Please refer to Figure 5 , in some embodiments, a chute 106 is provided on the placement surface 100. The transport mechanism 11 includes a sliding member 110 and a lifting member 111. The sliding member 110 is slidably connected to the chute 106. The lifting member 111 is provided on the sliding member 110. The lifting member 111 can move relative to the sliding member 110 in the height direction of the base 10 to abut against or disengage from the carrier 3.

[0068] In this way, the sliding member 110 can drive the lifting member 111 to move between different workstations. After the sliding member 110 moves to the workstation, the lifting member 111 can rise along the height direction of the base 10 and lift the carrier 3, so that the carrier 3 disengages from the bearing member 14. Then, the sliding member 110 drives the lifting member 111 and the carrier 3 to move to the next workstation. After the sliding member 110 moves to the position of another bearing member 14, the lifting member 111 moves relative to the sliding member 110 in the height direction of the base 10, so that the carrier 3 descends and is placed on the bearing member 14.

[0069] Please refer to Figure 6 , in a second aspect, the present invention also discloses a silicon wafer processing system 2, including a drying device 20 and the silicon wafer blanking device 1 as described in the first aspect above. The drying device 20 is used to dry the silicon wafers. The silicon wafer blanking device 1 is arranged downstream of the drying device 20. The transport mechanism 11 of the silicon wafer blanking device 1 is configured to transport the carrier 3, and the liquid removing structure 12 of the silicon wafer blanking device 1 is used to remove the liquid on the carrier 3 and the silicon wafers.

[0070] For the silicon wafer processing system 2 provided in the second aspect of the embodiments of the present invention, since the silicon wafer processing system 2 adopts the silicon wafer blanking device 1 provided in the first aspect of the embodiments of the present invention, by arranging a liquid removing device on the base 10, while ensuring the drying effect on the carrier 3 and the silicon wafers, there is no need to increase the drying time of the carrier 3 on the drying device 20. Instead, the time for the carrier 3 to be transported on the base 10 is used for liquid removal, thereby improving the overall processing efficiency of the silicon wafers.

[0071] The silicon wafer blanking device and the silicon wafer processing system disclosed in the embodiments of the present invention have been introduced in detail above. Specific examples are used in this article to elaborate on the principles and implementation manners of the present invention. The descriptions of the above embodiments are only used to help understand the silicon wafer blanking device and the silicon wafer processing system of the present invention and their core ideas; at the same time, for those of ordinary skill in the art, according to the ideas of the present invention, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A silicon wafer blanking device, characterized in that, Comprising: A base having a placement surface for placing a carrier for holding a silicon wafer. A transport mechanism provided on the base and configured to transport the carrier. And A liquid removal structure provided on the base and configured to remove liquid on the carrier and the silicon wafer.

2. The silicon wafer cutting device according to claim 1, characterized in that, The liquid removal structure includes a liquid absorption component provided on the base and configured to adsorb liquid on the carrier and the silicon wafer, and / or; The liquid removal structure includes a blowing component provided on the base and configured to blow air onto the carrier and the silicon wafer.

3. The silicon wafer cutting device according to claim 2, characterized in that, When the liquid removal structure includes the liquid absorption component, the liquid absorption component is provided on one side of the base, and a liquid absorption channel is provided on the placement surface and extends to one side of the base and communicates with the liquid absorption component.

4. The silicon wafer cutting device according to claim 2, characterized in that, When the liquid removal structure includes a blowing component, the silicon wafer unloading device further includes a ventilation component provided on the base. The ventilation component includes two support portions and a connecting portion. The two support portions extend along the height direction of the base to be located above the placement surface, and the two support portions are spaced apart. The two ends of the connecting portion are respectively connected to the two support portions. The connecting portion is provided with air holes that communicate with the blowing component and are configured to blow air toward the carrier and the silicon wafer.

5. The silicon wafer cutting device according to claim 4, characterized in that, The two support portions are rotatably connected to the base to adjust the angle of the air holes relative to the placement surface.

6. The silicon wafer cutting device according to any one of claims 1-5, characterized in that, A liquid discharge groove is provided on the placement surface for receiving liquid on the carrier and the silicon wafer.

7. The silicon wafer cutting device according to any one of claims 1-5, characterized in that, The number of the liquid removal structures is multiple, and the multiple liquid removal structures are provided on the base at intervals along the transport direction of the transport mechanism.

8. The silicon wafer cutting device according to claim 7, characterized in that, Along the transport direction of the transport mechanism, the placement surface has multiple stations. The multiple liquid removal structures are respectively provided corresponding to the multiple stations. The silicon wafer unloading device further includes multiple bearing components respectively provided at each station. The bearing components are used to bear the carrier, and the transport mechanism is configured to transport the carrier to different bearing components.

9. The silicon wafer cutting device according to claim 8, characterized in that, The multiple stations include a loading station, a weighing station, and an unloading station. The transport mechanism is configured to sequentially transport the carrier at the loading station to the weighing station and the unloading station; The loading station is configured to receive the carrier, the weighing station is configured to detect the weight of the carrier and the silicon wafer, and the unloading station is configured to unload the carrier.

10. A silicon wafer processing system, characterized in that, Including a drying device and the silicon wafer unloading device according to any one of claims 1-9. The drying device is used to dry the silicon wafer, and the silicon wafer unloading device is provided downstream of the drying device.

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