Temperature control device and reaction furnace

Abstract

The utility model relates to the technical field of semiconductors and photovoltaics, in particular to a temperature control device and a reaction furnace, and solves the problem that the temperatures of a furnace chamber and a bearing part cannot be constant due to the fact that the temperatures of the furnace chamber and the bearing part are continuously increased by a heating part in the film deposition process. The temperature control device comprises a heating piece, at least one cooling assembly and an adjusting assembly, at least part of the heating piece stretches into the furnace cavity, and the heating piece is configured to enable the temperature in the furnace cavity to rise; at least part of the cooling assembly is movably connected into the furnace chamber, and the cooling assembly is configured to cool at least one of the furnace chamber and the bearing piece; the adjusting assembly is connected with the cooling assembly, and the adjusting assembly can adjust the cooling speed of the cooling assembly so that the temperature of the furnace cavity and the temperature of the bearing piece can be maintained at the preset temperature. According to the temperature control device and the reacting furnace, the temperature of the furnace cavity and the temperature of the bearing piece can be kept constant, and the machining precision of the sheet is improved.

Description

Technical Field

[0001] The present disclosure relates to the fields of semiconductor and photovoltaic technologies, and particularly to a temperature control device and a reaction furnace. Background Art

[0002] In the thin film production process of solar cells, chemical vapor deposition (CVD) equipment for film coating includes catalytic chemical vapor deposition (CAT-CVD) equipment, plasma enhanced chemical vapor deposition (PECVD) equipment, etc. Among them, the principle of CAT-CVD equipment is that process gases are cracked under the high temperature and catalytic action of a hot wire and then deposited on the surface of a silicon wafer, so as to obtain the required process thin film.

[0003] However, the hot wire will always be in a high temperature heating state in the furnace cavity. During the heating process, heat is radiated, and this heat will cause the temperature of the furnace cavity and the carrier for carrying the sheet in the furnace cavity to rise non-constantly, affecting the process processing effect. Summary of the Utility Model

[0004] In view of this, embodiments of the present disclosure provide a temperature control device and a reaction furnace to solve the problem that during the process of depositing a thin film, the temperature of the furnace cavity and the carrier continuously rises due to the heating element, resulting in the non-constant temperature of the furnace cavity and the carrier, which affects the film forming effect.

[0005] In a first aspect, an embodiment of the present disclosure provides a temperature control device applied to a reaction furnace. The reaction furnace has a furnace cavity configured to accommodate a carrier, and the carrier is configured to carry a sheet. The temperature control device includes: a heating element at least partially extending into the furnace cavity, the heating element being configured to catalytically heat a gas at a high temperature to coat a process surface of the sheet; at least one set of cooling components at least partially movably connected to the furnace cavity, the cooling components being configured to cool at least one of the furnace cavity and the carrier; and an adjustment component connected to the cooling components, the adjustment component being capable of adjusting the cooling rate of the cooling components so that the temperatures of the furnace cavity and the carrier are maintained at a preset temperature.

[0006] In some embodiments, the adjustment component includes: a temperature detection element at least partially extending into the furnace cavity, the temperature detection element being configured to detect the temperature of the furnace cavity and / or the temperature of the carrier; and a temperature adjustment element connected to the cooling components, the temperature adjustment element being configured to increase the cooling rate of the cooling components when the temperature detection element detects that the temperature of the furnace cavity and / or the carrier is higher than the preset temperature, and to decrease the cooling rate of the cooling components when the temperature detection element detects that the temperature of the furnace cavity and / or the carrier is lower than the preset temperature.

[0007] In some embodiments, the cooling component includes: a water-cooled plate connected to the furnace chamber; a water-cooled pipeline arranged on the water-cooled plate, the water-cooled pipeline having an inlet and an outlet; a water inlet pipeline passing through the reaction furnace so that one end of the water inlet pipeline is connected to the inlet and the other end is connected to an external water inlet pipe; a water outlet pipeline passing through the reaction furnace so that one end of the water outlet pipeline is connected to the outlet and the other end is connected to an external water outlet pipe; wherein, a temperature regulating member is arranged on at least one of the water inlet pipeline and the water outlet pipeline, and the temperature regulating member is configured to regulate the water inlet rate of the water inlet pipeline and / or the water outlet rate of the water outlet pipeline to change the water flow rate in the water-cooled pipeline.

[0008] In some embodiments, the temperature regulating member includes: at least one flow meter arranged on the water inlet pipeline and / or the water outlet pipeline, the flow meter being configured to detect the water flow rate flowing from the water inlet pipeline into the water-cooled pipeline and / or the water flow rate flowing out of the water-cooled pipeline into the water outlet pipeline; at least one solenoid valve arranged on the water inlet pipeline and / or the water outlet pipeline, the solenoid valve being used to regulate the water flow rate flowing into and / or out of the water-cooled pipeline.

[0009] In some embodiments, along a first direction, the water-cooled plate is located on one side of the carrier, and the temperature control device further includes: a distance adjusting member connected to the water-cooled plate, the distance adjusting member being configured to drive the water-cooled plate to move along the first direction to approach or move away from the carrier.

[0010] In some embodiments, the reaction furnace is provided with at least one opening communicating with the furnace chamber, the reaction furnace includes at least one chamber door, the chamber door can cover the opening, and the distance adjusting member includes: a driving part arranged on the side of the chamber door away from the furnace chamber; a connecting part passing through the chamber door so that one end of the connecting part is connected to the output end of the driving part and the other end is connected to the water-cooled plate, and the driving part can drive the connecting part to move along the first direction to drive the water-cooled plate to approach or move away from the chamber door.

[0011] In some embodiments, the distance adjusting member further includes: a guide rail arranged on the side of the chamber door away from the furnace chamber, the guide rail extending along the first direction; a guide block slidably connected to the guide rail; a support pipe connected to the guide block, and the support pipe passes through the chamber door and is connected to the water-cooled plate, the guide block can move relative to the guide rail to drive the support pipe to move along the first direction, and the water inlet pipeline and the water outlet pipeline can pass through the lumen of the support pipe to extend out of the furnace chamber.

[0012] In some embodiments, it further includes: a sealing member configured to seal the gap between the connecting part and the chamber door, and / or configured to seal the gap between the support pipe and the chamber door.

[0013] In some embodiments, the reaction furnace is provided with at least one through hole communicating with the furnace chamber, and the heating member includes: at least one mounting part arranged at the position of the reaction furnace corresponding to the through hole; at least one heating part detachably connected to the mounting part, and the heating part can pass through the through hole to extend into the furnace chamber.

[0014] In a second aspect, embodiments of the present disclosure further provide a reaction furnace, including: a furnace body having a furnace cavity configured to accommodate a carrier configured to carry a sheet; the temperature control device described in the above embodiments configured to maintain the temperatures of the furnace cavity and the carrier at a preset temperature.

[0015] The temperature control device and the reaction furnace provided by the embodiments of the present disclosure utilize a cooling component to cool the furnace cavity and the carrier within the furnace cavity, and utilize an adjustment component connected to the cooling component to control the cooling rate of the cooling component for the furnace cavity and the carrier, so that the temperatures of the furnace cavity and the carrier are maintained at a constant temperature without being affected by the continuous heat radiation of the heating wire. The constant temperature environment is conducive to a more uniform film thickness and smaller color difference when the heating wire coats the process surface of the sheet through high-temperature catalytic gas, improving the coating accuracy and ensuring a better process processing effect.

[0016] In addition, by using at least partially movably connected cooling components, the cooling components can cool the temperature within the furnace cavity and can also cool the carrier, so that the temperatures of the furnace cavity and the carrier are quickly maintained at a constant temperature state of the preset temperature, further ensuring the process processing effect of the sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] By describing the embodiments of the present disclosure in more detail in conjunction with the drawings, the above and other objects, features, and advantages of the present disclosure will become more obvious. The drawings are used to provide a further understanding of the embodiments of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the present disclosure and do not constitute a limitation to the present disclosure. In the drawings, the same reference numerals generally represent the same components or steps.

[0018] Figure 1 The figure shows a schematic diagram of a reaction furnace provided by an embodiment of the present disclosure.

[0019] Figure 2 The figure shows a partial enlarged view of a reaction furnace provided by an embodiment of the present disclosure.

[0020] Figure 3 The figure shows a schematic diagram of a cooling component provided by an embodiment of the present disclosure.

[0021] Figure 4 The figure shows a schematic diagram of a water inlet pipeline and a temperature adjustment member provided by an embodiment of the present disclosure.

[0022] Figure 5 The figure shows a schematic diagram of a water outlet pipeline and a temperature adjustment member provided by an embodiment of the present disclosure.

[0023] Figure 6 The figure shows a schematic diagram of the cooperation between a distance adjustment member and a chamber door provided by an embodiment of the present disclosure.

[0024] Reference numerals:

[0025] 10, reactor; 1, temperature control device; 11, heating element; 111, heating part; 112, mounting part; 12, adjustment assembly; 121, temperature detection element; 122, temperature adjustment element; 1221, solenoid valve; 1222, flowmeter; 13, cooling assembly; 131, water inlet pipeline; 132, water outlet pipeline; 133, water-cooled plate; 134, water-cooling pipeline; 1341, inlet; 1342, outlet; 14, distance adjustment element; 141, support pipe; 142, seal; 143, guide rail; 144, guide block; 145, drive part; 146, connecting part; 147, lead screw; 148, nut; 2, furnace body; 2a, furnace cavity; 2b, furnace opening; 2c, observation window; 21, carrier; 22, cavity door; 3, water inlet pipe; 31, water inlet branch; 32, joint; 4, water outlet pipe; X, first direction; Y, second direction. Detailed implementation manners

[0026] The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present disclosure without creative efforts shall fall within the protection scope of the present disclosure.

[0027] Figure 1 The figure shows a schematic diagram of a reactor provided by an embodiment of the present disclosure. Figure 2 The figure shows a partial enlarged view of a reactor provided by an embodiment of the present disclosure. Figure 3 The figure shows a schematic diagram of a cooling assembly provided by an embodiment of the present disclosure. Among them, the direction indicated by arrow X is the first direction, and the direction indicated by arrow Y is the second direction. The first direction X and the second direction Y are perpendicular to each other, and will not be emphasized separately hereinafter.

[0028] The embodiments of the present disclosure provide a temperature control device, such as Figures 1 to 3, applied to the reaction furnace 10, the reaction furnace 10 has a furnace cavity 2a, the furnace cavity 2a is configured to accommodate a carrier 21, the carrier 21 is configured to carry a sheet, and the temperature control device 1 is disposed in the reaction furnace 10. The temperature control device 1 includes a heating element 11, at least one set of cooling components 13 and an adjustment component 12. The heating element 11 at least partially extends into the furnace cavity 2a, and the heating element 11 is configured to catalytically heat the gas at a high temperature to coat the process surface of the sheet. At least one set of cooling components 13 is at least partially movably connected in the furnace cavity 2a, and the cooling component 13 is configured to cool at least one of the furnace cavity 2a and the carrier 21. The adjustment component 12 is connected to the cooling component 13, and the adjustment component 12 can adjust the cooling rate of the cooling component 13 so that the temperatures of the furnace cavity 2a and the carrier 21 are maintained at a preset temperature.

[0029] It can be understood that the reaction furnace 10 can be, for example, a CAT-CVD reaction furnace. The reaction furnace 10 includes a furnace body 2, and the furnace body 2 can be a square plate furnace structure. A square furnace cavity 2a is formed in the plate-shaped furnace body 2. In other embodiments, the reaction furnace 10 can also be other devices that need to heat the furnace cavity 2a through the heating element 11, without specific limitation. In the embodiments of the present disclosure, the CAT-CVD reaction furnace is taken as an example for detailed description.

[0030] Optionally, the carrier 21 can be detachably connected to the furnace cavity 2a of the furnace body 2 in advance, or can enter the furnace cavity 2a after carrying the sheet outside the furnace cavity 2a, which varies according to different reaction furnaces 10. In the embodiments of the present disclosure, the carrier 21 is detachably connected in the furnace cavity 2a, and the specific structure of the carrier 21 will not be elaborated herein.

[0031] Optionally, the furnace body 2 is provided with at least one through hole communicating with the furnace cavity 2a. The heating element 11 includes at least one mounting portion 112 and at least one heating portion 111. The mounting portion 112 is disposed at a position corresponding to the through hole outside the furnace body 2, and the heating portion 111 is detachably connected to the mounting portion 112. The heating portion 111 can pass through the through hole to extend into the furnace cavity 2a. For example, the heating portion 111 can be a heating wire. A plurality of heating wires are respectively detachably connected to the furnace body 2 through the mounting portion 112, and the heating wires pass through the through holes to extend into the furnace cavity 2a. Further, the plurality of heating wires are arranged at intervals in the second direction Y in the furnace cavity 2a, and at least a part of the plurality of heating wires is opposite to the sheet carried by the carrier 21, so that the surrounding gas can be catalytically heated at a high temperature during the process of the heating wire heating and radiating heat, thereby forming a film on the process surface of the sheet. It should be emphasized that the number, shape, and specific position of the heating wires in the furnace cavity 2a (such as the distance between the heating wires and the sheet) can be adaptively adjusted according to requirements, without specific limitation.

[0032] Optionally, the furnace body 2 may include a bottom plate, a top plate, two first side plates, and two second side plates that enclose to form a furnace cavity 2a. The top plate is located above the bottom plate in the vertical direction. The two first side plates are arranged opposite to each other along the second direction Y, and the two second side plates are arranged opposite to each other along the first direction X. The bottom plate, the top plate, the two first side plates, and the two second side plates may be integrally formed or may be provided as a detachable connection structure, without specific limitation. Among them, a furnace opening 2b may be provided on the first side plate for taking and placing the sheet material.

[0033] It can be understood that the furnace body 2 may also be provided with a transparent observation window 2c. The observation window 2c may be provided on the second side plate, and the processing condition of the sheet material in the furnace cavity 2a can be seen through the observation window 2c.

[0034] Exemplarily, a heating wire may be installed on the top plate through the mounting portion 112 to ensure the stability of the heating wire extending into the furnace cavity 2a. The heating wire and the carrier 21 are arranged at intervals. One side of the carrier 21 facing the heating wire is used to carry the sheet material and make the process surface of the sheet material face the heating wire. Optionally, the heating wire and the carrier 21 may be arranged opposite to each other in the vertical direction, or may also be arranged opposite to each other in the first direction X, and can be adaptively adjusted according to the actual situation, without specific limitation.

[0035] The temperature control device 1 provided by the embodiment of the present disclosure can use the cooling component 13 to cool the furnace cavity 2a and the carrier 21 in the furnace cavity 2a, and use the adjustment component 12 connected to the cooling component 13 to control the cooling speed of the cooling component 13 for the furnace cavity 2a and the carrier 21, so that the temperature of the furnace cavity 2a and the carrier 21 is maintained at a constant temperature without being affected by the continuous radiation of heat from the heating wire. The constant temperature environment is conducive to the more uniform film thickness and smaller color difference when the heating wire coats the process surface of the sheet material through high-temperature catalytic gas, improving the coating accuracy and ensuring better process processing effects.

[0036] In addition, since the sheet material is carried on the carrier 21, while the heating wire continuously radiates heat into the furnace cavity 2a, the carrier 21 will also absorb heat and gradually increase in temperature. However, when the furnace cavity 2a is cooled to a preset temperature through the cooling component 13, the cooling speed of the carrier 21 and the carried sheet material is slower than that of the furnace cavity 2a, resulting in the temperature of the carrier 21 still being higher than the preset temperature, which will also affect the constant temperature required to be maintained in the furnace cavity 2a. Therefore, by using at least part of the cooling component 13 that is movably connected, the cooling component 13 can cool the temperature in the furnace cavity 2a and can also cool the carrier 21, so that the temperatures of the furnace cavity 2a and the carrier 21 are quickly maintained at a constant temperature state of the preset temperature, further ensuring the process processing effect of the sheet material.

[0037] It should be emphasized that the preset temperature is the temperature required for processing the sheet in the CAT-CVD reactor. When maintained at this temperature, the heating member 11 can catalytically react with the gas at high temperature to deposit a thin film on the processing surface. Therefore, the preset temperature is the constant temperature required to be maintained during the processing. This temperature can be a specific value or a temperature range, and can be adjusted adaptively according to the actual situation without specific limitation.

[0038] In some embodiments, the adjustment assembly 12 includes a temperature detection member 121, a temperature adjustment member 122, and a control member. At least a part of the temperature detection member 121 extends into the furnace chamber 2a. The temperature detection member 121 is configured to detect the temperature of the furnace chamber 2a and / or the temperature of the carrier member 21; the temperature adjustment member 122 is connected to the cooling assembly 13, and the temperature adjustment member 122 is configured to increase or decrease the cooling rate of the cooling assembly 13; the control member is electrically connected to the temperature detection member 121 and the temperature adjustment member 122 respectively; wherein, when the temperature detection member 121 detects that the temperature of the furnace chamber 2a and / or the carrier member 21 is higher than the preset temperature, the control member can control the temperature adjustment member 122 to increase the cooling rate so that the furnace chamber 2a and / or the carrier member 21 cools back to the preset temperature. When the temperature detection member 121 detects that the temperature of the furnace chamber 2a and / or the carrier member 21 is lower than the preset temperature, the control unit can control the temperature adjustment member 122 to decrease the cooling rate so that the furnace chamber 2a and / or the carrier member 21 heats up back to the preset temperature under the action of the heating member 11. By the cooperation of the temperature detection member 121, the temperature adjustment member 122, and the control member, the cooling rate can be adjusted in real time to improve the temperature control accuracy of the furnace chamber 2a and the carrier member 21, and the temperature can be quickly increased or decreased to adjust to the preset temperature, further improving the processing effect.

[0039] In other embodiments, the adjustment assembly 12 only includes the temperature detection member 121 and the temperature adjustment member 122, without including a control member. The operator can manually adjust the temperature adjustment member 122 according to the data measured by the temperature detection member 121. Exemplarily, when the operator detects that the temperature of the furnace chamber 2a and / or the carrier member 21 is higher than the preset temperature according to the temperature detection member 121, the operator manually adjusts the temperature adjustment member 122 to increase the cooling rate of the cooling assembly 13. Another example is that when the operator detects that the temperature of the furnace chamber 2a and / or the carrier member 21 is lower than the preset temperature according to the temperature detection member 121, the operator manually adjusts the temperature adjustment member 122 to decrease the cooling rate of the cooling assembly 13.

[0040] Figure 4 The figure shows a schematic diagram of the water inlet pipe and the temperature adjustment member provided by an embodiment of the present disclosure. Figure 5 The figure shows a schematic diagram of the water outlet pipe and the temperature adjustment member provided by an embodiment of the present disclosure. Figure 6 The figure shows a schematic diagram of the distance adjustment member cooperating with the chamber door provided by an embodiment of the present disclosure.

[0041] As Figures 3 to 6 , the temperature detection component 121 can be, for example, one or more thermometers. For example, the thermometer is used to detect the temperature inside the furnace cavity 2a, and can be fixedly connected to the furnace body 2 through a fixing structure, and the temperature detection head of the thermometer extends into the furnace cavity 2a. The thermometer can also be used to detect the temperature of the carrier 21. For example, the temperature detection head of the thermometer extends into the furnace cavity 2a near the carrier 21, which will not be elaborated. Optionally, the temperature detection component 121 can also be other devices for detecting temperature, without specific limitation.

[0042] In some embodiments, the cooling component 13 includes a water-cooled plate 133, a water-cooled pipeline 134, a water inlet pipeline 131, and a water outlet pipeline 132. The water-cooled plate 133 is movably connected to the furnace cavity 2a; the water-cooled pipeline 134 is arranged on the water-cooled plate 133, and the water-cooled pipeline 134 has an inlet 1341 and an outlet 1342; the water inlet pipeline 131 passes through the reaction furnace 10 so that one end of the water inlet pipeline 131 is connected to the inlet 1341 and the other end is connected to the external water inlet pipe 3; the water outlet pipeline 132 passes through the reaction furnace 10 so that one end of the water outlet pipeline 132 is connected to the outlet 1342 and the other end is connected to the external water outlet pipe 4; wherein, the temperature regulating component 122 is arranged in at least one of the water inlet pipeline 131 and the water outlet pipeline 132, and the temperature regulating component 122 is configured to regulate the water inlet rate of the water inlet pipeline 131 and / or the water outlet rate of the water outlet pipeline 132 to change the water flow rate in the water-cooled pipeline 134. By connecting the provided water-cooled pipeline 134 to the external inlet and outlet water pipes, water-cooling is achieved, and the circulating cooling water can quickly carry away the heat of the furnace cavity 2a and the carrier 21, having a good cooling effect.

[0043] Optionally, the shape and size of the water-cooled plate 133 and its position relative to the carrier 21 in the furnace cavity 2a can be adaptively adjusted according to the number of the provided cooling components 13, the required cooling capacity, etc., without specific limitation. In the embodiments of the present disclosure, the water-cooled plate 133 is set as a square plate-like structure, and the water-cooled pipeline 134 is arranged on the surface of the water-cooled plate 133 facing the carrier 21. Among them, the water-cooled pipeline 134 can be arranged in different forms such as a zigzag shape, a circular shape, or a wavy shape to cover as much as possible the surface of the water-cooled plate 133 to improve the heat exchange efficiency between the furnace cavity 2a and the carrier 21.

[0044] Optionally, the water-cooled pipeline 134 can be integrally formed with the water-cooled plate 133, that is, a flow channel can be directly arranged inside the water-cooled plate 133, and the water-cooled plate 133 is provided with two through holes communicating with the flow channel to be used as the inlet 1341 and the outlet 1342 respectively. In addition, the inlet 1341 and the water inlet pipeline 131, the outlet 1342 and the water outlet pipeline 132 can be connected through a joint 32, for example, which will not be elaborated.

[0045] Exemplarily, a water inlet pipe 3 and a water outlet pipe 4 are provided outside the reactor 10. The water inlet pipe 3 is used to introduce cold water, and the water outlet pipe 4 is used to export the heated hot water. The water inlet pipe 3 and the water outlet pipe 4 can be detachably connected to the outer side wall of the furnace body 2 through buckles or the like.

[0046] In addition, the cooling assembly 13 can be set to one group, or can be set to two groups or more than two groups. When the cooling assembly 13 is set to multiple groups, the cooling assembly 13 can be connected to one of the second side plates of the furnace body 2, or can be respectively connected to two different second side plates. The water inlet pipe 3 has a plurality of connected water inlet branches 31 to respectively connect to the water inlet pipelines 131 in different cooling assemblies 13, and the water outlet pipe 4 has a plurality of connected water outlet branches to respectively connect to the water outlet pipelines 132 in different cooling assemblies 13, which will not be elaborated here. In the embodiments of the present disclosure, the specific structure of the temperature control device 1 is described in detail with one connected group of cooling assemblies 13.

[0047] In some embodiments, the temperature regulating member 122 includes at least one flowmeter 1222 and at least one solenoid valve 1221. The flowmeter 1222 is disposed in the water inlet pipeline 131 and / or the water outlet pipeline 132. The flowmeter 1222 is configured to detect the water flow rate flowing from the water inlet pipeline 131 to the water cooling pipeline 134, and / or detect the water flow rate flowing out from the water cooling pipeline 134 to the water outlet pipeline 132; the solenoid valve 1221 is disposed in the water inlet pipeline 131 and / or the water outlet pipeline 132, and the solenoid valve 1221 is used to regulate the water flow rate flowing into and / or out of the water cooling pipeline 134.

[0048] In a possible implementation manner, both the flowmeter 1222 and the solenoid valve 1221 are electrically connected to the control member. The control member can obtain the water flow rate flowing into and / or out of the water cooling pipeline 134 measured by the flowmeter 1222. At the same time, the control member can control the opening degree of the solenoid valve 1221 so that the flow rate measured by the flowmeter 1222 reaches a preset value. By using the cooperation of the provided flowmeter 1222 and solenoid valve 1221, the water flow rate in the water cooling pipeline 134 can be adjusted conveniently and quickly according to the temperature in the furnace cavity 2a in real time, so as to increase or decrease the heat exchange capacity, which is beneficial to maintaining the furnace cavity 2a and the carrier 21 at a constant temperature.

[0049] In some other embodiments, the flowmeter 1222 and the solenoid valve 1221 are not electrically connected to the control member. The operator manually controls the opening degree of the solenoid valve 1221 according to the flow rate measured by the flowmeter 1222 to regulate the water flow rate flowing into and / or out of the water cooling pipeline 134.

[0050] It should be emphasized that in the embodiments of the present disclosure, the flowmeter 1222 and the solenoid valve 1221 are respectively provided in two, that is, the flowmeter 1222 and the solenoid valve 1221 can be provided in the water inlet pipe 131 or the water outlet pipe 132. Moreover, the flowmeter 1222 and the solenoid valve 1221 are arranged outside the furnace chamber 2a to ensure that the flowmeter 1222 and the solenoid valve 1221 can work normally under normal temperature and pressure.

[0051] In some embodiments, the temperature control device 1 further includes a distance adjusting member 14. The distance adjusting member 14 is connected to the water cooling plate 133 and is configured to drive the water cooling plate 133 to move along the first direction X to approach or move away from the carrier 21. By providing the distance adjusting member 14, the control of the cooling rate of the carrier 21 can be further improved, so that the furnace chamber 2a and the carrier 21 can be quickly adjusted to a constant temperature state.

[0052] In an alternative embodiment, an opening communicating with the furnace chamber 2a is provided on a second side plate of the furnace body 2. The chamber door 22 can cover the opening. The distance adjusting member 14 is arranged on the chamber door 22 to facilitate the connection of the distance adjusting member 14 and the water cooling plate 133 in the furnace chamber 2a. The distance adjusting member 14 can drive the water cooling plate 133 to move to approach or move away from the carrier 21.

[0053] Specifically, the distance adjusting member 14 includes a driving part 145 and a connecting part 146. The driving part 145 is arranged on the side of the chamber door 22 away from the furnace chamber 2a. The connecting part 146 passes through the chamber door 22 so that one end of the connecting part 146 is connected to the output end of the driving part 145, and the other end is connected to the water cooling plate 133. The driving part 145 can drive the connecting part 146 to move along the first direction X to drive the water cooling plate 133 to approach or move away from the chamber door 22. The driving part 145 is arranged on the chamber door 22 outside the furnace chamber 2a to ensure the normal operation of the driving part 145. The connecting part 146 passes through the chamber door 22 so that the driving part 145 can drive the connected water cooling plate 133 to move, thereby realizing the adjustment of the cooling rate of the carrier 21. When the temperatures of the furnace chamber 2a and the carrier 21 are higher than the preset temperature, the driving part 145 makes the water cooling plate 133 move towards the direction close to the carrier 21, which can increase the cooling rate of the carrier 21, so that the carrier 21 can be quickly cooled to the preset temperature to reach a constant temperature state. When the temperatures of the furnace chamber 2a and the carrier 21 are lower than the preset temperature, the driving part 145 makes the water cooling plate 133 move away from the carrier 21, which can reduce the cooling rate of the carrier 21. Under the continuous heating of the heating element 11, the temperatures of the furnace chamber 2a and the carrier 21 can be quickly raised to the preset temperature.

[0054] It can be understood that when multiple cooling components 13 are provided, the cavity door 22 can be provided as one, and multiple cooling components 13 are all arranged on the same cavity door 22. Alternatively, the cavity door 22 can also be provided as multiple, and multiple cooling components 13 are respectively arranged on different cavity doors 22, and the cavity door 22 can be arranged on different second side plates, without specific limitation.

[0055] Optionally, the water-cooled plate 133 can be arranged parallel to the cavity door 22. The connecting portion 146 can be, for example, a rod-shaped structure extending along the first direction X. A seal 142 can be arranged at the mating gap between the connecting portion 146 and the cavity door 22. By providing the seal 142, while not affecting the reciprocating movement of the connecting portion 146 along the first direction X, it can ensure that the furnace cavity 2a is maintained in a vacuum state.

[0056] It can be understood that the seal 142 can be, for example, a bellows connected between the connecting portion 146 and the cavity door 22, or it can also be other structures that can simultaneously meet the requirements of sealing and the reciprocating movement of the connecting portion 146 along the first direction X, without specific limitation.

[0057] In an alternative embodiment, the driving portion 145 can be, for example, a driving cylinder. The ejector rod of the driving cylinder is connected to the connecting portion 146, and the reciprocating movement of the ejector rod along the first direction X can drive the connecting portion 146 to reciprocate along the first direction X. Alternatively, the driving portion 145 can also be a driving motor. The distance adjusting member 14 further includes a lead screw nut pair structure. The lead screw 147 extends along the first direction X, and the nut 148 is threadedly connected to the lead screw 147. One end of the lead screw 147 is connected to the output end of the driving motor, and the nut 148 is fixedly connected to the connecting portion 146. When the driving motor operates, it can drive the nut 148 to reciprocate along the first direction X on the lead screw 147, thereby driving the connecting portion 146 to reciprocate along the first direction X. This kind of mating structure can more precisely control the moving distance of the water-cooled plate 133 in the first direction X, which is beneficial to better realizing the temperature adjustment of the furnace cavity 2a and the carrier 21.

[0058] In some embodiments, the distance adjusting member 14 further includes a guide rail 143, a guide block 144, and a support pipe 141. The guide rail 143 is disposed on the side of the cavity door 22 away from the furnace cavity 2a, and the guide rail 143 extends along the first direction X. The guide block 144 is slidably connected to the guide rail 143. The support pipe 141 is connected to the guide block 144, and the support pipe 141 passes through the cavity door 22 and is connected to the water-cooling plate 133. The guide block 144 can move relative to the guide rail 143 to drive the support pipe 141 to move along the first direction X, and the water inlet pipe 131 and the water outlet pipe 132 can pass through the lumen of the support pipe 141 to extend out of the furnace cavity 2a. On the one hand, through the cooperation of the guide rail 143 and the guide block 144, when the driving portion 145 drives the connecting portion 146 to reciprocate along the first direction X, the support rod can slide along the guide rail 143 to improve the accuracy and stability of the reciprocating movement of the water-cooling plate 133 along the first direction X. On the other hand, by using the provided support pipe 141, the water inlet pipe 131 and the water outlet pipe 132 pass through the lumen of the support pipe 141. While protecting the water inlet pipe 131 and the water outlet pipe 132, the water inlet pipe 131 and the water outlet pipe 132 can extend out of the furnace cavity 2a and be partially located outside the furnace cavity 2a to be connected to the external water inlet pipe 3 and water outlet pipe 4.

[0059] Optionally, the support pipe 141 can be, for example, a circular tubular structure. One end of the support pipe 141 is fixedly connected to the water-cooling plate 133, and at least a first through hole and a second through hole communicating with the lumen are provided in the part of the support pipe 141 located in the furnace cavity 2a. The water inlet pipe 131 and the water outlet pipe 132 respectively pass through the first through hole and the second through hole to extend into the lumen. The other end of the support pipe 141 is located outside the furnace cavity 2a, so that the water inlet pipe 131 and the water outlet pipe 132 can pass through the lumen and be partially located outside the furnace cavity 2a, so as to facilitate the connection of the water-cooling pipeline 134 in the furnace cavity 2a with the external inlet and outlet water pipes and realize water-cooling circulation for cooling. It should be emphasized that the support pipe 141 can also be provided with different shaped pipe structures such as square and oval. The shape and size of the lumen can be adaptively adjusted according to actual needs, as long as the water inlet pipe 131 and the water outlet pipe 132 can be led out of the furnace cavity 2a, and no specific limitation is made.

[0060] It can be understood that the first through hole and the second through hole can also communicate to form a through hole. The size and shape of the through hole can be adaptively adjusted according to the size and shape of the water inlet pipe 131 and the water outlet pipe 132, etc., and no specific limitation is made.

[0061] In an alternative embodiment, the connections between the water cooling pipeline 134, the water inlet pipeline 131, the water outlet pipeline 132, the water inlet pipe 3, and the water outlet pipe 4 can be connected through a metal joint 32 to avoid leakage. Additionally, at least the water cooling pipeline 134 is arranged as a metal tubular structure to prevent the water in the water cooling pipeline 134 from easily causing the pipe to burst when absorbing heat to become hot water or vaporizing into steam. Optionally, the water inlet pipeline 131 and the water outlet pipeline 132 can also be arranged as metal tubular structures to improve the stability of the water circulation and avoid leakage.

[0062] Optionally, a seal 142 can also be provided at the mating gap between the support pipe 141 and the chamber door 22. By setting the seal 142, while not affecting the reciprocating movement of the support pipe 141 in the first direction X, it ensures that the furnace chamber 2a remains in a vacuum state. The seal 142 can, for example, be a bellows connected between the support pipe 141 and the chamber door 22, or it can also be other structures that can simultaneously meet the requirements of sealing and the reciprocating movement of the support pipe 141 in the first direction X, without specific limitation.

[0063] The working principle of the temperature control device 1 provided by the present disclosure in the reaction furnace 10: Place a sheet on the carrier 21. After closing the furnace door, the sheet is in a vacuum environment inside the furnace chamber 2a, and the reaction furnace 10 starts to coat the process surface of the sheet. At this time, the temperature control device 1 can be in an initial state. In the initial state, the water-cooled plate 133 is at a certain position away from the carrier 21, and the control member controls the solenoid valve 1221 to be in a closed state, and there is no water or some water remains in the water-cooling pipeline 134. During the coating process, the heating member 11 continuously heats to a temperature capable of cracking the gas inside the furnace chamber 2a. At this time, the temperature inside the furnace chamber 2a is the preset temperature. Before the heating member 11 heats the temperature inside the furnace chamber 2a to the preset temperature, as the heating member 11 continuously heats, the temperature of the furnace chamber 2a and the carrier 21 will also increase accordingly. The control member controls the thermometer to work continuously. When the thermometer detects that the temperature inside the furnace chamber 2a and near the carrier 21 exceeds the preset temperature, the control member controls the solenoid valve 1221 to open, and the water in the water-cooling pipeline 134 flows at a first cooling rate, and the control member can control the distance-adjusting member 14 to work, so that the water-cooled plate 133 moves towards the direction close to the carrier 21. During this process, if the speed at which the cold water in the water-cooling pipeline 134 carries the heat inside the furnace chamber 2a is lower than the speed at which the heating member 11 raises the temperature inside the furnace chamber 2a, the control member can control the opening degree of the solenoid valve 1221 to increase, so as to increase the water flow rate, so that the cooling rate of the water-cooling pipeline 134 increases from the first cooling rate to the second cooling rate, and can control the water-cooled plate 133 to further move towards the direction close to the carrier 21, and even can directly contact the surface of the carrier 21, so that the temperature of the furnace chamber 2a and the carrier 21 can be quickly cooled to the preset temperature. When the thermometer detects that the temperature inside the furnace chamber 2a is lower than the preset temperature, the control member can control the opening degree of the solenoid valve 1221 to decrease or even close, so as to reduce the water flow rate, so that the cooling rate of the water-cooling pipeline 134 decreases from the second cooling rate to the third cooling rate. The third cooling rate is between the first cooling rate and the second cooling rate, and can control the water-cooled plate 133 to move away from the carrier 21, so that the cooling rate of the temperature of the furnace chamber 2a and the carrier 21 slows down. Under the heat radiation of the heating member 11, the temperature inside the furnace chamber 2a can quickly rise back to the preset temperature. Thus, in this way, it can be adjusted at any time according to the temperature change inside the furnace chamber 2a to ensure that the temperature inside the furnace chamber 2a is maintained at a constant temperature state, so as to ensure the coating effect of the sheet.

[0064] The embodiment of the present disclosure also provides a reaction furnace, such as Figure 1 , the reaction furnace 10 includes a furnace body 2, a carrier 21 and a temperature control device 1. The furnace body 2 has a furnace chamber 2a. The carrier 21 is located in the furnace chamber 2a. The carrier 21 is configured to carry a sheet. The temperature control device 1 is configured to maintain the temperature of the furnace chamber 2a and the carrier 21 at a preset temperature.

[0065] It should be emphasized that the temperature control device 1 can refer to the relevant descriptions of the above embodiments and will not be elaborated herein.

[0066] In addition, the reaction furnace 10 can be, for example, a CAT-CVD reaction furnace. The reaction furnace 10 includes a furnace body 2, and the furnace body 2 can be a square plate-type furnace structure. A square furnace cavity 2a is formed inside the plate-type furnace body 2. In other examples, the reaction furnace 10 can also be other devices that need to heat the furnace cavity 2a through the heating element 11, and no specific limitation is made.

[0067] In the embodiments of the present disclosure, if not clearly limited, the connection form can be detachable connection by means such as bolts and nuts, screws, buckles, magnetic attraction, etc. In some connections, if there is no special requirement for the form of detachable cooperation, non-detachable connection can be achieved by means such as welding and bonding.

[0068] The basic principles of the present disclosure have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, benefits, effects, etc. mentioned in the present disclosure are only examples and not limitations. It cannot be considered that these advantages, benefits, effects, etc. are essential for each embodiment of the present disclosure. In addition, the above-disclosed specific details are only for the purposes of illustration and easy understanding, rather than limitations. The above details do not limit the present disclosure to necessarily adopt the above specific details for implementation.

[0069] The block diagrams of the devices, apparatuses, equipment, and systems involved in the present disclosure are only illustrative examples and do not intend to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open-ended terms, meaning "including but not limited to", and can be used interchangeably with each other. The word "or" and "and" used herein refer to the word "and / or", and can be used interchangeably with each other, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to", and can be used interchangeably with each other.

[0070] It should also be noted that in the devices, equipment, and methods of the present disclosure, each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of the present disclosure.

[0071] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications to these aspects will be very apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of the present disclosure. Therefore, the present disclosure is not intended to be limited to the aspects shown herein, but rather to the broadest scope consistent with the principles and novel features disclosed herein.

[0072] The foregoing description has been presented for purposes of illustration and description. Furthermore, this description is not intended to limit embodiments of the present disclosure to the form disclosed herein. Although several example aspects and embodiments have been discussed above, those skilled in the art will recognize some variations, modifications, alterations, additions, and subcombinations thereof.

Claims

1. A temperature control device, characterized in that, Applied to a reaction furnace, the reaction furnace having a furnace cavity configured to accommodate a carrier, the carrier being configured to carry a sheet, the temperature control device comprising: A heating element at least partially extending into the furnace cavity, the heating element being configured to catalytically heat a gas at a high temperature to coat a process surface of the sheet; At least one set of cooling components at least partially movably connected within the furnace cavity, the cooling components being configured to cool at least one of the furnace cavity and the carrier; An adjustment component connected to the cooling components, the adjustment component being capable of adjusting the cooling rate of the cooling components so that the temperatures of the furnace cavity and the carrier are maintained at a preset temperature.

2. The temperature control device according to claim 1, wherein The adjustment component comprises: A temperature detection element at least partially extending into the furnace cavity, the temperature detection element being configured to detect the temperature of the furnace cavity and / or detect the temperature of the carrier; A temperature adjustment element connected to the cooling components, the temperature adjustment element being configured to increase the cooling rate of the cooling components when the temperature detection element detects that the temperature of the furnace cavity and / or the carrier is higher than the preset temperature, and to decrease the cooling rate of the cooling components when the temperature detection element detects that the temperature of the furnace cavity and / or the carrier is lower than the preset temperature.

3. The temperature control device according to claim 2, characterized in that, The cooling components comprise: A water-cooled plate connected to the furnace cavity; A water-cooling pipeline arranged on the water-cooled plate, the water-cooling pipeline having an inlet and an outlet; An inlet water pipeline passing through the reaction furnace so that one end of the inlet water pipeline is connected to the inlet and the other end is connected to an external inlet water pipe; An outlet water pipeline passing through the reaction furnace so that one end of the outlet water pipeline is connected to the outlet and the other end is connected to an external outlet water pipe; Wherein, the temperature adjustment element is arranged on at least one of the inlet water pipeline and the outlet water pipeline, the temperature adjustment element being configured to adjust the water inlet rate of the inlet water pipeline and / or the water outlet rate of the outlet water pipeline to change the water flow rate in the water-cooling pipeline.

4. The temperature control device according to claim 3, characterized in that, The temperature adjustment element comprises: At least one flow meter arranged on the inlet water pipeline and / or the outlet water pipeline, the flow meter being configured to detect the water flow rate flowing from the inlet water pipeline into the water-cooling pipeline, and / or detect the water flow rate flowing out of the water-cooling pipeline into the outlet water pipeline; At least one electromagnetic valve arranged on the inlet water pipeline and / or the outlet water pipeline, the electromagnetic valve being used to adjust the water flow rate flowing into and / or out of the water-cooling pipeline.

5. The temperature control device according to claim 3, wherein Along a first direction, the water-cooled plate is located on one side of the carrier, and the temperature control device further comprises: A distance adjustment element connected to the water-cooled plate, the distance adjustment element being configured to drive the water-cooled plate to move along the first direction to approach or move away from the carrier.

6. The temperature control device according to claim 5, wherein, The reaction furnace is provided with at least one opening communicating with the furnace cavity, the reaction furnace comprises at least one cavity door capable of covering the opening, and the distance adjustment element comprises: A driving part arranged on a side of the cavity door away from the furnace cavity; A connecting part passes through the chamber door so that one end of the connecting part is connected to the output end of the driving part, and the other end is connected to the water-cooling plate. The driving part can drive the connecting part to move along the first direction to drive the water-cooling plate to approach or move away from the chamber door.

7. The temperature control device according to claim 6, characterized in that, The distance adjusting member further includes: A guide rail is provided on the side of the chamber door away from the furnace chamber, and the guide rail extends along the first direction; A guide block is slidably connected to the guide rail; A support pipe is connected to the guide block, and the support pipe passes through the chamber door and is connected to the water-cooling plate. The guide block can move relative to the guide rail to drive the support pipe to move along the first direction, and the water inlet pipeline and the water outlet pipeline can pass through the lumen of the support pipe to extend out of the furnace chamber.

8. The temperature control device according to claim 7, characterized in that, It further includes: A seal is configured to seal the gap between the connecting part and the chamber door, and / or is configured to seal the gap between the support pipe and the chamber door.

9. The temperature control device according to any one of claims 1-8, characterized in that, The reaction furnace is provided with at least one through hole communicating with the furnace chamber, and the heating member includes: At least one mounting part is provided at the position of the reaction furnace corresponding to the through hole; At least one heating part is detachably connected to the mounting part, and the heating part can pass through the through hole to extend into the furnace chamber.

10. A reactor, characterized in that, It includes: A furnace body has a furnace chamber, and the furnace chamber is configured to accommodate a carrier, and the carrier is configured to carry a sheet; The temperature control device according to any one of claims 1 to 9 is configured to maintain the temperatures of the furnace chamber and the carrier at a preset temperature.

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