Electroplating assembly
By using an adjustable support mechanism and parallel-mounted electrodes in the electroplating equipment, the problems of poor plating uniformity and aspect ratio during the silicon wafer electroplating process are solved, and thinner gate lines and higher plating efficiency are achieved.
Patent Information
- Application Number
- CN202420848321.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-22
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-04-22
AI Technical Summary
During the silicon wafer electroplating process, the electroplating uniformity and aspect ratio of existing electroplating equipment have poor results, resulting in poor gate wire effect, especially the first gate wire is prone to overload.
An electroplating assembly including a tank body, an electrode and a support mechanism is adopted. The tank body is equipped with an anode and a cathode. The support mechanism is adjustable and parallel to the anode. The silicon wafer is placed on the support mechanism. The cathode is pressed on the silicon wafer to form good contact and is connected to the power supply through a wire to ensure that the electric field wire grows perpendicular to the vertical direction of the silicon wafer.
It achieves a higher aspect ratio and uniformity in the electroplating process, which can make the gate lines thinner, improve the plating effect and production capacity, and reduce the light-shading area, improve the short-circuit current and fill factor.
Smart Images
Figure CN223061115U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electroplating equipment, and particularly relates to an electroplating assembly. Background Art
[0002] Electroplating is based on the principle of electrolytic cell. The coating metal is used as the anode, and the product to be plated (usually a conductor) is used as the cathode. When the two electrodes are immersed in the electrolyte containing the metal ions to be plated and direct current is applied, an oxidation reaction occurs at the interface between the anode and the solution, and a reduction reaction occurs at the interface between the cathode and the solution. The metal to be plated is deposited on the product to be plated, improving the appearance and surface properties.
[0003] When the existing equipment is used for electroplating silicon wafers, a conductive roller or a brush electrode is used to contact the silicon wafer as the negative electrode, and the anode is placed below the roller or between the rollers for electroplating. As the silicon wafer moves on the roller, the current on the silicon wafer will change due to the switching and contact of the conductive roller, resulting in poor electroplating uniformity and aspect ratio. The contact current of the first grid line is relatively large and is extremely prone to overload. Summary of the Utility Model
[0004] (1) An electroplating assembly provided by the utility model alleviates the technical problems of poor electroplating uniformity and aspect ratio in the electroplating process in the prior art.
[0005] (2) Technical Solution
[0006] To solve the above technical problems, an embodiment of the utility model provides an electroplating assembly, which includes a tank body, an electrode, and a support mechanism;
[0007] The tank body is used for storing electroplating solution. The electrode includes an anode and a cathode. The anode is arranged at the bottom inside the tank body and is connected to the positive pole of a power supply, and the cathode is connected to the negative pole of the power supply;
[0008] The support mechanism is arranged in the tank body with an adjustable vertical position and is parallel to the anode. The silicon wafer is placed on the upper surface of the support mechanism, and the cathode presses on the silicon wafer.
[0009] Further, the tank body includes a liquid storage tank, an electroplating tank, and a circulation pump. The electroplating tank is communicated with the liquid storage tank, and the circulation pump is connected between the liquid storage tank and the electroplating tank for pumping the electroplating solution from the liquid storage tank into the electroplating tank.
[0010] Further, the electroplating tank includes an inner tank and an outer tank. The inner tank is arranged inside the outer tank and is used for placing electroplating solution, and the outer tank is used for collecting the electroplating solution overflowing from the inner tank.
[0011] Further, the electroplating tank further includes a liquid inlet pipe and a liquid return pipe;
[0012] The liquid inlet pipe is arranged at the bottom of the inner tank, and one end of the liquid inlet pipe away from the inner tank is connected to the liquid outlet of the circulation pump. The liquid return pipe is arranged at the bottom of the outer tank, and one end of the liquid return pipe away from the outer tank is connected to the liquid storage tank.
[0013] Furthermore, there are a plurality of electroplating tanks, each of which is arranged in parallel and independently communicated with the liquid storage tank.
[0014] Furthermore, the cathode includes an electrode plate and a fixed cathode, the electrode plate is pressed on the silicon wafer in the tank body, and the fixed cathode is respectively connected to the electrode plate and the negative electrode of the power supply.
[0015] Furthermore, the electrode plate includes a plate body and a contact pin, the electrode plate cover is pressed on the silicon wafer in the tank body, one end of the contact pin is connected to the plate body, and the other end is connected to the fixed cathode.
[0016] Furthermore, a light source is provided on the side wall of the electroplating tank between the anode and the cathode.
[0017] Furthermore, the support mechanism includes a plurality of support frames, the support frames are arranged parallel to the bottom wall of the electroplating tank, and each of the support frames is located in the same horizontal plane.
[0018] Furthermore, a plurality of protrusions are provided at intervals on the support frame, and the protrusions are used to support the silicon wafer.
[0019] The beneficial effects of the utility model: the utility model provides an electroplating component, which uses a cathode to press a silicon wafer to fix it on a supporting mechanism, and the cathode forms good contact with the silicon wafer. Since the upper and lower positions of the supporting mechanism in the tank body can be adjusted, the silicon wafer can be fully in contact with the electroplating solution, and then the anode located at the bottom of the tank body is connected to the negative pole of the power supply and the positive pole of the power supply through wires to form a power-on circuit for electroplating. Since the supporting mechanism is arranged in parallel with the anode, the silicon wafer is placed on the supporting mechanism, and the cathode is pressed on the silicon wafer, the anode, the cathode and the silicon wafer are parallel to each other, so that the direction of the electric field lines is perpendicular to the silicon wafer and grows preferentially in the vertical direction of the silicon wafer, so that the gate lines formed by electroplating can have a higher aspect ratio and uniformity, and the gate lines can be made thinner. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0021] Figure 1 Schematic diagram of the overall structure of a plating assembly provided by an embodiment of the present utility model;
[0022] Figure 2 Schematic diagram of the structure of an independent plating tank of a plating assembly provided by an embodiment of the present utility model;
[0023] Figure 3 Schematic diagram of the electrode plate structure of a plating assembly provided by an embodiment of the present utility model;
[0024] Figure 4 Schematic diagram of the support frame structure of a plating assembly provided by an embodiment of the present utility model.
[0025] Icon: 100 - tank body; 110 - plating tank; 111 - inner tank; 112 - outer tank; 113 - liquid inlet pipe; 114 - liquid return pipe; 120 - liquid storage tank; 130 - circulation pump;
[0026] 200 - electrode; 210 - anode; 220 - cathode; 221 - electrode plate; 2211 - plate body; 2212 - contact leg; 222 - fixed cathode;
[0027] 300 - support mechanism; 310 - support frame; 320 - protrusion;
[0028] 400 - power supply;
[0029] 500 - silicon wafer;
[0030] 600 - manual valve;
[0031] 700 - light source. Detailed implementation manners
[0032] Next, the technical solutions of the present utility model will be clearly and completely described in conjunction with the embodiments. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0033] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by terms such as "upper", "lower", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model. In addition, the terms "first", "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.
[0034] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "linkage" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the connection inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. In addition, in the description of the present utility model, unless otherwise stated, the meaning of "a plurality" is two or more.
[0035] As Figures 1 to 4 shown, the present utility model provides an electroplating assembly, which includes a tank body 100, an electrode 200, and a support mechanism 300; the tank body 100 is used for storing electroplating solution, the electrode 200 includes an anode 210 and a cathode 220, the anode 210 is arranged at the bottom inside the tank body 100 and is connected to the positive pole of a power supply 400, and the cathode 220 is connected to the negative pole of the power supply 400; the support mechanism 300 is arranged inside the tank body 100 with an adjustable vertical position and is parallel to the anode 210, a silicon wafer 500 is placed on the upper surface of the support mechanism 300, and the cathode 220 covers and presses on the silicon wafer 500.
[0036] In this embodiment, the silicon wafer 500 is pressed and fixed on the support mechanism 300 by using the cathode 220, and a good contact is formed between the cathode 220 and the silicon wafer 500. Since the vertical position of the support mechanism 300 inside the tank body 100 is adjustable, the silicon wafer 500 can be fully contacted with the electroplating solution. Then, electroplating is carried out by forming an energized circuit through connecting the anode 210 located at the bottom inside the tank body 100 to the negative pole and the positive pole of the power supply 400 through wires respectively. Since the support mechanism 300 is arranged parallel to the anode 210, the silicon wafer 500 is placed on the support mechanism 300, and the cathode 220 presses on the silicon wafer 500, the anode 210, the cathode 220, and the silicon wafer 500 are parallel to each other, so that the direction of the electric field lines is perpendicular to the silicon wafer 500 and preferentially grows in the vertical direction of the silicon wafer 500, thereby enabling the grid lines formed by electroplating to have a relatively high aspect ratio and uniformity, and the grid lines can be made thinner.
[0037] According to an embodiment provided by the present utility model, as Figure 1 and Figure 2 shown, the tank body 100 includes a liquid storage tank 120, an electroplating tank 110, and a circulation pump 130. The electroplating tank 110 is in communication with the liquid storage tank 120, and the circulation pump 130 is connected between the liquid storage tank 120 and the electroplating tank 110 for pumping the electroplating solution from the liquid storage tank 120 into the electroplating tank 110.
[0038] In this embodiment, the tank body 100 includes an electroplating tank 110 and a liquid storage tank 120, and the electroplating tank 110 is in communication with the liquid storage tank 120. Preferably, the volume of the liquid storage tank 120 is set to be relatively large, and its capacity needs to meet the storage requirement of the electroplating solution required by the electroplating tank 110.
[0039] Preferably, the liquid storage tank 120 and the electroplating tank 110 are made of acid and alkali resistant materials, which is convenient for storing the electroplating solution required for electroplating.
[0040] The tank body 100 further includes a circulation pump 130. The electroplating tank 110 is in communication with the liquid storage tank 120 through the circulation pump 130. The circulation pump 130 is used to pump the electroplating solution in the liquid storage tank 120 into the electroplating tank 110.
[0041] According to an embodiment provided by the present utility model, as Figure 1 and Figure 2 shown, the electroplating tank 110 includes an inner tank 111 and an outer tank 112. The inner tank 111 is arranged inside the outer tank 112 and is used to hold the electroplating solution, and the outer tank 112 is used to collect the electroplating solution that overflows from the inner tank 111.
[0042] In this embodiment, the electroplating tank 110 is composed of the inner tank 111 and the outer tank 112 together. The inner tank 111 is arranged inside the outer tank 112. The outer wall of the inner tank 111 and the inner wall of the outer tank 112 jointly enclose an accommodation space, which is used to collect the electroplating solution that overflows from the inner tank 111, which can effectively avoid waste, save resources, and at the same time reduce the use cost of the electroplating assembly.
[0043] According to an embodiment provided by the present utility model, as Figure 1 and Figure 2 shown, the electroplating tank 110 further includes a liquid inlet pipe 113 and a liquid return pipe 114. The liquid inlet pipe 113 is arranged at the bottom of the inner tank 111, and the end of the liquid inlet pipe 113 facing away from the inner tank 111 is connected to the liquid outlet of the circulation pump 130. The liquid return pipe 114 is arranged at the bottom of the outer tank 112, and the end of the liquid return pipe 114 facing away from the outer tank 112 is connected to the liquid storage tank 120.
[0044] In this embodiment, the bottom of the inner tank 111 is in communication with the circulation pump 130 through the liquid inlet pipe 113, and the electroplating solution is pumped from the liquid storage tank 120 into the electroplating tank 110 through the circulation pump 130. The bottom of the outer tank 112 is in communication with the liquid storage tank 120 through the liquid return pipe 114, and the collected electroplating solution that overflows from the inner tank 111 flows into the liquid storage tank 120.
[0045] Optionally, the liquid inlet ends of each liquid inlet pipe 113 are commonly connected to a main liquid inlet pipe 113. The liquid inlet end of the main liquid inlet pipe 113 is connected to a circulation pump 130. Each liquid return pipe 114 can be directly connected to the circulation pump 130, or can be commonly connected to a main liquid return pipe 114 at the liquid outlet end. The liquid outlet end of the main liquid return pipe 114 is directly communicated with the liquid storage tank 120.
[0046] Among them, preferably, a manual valve 600 is provided on each liquid inlet pipe 113 and liquid return pipe 114, and can be switched on and off by manual adjustment.
[0047] According to an embodiment provided by the present utility model, as Figure 1 and Figure 2 shown, a plurality of electroplating tanks 110 are provided. Each electroplating tank 110 is arranged in parallel and is independently communicated with the liquid storage tank 120.
[0048] In this embodiment, a plurality of electroplating tanks 110 are provided, and each electroplating tank 110 is arranged in parallel and independently connected to the liquid storage tank 120. Optionally, the shape and size of the electroplating tank 110 need to meet the size requirements of the silicon wafer 500 to be electroplated, and the depth of the electroplating tank 110 can be adjusted according to the actual use requirements at the electroplating site.
[0049] The plurality of electroplating tanks 110 are respectively communicated with the liquid storage tank 120 through the circulation pump 130. Therefore, each tank can be controlled to be communicated with the liquid storage tank 120 by manually switching the manual valve 600. The circulation pump 130 is used to pump the electroplating solution in the liquid storage tank 120 into the electroplating tank 110. The cooperation of the manual valve 600 and the circulation pump 130 can independently control the start-stop and quantity of the electroplating solution pumped into each electroplating tank 110.
[0050] Among them, optionally, each electroplating tank 110 can be independently communicated with the liquid storage tank 120 by using a circulation pump 130, or a plurality of electroplating tanks 110 can share a circulation pump 130 to be communicated with the liquid storage tank 120, and can be adjusted according to the actual use situation.
[0051] According to an embodiment provided by the present utility model, as Figure 1 and Figure 2 shown, the cathode 220 includes an electrode plate 221 and a fixed cathode 222. The electrode plate 221 covers and presses on the silicon wafer 500 in the tank body 100. The fixed cathode 222 is respectively connected to the electrode plate 221 and the negative electrode of the power supply 400.
[0052] In this embodiment, the electrode plate 221 fits with the silicon wafer 500 by its own gravity, so that a good contact can be formed between the electrode plate 221 and the silicon wafer 500, and then the silicon wafer 500 pressed by the electrode plate 221 is electroplated in the electroplating tank 110.
[0053] The electrode plate 221 is inserted into the fixed cathode 222, so that the silicon wafer 500 pressed below becomes the negative electrode, facilitating electroplating.
[0054] According to an embodiment provided by the present invention, as Figure 1 、 Figure 2 and Figure 3 shown, the electrode plate 221 includes a plate body 2211 and a contact leg 2212. The electrode plate 221 covers the silicon wafer 500 in the groove body 100. One end of the contact leg 2212 is connected to the plate body 2211, and the other end is connected to the fixed cathode 222.
[0055] In this embodiment, the electrode plate 221 includes a plate body 2211 and a contact leg 2212. The plate body 2211 fits with the silicon wafer 500 by its own gravity to form good contact. One end of the contact leg is connected to the plate body 2211, and the other end is inserted into the fixed cathode 222 for conducting electricity. Thus, during the electroplating process, external force is not required for support and conduction, liberating external force and making it easier to obtain higher production capacity during the electroplating process.
[0056] According to an embodiment provided by the present invention, as Figure 1 and Figure 2 shown, a light source 700 is further provided on the side wall of the electroplating tank 110 between the anode 210 and the cathode 220.
[0057] In this embodiment, a light source 700 is further provided on the side wall of the electroplating tank 110 between the anode 210 and the cathode 220. Since the anode 210, the cathode 220 and the silicon wafer 500 are parallel to each other, the direction of the electric field lines is perpendicular to the silicon wafer 500 and preferentially grows in the vertical direction of the silicon wafer 500. Thus, the grid lines formed by electroplating can have a high aspect ratio and uniformity, the grid lines can be made thinner, so the light shielding area will be reduced, effectively improving Isc (short-circuit current). Further, the number of grid lines can be increased, making the FF (fill factor) relatively increased.
[0058] The light source 700 is arranged on the side wall of the electroplating tank 110 and can irradiate the silicon wafer 500. After being irradiated by the light generated by the light source 700, the silicon wafer 500 generates photo carriers, effectively improving the electroplating effect.
[0059] Optionally, the wavelength of the light source 700 can be switched according to different electroplating solution colors to reduce the absorption of light by the electroplating solution.
[0060] According to an embodiment provided by the present invention, as Figure 1 、 Figure 2 and Figure 4As shown, the support mechanism 300 includes a plurality of support frames 310. The support frames 310 are arranged parallel to the bottom wall of the electroplating tank 110, and each support frame 310 is located in the same horizontal plane.
[0061] In this embodiment, the support mechanism 300 includes support frames 310. There are a plurality of support frames 310, which are used to place the silicon wafers 500 and can stably support the silicon wafers 500.
[0062] Among them, optionally, the number of the support frames 310 is at least two, and can also be three, four or more, and can be adjusted according to the shape and size of the silicon wafers 500 actually used in electroplating. As long as the design concept of the present utility model is not departed from, it should belong to the protection scope of the present utility model.
[0063] The support frames 310 are arranged parallel to the bottom wall of the electroplating tank 110, and each support frame 310 is located in the same horizontal plane. Since the silicon wafers 500 are placed on the support frames 310, it can be ensured that the anode 210, the cathode 220 and the silicon wafers 500 are parallel to each other, so that the direction of the electric field lines is perpendicular to the silicon wafers 500 and preferentially grows in the vertical direction of the silicon wafers 500. As a result, the grid lines formed by electroplating can have a relatively high aspect ratio and uniformity, the grid lines can be made thinner, and further, the number of grid lines can be effectively increased, so that the FF (fill factor) will also be relatively increased.
[0064] According to an embodiment provided by the present utility model, as Figure 1 、 Figure 2 and Figure 4 shown, a number of protrusions 320 are provided at intervals on the support frames 310. The protrusions 320 are used to support the silicon wafers 500.
[0065] In this embodiment, by providing a number of protrusions 320 to support the silicon wafers 500, the contact between the support frames 310 and the silicon wafers 500 can be made more stable.
[0066] Among them, preferably, each protrusion 320 is arranged at a certain uniform interval, and the number of protrusions 320 can be adjusted according to actual use requirements.
[0067] The above are only the preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.
Claims
1. An electroplating assembly, characterized in that, It comprises a tank body (100), an electrode (200) and a supporting mechanism (300); The tank body (100) is used to store electroplating solution, the electrode (200) comprises an anode (210) and a cathode (220), the anode (210) is arranged at the bottom of the tank body (100) and is connected to the positive electrode of the power source (400), and the cathode (220) is connected to the negative electrode of the power source (400); The support mechanism (300) is adjustable in up and down position and is arranged in the tank body (100) and is parallel to the anode (210). The silicon wafer (500) is placed on the upper surface of the support mechanism (300), and the cathode (220) is pressed on the silicon wafer (500).
2. The electroplating assembly according to claim 1, wherein The tank body (100) comprises an electroplating tank (110), a liquid storage tank (120) and a circulation pump (130); the electroplating tank (110) and the liquid storage tank (120) are interconnected; the circulation pump (130) is connected between the liquid storage tank (120) and the electroplating tank (110) and is used to pump the electroplating solution from the liquid storage tank (120) into the electroplating tank (110).
3. An electroplating assembly according to claim 2, characterized in that, The electroplating tank (110) comprises an inner tank (111) and an outer tank (112); the inner tank (111) is arranged inside the outer tank (112) and is used to place electroplating liquid; the outer tank (112) is used to collect the electroplating liquid overflowing from the inner tank (111).
4. The electroplating assembly according to claim 3, characterized in that, The electroplating tank (110) further comprises a liquid inlet pipe (113) and a liquid return pipe (114); The liquid inlet pipe (113) is arranged at the bottom of the inner tank (111), and one end of the liquid inlet pipe (113) facing away from the inner tank (111) is connected to the liquid outlet of the circulation pump (130). The liquid return pipe (114) is arranged at the bottom of the outer tank (112), and one end of the liquid return pipe (114) facing away from the outer tank (112) is connected to the liquid storage tank (120).
5. The electroplating assembly according to claim 2, wherein A plurality of the electroplating tanks (110) are provided, and each of the electroplating tanks (110) is arranged in parallel and is independently communicated with the liquid storage tank (120).
6. The electroplating assembly according to claim 1, wherein The cathode (220) comprises an electrode plate (221) and a fixed cathode (222); the electrode plate (221) is pressed onto the silicon wafer (500) in the tank body (100); and the fixed cathode (222) is respectively connected to the electrode plate (221) and the negative electrode of the power source (400).
7. An electroplating assembly according to claim 6, wherein, The electrode plate (221) comprises a plate body (2211) and a contact pin (2212); the electrode plate (221) is pressed onto the silicon wafer (500) in the tank body (100); one end of the contact pin (2212) is connected to the plate body (2211), and the other end is connected to the fixed cathode (222).
8. An electroplating component according to claim 2, characterized in that, A light source (700) is also provided on the side wall of the electroplating tank (110) located between the anode (210) and the cathode (220).
9. An electroplating assembly according to claim 2, characterized in that, The support mechanism (300) includes a plurality of support frames (310), the support frames (310) are arranged parallel to the bottom wall of the electroplating tank (110), and each of the support frames (310) is located in the same horizontal plane.
10. An electroplating assembly according to claim 9, characterized in that, A number of protrusions (320) are provided at intervals on the support frame (310), and the protrusions (320) are used to support the silicon wafer (500).