Pump shell with heat dissipation structure

Abstract

The utility model discloses a pump case with a heat dissipation structure, which relates to the technical field of liquid conveying equipment and comprises a pump case body and a motor arranged in the pump case body, one side of the surface of the pump case body is fixedly connected with a water inlet pipe, and the top surface of the pump case body is fixedly connected with a water outlet pipe. And one side of the surface of the water outlet pipe is fixedly connected with a water distribution pipe, and one end of the water distribution pipe is provided with a cooling assembly capable of cooling water sent by the water distribution pipe. According to the utility model, a part of water can enter the cold making assembly through the water distribution pipe when the device is used, then the water is refrigerated through the cold making assembly, and finally the refrigerated water is fed into the pump shell body through the heat dissipation assembly, so that the temperature of the pump shell body is reduced, a motor is located in a low-temperature space, and the service life of the motor is prolonged. The problem that the service life of the motor is affected by heating and burning caused by long-time use of the motor is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid conveying equipment, in particular to a pump housing with a heat dissipation structure. Background Art

[0002] The main function of a water pump is to convey and lift water. Under the action of the water pump, water can be effectively moved from one place to another, which is crucial for meeting the daily needs of humans, agricultural irrigation, industrial production, urban water supply, and other aspects.

[0003] The applicant found through retrieval that the Chinese patent discloses "a heat dissipation structure of a water pump housing and a water pump", and its publication number is "CN221033306U". This patent mainly forms a heat dissipation cavity by enclosing between the rear end of the pump housing and the rear end cover, suspends the controller in the heat dissipation cavity, and the top of the heat dissipation cavity is the motor, which is beneficial to the heat dissipation of the controller and the motor, ensuring the safe operation of the water pump; at the same time, the motor in the water pump provided by the utility model is a brushless DC motor, which can further reduce the volume of the equipment, has a small weight, low noise, and high safety without sparks. The utility model has the characteristics of good pressure resistance and can adapt to various harsh environments such as mechanical vibration and impact;

[0004] The above device can achieve a certain degree of heat dissipation for the motor and the controller to ensure the safe operation of the water pump through a series of structures. However, the heat dissipation efficiency of the above device by expanding the space around the motor to dissipate the heat of the motor is relatively slow. When the motor runs for a long time, the temperature of the motor itself cannot drop quickly, thus affecting the service life of the motor and then affecting the use of the water pump. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a pump housing with a heat dissipation structure to solve the problem that the heat dissipation method of the above device by expanding the space around the motor for natural cooling of the motor has a low heat dissipation efficiency, and when the motor works for a long time, the motor will be damaged due to low heat dissipation efficiency, thus affecting the use of the water pump as mentioned in the above background art.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A pump housing with a heat dissipation structure includes a pump housing body and a motor arranged inside the pump housing body. One side of the surface of the pump housing body is fixedly connected with a water inlet pipe, the top surface of the pump housing body is fixedly connected with a water outlet pipe, one side of the surface of the water outlet pipe is fixedly connected with a water distribution pipe, and one end of the water distribution pipe is provided with a refrigeration component capable of cooling the water sent by the water distribution pipe. The inside of the pump housing body is provided with a heat dissipation component capable of sending the water cooled by the refrigeration component into the inside of the pump housing body to cool the motor inside the pump housing body.

[0007] Preferably, the refrigeration component includes a refrigeration box, the bottom surface of the refrigeration box is fixedly connected to the top surface of the pump housing body, and one side of the surface of the refrigeration box is fixedly connected to one end of the water distribution pipe away from the water outlet pipe.

[0008] Preferably, the refrigeration component further includes a semiconductor refrigeration sheet, the semiconductor refrigeration sheet is fixedly connected to the inner wall of the refrigeration box, a conduction sealing plate is fixedly connected to the bottom surface of the semiconductor refrigeration sheet, two conduction rods are fixedly connected to the bottom surface of the conduction sealing plate, and a heat sink is fixedly connected to the top surface of the semiconductor refrigeration sheet.

[0009] Preferably, the heat dissipation component includes a first cavity and a second cavity opened inside the pump housing body, a first heat dissipation pipe and a second heat dissipation pipe are respectively fixedly connected to opposite sides of the inner walls of the first cavity and the second cavity, and one ends of the first heat dissipation pipe and the second heat dissipation pipe respectively penetrate through one side of the inner walls of the first cavity and the second cavity and extend to the surface of the pump housing body.

[0010] Preferably, the heat dissipation component further includes a fixing groove, the fixing groove is opened inside the pump housing body, and the fixing groove is respectively communicated with the inside of the first cavity and the second cavity.

[0011] Preferably, the heat dissipation component further includes a shunt pipe, the surface of the shunt pipe is fixedly connected to the inner wall of the fixing groove, two ends of the shunt pipe respectively extend into the first cavity and the second cavity and are respectively connected to the first heat dissipation pipe and the second heat dissipation pipe, a water guide pipe is fixedly connected to the top surface of the shunt pipe, and the top end of the water guide pipe extends into the refrigeration box.

[0012] Preferably, a heat dissipation port is opened on the top surface of the refrigeration box, the heat dissipation port is communicated with the inside of the refrigeration box, and a dust-proof net is fixedly connected to the inner wall of the heat dissipation port.

[0013] Preferably, the axis of the fixing groove is perpendicular to the first cavity and the second cavity respectively, and the first cavity and the second cavity are parallel to each other.

[0014] The technical effects and advantages of the present utility model: Through the water distribution pipe, a part of water can be separated into the inside of the refrigeration component when the device is in use, then the water is refrigerated by the refrigeration component, and finally the refrigerated water is sent into the pump housing body through the heat dissipation component, so as to reduce the temperature of the pump housing body, make the motor in a space with a not-high temperature, and solve the problem that the motor is overheated after long-term use, which affects the service life of the motor. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the present utility model.

[0016] Figure 2This is a front - view sectional structure schematic diagram of the present utility model.

[0017] Figure 3 This is a side - view sectional structure schematic diagram of the present utility model.

[0018] Figure 4 This is the present utility model Figure 2 A magnified structure schematic diagram at position A in it.

[0019] In the figure: 1. Pump housing body; 2. Refrigeration component; 3. Heat - dissipation component; 4. Water inlet pipe; 5. Water outlet pipe; 6. Water distribution pipe; 7. Motor; 8. Heat - dissipation port; 9. Dust - proof net; 201. Refrigeration box; 202. Thermoelectric cooler; 203. Conductive sealing plate; 204. Conductive rod; 205. Heat sink; 301. First cavity; 302. First heat - dissipation pipe; 303. Second cavity; 304. Second heat - dissipation pipe; 305. Fixed groove; 306. Shunt pipe; 307. Water guide pipe. Specific embodiments

[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

[0021] The present utility model provides a pump housing with a heat - dissipation structure as Figures 1-4 shown, which includes a pump housing body 1 and a motor 7 arranged inside the pump housing body 1. One side of the surface of the pump housing body 1 is fixedly connected with a water inlet pipe 4, the top surface of the pump housing body 1 is fixedly connected with a water outlet pipe 5, and one side of the surface of the water outlet pipe 5 is fixedly connected with a water distribution pipe 6. The water distribution pipe 6 can send out a part of the water flowing through the water outlet pipe 5 without affecting the normal use of the device. One end of the water distribution pipe 6 is provided with a refrigeration component 2 that can cool the water sent by the water distribution pipe 6. Inside the pump housing body 1, there is a heat - dissipation component 3 that can send the water cooled by the refrigeration component 2 into the inside of the pump housing body 1 to cool the motor 7 inside the pump housing body 1. Through the water distribution pipe 6, a part of the water can be separated and enter the inside of the refrigeration component 2 during the use of the device, then the water is refrigerated by the refrigeration component 2, and finally the refrigerated water is sent into the inside of the pump housing body 1 through the heat - dissipation component 3, thereby reducing the temperature of the pump housing body 1, making the motor 7 in a space with a relatively low temperature, and solving the problem that the motor 7 may become hot during long - term use and affect its service life.

[0022] Such as Figure 3 and Figure 4As shown in the figure, the refrigeration component 2 includes a refrigeration box 201. The bottom surface of the refrigeration box 201 is fixedly connected to the top surface of the pump housing body 1. One side of the surface of the refrigeration box 201 is fixedly connected to one end of the water distribution pipe 6 away from the water outlet pipe 5. The refrigeration component 2 further includes a semiconductor refrigeration sheet 202, which is fixedly connected to the inner wall of the refrigeration box 201. A conduction sealing plate 203 is fixedly connected to the bottom surface of the semiconductor refrigeration sheet 202. The conduction sealing plate 203 can transfer the temperature while forming a seal to prevent water from directly contacting the semiconductor refrigeration sheet 202. Two conduction rods 204 are fixedly connected to the bottom surface of the conduction sealing plate 203. The conduction rods 204 can directly contact the water to cool the water. A heat sink 205 is fixedly connected to the top surface of the semiconductor refrigeration sheet 202. The heat sink 205 can dissipate heat from the semiconductor refrigeration sheet 202 to prevent the semiconductor refrigeration sheet 202 from getting hot.

[0023] As Figures 1-3 shown, the heat dissipation component 3 includes a first cavity 301 and a second cavity 303 opened in the pump housing body 1. Opposite sides of the inner walls of the first cavity 301 and the second cavity 303 are respectively fixedly connected with a first heat dissipation pipe 302 and a second heat dissipation pipe 304. One ends of the first heat dissipation pipe 302 and the second heat dissipation pipe 304 respectively penetrate through one side of the inner walls of the first cavity 301 and the second cavity 303 and extend to the surface of the pump housing body 1. The heat dissipation component 3 further includes a fixing groove 305, which is opened in the pump housing body 1. The fixing groove 305 is respectively communicated with the inside of the first cavity 301 and the second cavity 303. The heat dissipation component 3 further includes a shunt pipe 306, which can send water into the first heat dissipation pipe 302 and the second heat dissipation pipe 304. The surface of the shunt pipe 306 is fixedly connected to the inner wall of the fixing groove 305. Two ends of the shunt pipe 306 respectively extend into the first cavity 301 and the second cavity 303 and are respectively connected to the first heat dissipation pipe 302 and the second heat dissipation pipe 304. A water guide pipe 307 is fixedly connected to the top surface of the shunt pipe 306. The top end of the water guide pipe 307 extends into the refrigeration box 201.

[0024] As Figure 3 shown, a heat dissipation port 8 is opened on the top surface of the refrigeration box 201. The heat dissipation port 8 can dissipate heat from the semiconductor refrigeration sheet 202 to prevent the semiconductor refrigeration sheet 202 from overheating. The heat dissipation port 8 is communicated with the inside of the refrigeration box 201. A dust-proof net 9 is fixedly connected to the inner wall of the heat dissipation port 8. The axis of the fixing groove 305 is perpendicular to the first cavity 301 and the second cavity 303 respectively. The first cavity 301 and the second cavity 303 are parallel to each other.

[0025] Working principle of the utility model: When the device is in use, first connect the water inlet pipe 4 of the device to the position where water needs to be pumped, then start the device, and then the device starts to pump water. Water enters through the water inlet pipe 4 and is discharged through the water outlet pipe 5. At the same time, a small part of the water enters the interior of the refrigeration box 201 through the branch water pipe 6 when it is discharged through the water outlet pipe 5. When the device is started, the semiconductor refrigeration sheet 202 is electrified, and then the semiconductor refrigeration sheet 202 performs refrigeration work. And through the setting of the conduction sealing plate 203 and the conduction rod 204, the temperature inside the refrigeration box 201 can be made relatively low. Then the water entering the interior of the refrigeration box 201 through the branch water pipe 6 comes into contact with the conduction rod 204 on average, and then the conduction rod 204 cools the water inside the refrigeration box 201. As the device continues to operate, continuous water enters the interior of the refrigeration box 201, and then the refrigerated water enters the interior of the shunt pipe 306 through the action of the guide pipe 307. Then the shunt pipe 306 sends the cold water into the interior of the first radiating pipe 302 and the second radiating pipe 304. At this time, since the interiors of the first radiating pipe 302 and the second radiating pipe 304 are both cold water, the relatively low temperature can be conducted to the pump housing body 1, making the overall temperature of the pump housing body 1 relatively low, so as to continuously cool the motor 7 and the internal controller directly, preventing the motor 7 from being damaged due to excessive temperature, which affects the normal use of the device. Finally, the cold water flowing through the first radiating pipe 302 and the second radiating pipe 304 will continue to be discharged back to the water source. The original text highlights the innovative structure and does not elaborate on the prior art too much.

[0026] Finally, it should be noted that the above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A pump housing with a heat dissipation structure, comprising a pump housing body (1) and a motor (7) arranged inside the pump housing body (1), characterized in that: On one side of the surface of the pump housing body (1), a water inlet pipe (4) is fixedly connected. On the top surface of the pump housing body (1), a water outlet pipe (5) is fixedly connected. On one side of the surface of the water outlet pipe (5), a water distribution pipe (6) is fixedly connected. At one end of the water distribution pipe (6), there is a refrigeration component (2) capable of cooling the water delivered by the water distribution pipe (6). Inside the pump housing body (1), there is a heat dissipation component (3) capable of sending the water cooled by the refrigeration component (2) into the pump housing body (1) to cool the motor (7) inside the pump housing body (1).

2. The pump housing with a heat dissipation structure according to claim 1, wherein: The refrigeration component (2) includes a refrigeration box (201). The bottom surface of the refrigeration box (201) is fixedly connected to the top surface of the pump housing body (1). One side of the surface of the refrigeration box (201) is fixedly connected to one end of the water distribution pipe (6) away from the water outlet pipe (5).

3. The pump housing with a heat dissipation structure according to claim 2, wherein: The refrigeration component (2) further includes a semiconductor refrigeration chip (202). The semiconductor refrigeration chip (202) is fixedly connected to the inner wall of the refrigeration box (201). The bottom surface of the semiconductor refrigeration chip (202) is fixedly connected to a conduction sealing plate (203). The bottom surface of the conduction sealing plate (203) is fixedly connected to two conduction rods (204). The top surface of the semiconductor refrigeration chip (202) is fixedly connected to a heat sink (205).

4. The pump housing with a heat dissipation structure according to claim 2, wherein: The heat dissipation component (3) includes a first cavity (301) and a second cavity (303) opened inside the pump housing body (1). On the opposite sides of the inner walls of the first cavity (301) and the second cavity (303), a first heat dissipation pipe (302) and a second heat dissipation pipe (304) are respectively fixedly connected. One ends of the first heat dissipation pipe (302) and the second heat dissipation pipe (304) respectively penetrate through one side of the inner walls of the first cavity (301) and the second cavity (303) and extend to the surface of the pump housing body (1).

5. The pump housing with a heat dissipation structure according to claim 4, wherein: The heat dissipation component (3) further includes a fixing groove (305). The fixing groove (305) is opened inside the pump housing body (1). The fixing groove (305) is respectively communicated with the inside of the first cavity (301) and the second cavity (303).

6. The pump housing with a heat dissipation structure according to claim 5, characterized in that: The heat dissipation component (3) further includes a shunt pipe (306). The surface of the shunt pipe (306) is fixedly connected to the inner wall of the fixing groove (305). Both ends of the shunt pipe (306) respectively extend into the first cavity (301) and the second cavity (303) and are respectively connected to the first heat dissipation pipe (302) and the second heat dissipation pipe (304). The top surface of the shunt pipe (306) is fixedly connected to a water guide pipe (307). The top end of the water guide pipe (307) extends into the refrigeration box (201).

7. The pump housing with a heat dissipation structure according to claim 2, characterized in that: On the top surface of the refrigeration box (201), a heat dissipation port (8) is opened. The heat dissipation port (8) is communicated with the inside of the refrigeration box (201). The inner wall of the heat dissipation port (8) is fixedly connected with a dust-proof net (9).

8. The pump housing with a heat dissipation structure according to claim 6, wherein: The axis of the fixing groove (305) is perpendicular to the first cavity (301) and the second cavity (303) respectively. The first cavity (301) and the second cavity (303) are parallel to each other.

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