Independent temperature control flip type chip test seat
Through the independent temperature-controlled flip chip test seat, high-temperature testing on a conventional work surface, the problems of inconvenient operation of high-temperature boxes and aging of PCB boards in the existing technology are solved, and efficient and stable chip testing is achieved.
Patent Information
- Application Number
- CN202421237069.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-31
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-05-31
AI Technical Summary
The existing chip test base needs to be placed in a high-temperature box during high-temperature testing, which makes it impossible to observe the test process in time, the PCB board aging accelerates, inconvenient operation and inability to test continuously, which wastes time.
An independent temperature-controlled flip-type chip test seat is designed, and high-temperature testing is carried out on a conventional work surface using electric heating parts. Combined with a rotating connection device, probe testing part and temperature control system, temperature control and probe contact are achieved to avoid overall placement in the high-temperature box.
It realizes high-temperature testing on a conventional work surface, ensures the stability of the PCB board, facilitates batch operation, avoids inconvenience of the high-temperature box and damage to the PCB board, and improves testing efficiency.
Smart Images
Figure CN223065340U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip test sockets, and particularly relates to an independently temperature-controlled flip-chip test socket. Background Art
[0002] Existing test sockets mainly connect chips to test PCBs. When high-temperature requirements are imposed on chips during testing, the entire test socket with the chip can only be placed in a high-temperature oven to heat the chip under test to the required temperature.
[0003] However, during the implementation of the embodiments of this application by the inventors of this application, it was found that the above technologies have at least the following technical problems:
[0004] 1. When high-temperature test performance requirements are imposed on the chip under test, the test board and the socket need to be placed in a high-temperature oven together. During the heating process, the high-temperature oven is a closed environment, making it impossible to observe and determine the test experimental conditions that occur during the test in a timely manner.
[0005] 2. The test scheme PCB board placed together will age and be damaged more quickly in a high-temperature environment, resulting in poor testing and affecting the judgment of test results.
[0006] 3. The overall heating time of the oven is too long, and the waiting time before testing is too long, resulting in serious waste of time during the early verification stage.
[0007] 4. The operation of the test socket in the high-temperature environment of the oven is inconvenient. When replacing the test chip, it can only be operated after the chip has cooled, resulting in discontinuous testing and inability to complete batch testing of chips. Summary of the Utility Model
[0008] The purpose of the utility model is to solve the problems existing in the prior art, and to propose an independently temperature-controlled flip-chip test socket, which does not require the operation of placing the entire test platform in a high-temperature oven. The chip under test can be heated and tested at a high temperature on a conventional workbench surface, increasing the temperature of the chip under test without any impact on the components of the overall test scheme PCB board, effectively ensuring the life and stability of the test scheme board. At the same time, since the device itself is not in the oven, it is also easy to operate and convenient for batch testing of chips.
[0009] To achieve the above purpose, the utility model adopts the following technical solutions:
[0010] An independent temperature-controlled flip-chip test socket, comprising a base plate, on the top of the base plate there is a mounting seat, on the top of the mounting seat there is a loading and testing part, on one side of the loading and testing part there is a pressing part rotatably mounted through a rotating connection device, the loading and testing part includes a base, at the bottom of the base there is a probe testing part, the probe testing part includes a basic probe table integrally provided at the bottom of the base and an auxiliary limiting frame detachably connected above the basic probe table, on one side of the pressing part there is a heat-conducting pressing block, inside the heat-conducting pressing block there is an electric heating element, and one end of the pressing part away from the rotating connection device is detachably connected to the base through a buckle structure.
[0011] Preferably, the rotating connection device includes a rotating shaft and a torsion spring, the rotating shaft is fixedly installed on the pressing part, and the rotating shaft movably penetrates through the loading and testing part, one end of the torsion spring is fixedly connected to the rotating shaft, and the other end is fixedly connected to the loading and testing part.
[0012] Preferably, there are probe holes provided on the basic probe table, and probes are provided inside the probe holes.
[0013] Preferably, the auxiliary limiting frame is a replaceable component and has a variety of selectable sizes.
[0014] Preferably, the buckle structure includes a limiting block provided on one side of the base and a buckle member provided on one side of the pressing part.
[0015] Preferably, a relay, a power supply and a temperature controller are further provided on the base plate, the power supply is electrically connected to the electric heating element and the relay, the relay is electrically connected to the electric heating element and the temperature controller, the temperature controller is electrically connected to a temperature sensor, and the temperature sensor is provided inside the heat-conducting pressing block.
[0016] Preferably, there are several groups of mounting holes provided at the bottom of the mounting seat, and each group of mounting holes is in a rectangular array, and threaded holes are opened at the four corners of the bottom of the base.
[0017] Preferably, the buckle member is made of rigid plastic.
[0018] Preferably, the basic probe table includes an upper needle plate and a lower needle plate, and the upper needle plate and the lower needle plate are arranged in a mirror image.
[0019] Compared with the prior art, the beneficial effects of the present utility model are:
[0020] With the heating element provided in the present utility model, during use, there is no need to put the entire test platform into a high-temperature oven. The chip under test can be heated and tested at a high temperature on a conventional workbench surface, raising the temperature of the chip under test without any impact on the devices on the PCB board of the overall test solution, effectively ensuring the lifespan and stability of the test solution board. At the same time, since the device itself is not in the oven, it is also easy to operate, facilitating the batch testing of chips. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 FIG. 6 is a three-dimensional schematic view of an open state of an independent temperature-controlled flip-type chip test socket proposed by the present utility model;
[0022] Figure 2 FIG. 10 is a front view of an open state of an independent temperature-controlled flip-type chip test socket proposed by the present utility model;
[0023] Figure 3 FIG. 14 is a rear view of an open state of an independent temperature-controlled flip-type chip test socket proposed by the present utility model;
[0024] Figure 4 FIG. 18 is a left view of an open state of an independent temperature-controlled flip-type chip test socket proposed by the present utility model;
[0025] Figure 5 FIG. 22 is a right view of an open state of an independent temperature-controlled flip-type chip test socket proposed by the present utility model;
[0026] Figure 6 FIG. 26 is a top view of an open state of an independent temperature-controlled flip-type chip test socket proposed by the present utility model;
[0027] Figure 7 FIG. 30 is a bottom view of an open state of an independent temperature-controlled flip-type chip test socket proposed by the present utility model;
[0028] Figure 8 FIG. 34 is a combined schematic view of the upper needle board and the lower needle board of an independent temperature-controlled flip-type chip test socket proposed by the present utility model;
[0029] Figure 9 FIG. 38 is a three-dimensional schematic view of a closed state of an independent temperature-controlled flip-type chip test socket proposed by the present utility model;
[0030] Figure 10 FIG. 42 is a front view of a closed state of an independent temperature-controlled flip-type chip test socket proposed by the present utility model;
[0031] Figure 11 FIG. 46 is a rear view of a closed state of an independent temperature-controlled flip-type chip test socket proposed by the present utility model;
[0032] Figure 12Left view of the closed state of an independent temperature-controlled flip-chip test socket proposed by the present utility model;
[0033] Figure 13 Right view of the closed state of an independent temperature-controlled flip-chip test socket proposed by the present utility model;
[0034] Figure 14 Top view of the closed state of an independent temperature-controlled flip-chip test socket proposed by the present utility model;
[0035] Figure 15 Bottom view of the closed state of an independent temperature-controlled flip-chip test socket proposed by the present utility model;
[0036] Figure 16 Circuit schematic diagram of an independent temperature-controlled flip-chip test socket proposed by the present utility model;
[0037] Figure 17 Bottom view of the mounting base of an independent temperature-controlled flip-chip test socket proposed by the present utility model.
[0038] In the figure: 1, bottom plate; 2, mounting base; 3, pressing part; 4, base; 5, basic probe table; 6, auxiliary limiting frame; 7, heat-conducting pressing block; 8, electric heating element; 9, rotating shaft; 10, torsion spring; 11, fastening part; 12, limiting block; 13, relay; 14, power supply; 15, temperature controller; 16, mounting hole; 17, upper needle plate; 18, lower needle plate; 19, temperature sensor. Specific embodiments
[0039] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments.
[0040] Refer to Figures 1-17 , an independent temperature-controlled flip-chip test socket, including a bottom plate 1, a mounting base 2 is arranged on the top of the bottom plate 1, a loading and testing part is installed on the top of the mounting base 2, one side of the loading and testing part is rotatably installed with a pressing part 3 through a rotating connection device, the loading and testing part includes a base 4, a probe testing part is arranged at the bottom of the base 4, the probe testing part includes a basic probe table 5 integrally arranged at the bottom of the base 4 and an auxiliary limiting frame 6 detachably connected above the basic probe table 5, a heat-conducting pressing block 7 is installed on one side of the pressing part 3, an electric heating element 8 is arranged inside the heat-conducting pressing block 7, and one end of the pressing part 3 away from the rotating connection device is detachably connected to the base 4 through a snap structure.
[0041] When this device is in use, there is no need to put the entire test platform into a high-temperature oven. The chip under test can be heated and tested at a high temperature on a regular workbench surface, increasing the temperature of the chip under test without any impact on the components of the overall test scheme PCB board, effectively ensuring the lifespan and stability of the test scheme board. At the same time, since the device itself is not in the oven, it is also easy to operate, facilitating the batch testing of chips.
[0042] In this embodiment, the rotational connection device includes a rotating shaft 9 and a torsion spring 10. The rotating shaft 9 is fixedly installed on the pressing part 3, and the rotating shaft 9 movably penetrates through the loading and testing part. One end of the torsion spring 10 is fixedly connected to the rotating shaft 9, and the other end is fixedly connected to the loading and testing part, facilitating the elastic rotation between the pressing part 3 and the loading and testing part. The elastic force of the torsion spring 10 provides a force for the closing of the pressing part 3 and the loading and testing part, making their closing tight.
[0043] In this embodiment, probe holes are provided on the basic probe table 5, and probes are arranged inside the probe holes.
[0044] In this embodiment, the auxiliary limiting frame 6 is a replaceable component with various selectable sizes, facilitating adaptation to chips of different sizes.
[0045] In this embodiment, the buckle structure includes a limiting block 12 provided on one side of the base 4 and a buckle member 11 provided on one side of the pressing part 3, facilitating the connection of the pressing part 3 and the base 4 through this structure.
[0046] In this embodiment, a relay 13, a power supply 14, and a temperature controller 15 are further provided on the bottom plate 1. The power supply 14 is electrically connected to the heating element 8 and the relay 13. The relay 13 is electrically connected to the heating element 8 and the temperature controller 15. The temperature controller 15 is electrically connected to a temperature sensor 19, and the temperature sensor 19 is arranged in the heat-conducting pressing block 7. The temperature sensor 19 can sense the heating temperature of the heating element 8, and through the temperature controller 15 and the relay 13, precise temperature control can be achieved. The power supply 14 uses a 12V power supply 14 to supply power to this device.
[0047] In this embodiment, a number of groups of mounting holes 16 are provided at the bottom of the mounting seat 2, and each group of mounting holes 16 is arranged in a rectangular array. Threaded holes are provided at the four corners of the bottom of the base 4. Bolts are passed through the mounting holes 16 and connected to the threaded holes, facilitating the installation of an appropriate number of loading and testing parts according to needs, so as to facilitate the user to batch test chips.
[0048] In this embodiment, the buckle member 11 is made of rigid plastic, providing a certain toughness for the buckle member 11, facilitating the disassembly and connection of the pressing part 3 and the base 4.
[0049] In this embodiment, the basic probe station 5 includes an upper probe plate 17 and a lower probe plate 18, the upper probe plate 17 and the lower probe plate 18 are arranged in a mirror image, and the basic probe station 5 composed of the upper probe plate 17 and the lower probe plate 18. The upper probe plate 17 and the lower probe plate 18 can be manufactured by unified mold opening to save costs.
[0050] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.
Claims
1. An independent temperature-controlled flip-chip test socket, characterized in that: It includes a bottom plate, on the top of which there is an installation seat, on the top of the installation seat there is a loading and testing part, on one side of the loading and testing part there is a pressing part rotatably installed through a rotating connection device. The loading and testing part includes a base, at the bottom of the base there is a probe testing part. The probe testing part includes a basic probe table integrally provided at the bottom of the base and an auxiliary limiting frame detachably connected above the basic probe table. On one side of the pressing part there is a heat-conducting pressing block, inside which there is an electric heating element. One end of the pressing part away from the rotating connection device is detachably connected to the base through a buckle structure.
2. The independent temperature-controlled flip-chip test socket according to claim 1, wherein: The rotating connection device includes a rotating shaft and a torsion spring. The rotating shaft is fixedly installed on the pressing part and the rotating shaft movably penetrates through the loading and testing part. One end of the torsion spring is fixedly connected to the rotating shaft and the other end is fixedly connected to the loading and testing part.
3. The independent temperature-controlled flip-chip test socket according to claim 1, wherein: There are probe holes provided on the basic probe table, and probes are provided inside the probe holes.
4. The independent temperature-controlled flip-chip test socket according to claim 2, characterized in that: The auxiliary limiting frame is a replaceable component and has a variety of selectable sizes.
5. An independent temperature-controlled flip-chip test socket according to claim 1, characterized in that: The buckle structure includes a limiting block provided on one side of the base and a buckle part provided on one side of the pressing part.
6. The independent temperature-controlled flip-chip test socket according to claim 1, characterized in that: There are also a relay, a power supply and a temperature controller provided on the bottom plate. The power supply is electrically connected to the electric heating element and the relay. The relay is electrically connected to the electric heating element and the temperature controller. The temperature controller is electrically connected to a temperature sensor, and the temperature sensor is provided inside the heat-conducting pressing block.
7. An independent temperature-controlled flip-chip test socket according to claim 6, characterized in that: There are several groups of mounting holes provided at the bottom of the installation seat, and each group of mounting holes is in a rectangular array. Threaded holes are opened at the four corners of the bottom of the base.
8. An independent temperature-controlled flip-chip test socket according to claim 5, characterized in that: The buckle part is made of rigid plastic.
9. The independent temperature-controlled flip-chip test socket according to claim 3, characterized in that: The basic probe table includes an upper needle plate and a lower needle plate, and the upper needle plate and the lower needle plate are arranged in a mirror image.