High-speed LCD probe card

Abstract

The utility model discloses a high-speed LCD (liquid crystal display) probe card, which belongs to the technical field of probe cards and comprises a substrate. One side of the high-speed circuit board in the thickness direction is provided with a first connection area and a second connection area, and the first connection area is suitable for being connected with the substrate; the high-speed rear module is arranged in the second connecting area, the high-speed front module is arranged on the other side of the high-speed circuit board in the thickness direction, and the high-speed front module is electrically connected with the high-speed circuit board; the plurality of probe assemblies are respectively arranged on one side, deviating from the high-speed circuit board, of the high-speed front module. According to the probe card designed by the utility model, the signal transmission efficiency of the wafer during testing is improved, so that the testing efficiency of the wafer is improved, meanwhile, the signal is processed through the high-speed front module and the high-speed rear module, the signal distortion is reduced, and the accuracy of the testing result is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of probe cards, and in particular relates to a high-speed LCD probe card. Background Art

[0002] In the related technologies, with the advancement of display technology, the operating frequencies of LCD and DDI (Display Driver IC) chips are constantly increasing, which puts higher requirements on testing technology and equipment. Traditional testing methods are often difficult to meet the operating frequency requirements above 500MHz, so it is necessary to develop a probe card that can support higher frequency testing. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the utility model is to propose a high-speed LCD probe card. The high-speed LCD probe card designed according to the utility model improves the signal transmission efficiency of the wafer during testing, thereby improving the test efficiency of the wafer. At the same time, the signal is processed by the high-speed front module and the high-speed rear module, which reduces the signal distortion and improves the accuracy of the test result.

[0004] In order to achieve the above object, the utility model provides the following technical solutions:

[0005] The utility model provides a high-speed LCD probe card, comprising: a substrate; a high-speed circuit board, wherein a first connection area and a second connection area are arranged on one side of the high-speed circuit board in a thickness direction, and the first connection area is suitable for connecting with the substrate; a high-speed rear module, wherein the high-speed rear module is arranged in the second connection area, and the high-speed rear module is electrically connected to the high-speed circuit board; a high-speed front module, wherein the high-speed front module is arranged on the other side of the high-speed circuit board in the thickness direction, and the high-speed front module is electrically connected to the high-speed circuit board; and a plurality of probe assemblies, wherein the plurality of probe assemblies are respectively arranged on one side of the high-speed front module away from the high-speed circuit board.

[0006] According to the high-speed LCD probe card of the utility model, a high-speed front module and a high-speed rear module are respectively arranged on both sides of the high-speed circuit board in the thickness direction, and the high-speed front module is suitable for being electrically connected to multiple probe components, thereby improving the signal transmission efficiency of the wafer during testing, thereby improving the test efficiency of the wafer, and at the same time, the signal is processed by the high-speed front module and the high-speed rear module, thereby reducing signal distortion and improving the accuracy of the test result.

[0007] Furthermore, it also includes: a high-speed output module, which is detachably arranged in the second connection area, and the high-speed output module is suitable for being electrically connected to a high-speed circuit board.

[0008] Further, the probe assembly includes: a base, the base is connected to and electrically connected to the high-speed front-end module, and a surface of the base facing away from the high-speed front-end module is configured as a mounting surface; a plurality of probes, the plurality of probes are respectively arranged on the mounting surface, and the plurality of probes are respectively electrically connected to the base.

[0009] Further, in the length and / or width direction, the distance between the mounting surface and the high-speed front-end module gradually decreases so that the mounting surface has an angle with the horizontal plane.

[0010] Further, the angle between the mounting surface and the horizontal plane is α, satisfying: 10° ≤ α ≤ 30°.

[0011] Further, the probe includes: a connecting portion, the connecting portion is arranged on the mounting surface, and the extending direction of the connecting portion is perpendicular to the mounting surface; a detecting portion, the detecting portion is arranged at the free end of the connecting portion, and the extending direction of the detecting portion is parallel to the height direction.

[0012] Further, it further includes: a fixed handle, the fixed handle is arranged on a side of the substrate facing away from the high-speed circuit board, and the fixed handle is adapted to be connected to a testing device.

[0013] Further, it further includes: a ceramic connecting plate, the ceramic connecting plate is arranged between the fixed handle and the substrate.

[0014] Other advantages, objectives and features of the present utility model will be described in the subsequent description, and to some extent, they are obvious to those skilled in the art, or those skilled in the art can obtain teachings from the practice of the present utility model. The objectives and other advantages of the present utility model can be achieved and obtained through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to make the objectives, technical solutions and beneficial effects of the present utility model clearer, the present utility model provides the following drawings for illustration:

[0016] Figure 1 It is a schematic structural diagram of the probe card of the present utility model;

[0017] Figure 2 It is a partial structural diagram of the probe card of the present utility model;

[0018] Figure 3 It is a connection diagram of the base, the slider and some probes of the present utility model;

[0019] Figure 4 It is a sectional view of the cooperation of the base, the slider and the probe of the present utility model.

[0020] The reference signs in the drawings are as follows:

[0021] 1. Probe card; 2. Wafer;

[0022] 10. Substrate; 20. High-speed circuit board; 30. High-speed rear module; 40. High-speed front module;

[0023] 50. Probe assembly; 51. Base; 511. Slide groove; 52. Probe; 521. Connection part; 522. Detection part; 523. Clamping section; 524. Limiting boss; 53. Slide block; 531. Clamping hole;

[0024] 60. High-speed output module; 70. Fixed handle; 80. Ceramic connection board. Detailed implementation mode

[0025] To make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below in conjunction with embodiments and drawings. The illustrative embodiments and descriptions thereof of the present utility model are only used to explain the present utility model and are not intended to limit the present utility model.

[0026] In the following description, a large number of specific details are set forth in order to provide a thorough understanding of the present utility model. However, it will be apparent to those of ordinary skill in the art that: It is not necessary to employ these specific details to implement the present utility model. In other instances, well-known structures, circuits, materials or methods have not been specifically described in order to avoid obscuring the present utility model.

[0027] Throughout the specification, references to "one embodiment", "an embodiment", "one example" or "an example" mean that a particular feature, structure or characteristic described in connection with the embodiment or example is included in at least one embodiment of the present utility model. Thus, the phrases "one embodiment", "an embodiment", "one example" or "an example" appearing throughout the specification do not necessarily all refer to the same embodiment or example. Furthermore, the specific features, structures or characteristics may be combined in any suitable combination and / or sub-combination in one or more embodiments or examples. In addition, those of ordinary skill in the art should understand that the drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale. The term "and / or" used herein includes any and all combinations of one or more of the associated listed items.

[0028] In the description of the present utility model, it should be understood that the orientation or positional relationships indicated by the terms "front", "rear", "left", "right", "upper", "lower", "vertical", "horizontal", "high", "low", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the protection scope of the present utility model.

[0029] Embodiment 1:

[0030] As Figures 1 - 4 shown, the present utility model provides a high-speed LCD probe card 1, including: a substrate 10, a high-speed circuit board 20, a high-speed rear module 30, a high-speed front module 40, and a plurality of probe assemblies 50. A first connection area and a second connection area are provided on one side of the high-speed circuit board 20 in the thickness direction. The first connection area is adapted to be connected to the substrate 10. The high-speed rear module 30 is disposed in the second connection area. The high-speed rear module 30 is electrically connected to the high-speed circuit board 20. The high-speed front module 40 is disposed on the other side of the high-speed circuit board 20 in the thickness direction. The high-speed front module 40 is electrically connected to the high-speed circuit board 20. The plurality of probe assemblies 50 are respectively disposed on the side of the high-speed front module 40 facing away from the high-speed circuit board 20.

[0031] It should be noted that the probe card 1 of the present application is not only applicable to the test of the LCD wafer 2, but also applicable to the test of the DDI wafer 2. The second connection area is disposed around the outer periphery of the first connection area, so that the layout of the probe card 1 can be made more symmetrical, thereby improving the structural stability and aesthetics of the probe card 1.

[0032] In some embodiments, the substrate 10, the high-speed circuit board 20, and the high-speed front module 40 are sequentially disposed in the thickness direction. A first connection area and a second connection area are provided on the side of the high-speed circuit board 20 facing the substrate 10 in the thickness direction. The first connection area is adapted to connect to the substrate 10. The second connection area is adapted to dispose the high-speed rear module 30. A plurality of probe assemblies 50 are provided on the side of the high-speed front module 40 facing away from the high-speed circuit board 20. The plurality of probe assemblies 50 are respectively electrically connected to the high-speed circuit board 20, and the plurality of probe assemblies 50 are respectively adapted to contact the wafer 2.

[0033] It can be understood that the substrate 10 is the basic support structure of the entire probe card 1. The substrate 10 is usually made of insulating materials such as epoxy glass fiber. The substrate 10 is suitable for providing mechanical support and electrical isolation, and at the same time serves as an installation platform for other components. The high-speed circuit board 20 is a printed circuit board (PCB) designed specifically for high-speed signal transmission. The high-speed circuit board 20 has good signal integrity characteristics. As a signal transmission path, the high-speed circuit board 20 transmits signals from the high-speed front-end module 40 to the high-speed rear-end module 30. The high-speed rear-end module 30 is an electronic component located in the second connection area. The high-speed rear-end module 30 is used to process and analyze signals for further data processing or direct output. The high-speed front-end module 40 is located on the other side of the high-speed circuit board 20. The high-speed front-end module 40 is used to process signals from the probes 52, that is, the high-speed front-end module 40 can amplify, shape, and adjust signals from the probe assembly 50 to improve signal quality and stability. The probe assembly 50 is a set composed of multiple probes 52. The probe assembly 50 is used to contact test points on the wafer 2 to be tested, and the probe assembly 50 is suitable for transmitting signals on the wafer 2 to be tested to the high-speed front-end module 40.

[0034] During operation, multiple probe assemblies 50 contact test points on the wafer 2 to be tested to collect signals. Subsequently, the signals collected by the probe assembly 50 are transmitted to the high-speed front-end module 40 for preprocessing such as amplification and shaping. Then, the preprocessed signals are transmitted to the high-speed rear-end module 30 through the high-speed circuit board 20. At this time, the high-speed rear-end module 30 further processes the signals, such as data analysis and result summarization. Finally, the processed data is output or sent to an external system for analysis.

[0035] According to the high-speed LCD probe card 1 of the present invention, by respectively arranging the high-speed front-end module 40 and the high-speed rear-end module 30 on both sides in the thickness direction of the high-speed circuit board 20, and the high-speed front-end module 40 is suitable for being electrically connected to multiple probe assemblies 50, the signal transmission efficiency of the wafer 2 during testing is improved, thereby improving the testing efficiency of the wafer 2. At the same time, by processing signals through the high-speed front-end module 40 and the high-speed rear-end module 30, signal distortion is reduced, and the accuracy of the test results is improved.

[0036] Embodiment 2:

[0037] Based on Embodiment 1, the probe card 1 further includes: a high-speed output module 60. The high-speed output module 60 is detachably arranged in the second connection area, and the high-speed output module 60 is suitable for being electrically connected to the high-speed circuit board 20.

[0038] It can be understood that the high-speed output module 60 is a module for transferring the processed data from the probe card 1 to an external system. The high-speed output module 60 is suitable for quickly transferring test results, thereby supporting a high-speed data transfer rate.

[0039] The high-speed output module 60 is detachably disposed in the second connection area of the high-speed circuit board 20, and the high-speed output module 60 is electrically connected to the high-speed circuit board 20. Thus, the probe card 1 of the present application can selectively use the high-speed output module 60 according to actual needs. At the same time, the user can also selectively use high-speed output modules 60 of different specifications according to actual needs. Of course, through the above settings, the maintenance and upgrade of the high-speed output module 60 become easier, and the high-speed output module 60 can be updated without replacing the entire probe card 1.

[0040] It should be noted that the high-speed output module 60 is located in the second connection area of the high-speed circuit board 20, and the high-speed output module 60 is adjacent to or directly connected to the high-speed post-module 30. When the signal is processed by the high-speed post-module 30, it will be transmitted to the high-speed output module 60 through the high-speed circuit board 20. The high-speed output module 60 can then convert the processed data into a format suitable for high-speed transmission and send the converted signal to an external test device or control system.

[0041] It is worth mentioning that the probe card 1 of the present application realizes high-speed signal transmission during the test of the wafer 2 through the above settings. After testing, the probe card 1 of the present application can achieve a data transfer rate of up to 3.5 GHz, ensuring that the test results can be quickly transmitted to an external system for analysis.

[0042] In summary, by adding the high-speed output module 60, the entire probe card 1 can not only efficiently collect and process signals, but also quickly transfer the processed data to an external system, thereby improving the efficiency of the entire test process.

[0043] Embodiment 3:

[0044] Based on Embodiment 2, the probe assembly 50 includes: a base 51 and a plurality of probes 52. The base 51 is connected to and electrically connected to the high-speed pre-module 40. One side surface of the base 51 facing away from the high-speed pre-module 40 is configured as a mounting surface, and the plurality of probes 52 are respectively disposed on the mounting surface, and the plurality of probes 52 are respectively electrically connected to the base 51.

[0045] In some embodiments, the base 51 is a structural member for fixing the probes 52 and connecting to the high-speed pre-module 40. The base 51 is suitable for providing electrical connection to transfer the signal from the probes 52 to the high-speed pre-module 40. The probes 52 are small metal pins for contacting the test points on the wafer 2, and the probes 52 can collect signals and transfer the signals to the base 51.

[0046] It can be understood that the base 51 in the probe assembly 50 is electrically connected to the high-speed front-end module 40, and the plurality of probes 52 are fixed on the mounting surface of the base 51. When the probe 52 contacts the test point on the wafer 2, the probe 52 collects signals and transmits them to the high-speed front-end module 40 through the base 51 for processing.

[0047] The base 51 can ensure good contact between the probe 52 and the wafer 2, reducing interference during signal transmission. At the same time, the above settings make the probe 52 easy to replace and convenient for maintenance. Of course, the good electrical connection between the base 51 and the high-speed front-end module 40 ensures the efficiency of signal transmission. In particular, the probe assembly 50 can be customized according to different test requirements to adapt to different types of wafer 2 tests.

[0048] According to some embodiments of the present invention, in the length and / or width direction, the distance between the mounting surface and the high-speed front-end module 40 gradually decreases to make the mounting surface have an angle with the horizontal plane. It can be understood that through the above settings, the mounting surface is configured as an inclined plane. Compared with the horizontal mounting surface, the inclined mounting surface has a larger area. With the same number of probes 52, the inclined mounting surface can provide a larger connection area, making it easier to install the probes 52. Of course, the inclined design of the mounting surface also helps to reduce reflection and interference during signal transmission and improve signal integrity.

[0049] Preferably, the angle between the mounting surface and the horizontal plane is α, satisfying: 10° ≤ α ≤ 30°. It can be understood that when α is between 10° and 30°, the base 51 has a smaller height dimension with a relatively large area of the mounting surface, so that the probe card 1 occupies less space in the height direction, improving the structural compactness of the probe card 1. Of course, the above settings help to reduce reflection and interference during signal transmission, improving signal integrity and test accuracy.

[0050] Embodiment 4:

[0051] Based on Embodiment 3, in this embodiment, the probe 52 includes: a connecting portion 521 and a detecting portion 522. The connecting portion 521 is disposed on the mounting surface, the extending direction of the connecting portion 521 is perpendicular to the mounting surface, and the detecting portion 522 is disposed at the free end of the connecting portion 521, and the extending direction of the detecting portion 522 is parallel to the height direction.

[0052] In some embodiments, the connecting portion 521 is a part of the probe 52. The connecting portion 521 is used to fix the probe 52 on the mounting surface and make electrical connection with the mounting surface. The detecting portion 522 is another part of the probe 52, and the detecting portion 522 is used to contact the test point on the wafer 2.

[0053] It can be understood that the connecting portion 521 of the probe 52 is fixed on the mounting surface, and the connecting portion 521 is perpendicular to the mounting surface to ensure good electrical connection between the probe 52 and the mounting surface. The detecting portion 522 extends along the height direction. Thus, when the detecting portion 522 contacts the wafer 2, the detecting portion 522 can stably contact the surface of the wafer 2, so as to accurately collect signals.

[0054] Of course, when the probe 52 contacts the wafer 2, the connecting portion 521 can provide a certain deformation ability, so that the detecting portion 522 can have a certain moving ability in the height direction, avoiding the detecting portion 522 contacting the wafer 2 in an absolutely rigid contact manner, thereby avoiding damage to the wafer 2 or breakage of the probe 52.

[0055] In some embodiments, a plurality of sliding grooves 511 are provided in the base 51. The plurality of sliding grooves 511 are spaced apart in the length direction, and the extending directions of the plurality of sliding grooves 511 are all perpendicular to the mounting surface. A slider 53 is movably arranged in each sliding groove 511. Each slider 53 extends in the width direction. A plurality of clamping holes 531 are provided at the free end of each slider 53. The extending directions of the plurality of clamping holes 531 are all parallel to the extending direction of the sliding groove 511. The base 51 is further provided with connection holes corresponding to the plurality of clamping holes 531 one by one. A clamping section 523 is provided at one end of the connecting portion 521 away from the detecting portion 522. A limiting boss 524 is provided between the clamping section 523 and the detecting portion 522. Thus, the clamping section 523 of the probe 52 passes through the connection hole and is in clamping fit with the clamping hole 531 to realize the connection between the probe 52 and the base 51.

[0056] It is worth noting that the side wall of the limiting boss 524 abuts against the mounting surface to realize the limitation of the probe 52, so as to ensure that the detecting portion 522 is located at a preset position. In particular, when the probe 52 needs to be disassembled or replaced, only by moving the slider 53 away from the mounting surface can the clamping sections 523 of the plurality of probes 52 be disengaged from the corresponding clamping holes 531, thus realizing the convenient disassembly and replacement of the probe 52.

[0057] Embodiment Five:

[0058] Based on Embodiment One, the probe card 1 further includes: a fixed handle 70. The fixed handle 70 is arranged on the side of the substrate 10 away from the high-speed circuit board 20. The fixed handle 70 is adapted to be connected to a testing device. It can be understood that the fixed handle 70 is located on one side of the substrate 10 in the thickness direction. The fixed handle 70 is connected to the substrate 10. The fixed handle 70 is used to securely fix the entire probe card 1 on the testing device. By connecting the fixed handle 70 with the corresponding components on the testing device, the stability and accurate alignment of the probe card 1 during the testing process are ensured.

[0059] According to some embodiments of the present utility model, the probe card 1 further includes: a ceramic connecting plate 80, and the ceramic connecting plate 80 is disposed between the fixed handle 70 and the substrate 10. It can be understood that the ceramic connecting plate 80 is located between the fixed handle 70 and the substrate 10, and the ceramic connecting plate 80 plays a role of electrical isolation to ensure that no accidental electrical short circuit occurs between the probe card 1 and the testing device. In addition, the ceramic connecting plate 80 also provides additional mechanical support, enhancing the connection stability between the fixed handle 70 and the substrate 10. At the same time, the ceramic connecting plate 80 can also improve the overall structural strength of the probe card 1.

[0060] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solutions of the present utility model and not to limit them. Although the present utility model has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made in form and details without departing from the scope defined by the claims of the present utility model.

Claims

1. A high-speed LCD probe card, characterized in that, Comprising: A substrate (10); A high-speed circuit board (20), on one side of the high-speed circuit board (20) in the thickness direction, a first connection area and a second connection area are provided, and the first connection area is adapted to be connected to the substrate (10); A high-speed rear module (30), the high-speed rear module (30) is arranged in the second connection area, and the high-speed rear module (30) is electrically connected to the high-speed circuit board (20); A high-speed front module (40), the high-speed front module (40) is arranged on the other side of the high-speed circuit board (20) in the thickness direction, and the high-speed front module (40) is electrically connected to the high-speed circuit board (20); A plurality of probe assemblies (50), the plurality of probe assemblies (50) are respectively arranged on the side of the high-speed front module (40) facing away from the high-speed circuit board (20).

2. The high-speed LCD probe card according to claim 1, wherein Further comprising: A high-speed output module (60), the high-speed output module (60) is detachably arranged in the second connection area, and the high-speed output module (60) is adapted to be electrically connected to the high-speed circuit board (20).

3. The high-speed LCD probe card according to claim 2, wherein The probe assembly (50) includes: A base (51), the base (51) is connected and electrically connected to the high-speed front module (40), and the surface of the base (51) facing away from the high-speed front module (40) is configured as a mounting surface; A plurality of probes (52), the plurality of probes (52) are respectively arranged on the mounting surface, and the plurality of probes (52) are respectively electrically connected to the base (51).

4. The high-speed LCD probe card according to claim 3, wherein, In the length and / or width direction, the distance between the mounting surface and the high-speed front module (40) gradually decreases so that the mounting surface has an angle with the horizontal plane.

5. The high-speed LCD probe card according to claim 4, wherein The angle between the mounting surface and the horizontal plane is α, satisfying: 10° ≤ α ≤ 30°.

6. The high-speed LCD probe card according to claim 5, wherein The probe (52) includes: A connecting portion (521), the connecting portion (521) is arranged on the mounting surface, and the extending direction of the connecting portion (521) is perpendicular to the mounting surface; A detecting portion (522), the detecting portion (522) is arranged at the free end of the connecting portion (521), and the extending direction of the detecting portion (522) is parallel to the height direction.

7. The high-speed LCD probe card according to claim 1, characterized in that, Further comprising: A fixed handle (70), the fixed handle (70) is arranged on the side of the substrate (10) facing away from the high-speed circuit board (20), and the fixed handle (70) is adapted to be connected to a testing device.

8. The high-speed LCD probe card according to claim 7, characterized in that, Further comprising: A ceramic connecting plate (80), the ceramic connecting plate (80) is arranged between the fixed handle (70) and the substrate (10).

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