Die bonding device

Abstract

The utility model provides a die bonding device. The die bonding device comprises a substrate feeding mechanism, a chip feeding mechanism and a die bonding mechanism. The substrate feeding mechanism is used for bearing a substrate and controlling the substrate to move, so that a to-be-die-bonded area on the substrate is moved to the die bonding station. The chip feeding mechanism is used for bearing a blue film where chips are stored and controlling the blue film to move so that the to-be-picked chips on the blue film can move to the wafer taking station, and a first included angle larger than 90 degrees and smaller than 180 degrees is formed between the bearing face of the chip feeding mechanism and the bearing face of the substrate feeding mechanism. The die bonding mechanism comprises a rotating part and at least two die bonding assemblies, and the rotating part drives the die bonding assemblies to rotate step by step, so that the die bonding assemblies sequentially rotate to a die taking station and a die bonding station. The die bonding device comprises at least two die bonding assemblies, the die bonding assemblies are driven by the rotation of the rotating part to circularly pick up the chips from the chip feeding mechanism and fix the chips to the substrate located on the substrate feeding mechanism, and the die bonding efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor production equipment, and more specifically to a die bonding device. Background Art

[0002] The die bonding operation is an important process in the production of semiconductor devices, which requires picking up chips from a blue film and mounting the chips onto a substrate. The existing die bonding method is that the die bonding head first sucks up a chip from the blue film, and then under the drive of a translation module, the die bonding head moves the chip above the substrate and mounts the chip at a specified position on the substrate. Subsequently, under the drive of the translation module, the die bonding head moves above the blue film again to suck up the next chip, thereby realizing the process of cyclic chip loading.

[0003] The existing die bonding method requires controlling the back-and-forth movement of the die bonding head. Each reciprocating movement can only complete the die bonding operation of one chip, resulting in low die bonding efficiency. In addition, the frequent translational movement of the die bonding head will cause the machine table to resonate, affecting the die bonding accuracy. Summary of the Utility Model

[0004] In order to solve the above technical problems, this application provides a die bonding device, which adopts the following technical solutions:

[0005] A die bonding device includes a substrate feeding mechanism, a chip feeding mechanism, and a die bonding mechanism, wherein:

[0006] The substrate feeding mechanism is used to carry the substrate and control the movement of the substrate so that the die bonding area on the substrate moves to the die bonding station;

[0007] The chip feeding mechanism is used to carry and tension the blue film storing the chips, and control the movement of the blue film so that the chips to be picked up on the blue film move to the chip picking station. The bearing surface of the chip feeding mechanism is inclined, and a first included angle is formed between the bearing surface of the chip feeding mechanism and the bearing surface of the substrate feeding mechanism, and the first included angle is greater than 90° and less than 180°;

[0008] The die bonding mechanism includes a rotating part and at least two die bonding components. Among them, at least two die bonding components are circumferentially and equidistantly arranged on the rotating part. The rotating part is used to drive the at least two die bonding components to rotate step by step so that each die bonding component rotates to the chip picking station and the die bonding station in turn; when the die bonding component rotates to the chip picking station, it is configured to pick up the chips to be picked up from the chip picking station; when the die bonding component rotates to the die bonding station, it is configured to fix the chips to the die bonding area of the substrate.

[0009] The die bonding device of the present application has a die bonding mechanism including at least two die bonding components. Driven by the rotation of the rotating part, the at least two die bonding components cyclically pick up chips from the chip feeding mechanism and fix the chips to the substrate located on the substrate feeding mechanism, thereby improving the die bonding efficiency. In addition, compared with linear motion, the resonance amplitude of the machine caused by rotational motion is smaller, thus improving the die bonding accuracy. In addition, since an angle greater than 90° and less than 180° is formed between the bearing surface of the chip feeding mechanism and the bearing surface of the substrate feeding mechanism, the distance between the chip picking station and the die bonding station is shortened, that is, the rotational transfer stroke of the die bonding component is shortened, further improving the die bonding efficiency.

[0010] In some embodiments, the rotating part includes a first mounting seat, a first rotation driving member and a turret, wherein: the turret is rotatably mounted on the first mounting seat and is in transmission connection with the first rotation driving member arranged on the first mounting seat, and the first rotation driving member is configured to drive the turret to rotate; at least two die bonding components are equidistantly mounted along the circumference on the mounting surface of the turret.

[0011] A rotating part with a simple structure and stable driving is provided. When the first rotation driving member drives the turret to rotate, it can drive each die bonding component to rotate to the chip picking station and the die bonding station in turn, so that each die bonding component picks up chips from the chip feeding mechanism and fixes the chips to the substrate located on the substrate feeding mechanism.

[0012] In some embodiments, the turret is inclined, a second angle is formed between the mounting surface of the turret and the bearing surface of the substrate feeding mechanism, and a third angle is formed between the mounting surface of the turret and the bearing surface of the chip feeding mechanism.

[0013] Ensure that each die bonding component can smoothly pick up chips from the chip feeding mechanism and fix the chips to the substrate located on the substrate feeding mechanism.

[0014] In some embodiments, the die bonding component includes a second mounting seat, a lifting driving member, a buffer part, a second rotation driving member and a die bonding head, wherein: the second mounting seat is connected to the turret, the buffer part is liftably connected to the second mounting seat and is connected to the lifting driving member arranged on the second mounting seat; the die bonding head is rotatably connected to the lower end of the buffer part, and the lifting driving member is configured to drive the buffer part and the die bonding head to lift; the second rotation driving member is in transmission connection with the die bonding head, and the second rotation driving member is configured to drive the die bonding head to rotate.

[0015] By setting the die bonding component, the die bonding component can pick up the chip from the chip picking station and fix the chip to the die bonding area on the substrate. Due to the buffer part being provided, the suction head realizes elastic downward pressing on the chip, finally enabling the chip to be fully attached to the die bonding area in all directions, improving the die bonding effect and preventing the chip from being damaged by pressing. Due to the second rotation driving component being provided, the suction head can adjust the angle of the chip, so that the chip is aligned with the die bonding area, ensuring the die bonding accuracy.

[0016] In some embodiments, the die bonding component further includes a guide rail vertically arranged on the second mounting seat; the buffer part includes a constant pressure cylinder, the cylinder body of the constant pressure cylinder is slidably connected to the guide rail and connected to the lifting driving component, and the die bonding head is connected to the lower end of the telescopic rod of the constant pressure cylinder.

[0017] Using a constant pressure cylinder as the buffer part makes the elastic downward pressing force of the suction head on the chip remain constant, avoiding damaging the chip by pressing.

[0018] In some embodiments, the second rotation driving component includes a rotation motor, a first gear and a second gear. Among them, the rotation motor is arranged on the second mounting seat, the first gear is connected to the driving end of the rotation motor, the second gear is sleeved on the die bonding head and meshes with the first gear, and the second gear can move up and down relative to the first gear; the rotation motor is configured to drive the first gear to rotate, and when the first gear rotates, it drives the die bonding head to rotate through the second gear.

[0019] A second rotation driving component with a simple structure is provided, which can stably drive the turret and ensure that the die bonding component is accurately driven to the chip picking station or the die bonding station.

[0020] In some embodiments, after each step-by-step rotation of the rotation part, there is a die bonding component at both the chip picking station and the die bonding station.

[0021] When the die bonding component at the chip picking station picks up the chip from the die bonding mechanism, another die bonding component at the die bonding station fixes the chip to the die bonding area on the substrate, thereby further improving the die bonding efficiency.

[0022] In some embodiments, the die bonding device further includes a chip picking positioning mechanism and a chip placing positioning mechanism, where: the chip picking positioning mechanism is configured to position the chip at the chip picking station to obtain the first position information of the chip, and the die bonding component picks up the chip from the chip picking station based on the first position information of the chip; the chip placing positioning mechanism is configured to position the die bonding area at the die bonding station to obtain the position information of the die bonding area, and the die bonding component fixes the chip to the die bonding area based on the position information of the die bonding area.

[0023] By setting up a wafer positioning mechanism, the positioning of the chip located at the crystal picking station is realized, so that the crystal bonding component rotated to the top of the crystal picking station can smoothly pick up the chip to be picked up based on the position information of the chip to be picked up. By setting up a wafer positioning mechanism, the positioning of the area to be crystal bonded at the crystal bonding station is realized, so that the crystal bonding component rotated to the top of the crystal bonding station can accurately fix the chip to the area to be crystal bonded based on the position information of the area to be crystal bonded.

[0024] In some embodiments, a deviation correction station located between the crystal retrieval station and the crystal bonding station is also provided on the rotation path of the crystal bonding component. The crystal bonding mechanism includes at least three crystal bonding components. After each step rotation of the rotating part, there is a crystal bonding component at the crystal retrieval station, the deviation correction station and the crystal bonding station. The crystal bonding device also includes a deviation correction positioning mechanism, which is configured to position the chip on the crystal bonding component located at the deviation correction station to obtain the second position information of the chip. The crystal bonding component adjusts the position of the chip based on the position information of the area to be crystal bonded and the second position information of the chip, and then fixes the chip to the area to be crystal bonded.

[0025] Through the cooperation of the wafer placement positioning mechanism and the deviation correction positioning mechanism, the die bonding component rotated to the top of the die bonding station can adjust the chip to the optimal position and fix it to the area to be bonded based on the position information of the area to be bonded and the position information of the chip adsorbed thereon, thereby further ensuring that the chip is accurately fixed to the area to be bonded.

[0026] In some embodiments, the chip feeding mechanism includes a third mounting seat, a first translation module, a rotation module, a blue film fixing assembly and a chip lifting assembly, wherein: the first translation module is arranged on the third mounting seat, the blue film fixing assembly is rotatably connected to the movable part of the first translation module, and the blue film fixing assembly is transmission-connected to the rotation module arranged on the movable part of the first translation module; the blue film fixing assembly is configured to carry and tension the blue film, the first translation module is configured to drive the blue film fixing assembly to translate, and the rotation module is configured to drive the blue film fixing assembly to rotate, so that the chip to be picked up on the blue film is moved to the crystal retrieval station; the chip lifting assembly is arranged on the third mounting seat and located below the blue film, and the chip lifting assembly is configured to lift the chip to be picked up on the blue film located at the crystal retrieval station upward.

[0027] By setting up the chip feeding mechanism, the chip feeding mechanism can carry and tension the blue film, and can adjust the position and angle of the blue film, so that the chip to be picked up on the blue film can be moved to the crystal retrieval station, ensuring that the crystal bonding component rotated above the crystal retrieval station can smoothly pick up the chip. In addition, by setting up the chip lifting component, the chip to be picked up at the crystal retrieval station can be lifted, so that the chip to be picked up reaches a predetermined height, which facilitates the picking of the crystal bonding component.

[0028] In some embodiments, the substrate feeding mechanism includes a second translation module and a substrate conveying module. Among them, the substrate conveying module is connected to the moving part of the second translation module; the substrate conveying module is configured to carry and convey the substrate, and the second translation module is configured to drive the substrate conveying module to translate so that the area to be die-bonded of the substrate moves to the die-bonding station.

[0029] By arranging the substrate feeding mechanism, the substrate feeding mechanism can carry and convey the substrate and can adjust the position of the substrate, so that the area to be die-bonded of the substrate moves to the die-bonding station, ensuring that the die-bonding component rotated above the die-bonding station can smoothly fix the chip to the area to be die-bonded. Description of the Drawings

[0030] Figure 1 It is a schematic structural diagram of the die-bonding device in the first perspective in the embodiments of the present application;

[0031] Figure 2 It is a schematic structural diagram of the die-bonding device in the second perspective in the embodiments of the present application;

[0032] Figure 3 It is a schematic structural diagram of the die-bonding mechanism in the first perspective in the embodiments of the present application;

[0033] Figure 4 It is a schematic structural diagram of the die-bonding mechanism in the second perspective in the embodiments of the present application;

[0034] Figure 5 It is a schematic structural diagram of the die-bonding mechanism in the third perspective in the embodiments of the present application;

[0035] Figure 6 It is a schematic structural diagram of the die-bonding mechanism in the fourth perspective in the embodiments of the present application;

[0036] Figure 7 It is a schematic structural diagram of the die-bonding component in the first perspective in the embodiments of the present application;

[0037] Figure 8 It is a schematic structural diagram of the chip feeding mechanism in the embodiments of the present application;

[0038] Figure 9 It is a schematic structural diagram of the substrate feeding mechanism in the embodiments of the present application.

[0039] Figures 1 to 9 It includes:

[0040] Chip feeding mechanism 1: the third mounting seat 11, the first translation module 12, the blue film fixing component 13, and the chip lifting component 14;

[0041] Substrate feeding mechanism 2: second translation module 21, substrate conveying module 22, lifting module 23;

[0042] Die bonding mechanism 3: rotating part 31, die bonding assembly 32, first mounting seat 311, first rotation driving part 312, turret 313, second mounting seat 321, lifting driving part 322, buffer part 323, second rotation driving part 324, die bonding head 325, guide rail 326, rotation motor 3241, first gear 3242, second gear 3243;

[0043] Chip picking and positioning mechanism 4;

[0044] Chip placing and positioning mechanism 5;

[0045] Deviation correction and positioning mechanism 6;

[0046] Mounting frame 7. Detailed implementation manners

[0047] To make the above objects, features, and advantages of the present application more obvious and understandable, the present application will be further described in detail below with reference to the accompanying drawings and specific implementation manners.

[0048] As Figures 1 to 6 shown, the die bonding device of the embodiment of the present application includes a chip feeding mechanism 1, a substrate feeding mechanism 2, and a die bonding mechanism 3, wherein:

[0049] The substrate feeding mechanism 2 is used to carry the substrate and control the movement of the substrate so that the die bonding area on the substrate moves to the die bonding station.

[0050] The chip feeding mechanism 1 is used to carry and tension the blue film storing the chips, and control the movement of the blue film so that the chips to be picked up on the blue film move to the chip picking station. The bearing surface of the chip feeding mechanism 1 is inclined. A first included angle is formed between the bearing surface of the chip feeding mechanism 1 and the bearing surface of the substrate feeding mechanism 2. The first included angle is greater than 90° and less than 180°. For example, the first included angle is 135°.

[0051] The die bonding mechanism 3 includes a rotating part 31 and at least two die bonding assemblies 32. For example, Figures 3 to 6 as shown in the embodiment, the die bonding mechanism 3 is provided with four die bonding assemblies 32. The four die bonding assemblies 32 are arranged equidistantly in the circumferential direction on the rotating part 31. The rotating part 31 is used to drive the four die bonding assemblies 32 to rotate step by step so that each die bonding assembly 32 rotates to the chip picking station and the die bonding station in turn. When the die bonding assembly 32 rotates to the chip picking station, it is configured to pick up the chips to be picked up from the chip picking station. When the die bonding assembly 32 rotates to the die bonding station, it is configured to fix the chips to the die bonding area of the substrate.

[0052] In the die bonding device according to the embodiment of the present application, the die bonding mechanism 3 includes at least two die bonding components 32. Driven by the rotation of the rotating part, the at least two die bonding components 32 cyclically pick up chips from the chip feeding mechanism 1 and fix the chips to the substrate located on the substrate feeding mechanism 2, thereby improving the die bonding efficiency. In addition, compared with linear motion, the resonance amplitude of the machine caused by rotational motion is smaller, thereby improving the die bonding accuracy. In addition, since an angle greater than 90° and less than 180° is formed between the bearing surface of the chip feeding machine 1 and the bearing surface of the substrate feeding mechanism 2, the distance between the chip picking station and the die bonding station is shortened, that is, the rotational transfer stroke of the die bonding component 32 is shortened, further improving the die bonding efficiency.

[0053] As Figures 3 to 6 shown, optionally, the rotating part 31 includes a first mounting seat 311, a first rotation driving member 312 and a turret 313, wherein: the turret 313 is rotatably mounted on the first mounting seat 311 and is in transmission connection with the first rotation driving member 312 arranged on the first mounting seat 311, and the first rotation driving member 312 is configured to drive the turret 313 to rotate. At least two die bonding components 32 are equidistantly arranged along the circumference on the mounting surface of the turret 313.

[0054] Figures 3 to 6 In the embodiment shown, 4 die bonding components 32 are equidistantly arranged along the circumference at the edge of the turret 313. The first rotation driving member 312 drives the turret 313 to step-rotate once, and the turret 313 rotates 90°. By setting the positions of the chip picking station and the die bonding station, the chip picking station and the die bonding station are arranged at the edge of the turret 313. Specifically, the chip picking station and the die bonding station are arranged on the movement track of the die bonding component 32. It can be realized that the 4 die bonding components 32 can sequentially rotate to the chip picking station and the die bonding station. In addition, after each rotation of the turret 313, there is a die bonding component 32 at both the chip picking station and the die bonding station. While the die bonding component at the chip picking station picks up the chip, the die bonding component 32 at the die bonding station fixes the picked-up chip to the substrate, thereby further improving the die bonding efficiency.

[0055] Of course, other numbers of die bonding components 32 such as 2, 3, 5, etc. can also be set. For example, in order to save costs, only two die bonding components 32 can be set. The first rotation driving member 312 drives the turret 313 to step-rotate once, and the turret 313 rotates 180°. In this way, the position exchange of the two die bonding components 32 between the chip picking station and the die bonding station can be implemented, so that the two die bonding components 32 alternately pick up chips from the blue film at the chip picking station and alternately fix the chips to the area to be die bonded at the die bonding station.

[0056] As Figures 1 to 2As shown, optionally, the turret 313 is inclined, and a second included angle is formed between the mounting surface of the turret 313 and the bearing surface of the substrate feeding mechanism 2, and a third included angle is formed between the mounting surface of the turret 313 and the bearing surface of the chip feeding mechanism 1. In this way, it is ensured that each die bonding component 32 can pick up chips from the chip feeding mechanism 1 more smoothly and fix the chips to the substrate located on the substrate feeding mechanism 2.

[0057] As Figure 7 As shown, optionally, the die bonding component 32 includes a second mounting base 321, a lifting driving member 322, a buffer portion 323, a second rotation driving member 324 and a die bonding head 325, wherein: The second mounting base 321 is connected to the turret 313, the buffer portion 323 is connected to the second mounting base 321 in a liftable manner and is connected to the lifting driving member 322 provided on the second mounting base 321. The die bonding head 325 is rotatably connected to the lower end of the buffer portion 323, and the lifting driving member 322 is configured to drive the buffer portion 323 and the die bonding head 325 to lift. The second rotation driving member 324 is in transmission connection with the die bonding head 325, and the second rotation driving member 324 is configured to drive the die bonding head 325 to rotate.

[0058] When the die bonding component 32 rotates to the chip picking station driven by the turret 313, the lifting driving member 322 drives the die bonding head 325 to descend and then ascend, so as to drive the die bonding head 325 to pick up chips from the chip picking station.

[0059] When the die bonding component 32 rotates to the die bonding station driven by the turret 313, the lifting driving member 322 drives the die bonding head 325 to descend, so as to drive the die bonding head 325 to press the chip down to the area to be die bonded. During the process of the die bonding head 325 pressing down the chip, the buffer portion 323 generates elastic deformation, and finally the chip is elastically pressed against the area to be die bonded, so as to form an all-round fit with the area to be die bonded, improving the die bonding effect and preventing the chip from being damaged.

[0060] In addition, after the die bonding head 325 picks up chips from the chip picking station, the second rotation driving member 324 can drive the die bonding head 325 to rotate in the horizontal plane, so as to adjust the angle of the chips, align the chips with the area to be die bonded, and finally ensure the die bonding accuracy. For example, both the chip and the area to be die bonded are square. By adjusting the angle of the chip, the four sides of the chip can be made parallel to the four sides of the area to be die bonded respectively.

[0061] As Figure 7As shown, optionally, the die bonding assembly 32 further includes a guide rail 326 disposed on the second mounting base 321 in the vertical direction. The buffer portion 323 includes a constant pressure cylinder, the cylinder body of the constant pressure cylinder is slidably connected to the guide rail 326 and connected to the lifting drive member 322, and the die bonding head 325 is connected to the lower end of the telescopic rod of the constant pressure cylinder. Using a constant pressure cylinder as the buffer portion makes the elastic downward pressure of the suction head 325 on the chip remain constant, avoiding damage to the chip.

[0062] Optionally, the second rotation drive member 324 includes a rotation motor 3241, a first gear 3242, and a second gear 3243. Among them, the rotation motor 3241 is disposed on the second mounting base 321, the first gear 3242 is connected to the drive end of the rotation motor 3241, the second gear 3243 is sleeved on the die bonding head 325 and meshes with the first gear 3242, and the second gear 3243 can move up and down relative to the first gear 3242. The rotation motor 3241 is configured to drive the first gear 3242 to rotate, and when the first gear 3242 rotates, it drives the die bonding head 325 to rotate through the second gear 3243.

[0063] As Figure 3 shown, optionally, the die bonding device in the embodiment of the present application further includes a chip picking and positioning mechanism 4 and a chip placing and positioning mechanism 5, wherein: the chip picking and positioning mechanism 4 is configured to position the chip located at the chip picking station to obtain the first position information of the chip, and the die bonding assembly 32 picks up the chip from the chip picking station based on the first position information of the chip, so as to ensure that the chip can be picked up smoothly.

[0064] The chip placing and positioning mechanism 5 is configured to position the area to be die bonded located at the die bonding station to obtain the position information of the area to be die bonded, and the die bonding assembly 32 fixes the chip to the area to be die bonded based on the position information of the area to be die bonded, so as to ensure that the chip can be accurately fixed to the area to be die bonded.

[0065] Optionally, for the case where the number of die bonding assemblies 32 is three or more. There is also a deviation correction station located between the chip picking station and the die bonding station on the rotation path of the die bonding assembly 32. After each step rotation of the rotating portion, there is a die bonding assembly 32 at the chip picking station, the deviation correction station, and the die bonding station.

[0066] Correspondingly, the die bonding device in the embodiment of the present application further includes a deviation correction and positioning mechanism 6, and the deviation correction and positioning mechanism 6 is configured to position the chip on the die bonding assembly 32 located at the deviation correction station to obtain the second position information of the chip. The die bonding assembly 32 adjusts the position of the chip based on the position information of the area to be die bonded and the second position information of the chip, and then fixes the chip to the area to be die bonded.

[0067] As Figure 8As shown, optionally, the chip feeding mechanism 1 includes a third mounting base 11, a first translation module 12, a rotation module (not shown in the figure), a blue film fixing component 13, and a chip lifting component 14, where: The first translation module 12 is disposed on the third mounting base 11, the blue film fixing component 13 is rotatably connected to the moving part of the first translation module 12, and the blue film fixing component 13 is in transmission connection with the rotation module disposed on the moving part of the first translation module 12. The blue film fixing component 13 is configured to carry and tension the blue film, the first translation module 12 is configured to drive the blue film fixing component 13 to translate, and the rotation module is configured to drive the blue film fixing component 13 to rotate, so that the chips to be picked up on the blue film are moved to the crystal picking station.

[0068] The chip lifting component 14 is disposed on the third mounting base 11 and is located below the blue film. The chip lifting component 14 is configured to lift upward the chips to be picked up on the blue film at the crystal picking station.

[0069] In order to flexibly adjust the position of the blue film on the horizontal plane, optionally, the first translation module 12 may be composed of an X-axis translation module and a Y-axis translation module. Among them, the Y-axis translation module is connected to the moving part of the X-axis translation module, and the rotation module is connected to the moving part of the Y-axis translation module. The X-axis translation module can drive the blue film fixing component 13 to translate on the X-axis, and the Y-axis translation module can drive the blue film fixing component 13 to translate on the Y-axis. The rotation module drives the blue film fixing component 13 to rotate in the horizontal plane. Through the cooperation and adjustment of the X-axis translation module, the Y-axis translation module, and the rotation module, it can be ensured that the chips to be picked up on the blue film can be accurately moved to the crystal picking station.

[0070] Both the X-axis translation module and the Y-axis translation module can adopt various existing linear drive modules, such as a cylinder drive module composed of a cylinder, a slide rail, and a slider, or a screw drive module composed of a motor, a screw, and a screw nut.

[0071] The lifting component is, for example, a lifting cylinder or a pneumatic ejector pin, which realizes the lifting of the chips to be picked up at the crystal picking station, so that the chips to be picked up reach a predetermined height, facilitating the picking of the die bonding component 32.

[0072] As Figure 9 As shown, optionally, the substrate feeding mechanism 2 includes a second translation module 21 and a substrate conveying module 22, where the substrate conveying module 22 is connected to the moving part of the second translation module 21. The substrate conveying module 22 is configured to carry and convey the substrate, and the second translation module 21 is configured to drive the substrate conveying module 22 to translate, so that the die bonding area of the substrate is moved to the die bonding station.

[0073] Similarly, in order to flexibly adjust the position of the substrate on the horizontal plane, optionally, the second translation module 21 may also be composed of an X-axis translation module and a Y-axis translation module. Among them, the X-axis translation module can drive the substrate conveying module 22 to translate on the X-axis, and the Y-axis translation module can drive the substrate conveying module 22 to translate on the Y-axis. Through the coordinated adjustment of the X-axis translation module and the Y-axis translation module, it can be ensured that the die-bonding area of the substrate on the substrate conveying module 22 is accurately adjusted to the fixed working position.

[0074] Optionally, the substrate feeding mechanism 2 further includes a lifting module 23. The substrate conveying module 22 is connected to the moving part of the lifting module 23. The lifting module 23 is used to drive the substrate conveying module 22 to lift, so as to adjust the height of the substrate, so that the height difference between the die-bonding area of the substrate and the die-bonding component 32 rotated to the die-bonding station meets the die-bonding requirements, and ensure that the die-bonding component 32 can fix the chip to the die-bonding area.

[0075] The above has described the present application in sufficient detail with a certain degree of particularity. Those of ordinary skill in the art should understand that the description in the embodiments is only exemplary, and all changes made without departing from the true spirit and scope of the present application should fall within the protection scope of the present application. The scope of protection required by the present application is defined by the claims described, rather than by the above description in the embodiments.

Claims

1. A die bonding device, characterized in that, The die bonding device includes a substrate feeding mechanism, a chip feeding mechanism and a die bonding mechanism, wherein: The substrate feeding mechanism is used for carrying a substrate and controlling the movement of the substrate so that the die bonding area on the substrate moves to the die bonding station; The chip feeding mechanism is used for carrying and tensioning a blue film storing chips, and controlling the movement of the blue film so that the chips to be picked up on the blue film move to the chip picking station. The carrying surface of the chip feeding mechanism is inclined. A first angle is formed between the carrying surface of the chip feeding mechanism and the carrying surface of the substrate feeding mechanism, and the first angle is greater than 90° and less than 180°; The die bonding mechanism includes a rotating part and at least two die bonding components. At least two of the die bonding components are circumferentially and equidistantly arranged on the rotating part. The rotating part is used for driving at least two die bonding components to rotate step by step so that each die bonding component rotates to the chip picking station and the die bonding station in turn. When the die bonding component rotates to the chip picking station, it is configured to pick up the chips to be picked up from the chip picking station. When the die bonding component rotates to the die bonding station, it is configured to fix the chip to the die bonding area of the substrate.

2. The die bonding apparatus according to claim 1, wherein The rotating part includes a first mounting seat, a first rotation driving part and a turret, wherein: The turret is rotatably mounted on the first mounting seat and is in transmission connection with the first rotation driving part arranged on the first mounting seat. The first rotation driving part is configured to drive the turret to rotate; At least two die bonding components are circumferentially and equidistantly mounted on the mounting surface of the turret.

3. The die bonding apparatus according to claim 2, wherein, The turret is inclined. A second angle is formed between the mounting surface of the turret and the carrying surface of the substrate feeding mechanism, and a third angle is formed between the mounting surface of the turret and the carrying surface of the chip feeding mechanism.

4. The die bonding apparatus according to claim 2, wherein The die bonding component includes a second mounting seat, a lifting driving part, a buffer part, a second rotation driving part and a die bonding head, wherein: The second mounting seat is connected to the turret. The buffer part is connected to the second mounting seat in a liftable manner and is connected to the lifting driving part arranged on the second mounting seat; The die bonding head is rotatably connected to the lower end of the buffer part. The lifting driving part is configured to drive the buffer part and the die bonding head to lift; The second rotation driving part is in transmission connection with the die bonding head. The second rotation driving part is configured to drive the die bonding head to rotate.

5. The die bonding apparatus according to claim 4, wherein The die bonding component further includes a guide rail arranged on the second mounting seat in the vertical direction; The buffer part includes a constant pressure cylinder. The cylinder body of the constant pressure cylinder is slidably connected to the guide rail and is connected to the lifting driving part. The die bonding head is connected to the lower end of the telescopic rod of the constant pressure cylinder.

6. The die bonding apparatus according to claim 4, wherein, The second rotation driving part includes a rotation motor, a first gear and a second gear. The rotation motor is arranged on the second mounting seat. The first gear is connected to the driving end of the rotation motor. The second gear is sleeved on the die bonding head and meshes with the first gear. The second gear can move up and down relative to the first gear; The rotating electric machine is configured to drive the first gear to rotate. When the first gear rotates, the die bonding head is driven to rotate via the second gear.

7. The die bonding apparatus according to claim 1, wherein After each step rotation of the rotating part, there is one die bonding assembly at the die picking station and the die bonding station respectively.

8. The die bonding apparatus according to claim 1, wherein, The die bonding device further includes a wafer picking positioning mechanism and a wafer placing positioning mechanism, where: The wafer picking positioning mechanism is configured to position the chip at the die picking station to obtain the first position information of the chip. The die bonding assembly picks up the chip from the die picking station based on the first position information of the chip. The wafer placing positioning mechanism is configured to position the die bonding area at the die bonding station to obtain the position information of the die bonding area. The die bonding assembly fixes the chip to the die bonding area based on the position information of the die bonding area.

9. The die bonding device according to claim 8, wherein, There is also an alignment station located between the die picking station and the die bonding station on the rotation path of the die bonding assembly. The die bonding mechanism includes at least three die bonding assemblies. After each step rotation of the rotating part, there is one die bonding assembly at the die picking station, the alignment station and the die bonding station respectively. The die bonding device further includes an alignment positioning mechanism, which is configured to position the chip on the die bonding assembly at the alignment station to obtain the second position information of the chip. The die bonding assembly adjusts the position of the chip based on the position information of the die bonding area and the second position information of the chip, and then fixes the chip to the die bonding area.

10. The die bonding apparatus according to claim 1, wherein The chip feeding mechanism includes a third mounting base, a first translation module, a rotation module, a blue film fixing component and a chip lifting component, where: The first translation module is arranged on the third mounting base. The blue film fixing component is rotatably connected to the moving part of the first translation module, and the blue film fixing component is in transmission connection with the rotation module arranged on the moving part of the first translation module. The blue film fixing component is configured to carry and tension the blue film. The first translation module is configured to drive the blue film fixing component to translate. The rotation module is configured to drive the blue film fixing component to rotate, so that the chip to be picked up on the blue film moves to the die picking station. The chip lifting component is arranged on the third mounting base and is located below the blue film. The chip lifting component is configured to lift the chip to be picked up at the die picking station on the blue film upward.

11. The die bonding device according to claim 1, wherein, The substrate feeding mechanism includes a second translation module and a substrate conveying module, where the substrate conveying module is connected to the moving part of the second translation module. The substrate conveying module is configured to carry and convey the substrate. The second translation module is configured to drive the substrate conveying module to translate, so that the die bonding area of the substrate moves to the die bonding station.

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