Laser device

Abstract

A laser device according to various embodiments includes: a housing; an inlet valve disposed in a first direction of the housing and configured to flow cooling water; an outlet valve disposed in a second direction of the housing and configured to discharge cooling water; a laser output unit which is accommodated in the housing and is configured so as to apply a power supply to output a laser beam; and a cooling structure for cooling the laser output unit, the cooling structure may include: a support member for accommodating the laser output unit therein; and a flow path that is formed on the surface of the support member so as to face the inside direction of the support member and that provides a path through which the cooling water flows. According to the utility model, by using the supporting component with the micro-channel, not only can the laser active medium be directly cooled by using cooling water, but also the vibration caused by the flow velocity is inhibited by using the micro-channel.

Description

Technical Field

[0001] The present disclosure relates to a laser device, and more particularly to a laser device including a cooling structure having microchannels. Background Art

[0002] Cooling of a laser medium is related to laser quality. Therefore, the cooling efficiency of the laser medium can play an important role in determining laser quality. Generally, the laser medium is surrounded by a thick housing, and a cooling water channel is arranged on the upper part of the housing.

[0003] In this case, indirect cooling through the housing not only reduces the cooling efficiency but also raises concerns about vibrations in the device caused by the flow of the cooling water in the channel. Summary of the Utility Model

[0004] [Problems to be Solved by the Utility Model]

[0005] The problem to be solved in the present disclosure is to improve the cooling efficiency of the laser medium through direct cooling and suppress vibrations in the laser device.

[0006] [Technical Means for Solving the Problem]

[0007] According to various embodiments, a laser device can be provided. In the laser device (e.g., Figure 1 laser device (100)), it includes: a housing (e.g., Figure 2 second housing 107); an inlet valve (e.g., Figure 2 inlet 103), configured to be arranged in a first direction of the housing and allow cooling water to flow in; an outlet valve (e.g., Figure 2 outlet 105), configured to be arranged in a second direction of the housing and discharge the cooling water; a laser output unit (e.g., Figure 2 laser output unit 110), housed in the housing and configured to output a laser beam by applying power; and a cooling structure (e.g., Figure 2 cooling structure 200) for cooling the laser output unit. The cooling structure includes: a support member (e.g., Figure 2 support member 201) for internally housing the laser output unit; and a flow path formed on the surface of the support member in a direction toward the inside of the support member and providing a path for the cooling water to flow.

[0008] According to various embodiments, a laser device can be provided. In the laser device (e.g., Figure 5 laser device 300), it includes: a housing (e.g., Figure 5the second housing 307); an inlet valve (e.g., Figure 5 the inlet 303), configured to be arranged in the first direction of the housing and to allow the cooling water to flow in; an outlet valve (e.g., Figure 5 the outlet 305), configured to be arranged in the second direction of the housing and to discharge the cooling water; a laser output unit (e.g., Figure 5 the laser output unit 310), housed in the housing and configured to output a laser beam by applying power; and a cooling structure (e.g., Figure 5 the cooling structure 400) for cooling the laser output unit, the cooling structure including: a support member (e.g., Figure 5 the support member 401) for internally housing the laser output unit; and a flow path region (e.g., Figure 6 the flow path region 410), provided in the support member and providing a fluid movement path for the cooling water, the flow path region including a first flow path region (e.g., Figure 6 the first flow path region 410a) provided close to the inlet valve and a second flow path region (e.g., Figure 6 the second flow path region 410b) provided close to the outlet valve).

[0009] [Effects of the Utility Model]

[0010] According to the present disclosure, by using a support member having microchannels (for supporting the laser active medium), not only can the laser active medium be directly cooled by the cooling water, but also the vibration caused by the flow rate can be suppressed by the microchannels. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is an implementation example of a laser device according to various embodiments.

[0012] Figure 2 is a cross-sectional view of a laser device according to various embodiments.

[0013] Figure 3 is a diagram showing a cooling structure according to various embodiments.

[0014] Figure 4 is a diagram showing the cooling structure according to various embodiments from another angle.

[0015] Figure 5 is a cross-sectional view of a laser device according to a second embodiment.

[0016] Figure 6 is a diagram showing a cooling structure according to a second embodiment.

[0017] Figure 7 is a diagram showing the cooling structure according to a second embodiment from another angle.

[0018] Figure 8 It is a cross-sectional view of the cooling structure according to the second embodiment with respect to the X-Z plane.

[0019] Figure 9 It is a diagram showing a part of the cooling process of the cooling structure according to the second embodiment.

[0020] Figure 10 It is a diagram showing another part of the cooling process of the cooling structure according to the second embodiment.

[0021] Figure 11 It is a diagram showing yet another part of the cooling process of the cooling structure according to the second embodiment.

[0022] [Description of reference signs]

[0023] 100, 300: Laser device;

[0024] 101, 301: First housing;

[0025] 103, 303: Inlet;

[0026] 103a, 303a: First input area;

[0027] 103b: Second input area;

[0028] 105, 305: Outlet;

[0029] 105a: First discharge area;

[0030] 105b: Second discharge area;

[0031] 107, 307: Second housing;

[0032] 108, 308: Cavity;

[0033] 108a, 308a: First cavity;

[0034] 108b, 308b: Second cavity;

[0035] 110, 310: Laser output section;

[0036] 200, 400: Cooling structure;

[0037] 201, 401: Support member;

[0038] 202: Flow path section;

[0039] 202a: First flow path section;

[0040] 202b: Second flow path section;

[0041] 211: Partition wall section;

[0042] 211a: First partition wall section;

[0043] 211b: Second partition wall section;

[0044] 211c: Third partition wall section;

[0045] 212: Channel section;

[0046] 212a: First channel section;

[0047] 212b: Second channel section;

[0048] 212c: Third channel section;

[0049] 213, 442: Support section;

[0050] 220: Connection part;

[0051] 221: First connection part;

[0052] 222: Second connection part;

[0053] 224: Injection hole / injection opening;

[0054] 224a: First injection hole;

[0055] 224b: Second injection hole;

[0056] 410: Flow path area;

[0057] 410a: First flow path area;

[0058] 410b: Second flow path area;

[0059] 410c: Third flow path area;

[0060] 411: Opening;

[0061] 411a: First opening / opening;

[0062] 411b: Second opening / opening;

[0063] 411c: Third opening / opening;

[0064] 412: First housing section;

[0065] 413: Surface;

[0066] 414: Second housing section;

[0067] 415a: Inlet opening;

[0068] 415b: Outlet opening;

[0069] 417: Discharge opening;

[0070] 431: Partition;

[0071] 441: Mounting part;

[0072] 441a: Mounting area;

[0073] A - A': Section;

[0074] X, Y, Z: Axial directions;

[0075] w: Cooling water. Detailed implementation mode

[0076] The above - mentioned objects, features and advantages of the present utility model are further clarified by the following detailed description related to the accompanying drawings. However, the present utility model can be variously modified and can have various embodiments. Hereinafter, specific embodiments will be illustrated in the accompanying drawings and described in detail.

[0077] In the accompanying drawings, for clarity, the thickness of layers and regions is exaggerated. In addition, the situation where an element or layer is located "on" or "above" another element or layer not only includes the case where it is directly above another element or layer, but also includes the case where other layers or other elements are interposed in between. Throughout the specification, the same reference numerals generally denote the same elements. In addition, elements having the same function within the same concept appearing in the drawings of each embodiment are described using the same reference numerals.

[0078] In cases where it is judged that the known functions related to the present utility model or the specific description of the constitution may unnecessarily obscure the gist of the present utility model, the detailed description thereof will be omitted. In addition, the numbers (such as first, second, etc.) used in the description process of this specification are only identification marks for distinguishing one element from another element.

[0079] In addition, the suffixes "area", "part" and "portion" of the elements used in the following description are given or mixed only for the convenience of writing the specification, and they do not have distinct meanings or functions from each other.

[0080] The present disclosure relates to a cooling structure according to various embodiments and a laser device applying the cooling structure.

[0081] The cooling structure described in the present disclosure may use a water-cooling method using cooling water. In the following various embodiments, the water-cooling structure includes a flow path provided inside the laser device and through which cooling water can flow. The flow path provided in the water-cooling structure may be a micro channel having a fine structure.

[0082] Figure 1 is an implementation example of a laser device according to various embodiments.

[0083] Refer to Figure 1 , the laser device 100 according to various embodiments may include all or a part of the first housing 101, the inlet 103, and the outlet 105.

[0084] According to various embodiments, the laser device 100 may generate and output a laser beam. In one embodiment, the laser device 100 may refer to a laser device for semiconductor processes and / or marking processes of general materials. It is not limited thereto, and various types of laser devices 100 may be applicable to the present disclosure.

[0085] In one embodiment, the laser device 100 may include a laser output unit 110 for irradiating a laser beam to the outside of the first housing 101. The laser output unit 110 is disposed inside the first housing 101 and may apply power to generate and output a laser beam. The laser output unit 110 may be exposed to the outside of the first housing 101. For example, the laser output unit 110 may include a laser source (e.g., a laser active medium). The laser active medium may use a neodymium-doped yttrium aluminum garnet laser (Nd:YAG laser), an erbium-doped yttrium aluminum garnet laser (Er:YAG laser), and / or a ytterbium-doped yttrium aluminum garnet laser (Yb:YAG laser), etc., but is not limited thereto, and various laser active media may be used. In various embodiments, the laser output unit 110 may be provided in a rod shape.

[0086] According to various embodiments, the laser device 100 may include the inlet 103 and the outlet 105. The inlet 103 and the outlet 105 may be disposed on the outer surface of the first housing 101 in a manner symmetric with respect to the laser output unit 110. In one embodiment, the inlet 103 may be disposed vertically above with respect to the ground, and the outlet 105 may be disposed vertically below with respect to the ground.

[0087] In one embodiment, the inlet 103 and the outlet 105 may be arranged in a manner opposite to each other with respect to a horizontal axis (e.g., the Y-axis direction and / or the X-axis direction). For example, the inlet 103 may be arranged to be inclined in a first horizontal direction (e.g., the +Y-axis direction), while the outlet 105 is arranged to be inclined in a second horizontal direction (e.g., the -Y-axis direction). It should be understood that a similar description also applies to the X-axis direction.

[0088] In a certain embodiment, the inlet 103 and the outlet 105 may be arranged to be inclined in the same direction with respect to a horizontal axis (e.g., the Y-axis direction and / or the X-axis direction). For example, the inlet 103 and the outlet 105 may be arranged symmetrically with respect to the laser output unit 110, and at the same time arranged at the same or substantially corresponding positions with respect to a first horizontal direction (e.g., the +Y-axis direction). Specifically, the inlet 103 may be arranged at the upper part on the first horizontal direction side (+Y and +Z directions), while the outlet 105 is arranged at the lower part on the first horizontal direction side (+Y and -Z directions). Similarly, it should be understood that the inlet 103 and the outlet 105 may also be arranged to be inclined in a second horizontal direction (-Y-axis direction).

[0089] In a certain embodiment, the inlet 103 and the outlet 105 may be arranged at corresponding positions with respect to a horizontal axis (e.g., the Y-axis direction and / or the X-axis direction). For example, the inlet 103 and the outlet 105 may be arranged symmetrically with respect to the vertical direction (Z-axis direction), and at the same time arranged at the same positions with respect to the horizontal direction (Y-axis direction and / or X-axis direction). In other words, it can also be expressed that when observing the laser device 100 in a direction parallel to the vertical upper (+Z-axis direction) and / or the vertical lower (-Z-axis direction), all or at least a part of the inlet 103 and the outlet 105 overlap each other. As another example, the inlet 103 and the outlet 105 may be arranged in a region near the center of the laser device 100 with respect to a horizontal axis (e.g., the Y-axis direction).

[0090] In addition, various implementation deformations can be made to the arrangement positions of the inlet 103 and the outlet 105.

[0091] According to various embodiments, the inlet 103 and the outlet 105 may be provided as valves. The inlet 103 may be configured to allow cooling water to flow into the laser device 100, and the outlet 105 is configured to discharge the cooling water inside the laser device 100 to the outside. The cooling water flowing in through the inlet 103 can cool the laser output unit 110 and be discharged through the outlet 105.

[0092] According to various embodiments, the laser device 100 may include a cooling structure for cooling the laser output unit 110. For example, the laser output unit 110 may be heated when generating a laser beam, and the cooling structure may be used to cool the heated laser output unit 110. In various embodiments, the cooling structure may be provided as a combination of all or part of a flow path portion, an inlet 103, and an outlet 105 for allowing cooling water to flow.

[0093] Figure 2 is a cross-sectional view of a laser device according to various embodiments.

[0094] Referring to Figure 2 , the laser device 100 may include a cooling structure 200. In one embodiment, the cooling structure 200 may include a second housing 107, a support member 201, and a flow path portion 202. Figure 2 The laser device 100 of Figure 1 may mean a configuration that is wholly or partially the same as the laser device 100 of

[0095] According to various embodiments, the second housing 107 may be disposed inside the first housing 101. The second housing 107 may provide a cavity 108 inside. In addition, the second housing 107 may include a second input area 103b fluidly connected to the inlet 103 and a first discharge area 105a fluidly connected to the outlet 105. For example, the cooling water flowing in through the first input area 103a of the inlet 103 may flow into the second housing 107 through the second input area 103b. In addition, the cooling water transferred through the first discharge area 105a may be discharged to the outside of the laser device 100 through the second discharge area 105b.

[0096] According to various embodiments, the support member 201 may be disposed inside the second housing 107. The support member 201 houses the laser output unit 110 inside and may stably support the laser output unit 110. According to various embodiments, a flow path portion 202 may be provided on the outer surface of the support member 201. The flow path portion 202 may provide a path for the cooling water flowing into the second housing 107 to flow.

[0097] According to various embodiments, the cavity 108 may include a first cavity 108a and a second cavity 108b. In one embodiment, the first cavity 108a is disposed adjacent to the inlet 103 and may provide a space for holding the cooling water flowing in through the inlet 103 for a predetermined time. The cooling water flowing inside the first cavity 108a may cool the support member 201 and the laser output unit 110 inside the support member 201 while flowing through the flow path portion 202. In one embodiment, the cooling water flowing along the flow path portion 202 in the first cavity 108a may flow into the second cavity 108b. For example, the support member 201 may substantially have a cylindrical shape, and the cooling water may flow from the first cavity 108a toward the second cavity 108b along the flow path portion 202 formed on the outer surface of the cylindrical support member 201. The cooling water may flow from the first cavity 108a toward the second cavity 108b along the flow path portion 202 and cool the support member 201 and the laser output unit 110 installed inside the support member 201.

[0098] In one embodiment, within the laser device 100, a fluid (cooling water) may flow from the inlet 103 toward the outlet 105. For example, the inlet 103 is disposed vertically above (in the +Z-axis direction) with respect to the ground, and the outlet 105 is disposed vertically below (in the -Z-axis direction) with respect to the ground, so that the cooling water may flow from the inlet 103 toward the outlet 105 due to the influence of gravity. As another example, the pressure difference between the inlet 103 and the outlet 105 may be utilized to cause the cooling water to flow from the inlet 103 toward the outlet 105.

[0099] Figure 3 is a diagram showing a cooling structure according to various embodiments. Figure 4 is a diagram showing the cooling structure according to various embodiments from another angle.

[0100] Referring to Figure 3 and Figure 4 , the support member 201 applied to the cooling structure 200 may include a partition wall portion 211, a channel portion 212, and a support portion 213. Figure 3 and Figure 4 The support member 201 of Figure 2 may mean a configuration that is all or partially the same as the support member 201 of

[0101] According to various embodiments, a plurality of partition wall portions 211 may be arranged in such a manner as to surround the outer surface of the support portion 213. In one embodiment, the plurality of partition wall portions 211 may be arranged at a prescribed interval from each other. For example, in the case where the support portion 213 has a cylindrical shape, the partition wall portion 211 may have a circular plate form surrounding the support portion 213. However, this is illustrative, and the shape of the partition wall portion 211 may be determined in various ways. In one embodiment, the space between the plurality of partition wall portions 211 may be provided as the passage portion 212.

[0102] According to various embodiments, the cooling water may flow along the passage portion 212 provided as the space between the plurality of partition wall portions 211, and the cooling water may flow along the surface of the support portion 213. In one embodiment, a heatable laser output portion 110 (laser active medium) is arranged inside the support portion 213, and the cooling water flowing along the surface of the support portion 213 may cool the laser output portion 110. The support portion 213 is arranged as close as possible to the laser output portion 110, and the cooling efficiency of the laser output portion 110 may be improved. According to one embodiment, the passage portion 212 may be formed by processing the outer surface of the support member 201. For example, the passage portion 212 may be provided by forming a groove in the outer surface of the support member 201. Here, the passage portion 212 may be provided by micro-processing the outer surface of the support member 201, and may be referred to as a micro channel.

[0103] According to various embodiments, the connection portion 220 may be connected to the second housing 107. In one embodiment, the first connection portion 221 may be connected in the first direction (+Y-axis direction) of the second housing 107, and the second connection portion 222 may be connected in the second direction (-Y-axis direction) of the second housing 107. The support member 201 may be coupled to the second housing 107 through the connection portion 220.

[0104] According to one embodiment, the first partition wall portion 211a may be arranged adjacent to the first connection portion 221. The second partition wall portion 211b may be arranged in the middle region with respect to the longitudinal direction (Y-axis direction) of the support member 201. The third partition wall portion 211c may be arranged adjacent to the second connection portion 222.

[0105] In one embodiment, the first partition wall portion 211a may be disposed in close contact with the first connection portion 221, or may be formed integrally with the first connection portion 221. As another example, the third partition wall portion 211c may be disposed slightly spaced apart from the second connection portion 222. In one embodiment, the first channel portion 212a and the second channel portion 212b may be formed in such a manner that their lengths (Y-axis direction) are the same. In another example, the width of the third channel portion 212c between the second connection portion 222 and the third partition wall portion 211c may be smaller than the width of the first channel portion 212a and / or the second channel portion 212b. However, this is exemplary, and the third partition wall portion 211c may also be disposed in close contact with the second connection portion 222 or formed integrally therewith. In this case, the intervals between the plurality of partition wall portions 211 may all be fixed.

[0106] According to various embodiments, the flow path portion 202 may include a first flow path portion 202a and a second flow path portion 202b. The first flow path portion 202a and the second flow path portion 202b may be distinguished based on the flow direction of the cooling water. For example, the first flow path portion 202a may refer to the flow path portion 202 provided in the upper direction (+Z-axis direction) toward the inlet 103, and the second flow path portion 202b may refer to the flow path portion 202 provided in the lower direction (-Z-axis direction) toward the outlet 105. That is, the cooling water entering through the first cavity 108a cools the support member 201 and the laser output unit 110 while flowing through the first flow path portion 202a, and the cooling water for cooling may flow from the first flow path portion 202a to the second flow path portion 202b and be discharged from the outlet 105 through the second cavity 108b.

[0107] According to various embodiments, since the cooling water flows through the plurality of channel portions 212 formed with a fine width, unnecessary vibrations caused by the flow rate of the cooling water can be suppressed.

[0108] In one embodiment, the first connection portion 221 and / or the second connection portion 222 may each include a first injection hole 224a and / or a second injection hole 224b connected to an installation area (e.g., Figure 5 the installation area 441a shown) where the laser output unit 110 is installed. A curing agent for fixing the laser output unit 110 to the installation area (e.g., Figure 5 the installation area 441a shown) may be injected through the injection hole 224.

[0109] Figure 5 is a cross-sectional view of a laser device according to a second embodiment.

[0110] Refer to Figure 5, the laser device 300 according to the second embodiment may include all or part of a first housing 301, a second housing 307, an inlet 303, an outlet 305, a support member 401, and a laser output unit 310. Here, a cooling structure 400 for cooling the laser output unit 310 may be provided as a combination of the support member 401, a flow path region 410 provided in the support member 401, and the second housing 307.

[0111] Since the descriptions of the first housing 301, the second housing 307, the inlet 303, the outlet 305, and the laser output unit 310 of the laser device 300 according to the second embodiment can be referred to Figures 1 to 4 the descriptions of the above-mentioned first housing 101, second housing 107, inlet 103, outlet 105, and laser output unit 110, they will not be elaborated here. Conversely, the following descriptions of the laser device 300 according to the second embodiment can also be applied to Figures 1 to 4 the laser device 100.

[0112] According to various embodiments, a flow path region 410 for cooling the laser output unit 310 may be provided in the support member 401. In one embodiment, the flow path region 410 may include a plurality of openings 411. The cooling water flowing in from the inlet 303 may directly contact the laser output unit 310 through the openings 411 to cool the laser output unit 310. In one embodiment, the cooling water applied to the first input region 303a of the inlet 303 is stored in the first cavity 308a, and when the first cavity 308a is filled with a cooling water of a certain capacity or more, the cooling water may cool the laser output unit 310 through the openings 411 and flow. This will be elaborated below for further explanation.

[0113] According to various embodiments, the support member 401 may include a mounting portion 441 provided therein. The mounting portion 441 may include a mounting region 441a inside. The mounting region 441a may refer to a space extending in the length direction (Y-axis direction) inside the mounting portion 441. The laser output unit 310 may be disposed in the mounting region 441a. The mounting portion 441 may further include a fluid transfer path (e.g., an inlet opening 415a) for transferring a fluid (cooling water) to the mounting region 441a. This will be elaborated in Figures 9 to 11 for explanation.

[0114] Figure 6 is a diagram showing the cooling structure according to the second embodiment. Figure 7 is a diagram showing the cooling structure according to the second embodiment from another angle.

[0115] Refer to Figure 6 and Figure 7, the support member 401 may include at least one or more flow path regions 410. For example, the flow path region 410 may include a region (e.g., a first flow path region 410a, a second flow path region 410b, and / or a third flow path region 410c) formed by a plurality of openings (e.g., a plurality of first openings 411a, a plurality of second openings 411b, and / or a plurality of third openings 411c). Figure 6 The support member 401 may mean a structure that is all or partially the same as Figure 5 the support member 401.

[0116] According to various embodiments, through the flow path region 410, cooling water may flow into the interior of the support member 401. In one embodiment, the flow path region 410 may include a plurality of openings (411: 411a, 411b, 411c) arranged at regular intervals.

[0117] According to various embodiments, the flow path region 410 may be arranged along the circumferential edge of the support member 401. In one embodiment, the first flow path region 410a and the second flow path region 410b may be arranged circumferentially on the surface 413 of the support member 401. Similarly, the second flow path region 410b and the third flow path region 410c may also be arranged circumferentially on the surface 413 of the support member 401. Only the first flow path region 410a, the second flow path region 410b, and the third flow path region 410c are shown in the illustrated drawings, but more or fewer flow path regions 410 may be formed along the circumferential direction of the surface 413 of the support member 401.

[0118] According to various embodiments, a part of the flow path region 410 may be provided as an inflow path for cooling water, while another part of the flow path region 410 is provided as an outflow path for cooling water. In one embodiment, the first flow path region 410a may be provided as an inflow path for cooling water, while the third flow path region 410c is provided as an outflow path for cooling water. For example, the first flow path region 410a adjacent to the inlet 303 is an inflow path for cooling water, while the third flow path region 410c adjacent to the outlet 305 is an outflow path for cooling water. The second flow path region 410b may be provided as an inflow path or an outflow path for cooling water according to its arrangement relationship with the inlet 303 or the outlet 305.

[0119] According to various embodiments, the plurality of openings 411 may be arranged along the length direction (e.g., the +Z axis direction) of the surface 413 of the support member 401. In one embodiment, the first opening 411a may be arranged along the length direction (+Z axis direction) in the first flow path region 410a. The second opening 411b and the third opening 411c may be described by referring to the description of the first opening 411a.

[0120] According to various embodiments, the size of the opening 411 may be predetermined. For example, as will be described below, the size of the opening 411 may be determined such that cooling water flows through the opening 411 when the pressure exerted by the cooling water accumulated in the first cavity (e.g., the first cavity 308a of Figure 9 ) is above a specified pressure. Figure 9 The cooling water accumulated in the first cavity 308a causes the cooling water to flow through the opening 411 when the pressure is above a specified pressure.

[0121] Figure 8 FIG. 6 is a cross-sectional view of the cooling structure according to the second embodiment with respect to the X-Z plane.

[0122] Figure 8 Shows Figure 5 the A-A' cross-section.

[0123] Referring to Figure 8 , the support member 401 may include a partition 431 disposed between the first cavity 308a and the second cavity 308b. Figure 8 The support member 401 of Figure 8 may wholly or partly draw on the description of the support member 401 in the above embodiments.

[0124] According to various embodiments, the partition 431 may divide the first cavity 308a and the second cavity 308b. In one embodiment, the partition 431 may extend from the surface 413 of the support member 401 to the second housing 307. The partition 431 also extends in the longitudinal direction of the support member 401, thereby fluidly dividing the first cavity 308a and the second cavity 308b.

[0125] According to various embodiments, the first cavity 308a partitioned by the partition 431 may be filled with cooling water. In one embodiment, when the cooling water in the first cavity 308a rises above a specified amount, the cooling water may flow into the interior of the support member 401 through an opening (e.g., the opening 411 of Figure 7 ). Figure 7 The cooling water in the first cavity 308a flows into the interior of the support member 401 through the opening 411 when it rises above a specified amount.

[0126] According to various embodiments, the cooling water passing through the interior of the support member 401 may be transferred to the second cavity 308b. In one embodiment, the partition 431 divides the second cavity 308b and the first cavity 308a and may prevent the heated cooling water transferred to the second cavity 308b from flowing back to the first cavity 308a.

[0127] Figure 9 FIG. 34 is a diagram showing a part of the cooling process of the cooling structure according to the second embodiment. Figure 10 FIG. 36 is a diagram showing another part of the cooling process of the cooling structure according to the second embodiment. Figure 11 FIG. 38 is a diagram showing yet another part of the cooling process of the cooling structure according to the second embodiment.

[0128] Referring to Figures 9 to 11, the cooling process according to various embodiments will be described. When describing Figures 9 to 11 , the reference numerals of Figures 5 to 8 may be mentioned at the same time.

[0129] According to various embodiments, the cooling water w may be stored in the first cavity 308a. In one embodiment, the cooling water w flowing in through the inlet 303 may be transferred to the space between the support member 401 and the second housing 307, that is, the first cavity 308a and filled. When the cooling water w above a predetermined capacity is filled in the first cavity 308a, the cooling water may be transferred to the inside of the support member 401 through the opening 411. Here, it is preferable that the cooling water w uniformly flows into the plurality of openings 411 arranged in the longitudinal direction (for example, the Y-axis direction) of the support member 401. Therefore, the laser output unit 310 arranged in the longitudinal direction (Y-axis direction) inside the support member 401 may be uniformly cooled in the longitudinal direction (Y-axis direction). Therefore, the openings 411 arranged in the longitudinal direction (Y-axis direction) may have a predetermined size so that the cooling water w can substantially flow out simultaneously after filling the first cavity 308a with sufficient cooling water w.

[0130] According to various embodiments, the cooling water flowing in through the opening 411 may be transferred to the first receiving portion 412. In one embodiment, the first receiving portion 412 may be provided between the mounting portion 441 for arranging the laser output unit 310 and the support portion 442 of the support member 401 formed with the opening 411. Here, the outer surface of the support portion 442 may be the above-mentioned surface 413. When the cooling water w above a predetermined capacity is filled in the first receiving portion 412, the cooling water w may flow into the inside of the mounting portion 441 through the inlet opening 415a formed in the mounting portion 441. The cooling water w flowing into the inside of the mounting portion 441 is in direct contact with the laser output unit 310, thereby cooling the laser output unit 310.

[0131] According to various embodiments, the mounting portion 441 may refer to a component and / or area provided inside the support member 401 and used for installing the laser output unit 310. In one embodiment, the mounting portion 441 may include an installation area 441a inside. The laser output unit 310 may be arranged in the installation area 441a.

[0132] In various embodiments, the inlet opening 415a may be formed in the mounting portion 441 in a manner facing the inlet 303. The inlet opening 415a may be arranged in a manner corresponding to the opening 411, but this is not necessary. The inlet opening 415a is fluidly connected to the first receiving portion 412 and may provide a fluid movement path for transferring the cooling water w filled in the first receiving portion 412 to the installation area 441a.

[0133] In various embodiments, the outlet opening 415b may be provided in the mounting portion 441 in a manner that faces a direction substantially opposite to the inlet opening 415a (or in a manner that faces the outlet 305). The outlet opening 415b may provide a fluid path through which the cooling water w that has been transferred to the inside of the mounting area 441a through the inlet opening 415a can be discharged after cooling the laser output unit 310. In one embodiment, the outlet opening 415b may be fluidly connected to the discharge opening 417. Additionally, a second housing portion 414 may be provided between the outlet opening 415b and the discharge opening 417. For example, the cooling water w discharged from the outlet opening 415b fills the second housing portion 414, and the cooling water w filled in the second housing portion 414 can be discharged through the discharge opening 417.

[0134] In a certain embodiment, the opening 411 and / or the discharge opening 417 may have a specified depth with respect to the traveling direction of the cooling water w (e.g., the Z-axis direction). Here, the specified depth may be set such that the cooling water w can pass through the opening 411 under a specified pressure. That is, for example, the depth of the opening 411 may be determined in such a way that the cooling water w can flow through the opening 411 only when the cooling water w filled in the first cavity 308a fills a specified capacity or more. Thus, the cooling water w can flow into a plurality of openings 411 arranged in the longitudinal direction (e.g., the Y-axis direction) of the support member 401 simultaneously. The description of the opening 411 can similarly be applied to the discharge opening 417, the inlet opening 415a, and / or the outlet opening 415b.

[0135] According to various embodiments, a laser device may be provided. In the laser device (e.g., Figure 1 the laser device 100), it includes: a housing (e.g., Figure 2 the second housing 107); an inlet valve (e.g., Figure 2 the inlet 103), configured to be arranged in the first direction of the housing and to allow the inflow of cooling water; an outlet valve (e.g., Figure 2 the outlet 105), configured to be arranged in the second direction of the housing and to discharge the cooling water; a laser output unit (e.g., Figure 2 the laser output unit 110), housed in the housing and configured to output a laser beam by applying power; and a cooling structure (e.g., Figure 2 the cooling structure 200) for cooling the laser output unit. The cooling structure includes: a support member (e.g., Figure 2 the support member 201) for housing the laser output unit inside; and a flow path formed on the surface of the support member in a manner that faces the inner direction of the support member and for providing a path for the cooling water to flow.

[0136] According to an embodiment, the following laser device can be provided: The support member includes a mounting portion (e.g., Figure 5 the mounting portion 441), which extends along the length direction of the support member inside the support member and is used for mounting the laser output portion.

[0137] According to an embodiment, the following laser device can be provided: The flow path includes a plurality of openings (e.g., Figure 7 the opening 411) formed on the surface of the support member in a direction toward the inlet valve.

[0138] According to an embodiment, the following laser device can be provided: The flow path includes a plurality of discharge openings (e.g., Figure 9 the discharge opening 417) formed on the surface of the support member in a direction toward the outlet valve.

[0139] According to an embodiment, the following laser device can be provided: A cavity (e.g., Figure 9 the cavity 308) for filling the cooling water is provided between the housing and the support member, and the cavity includes a first cavity (e.g., Figure 9 the first cavity 308a) near the inlet valve and a second cavity (e.g., Figure 9 the second cavity 308b) near the outlet valve.

[0140] According to an embodiment, the following laser device can be provided: The widths of the plurality of openings are provided to be below a specified width so that the cooling water filled in the first cavity can flow through the plurality of openings when the volume of the cooling water is above a specified capacity.

[0141] According to an embodiment, the following laser device can be provided: The depths of the plurality of openings are provided to be above a specified depth so that the cooling water filled in the first cavity can flow through the plurality of openings when the volume of the cooling water is above a specified capacity.

[0142] According to an embodiment, the following laser device can be provided: The cooling structure further includes a first accommodation portion (e.g., Figure 9 the first accommodation portion 412) provided between the mounting portion and the plurality of openings.

[0143] According to an embodiment, the following laser device can be provided: The cooling structure further includes: a plurality of inlet openings (e.g., Figure 9 the inlet opening 415a), which are connected to the inside of the mounting portion and are used for providing a fluid movement path for the cooling water so that the cooling water is in direct contact with the laser output portion.

[0144] According to one embodiment, the following laser device may be provided: the first cavity, the plurality of openings, the first receiving portion, and the plurality of inlet openings are fluidly connected to each other.

[0145] According to one embodiment, the following laser device may be provided: the cooling structure further includes: a partition plate (for example: Figure 8 the partition plate 431), configured to divide between the first cavity and the second cavity in a fluid manner and disposed between the housing and the support member.

[0146] According to one embodiment, the following laser device may be provided: the cooling structure further includes: an outlet opening (for example: Figure 9 the outlet opening 415b), configured to be connected from the inside of the mounting portion to the outside of the mounting portion and provide a discharge path for the cooling water for cooling the laser output portion, and formed to face a direction different from that of the inlet opening.

[0147] According to one embodiment, the following laser device may be provided: the flow path is formed by machining the outer surface of the support member.

[0148] According to one embodiment, the following laser device may be provided: the support member further includes: a plurality of partition wall portions (for example: Figure 4 the partition wall portion 211), arranged at regular intervals along the length direction of the support member; and a channel portion (for example: Figure 4 the channel portion 212), provided by the space between the partition wall portions.

[0149] According to one embodiment, the following laser device may be provided: at least a part of the plurality of partition wall portions is arranged to surround the circumferential direction of the support member.

[0150] According to one embodiment, the following laser device may be provided: the support member further includes: an injection opening (for example: Figure 3 the injection opening 224), configured to introduce a curing agent for fixing the support member to the laser output portion.

[0151] According to one embodiment, the following laser device may be provided: the laser output portion includes a laser active medium.

[0152] According to various embodiments, a laser device may be provided. In the laser device (for example: Figure 5 the laser device 300), it includes: a housing (for example: Figure 5 the second housing 307); an inlet valve (for example: Figure 5 the inlet 303), configured to be arranged in a first direction of the housing and allow cooling water to flow in; an outlet valve (for example: Figure 5The outlet 305) is configured to be arranged in the second direction of the housing and discharge the cooling water; a laser output unit (e.g., Figure 5 The laser output unit 310) of is housed in the housing and configured to output a laser beam by applying power; and a cooling structure (e.g., Figure 5 The cooling structure 400) for cooling the laser output unit, the cooling structure includes: a support member (e.g., Figure 5 The support member 401) for housing the laser output unit therein; and a flow path region (e.g., Figure 6 The flow path region 410) provided in the support member and providing a fluid movement path for the cooling water, the flow path region includes a first flow path region (e.g., Figure 6 The first flow path region 410a) provided near the inlet valve and a second flow path region (e.g., Figure 6 The second flow path region 410b) provided near the outlet valve.

[0153] According to an embodiment, the following laser device may be provided: the first flow path region includes a plurality of first openings (e.g., Figure 6 The first openings 411a) arranged along the length direction of the support member, the second flow path region includes a plurality of second openings (e.g., Figure 6 The second openings 411b) arranged along the length direction of the support member, the first openings provide an inflow path for the cooling water to flow into the interior of the support member, and the second openings provide a discharge path for the cooling water heated by the laser output unit inside the support member.

[0154] As described above, although the embodiments are described using limited embodiments and drawings, those skilled in the relevant technical field can make various modifications and deformations based on the above description. For example, even if the described technology is executed in an order different from the described method, and / or the components such as the described system, structure, device, circuit, etc. are combined or combined in a form different from the described method, or are replaced or substituted by other components or equivalents, appropriate results can also be achieved.

[0155] Therefore, those equivalent to other implementations, other embodiments, and claims also fall within the scope of the above claims.

Claims

1. A laser device, wherein, characterized in that, Comprising: A housing; An inlet valve configured to be arranged in a first direction of the housing and to allow cooling water to flow in; An outlet valve configured to be arranged in a second direction of the housing and to discharge the cooling water; A laser output unit housed in the housing and configured to output a laser beam by applying power; And A cooling structure for cooling the laser output unit, The cooling structure comprising: A support member for housing the laser output unit therein; And A flow path formed on a surface of the support member in a direction toward an inner side of the support member and configured to provide a path for the cooling water to flow.

2. The laser device according to claim 1, wherein The support member includes a mounting portion that extends along a length direction of the support member inside the support member and is configured to mount the laser output unit.

3. The laser device according to claim 2, wherein The flow path includes a plurality of openings formed on a surface of the support member in a direction toward the inlet valve.

4. The laser device according to claim 3, wherein The flow path includes a plurality of discharge openings formed on a surface of the support member in a direction toward the outlet valve.

5. The laser device according to claim 3, wherein A cavity for filling the cooling water is provided between the housing and the support member, The cavity includes a first cavity near the inlet valve and a second cavity near the outlet valve.

6. The laser device according to claim 5, wherein The widths of the plurality of openings are provided to be equal to or less than a specified width so that the cooling water filled in the first cavity can flow through the plurality of openings when the amount of the cooling water is equal to or more than a specified capacity.

7. The laser device according to claim 5, wherein The depths of the plurality of openings are provided to be equal to or more than a specified depth so that the cooling water filled in the first cavity can flow through the plurality of openings when the amount of the cooling water is equal to or more than a specified capacity.

8. The laser device according to claim 3, wherein The cooling structure further includes a first accommodation portion provided between the mounting portion and the plurality of openings.

9. The laser device according to claim 8, wherein The cooling structure further includes: a plurality of inlet openings connected to an inside of the mounting portion and configured to provide a fluid movement path for the cooling water so that the cooling water directly contacts the laser output unit.

10. The laser device according to claim 9, wherein The first cavity, the plurality of openings, the first accommodation portion, and the plurality of inlet openings are fluidly connected to each other.

11. The laser device according to claim 5, wherein The cooling structure further includes: a partition configured to fluidly divide between the first cavity and the second cavity and arranged between the housing and the support member.

12. The laser device according to claim 10, wherein The cooling structure further includes: an outlet opening configured to connect from the inside of the mounting portion to the outside of the mounting portion and provide a discharge path for cooling water for cooling the laser output portion, and formed to face a direction different from that of the inlet opening.

13. The laser device according to claim 1, wherein The flow path is formed by machining the outer surface of the support member.

14. The laser device according to claim 13, wherein The support member further includes: a plurality of partition wall portions arranged at regular intervals along the length direction of the support member; and a channel portion provided by a space between the plurality of partition wall portions.

15. The laser device according to claim 14, wherein At least a part of the plurality of partition wall portions is arranged to surround the circumferential direction of the support member.

16. The laser device according to claim 1, wherein The support member further includes: an injection opening configured to inject a curing agent for fixing the support member to the laser output portion.

17. The laser device according to claim 1, wherein The laser output portion includes a laser active medium.

18. A laser device, characterized in that, in the laser device Comprising: A housing; An inlet valve configured to be arranged in a first direction of the housing and allow cooling water to flow in; An outlet valve configured to be arranged in a second direction of the housing and discharge cooling water; A laser output portion housed in the housing and configured to output a laser beam by applying power; And A cooling structure for cooling the laser output portion, The cooling structure includes: A support member for housing the laser output portion therein; And A flow path region provided in the support member and providing a fluid movement path for the cooling water, the flow path region including a first flow path region provided near the inlet valve and a second flow path region provided near the outlet valve.

19. The laser device according to claim 18, wherein The first flow path region includes a plurality of first openings arranged along the length direction of the support member, The second flow path region includes a plurality of second openings arranged along the length direction of the support member, The first openings provide an inflow path for the cooling water to flow into the inside of the support member, The second openings provide a discharge path for the cooling water heated by the laser output portion inside the support member.

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