Semiconductor laser with water cooling channel and modularized water cooling system

By setting up a modular design of water-cooling channels and quick connectors on the laser and cooling units, the problems of large size and complex maintenance of traditional laser water-cooling systems are solved, and efficient heat dissipation and convenient maintenance are achieved.

CN223066626UActive Publication Date: 2025-07-04SHENZHEN PARALASER TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202422303903.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-21
Publication Date
2025-07-04
Estimated Expiration
2034-09-21

AI Technical Summary

Technical Problem

Traditional laser water cooling systems are large in size and heavy, which are inconvenient for installation and transportation, complex maintenance and low heat dissipation efficiency.

Method used

The semiconductor laser with water-cooled channels and a modular water-cooling system are used to transfer heat from the laser body to the cooling unit through a water pump, and multi-stage cooling is used to use semiconductor refrigeration sheets and cooling fans. Each module is connected through quick connectors and pipes for easy disassembly and maintenance.

Benefits of technology

It realizes a compact structural design, improves heat dissipation efficiency, and can quickly recover by replacing a separate module in the event of a module failure, simplifying the maintenance process.

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Abstract

The utility model discloses a semiconductor laser with a water cooling channel and a modularized water cooling system. The semiconductor laser comprises a water tank, a water pump, a laser main body and a cooling unit, the laser main body and the cooling unit are both provided with water cooling channels, and the water cooling channels on the laser main body and the cooling unit are connected with each other; the water outlet end of the water tank is connected with the water pump, water is injected into the water cooling channel on the laser main body through the water pump, heat dissipated by the laser main body is taken away, and then the heat enters the cooling unit, is cooled by the multi-stage cooling unit and flows back into the water tank. According to the utility model, the installation of a water cooling plate is avoided, the structure is more compact, and the heat dissipation efficiency is higher; all the modules are connected through pipelines and quick connectors, assembly, disassembly and transportation are convenient, when any module in the system breaks down, quick recovery can be achieved only by disassembling and replacing the faulted module, and maintenance is convenient.
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Description

Technical Field

[0001] The utility model relates to a laser water cooling system, in particular to a semiconductor laser with a water cooling channel and a modular water cooling system. Background Art

[0002] The laser water cooling system mainly cools the laser by fixing it on a water cooling plate and using a water chiller and a water pump for cooling circulation. However, this traditional design has the following several significant problems:

[0003] Since the traditional laser water cooling system needs to be installed on a large water cooling plate and requires a water cooling compressor, the overall volume and weight are relatively large, which makes the system inconvenient for installation and transportation and limits its application scenarios.

[0004] Since the system mainly relies on the compressor for cooling, its functional structure is complex. Once the system fails, it often requires disassembly, installation, and repair of the entire system, increasing the maintenance difficulty and cost.

[0005] The heat dissipation of the traditional system depends on the overall design of the water cooling plate and the cooling circulation. The heat dissipation efficiency is limited by the physical properties of the water cooling plate and the design of the cooling circulation, and it is difficult to meet the requirements of efficient heat dissipation. Summary of the Utility Model

[0006] The technical problem to be solved by the utility model is to provide a semiconductor laser with a water cooling channel and a modular water cooling system to solve the problems existing in the background art.

[0007] The semiconductor laser with a water cooling channel and the modular water cooling system of the utility model are realized through the following technical solutions, including a water tank, a water pump, a laser main body, and a cooling unit;

[0008] Water cooling channels are provided on both the laser main body and the cooling unit, and the water cooling channels on the laser main body and the cooling unit are connected to each other; the water outlet end of the water tank is connected to the water pump, and water is injected into the water cooling channel on the laser main body through the water pump, thereby taking away the heat dissipated by the laser main body, and then entering the cooling unit to be cooled by multiple cooling units and then flowing back to the water tank.

[0009] As a preferred technical solution, temperature sensors are provided on the cooling units, and the cooling unit includes a cooling module main body, a semiconductor refrigeration sheet, a radiator, and a cooling fan;

[0010] The cooling end of the semiconductor refrigeration sheet is in contact with the cooling module main body, the radiator is installed at the heating end of the semiconductor refrigeration sheet, the heat is transferred to the radiator by the semiconductor refrigeration sheet, and the heat is dissipated to the outside through the cooling fan.

[0011] As a preferred technical solution, the water tank, the water pump and the laser main body are connected through an external pipeline, and the cooling module is connected to the water tank through an external pipeline;

[0012] The cooling units are connected to each other through an internal pipeline and are connected to the water cooling channel through the internal pipeline.

[0013] As a preferred technical solution, a flow sensor is provided on the external pipeline or the internal pipeline for monitoring the circulating water flow state.

[0014] As a preferred technical solution, the laser main body has a laser overheat protection module. If the laser temperature exceeds the set protection temperature, the laser output will be turned off and an alarm will be given.

[0015] As a preferred technical solution, a water level alarm module is provided in the water tank. When the water level in the water tank is lower than the warning limit, the system will output an alarm prompt.

[0016] As a preferred technical solution, a water filter is provided on the external pipeline or the internal pipeline to prevent the external pipeline and the internal pipeline from being blocked due to long-term use.

[0017] As a preferred technical solution, the water tank is equipped with a temperature control module. If the water temperature is too low, the temperature control module preheats the water in the water tank.

[0018] As a preferred technical solution, quick connectors are provided at the connection ends of the laser main body and the cooling unit.

[0019] As a preferred technical solution, the water cooling channels of the laser main body and the cooling unit are machined by milling, and the main body and the cover are welded by friction welding or brazing.

[0020] The beneficial effects of the present utility model are as follows:

[0021] The present utility model eliminates the installation of the water cooling plate, has a more compact structure and higher heat dissipation efficiency; each module is connected through pipelines and quick connectors, which is convenient for assembly, disassembly and transportation. If any module in the system fails, only the faulty module needs to be disassembled and replaced to quickly resume operation, and the maintenance is convenient. Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 It is a structural schematic diagram of the present utility model;

[0024] Figure 2 This is a schematic structural diagram of the cooling unit of the present utility model.

[0025] Explanation of reference numerals in the drawings:

[0026] 1. Water tank; 2. Water pump; 3. Laser main body; 4. Quick connector; 5. Cooling unit; 6. Cooling module main body; 7. Semiconductor refrigeration sheet; 8. Radiator; 9. Cooling fan. Specific implementation manners

[0027] All features disclosed in this specification, or all steps in the disclosed methods or processes, except for mutually exclusive features and / or steps, can be combined in any manner.

[0028] As Figure 1 shown, a semiconductor laser with a water-cooling channel and a modular water-cooling system of the present utility model include a water tank 1, a water pump 2, a laser main body 3, and a cooling unit 5;

[0029] Water-cooling channels are provided on both the laser main body 3 and the cooling unit 5, and the water-cooling channels on the laser main body 3 and the cooling unit 5 are connected to each other; the water outlet end of the water tank 1 is connected to the water pump 2, and water is injected into the water-cooling channel on the laser main body 3 through the water pump 2, thereby taking away the heat dissipated by the laser main body 3, and then entering the cooling unit 5 and being cooled by the multi-stage cooling unit 5, and then flowing back to the water tank 1.

[0030] As Figure 2 shown, temperature sensors are provided on the cooling unit 5, and the cooling unit 5 includes a cooling module main body 6, a semiconductor refrigeration sheet 7, a radiator 8, and a cooling fan 9;

[0031] The cooling end of the semiconductor refrigeration sheet 7 is in contact with the cooling module main body 6, the radiator 8 is installed on the heating end of the semiconductor refrigeration sheet 7, the heat is transferred to the radiator 8 by the semiconductor refrigeration sheet 7, and the heat is dissipated to the outside through the cooling fan 9.

[0032] Among them, the water tank 1, the water pump 2, and the laser main body 3 are connected by external pipelines, and the cooling module is connected to the water tank 1 by an external pipeline;

[0033] The cooling units 5 are connected to each other by internal pipelines and are connected to the water-cooling channels through the internal pipelines.

[0034] Among them, a flow sensor is provided on the external pipeline or the internal pipeline for monitoring the circulating water flow state.

[0035] Among them, the laser main body 3 has a laser overheat protection module, and if the laser temperature exceeds the set protection temperature, the laser output will be turned off and an alarm will be given.

[0036] Among them, a water level alarm module is provided in the water tank 1. When the water level of the water tank 1 is lower than the warning limit, the system will output an alarm prompt.

[0037] In addition, a water filter is provided on the external pipe or the internal pipe to prevent the external pipe and the internal pipe from being blocked due to long-term use.

[0038] In addition, the water tank 1 is provided with a temperature control module. If the water temperature is too low, the temperature control module preheats the water in the water tank 1 .

[0039] In addition, quick connectors 4 are provided at the connection ends of the laser body 3 and the cooling unit 5 .

[0040] In addition, the laser body 3 and the water cooling channels of the cooling unit 5 are formed by machining and milling, and the body and the cover are welded by friction welding or brazing.

[0041] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that are not conceived through creative work should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope defined in the claims.

Claims

1. A semiconductor laser with a water-cooling channel and a modular water-cooling system, characterized in that, It includes a water tank (1), a water pump (2), a laser main body (3), and a cooling unit (5); The laser main body (3) and the cooling unit (5) are both provided with water cooling channels, and the water cooling channels on the laser main body (3) and the cooling unit (5) are connected to each other; the water outlet end of the water tank (1) is connected to the water pump (2), and is injected into the water cooling channel on the laser main body (3) through the water pump (2), thereby taking away the heat dissipated by the laser main body (3), and then entering the cooling unit (5). After being cooled by multiple cooling units (5), it flows back into the water tank (1).

2. The semiconductor laser with a water-cooling channel and the modular water-cooling system according to claim 1, characterized in that: Temperature sensors are provided on the cooling unit (5), and the cooling unit (5) includes a cooling module main body (6), a semiconductor refrigeration sheet (7), a radiator (8), and a cooling fan (9); The cooling end of the semiconductor refrigeration sheet (7) is in contact with the cooling module main body (6), the radiator (8) is installed at the heating end of the semiconductor refrigeration sheet (7), the heat is transferred to the radiator (8) by the semiconductor refrigeration sheet (7), and the heat is dissipated to the outside through the cooling fan (9).

3. The semiconductor laser with a water-cooling channel and the modular water-cooling system according to claim 1, characterized in that: The water tank (1), the water pump (2), and the laser main body (3) are connected by an external pipeline, and the cooling module is connected to the water tank (1) by an external pipeline; The cooling units (5) are connected to each other by an internal pipeline and are connected to the water cooling channel through the internal pipeline.

4. The semiconductor laser with a water cooling channel and the modular water cooling system according to claim 3, characterized in that: A flow sensor is provided on the external pipeline or the internal pipeline.

5. The semiconductor laser with a water cooling channel and the modular water cooling system according to claim 1, characterized in that: The laser main body (3) has a laser overheat protection module.

6. The semiconductor laser with a water-cooling channel and the modular water-cooling system according to claim 1, wherein: A water level alarm module is provided in the water tank (1).

7. The semiconductor laser with a water-cooling channel and the modular water-cooling system according to claim 3, characterized in that: A water filter is provided on the external pipeline or the internal pipeline.

8. The semiconductor laser with a water cooling channel and the modular water cooling system according to claim 1, characterized in that: A temperature control module is provided in the water tank (1).

9. The semiconductor laser with a water-cooling channel and the modular water-cooling system according to claim 1, characterized in that: Quick connectors (4) are provided at the connection ends of the laser main body (3) and the cooling unit (5).

10. The semiconductor laser with a water-cooling channel and the modular water-cooling system according to claim 1, characterized in that: The water cooling channels of the laser main body (3) and the cooling unit (5) are formed by machining milling, and the main body and the cover are welded by friction welding or brazing.