Circuit board with heat dissipation function

Abstract

The utility model is applicable to the technical field of circuit boards, and provides a circuit board with a heat dissipation function, which comprises a circuit board body, the upper surface of the circuit board body is fixedly connected with a heat dissipation frame, the outer wall of the heat dissipation frame is provided with a heat dissipation channel, the upper surface of the circuit board body is fixedly connected with heat dissipation fins, and the heat dissipation fins are arranged in the heat dissipation channel. The circuit board comprises a circuit board body, a heat dissipation frame is arranged in the circuit board body, heat dissipation fins are arranged in the heat dissipation frame, an air pump is arranged on the upper surface of the heat dissipation frame, an inner cavity is formed in the heat dissipation frame, and air holes are formed in the inner wall of the heat dissipation frame. According to the circuit board, the air pump works, high-speed airflow is generated in the heat dissipation channel, the airflow can take away the temperature of the outer walls of the heat dissipation fins through the heat dissipation fins, the heat dissipation efficiency of the circuit board body is improved, an air inlet channel and an air exhaust channel do not need to be reserved when the air pump works, and the use space of the circuit board body is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit boards, and particularly relates to a circuit board with a heat dissipation function. Background Art

[0002] The circuit board plays a role in connecting components in the electrical equipment, and can also play a role in controlling the circuit in the electrical equipment, and can form an integrated circuit in the electrical equipment. In order to improve the service life of the circuit board, many circuit boards are equipped with heat dissipation structures.

[0003] Most of the existing heat dissipation structures of circuit boards are fan air guiding, and heat dissipation is achieved through the convection of air. However, fan air guiding requires reserving an air inlet channel and an air outlet channel for the fan, resulting in a large occupied space of the circuit board. Summary of the Utility Model

[0004] The utility model provides a circuit board with a heat dissipation function, aiming to solve the problem that most of the existing heat dissipation structures of circuit boards are fan air guiding, and heat dissipation is achieved through the convection of air. However, fan air guiding requires reserving an air inlet channel and an air outlet channel for the fan, resulting in a large occupied space of the circuit board.

[0005] The utility model is realized as follows. A circuit board with a heat dissipation function includes a circuit board body. A heat dissipation frame is fixedly connected to the upper surface of the circuit board body, and heat dissipation channels are formed in the outer wall of the heat dissipation frame. Heat dissipation fins are fixedly connected to the upper surface of the circuit board body, and the heat dissipation fins are located inside the heat dissipation frame. An air pump is arranged on the upper surface of the heat dissipation frame, and an inner cavity is formed inside the heat dissipation frame. Air holes are formed in the inner wall of the heat dissipation frame, and the air holes and the air pump are communicated with the inner cavity.

[0006] Preferably, the air pump can be located outside the circuit board body.

[0007] Preferably, a dust-proof cover is arranged on the outer wall of the left end of the air pump.

[0008] Preferably, the dust-proof cover is threadedly connected to the air pump.

[0009] Preferably, an insect-proof net is fixedly connected to the inner wall of the heat dissipation channel.

[0010] Compared with the prior art, the embodiments of the present application mainly have the following beneficial effects:

[0011] The surface area of the circuit board body is increased by the heat dissipation fins, improving the heat exchange performance of the circuit board body. When the air pump works, a high-speed air flow is generated in the heat dissipation channel. The air flow can carry away the temperature of the outer wall of the heat dissipation fins through the heat dissipation fins, improving the heat dissipation efficiency of the circuit board body. When the air pump works, there is no need to reserve an air inlet channel and an air outlet channel, reducing the space occupied by the circuit board body. Description of the Drawings

[0012] Figure 1 is a three-dimensional structural schematic diagram of the present utility model;

[0013] Figure 2 is a three-dimensional structural schematic diagram of the heat dissipation frame of the present utility model;

[0014] Figure 3 is a sectional structural schematic diagram of the heat dissipation frame of the present utility model;

[0015] In the figure: 1, circuit board body; 2, heat dissipation frame; 3, air pump; 4, heat dissipation channel; 5, heat dissipation fins; 6, inner cavity; 7, air holes; 8, insect-proof net; 9, dust-proof cover. Detailed Embodiments

[0016] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above description of the drawings are intended to cover non-exclusive inclusion. The terms "first", "second", etc. in the specification and claims of this application or the above drawings are used to distinguish different objects and not to describe a specific order.

[0017] Reference to "embodiment" herein means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of this application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0018] An embodiment of the present utility model provides a circuit board with a heat dissipation function, as Figures 1-3As shown in the figure, it includes a circuit board body 1. A heat dissipation frame 2 is fixedly connected to the upper surface of the circuit board body 1, and heat dissipation channels 4 are formed on the outer wall of the heat dissipation frame 2. A heat dissipation fin 5 is fixedly connected to the upper surface of the circuit board body 1, and the heat dissipation fin 5 is located inside the heat dissipation frame 2. An air pump 3 is arranged on the upper surface of the heat dissipation frame 2, and an inner cavity 6 is formed inside the heat dissipation frame 2. Air holes 7 are formed on the inner wall of the heat dissipation frame 2, and the air holes 7 and the air pump 3 are communicated with the inner cavity 6.

[0019] It should be noted that most of the existing circuit board heat dissipation structures are fan air guiding, dissipating heat through the convection of air. However, fan air guiding requires reserving an air inlet channel and an air outlet channel for the fan, resulting in a large occupied space for the circuit board. Therefore, to solve the problem that most of the existing circuit board heat dissipation structures are fan air guiding, dissipating heat through the convection of air, and fan air guiding requires reserving an air inlet channel and an air outlet channel for the fan, resulting in a large occupied space for the circuit board, in this solution, the surface area of the circuit board body 1 is increased through the heat dissipation fins 5, and the heat exchange performance of the circuit board body 1 is improved. By the operation of the air pump 3, a high-speed air flow is generated in the heat dissipation channels 4, and the air flow can take away the temperature on the outer wall of the heat dissipation fins 5 through the heat dissipation fins 5, improving the heat dissipation efficiency of the circuit board body 1. When the air pump 3 operates, there is no need to reserve an air inlet channel and an air outlet channel, reducing the usage space of the circuit board body 1.

[0020] In a further preferred embodiment of the present utility model, as Figure 1 shown, the air pump 3 can be located outside the circuit board body 1.

[0021] In this embodiment, the air pump 3 is located outside the circuit board body 1, and the air pump 3 can be communicated with the inner cavity 6 through an air pipe, preventing the air pump 3 from increasing the occupied space of the circuit board body 1 on the circuit board body 1 and further reducing the usage space of the circuit board body 1.

[0022] In a further preferred embodiment of the present utility model, as Figure 2 shown, a dust-proof cover 9 is arranged on the left end outer wall of the air pump 3.

[0023] In this embodiment, through the dust-proof cover 9, impurities are prevented from entering the inner cavity 6 and causing blockage of the air holes 7.

[0024] In a further preferred embodiment of the present utility model, as Figure 2 shown, the dust-proof cover 9 and the air pump 3 are in threaded connection.

[0025] In this embodiment, the threaded connection between the dust-proof cover 9 and the air pump 3 facilitates the disassembly and assembly of the dust-proof cover 9.

[0026] In a further preferred embodiment of the present utility model, as Figure 1 shown, an insect-proof net 8 is fixedly connected to the inner wall of the heat dissipation channel 4.

[0027] It should be noted that, for the foregoing embodiments, for the sake of simple description, they are all expressed as a series of action combinations. However, those skilled in the art should know that the present utility model is not limited by the described action sequence, because according to the present utility model, some steps may be performed in other sequences or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily essential to the present utility model.

[0028] In several embodiments provided by the present application, it should be understood that the disclosed device can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the above division of units may have other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling or communication connection between each other can be through some interfaces. The indirect coupling or communication connection between devices or units can be in the form of telecommunications or other forms.

[0029] The units described as separate components above may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0030] The above embodiments are only used to illustrate the technical solutions of the present utility model, rather than limiting the protection scope of the utility model. Obviously, the described embodiments are only part of the embodiments of the present utility model, rather than all embodiments. Based on these embodiments, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model. Although the present utility model has been described in detail with reference to the above embodiments, those of ordinary skill in the art can still, without conflict, make combinations, additions, deletions or other adjustments to the features in the embodiments of the present utility model according to the situation without creative efforts, so as to obtain different technical solutions that essentially do not deviate from the concept of the present utility model. These technical solutions also belong to the scope of protection of the present utility model.

Claims

1. A circuit board with a heat dissipation function, characterized in that, It includes a circuit board body (1), on the upper surface of the circuit board body (1) is fixedly connected a heat dissipation frame (2), and on the outer wall of the heat dissipation frame (2) is provided a heat dissipation channel (4). On the upper surface of the circuit board body (1) is fixedly connected a heat dissipation fin (5), and the heat dissipation fin (5) is located inside the heat dissipation frame (2). On the upper surface of the heat dissipation frame (2) is provided an air pump (3), and inside the heat dissipation frame (2) is provided an inner cavity (6). On the inner wall of the heat dissipation frame (2) is provided an air hole (7), and the air hole (7) and the air pump (3) are communicated with the inner cavity (6).

2. The circuit board with a heat dissipation function according to claim 1, wherein The air pump (3) can be located outside the circuit board body (1).

3. The circuit board with heat dissipation function according to claim 1, characterized in that, On the outer wall of the left end of the air pump (3) is provided a dust-proof cover (9).

4. The circuit board with a heat dissipation function according to claim 3, characterized in that, The dust-proof cover (9) is threadedly connected with the air pump (3).

5. A circuit board with a heat dissipation function according to claim 1, characterized in that, On the inner wall of the heat dissipation channel (4) is fixedly connected an insect-proof net (8).

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