Heat dissipation device, power supply and server power supply

Abstract

The utility model relates to a heat dissipation device, a power supply and a server power supply. The heat dissipation device comprises a PCB (Printed Circuit Board), a patch power device, wherein the patch power device is connected with the PCB; the heat dissipation plate comprises a first plate surface and a second plate surface which are opposite to each other, a heat dissipation structure is arranged on the first plate surface, at least one weld leg is arranged on the second plate surface, and the heat dissipation plate is connected with the PCB through the weld legs. The heat dissipation plate can be directly connected with the PCB in cooperation with the weld legs, fixing parts such as screws are not needed for fixing, the assembling space and the manufacturing process are saved, the heat conduction path is short, heat of the heat dissipation plate can be directly taken away through air flow, the heat dissipation capacity is effectively improved, and the technical problem that the heat dissipation effect of the patch power device is poor is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electrical components, in particular to a heat dissipation device, a power supply and a server power supply. Background Art

[0002] At present, with the rapid growth of the server market, the demand for server power supplies has also increased significantly. With the upgrading of server power supplies, server power supplies are constantly developing towards smaller sizes and higher powers. However, traditional surface-mounted power devices are relatively large in size, and their corresponding radiators are also relatively large, occupying a large amount of space, which restricts the development of power supply products (such as server power supplies) towards smaller sizes and higher powers.

[0003] At this time, smaller and smaller surface-mounted power devices provide the necessary conditions for the development of high-power density power supplies. For example, Figure 1 、 Figure 2 As shown, the volume of existing surface-mounted power devices has been greatly reduced compared to traditional surface-mounted power devices (only one-thousandth of the volume of traditional surface-mounted power devices), but the loss has not decreased. How to solve the heat dissipation problem of small-sized surface-mounted power devices has become a difficult point. Currently, the following several heat dissipation methods are mainly adopted to achieve this:

[0004] Method 1: Increase the number of surface-mounted power devices 10 so that the loss borne by each surface-mounted power device 10 is smaller, and thus the heat dissipation of each surface-mounted power device 10 is relatively reduced;

[0005] Method 2: Add more vias 30 on the PCB board 20 where the surface-mounted power devices 10 are arranged, and use a thicker copper layer to increase the thermal conductivity in the thickness direction of the PCB board 20 and improve the heat dissipation capacity;

[0006] Method 3: Attach a heat dissipation strip (such as a copper strip) 40 to the back of the PCB board 20 to increase the contact area between the PCB board 20 and the air and improve the heat dissipation capacity;

[0007] Method 4: Install an additional heat sink to increase the heat dissipation area.

[0008] However, the above-mentioned methods for improving heat dissipation all have certain disadvantages and deficiencies. For example, in Method 1, blindly increasing the number of surface-mounted power devices 10 solely to solve the heat dissipation problem will not only increase costs but also waste a lot of space, and the actual effect is not ideal; in Method 2, thickening the copper layer will also cause an increase in costs, and adding vias 30 is restricted by the process and there may be other signal traces on the inner layer of the PCB board 20, so the vias 30 cannot be added; in Method 3, adding heat dissipation strips 40 is restricted by the material characteristics (softness) of the copper strips themselves and cannot be processed into smaller sizes, and since a large number of copper strips cannot be laid on the surface of the PCB board 20, a large surface area cannot be achieved, and the actual heat dissipation effect is not ideal; in Method 4, the added heat sinks often need to be fixed using structures such as screws. Due to their small size, the manufacturing process is difficult and it also occupies a large amount of space.

[0009] In the related art, there is currently no effective solution to the problem of poor heat dissipation effect for small-sized surface-mounted power devices.

[0010] Therefore, based on years of experience and practice in the relevant industry, the inventor of the present invention proposes a heat dissipation device, a power supply, and a server power supply to overcome the defects of the prior art. Utility Model Content

[0011] The present utility model provides a heat dissipation device, a power supply, and a server power supply for solving the problem of poor heat dissipation effect of small-sized surface-mounted power devices in the prior art.

[0012] The object of the present utility model can be achieved by the following solutions:

[0013] The present utility model provides a heat dissipation device, and the heat dissipation device includes:

[0014] A PCB board;

[0015] A surface-mounted power device, and the surface-mounted power device is connected to the PCB board;

[0016] A heat dissipation plate, the heat dissipation plate includes a first plate surface and a second plate surface opposite to each other. A heat dissipation structure is provided on the first plate surface, and at least one welding foot is provided on the second plate surface. The heat dissipation plate is connected to the PCB board through the welding foot.

[0017] In a preferred embodiment of the present utility model, the heat dissipation plate and the surface-mounted power device are respectively arranged on both sides of the PCB board.

[0018] In a preferred embodiment of the present utility model, a heat conduction layer is provided on the second plate surface of the heat dissipation plate.

[0019] In a preferred embodiment of the present utility model, at least one platform is reserved on the heat dissipation plate, and the platform is used for negative pressure adsorption of surface mount components.

[0020] In a preferred embodiment of the present utility model, the heat dissipation plate and the surface mount power device are arranged on the same side of the PCB board. A accommodating space for accommodating the surface mount power device is left between the heat dissipation plate and the board surface of the PCB board, and the heat dissipation plate at least covers the surface mount power device.

[0021] In a preferred embodiment of the present utility model, the heat dissipation plate has an avoidance portion. When the heat dissipation plate is connected to the PCB board, the avoidance portion is used to provide a accommodating space for preset functional components on the PCB board.

[0022] In a preferred embodiment of the present utility model, the avoidance portion is a through hole and / or notch opened on the heat dissipation plate and penetrating the heat dissipation plate, and / or the avoidance portion is a accommodating groove opened on the second board surface of the heat dissipation plate.

[0023] In a preferred embodiment of the present utility model, the heat dissipation structure includes a plurality of convex portions protruding from the first board surface, and a groove-shaped concave portion is formed between adjacent two of the convex portions.

[0024] In a preferred embodiment of the present utility model, an insulating layer is covered on the surface of the heat dissipation plate.

[0025] In a preferred embodiment of the present utility model, the welding leg is a columnar or sheet-shaped welding leg made of carbon steel, and a tin layer is plated on the surface of the carbon steel.

[0026] The present utility model provides a power supply, and the power supply includes the above-mentioned heat dissipation device.

[0027] The present utility model provides a server power supply, and the server power supply includes the above-mentioned heat dissipation device.

[0028] As described above, the features and advantages of the heat dissipation device, power supply and server power supply of the present utility model are:

[0029] A heat dissipation structure is arranged on the first board surface of the heat dissipation plate to improve the heat dissipation capacity. The second board surface of the heat dissipation plate is provided with welding legs and is directly connected to the PCB board through the welding legs, without using fixing parts such as screws for fixing, saving the assembly space and manufacturing process, and having a short heat conduction path, ensuring good heat transfer performance between the heat dissipation plate and the surface mount power device. The heat of the heat dissipation plate can be directly taken away through air flow, improving the heat dissipation capacity of the heat dissipation plate for the surface mount power device. Description of the Drawings

[0030] The following drawings are only intended to illustrate and explain the present utility model schematically, and do not limit the scope of the present utility model. Among them:

[0031] Figure 1 : One of the schematic structural diagrams of the surface mount power device on the PCB board in the prior art.

[0032] Figure 2 : Another schematic structural diagram of the surface mount power device on the PCB board in the prior art.

[0033] Figure 3 : Schematic structural diagram of the heat dissipation plate installed on the PCB board in the heat dissipation device of the present utility model.

[0034] Figure 4 : Schematic rear view of the heat dissipation plate in the heat dissipation device of the present utility model.

[0035] Figure 5 : Schematic structural diagram of the convex part on the heat dissipation plate in the heat dissipation device of the present utility model.

[0036] Figure 6 : One of the front cross-sectional views of the surface mount power device in the heat dissipation device of the present utility model.

[0037] Figure 7 : One of the side cross-sectional views of the heat dissipation plate installed on the PCB board in the heat dissipation device of the present utility model.

[0038] Figure 8 : Another front cross-sectional view of the surface mount power device in the heat dissipation device of the present utility model.

[0039] Figure 9 : Another side cross-sectional view of the heat dissipation plate installed on the PCB board in the heat dissipation device of the present utility model.

[0040] Figure 10 : Front view of the heat dissipation plate installed on the PCB board in the heat dissipation device of the present utility model.

[0041] Figure 11 : Schematic front view of the heat dissipation plate in the heat dissipation device of the present utility model.

[0042] Reference numerals in the background art are:

[0043] 10. Surface mount power device; 20. PCB board;

[0044] 30. Via hole; 40. Heat dissipation strip.

[0045] Reference numerals in the present utility model are:

[0046] 1. Heat dissipation plate; 101. Convex part;

[0047] 102. Weld foot; 103. Concave part;

[0048] 104. Avoidance part; 105. Platform;

[0049] 2. PCB board; 3. Surface mount power device;

[0050] 301. Heating element; 302. Metal plate;

[0051] 303. Housing; 4. Functional element;

[0052] 5. Accommodating space. Detailed implementation mode

[0053] For a clearer understanding of the technical features, objectives, and effects of the present utility model, the specific implementation mode of the present utility model is described below with reference to the accompanying drawings.

[0054] To solve the fundamental problem of heat dissipation in forced convection, it is necessary to increase the convective heat resistance between the heat source and the air flowing through the heat source or the air around the heat source. Since the convective heat resistance is 1 / (h×A), where h is the convective coefficient and A is the surface area of contact between the heat source and the air, it can be seen that the magnitude of the convective heat resistance depends on the convective coefficient h and the surface area of contact between the heat source and the air. The present utility model can not only increase the surface area of contact A between the heat source and the air, but also cause the air flowing through or around to generate turbulence, thereby increasing the convective coefficient h. Therefore, the heat dissipation device is designed from both the convective coefficient h and the surface area of contact between the heat source and the air to achieve a better heat dissipation effect for surface mount power devices of smaller sizes. While ensuring that both the surface mount power device and the heat dissipation device can be of smaller volumes, it is thus applicable to small-sized power supply products, enabling power supply products to develop in the direction of small size and high power.

[0055] Embodiment 1

[0056] As Figures 3 to 11 shown, the present utility model provides a heat dissipation device, which includes a PCB board 2, a surface mount power device 3, and a heat dissipation plate 1. The surface mount power device 3 is connected to the PCB board 2; the heat dissipation plate 1 includes an opposite first plate surface and a second plate surface. A heat dissipation structure is provided on the first plate surface, and at least one weld foot 102 is provided on the second plate surface. The heat dissipation plate 1 is connected to the PCB board 2 through the weld foot 102.

[0057] In this utility model, a heat dissipation structure is provided on the first surface of the heat dissipation plate 1 to enhance the heat dissipation capacity. The second surface of the heat dissipation plate 1 is provided with welding feet 102, and is directly connected to the PCB board 2 through the welding feet 102, without the need for fixing parts such as screws for fixation, saving assembly space and the manufacturing process (the process of production and processing), greatly shortening the heat conduction path, ensuring good heat transfer performance between the heat dissipation plate 1 and the surface-mounted power device 3, and the heat of the heat dissipation plate 1 can be directly taken away through air flow, improving the heat dissipation capacity of the heat dissipation plate 1 for the surface-mounted power device 3.

[0058] In an alternative embodiment of the present utility model, as Figure 6 , Figure 7 shown, the surface-mounted power device 3 includes a housing 303 and a heating element 301 located inside the housing 303. A metal plate 302 is provided on one side of the housing 303, and the heating element 301 is connected to the metal plate 302. At this time, if the thermal resistance Rja between the heating element 301 and the housing 303 is much larger than the thermal resistance Rjc of the metal plate 302 (i.e., Rja >> Rjc), most of the heat generated by the heating element 301 will conduct heat and be discharged from the side of the metal plate 302. Therefore, the side of the surface-mounted power device 3 with the metal plate 302 needs to be bonded or welded to the surface of the PCB board 2, and the heat dissipation plate 1 is welded to the PCB board 2 through the welding feet 102, and is respectively arranged on both sides of the PCB board 2 with the surface-mounted power device 3, so that the heat conducted from the metal plate 302 on the surface-mounted power device 3 to the PCB board 2 is directly transferred to the heat dissipation plate 1 and dissipated, which is convenient for manufacturing and has good heat dissipation effect.

[0059] In an alternative embodiment of the present utility model, as Figure 8 , Figure 9As shown, the surface mount power device 3 includes a housing 303 and a heating element 301 located inside the housing 303. Metal plates 302 are respectively arranged on two opposite sides of the housing 303. The heating element 301 is clamped between the two metal plates 302 and connected to the two metal plates 302. At this time, the thermal resistance Rjc from the heating element 301 to the two side metal plates 302 is the same or approximately the same, and the two metal plates 302 can be used for heat conduction. Therefore, the heat sink 1 is welded to the PCB board 2 through the welding feet 102, and is arranged on the same side of the PCB board 2 as the surface mount power device 3. A receiving space 5 for accommodating the surface mount power device 3 is left between the surface of the heat sink 1 and the PCB board 2, and the area of the heat sink 1 can at least cover the surface mount power device 3. In this case, one side metal plate 302 on the surface mount power device 3 is in contact with the surface of the PCB board 2, while the other opposite side metal plate 302 on the surface mount power device 3 is in contact with the second surface of the heat sink 1, so that the heat conducted by the metal plate 302 on the surface mount power device 3 is directly transferred to the heat sink 1 for heat dissipation, which is convenient for manufacturing and has good heat dissipation effect. Of course, when there is no surface mount power device 3 or other preset functional components on the surface of the PCB board 2 facing the heat sink 1, the back surface of the heat sink 1 can also be attached to the surface of the PCB board 2 to achieve the purpose of rapid heat dissipation.

[0060] In this embodiment, as Figure 9 shown, the height of the welding feet 102 is greater than or equal to the height of the surface mount power device 3 to ensure that the welding of the heat sink 1 will not affect the setting of the surface mount power device 3 on the PCB board 2 and avoid interference between the two.

[0061] In an alternative embodiment of the present utility model, a heat conducting layer (not shown) is provided on the second surface of the heat sink 1. Through the setting of the heat conducting layer, the flatness tolerance of the heat sink 1 can be compensated, the heat conduction performance can be improved, and thus the heat sink 1 has better heat dissipation ability. The heat conducting layer can be made of heat conducting materials such as but not limited to silica gel.

[0062] In an alternative embodiment of the present utility model, as Figure 11 shown, at least one platform 105 is reserved on the front surface (i.e., the first surface) of the heat sink 1. The platform 105 or at least part of the platform 105 is a flat plane. The setting of the platform 105 is used for negative pressure adsorption and fixation of surface mount components, so as to facilitate the installation of surface mount components on the heat sink 1. The surface mount components in the present utility model are only limited to their assembly form (i.e., surface mount form), and the functions of the surface mount components are not limited. Surface mount components with different functions are all applicable to the assembly of the heat sink 1.

[0063] In an alternative embodiment of the present utility model, as Figure 10As shown in the figure, the heat dissipation plate 1 is provided with an avoidance portion 104. When the heat dissipation plate 1 is connected to the PCB board 2, if there are other functional components 4 preset on the PCB board 2, the setting of the avoidance portion 104 enables the heat dissipation plate 1 to avoid the functional components 4, thereby providing a placement space for the functional components 4 on the PCB board 2, ensuring that the setting of the heat dissipation plate 1 does not interfere with the functional components 4 preset on the PCB board 2, and ensuring the normal operation of other functional components 4 on the PCB board 2. In the present utility model, the types of the functional components 4 are not limited. According to the functions to be achieved by the PCB board 2, suitable functional components 4 can be selected.

[0064] Further, as Figure 10 shown, the avoidance portion 104 can be a through hole opened on the heat dissipation plate 1 and penetrating the heat dissipation plate 1. When the heat dissipation plate 1 is connected to the PCB board 2, the functional component 4 on the PCB board 2 is exactly located within the through hole to achieve the purpose of avoidance. Of course, the avoidance portion 104 can also be a notch (or gap) opened on the heat dissipation plate 1 and located at the edge of the heat dissipation plate 1. At this time, the functional component 4 is located at the edge or near the edge of the PCB board 2. When the heat dissipation plate 1 is connected to the PCB board 2, the functional component 4 on the PCB board 2 is exactly located within the notch to achieve the purpose of avoidance.

[0065] In the present utility model, the avoidance portion 104 can be a through hole opened on the heat dissipation plate 1 and penetrating the heat dissipation plate 1. In another alternative embodiment of the present utility model, the avoidance portion 104 can also be a receiving groove opened on the second surface of the heat dissipation plate 1 without penetrating the heat dissipation plate 1. When the heat dissipation plate 1 is connected to the PCB board 2, the functional component 4 on the PCB board 2 is exactly located within the receiving groove to achieve the purpose of avoidance.

[0066] In an alternative embodiment of the present utility model, when there are multiple lines on the PCB board 2 and the potentials on each line are different, if the heat dissipation plate 1 is conductive, a short - circuit situation may occur. Therefore, an insulating layer can be provided on the surface of the heat dissipation plate 1. By insulating the surface of the heat dissipation plate 1, its surface is insulated, and there is almost no impact on the heat dissipation effect of the heat dissipation plate 1, and the purpose of avoiding the occurrence of short - circuit situations can be achieved.

[0067] In an alternative embodiment of the present utility model, as Figure 3 、 Figure 5 、 Figure 7 、 Figure 9 、 Figure 10As shown in the figure, the heat dissipation plate 1 has opposite front (i.e., the first plate surface) and back (i.e., the second plate surface). Among them, the heat dissipation structure is specifically that a plurality of convex portions 101 protruding from the surface of the heat dissipation plate 1 are provided on the front of the heat dissipation plate 1, and a groove-shaped concave portion 103 is formed between two adjacent convex portions 101; the welding feet 102 are provided on the back of the heat dissipation plate 1. By providing a plurality of convex portions 101 protruding from the surface of the heat dissipation plate 1 on the front of the heat dissipation plate 1, and a groove-shaped concave portion 103 is formed between two adjacent convex portions 101. Through the cooperation of the convex portions 101 and the concave portions 103, the surface area of the side of the heat dissipation plate 1 in contact with the air (i.e., the side facing away from the surface-mounted power device 3) can be greatly increased, and the contact area between the heat dissipation plate 1 and the air is increased, thereby improving the heat dissipation capacity of the heat dissipation plate 1; moreover, through the arrangement of the plurality of convex portions 101 and the concave portions 103, air turbulence flowing through the surface of the heat dissipation plate 1 can be caused, which is more conducive to the air taking away the heat transferred to the heat dissipation plate 1, effectively improving the heat dissipation capacity for the relatively small surface-mounted power device 3.

[0068] In an alternative embodiment of the present invention, as Figure 3 、 Figure 4 shown, the heat dissipation plate 1 is a rectangular flat plate structure, and the size of the heat dissipation plate 1 is adapted to the PCB board 2, that is, when the heat dissipation plate 1 is in a connected state with the PCB board 2, the heat dissipation plate 1 can cover the plate surface of the PCB board 2 as much as possible. Among them, for the rectangular heat dissipation plate 1, the number of welding feet 102 can be set to four. The four welding feet 102 are located on the back of the heat dissipation plate 1 and are respectively close to the four vertex positions of the heat dissipation plate 1, which can not only ensure the stable connection between the heat dissipation plate 1 and the PCB board 2, but also the arrangement of the plurality of welding feet 102 is beneficial to the rapid transfer of heat and improves the heat conduction ability. Of course, for heat dissipation plates 1 of other shapes, the number and position of the welding feet 102 can also be set to ensure that the heat dissipation plate 1 and the PCB board 2 have good connection strength.

[0069] In an alternative embodiment of the present invention, as Figure 3 、 Figure 7 、 Figure 9 、 Figure 10 shown, the plurality of convex portions 101 are a plurality of strip-shaped protrusions arranged side by side in one direction on the front of the heat dissipation plate 1, and the concave portion 103 is a strip-shaped groove located between two adjacent strip-shaped protrusions, so as to achieve the purpose of increasing the contact area between the heat dissipation plate 1 and the air and improving the heat dissipation capacity of the heat dissipation plate 1.

[0070] Specifically, as Figure 3 、 Figure 7 、 Figure 9 、 Figure 10As shown, the strip-shaped protrusions extend along the width direction of the heat dissipation plate 1, and a plurality of strip-shaped protrusions are arranged side by side along the length direction of the heat dissipation plate 1. Here, the width of the strip-shaped protrusions is not limited, as long as the cooperation between the strip-shaped protrusions and the strip-shaped grooves can cause air turbulence flowing through the surface of the heat dissipation plate 1.

[0071] In an alternative embodiment of the present invention, as Figure 5 shown, a plurality of convex portions 101 are a plurality of bumps arranged in an array on the front surface of the heat dissipation plate 1. Specifically, as Figure 5 shown, the bumps are pyramid-shaped, and the concave portions 103 are grooves with an inverted triangular cross-section located between adjacent bumps. The pyramid-shaped bumps can increase their surface area as much as possible, so that the cooperation between the pyramid-shaped bumps and the grooves can cause air turbulence flowing through the surface of the heat dissipation plate 1. Here, the size of the pyramid-shaped bumps can be determined according to the size of the heat dissipation plate 1 and is not limited here, as long as the cooperation between the pyramid-shaped bumps and the grooves can cause air turbulence flowing through the surface of the heat dissipation plate 1.

[0072] In an alternative embodiment of the present invention, the heat dissipation plate 1 can be a flat heat dissipation plate made of aluminum or aluminum alloy. Of course, copper materials can also be used. Aluminum or aluminum alloy materials not only have good heat dissipation performance but also have lower costs compared to copper materials, showing better economic efficiency. When manufacturing the heat dissipation plate 1, cold forging or extrusion forming methods can be preferentially used to form the heat dissipation plate 1, which also has the advantage of low cost.

[0073] In an alternative embodiment of the present invention, the welding feet 102 are columnar or sheet-shaped welding feet made of carbon steel, and the surface of the carbon steel is plated with a tin layer, which is more convenient for welding. Among them, the welding feet 102 can be connected to the heat dissipation plate 1 body and / or the PCB board 2 by, but not limited to, wave soldering or reflow soldering methods.

[0074] The characteristics and advantages of the heat dissipation device of the present invention are as follows:

[0075] First, in this heat dissipation device, the heat dissipation plate 1 is directly connected to the PCB board 2 through the welding feet 102, so that the heat generated by the surface-mounted power device 3 on the PCB board 2 can be directly transferred to the heat dissipation plate 1 through the welding feet 102, ensuring good heat transfer performance between the heat dissipation plate 1 and the surface-mounted power device 3. The heat generated by the surface-mounted power device 3 can be quickly transferred to the heat dissipation plate 1, improving the heat dissipation ability of the heat dissipation plate 1 for the surface-mounted power device 3.

[0076] Second, in this heat dissipation device, the cooperation between the convex portions 101 and the concave portions 103 on the heat dissipation plate 1 can greatly increase the surface area on the side of the heat dissipation plate 1 in contact with the air, increasing the contact area between the heat dissipation plate 1 and the air, thereby improving the heat dissipation ability of the heat dissipation plate 1.

[0077] III. In this heat dissipation device, through the arrangement of a plurality of convex portions 101 and concave portions 103, air turbulence can be caused to flow through the surface of the heat dissipation plate 1, which is more conducive to the air taking away the heat transferred to the heat dissipation plate 1, effectively improving the heat dissipation capacity for the relatively small patch power device 3.

[0078] IV. This heat dissipation device has a simple structure, low material cost, is convenient for production and manufacturing, saves costs, and has better economy.

[0079] V. An avoidance portion 104 is provided on this heat dissipation device, which can enable the heat dissipation plate 1 to avoid the preset functional elements 4 on the PCB board 2, ensuring that the setting of the heat dissipation plate 1 will not interfere with the functional elements 4 preset on the PCB board 2, and ensuring the normal operation of other functional elements 4 on the PCB board 2.

[0080] VI. In this heat dissipation device, an insulating layer is covered on the surface of the heat dissipation plate 1, which not only has almost no influence on the heat dissipation effect of the heat dissipation plate 1, but also can achieve the effects of insulation and avoiding short circuits.

[0081] Embodiment 2

[0082] As Figure 3 、 Figure 7 、 Figure 9 、 Figure 10 shown, the present invention provides a power supply, and this power supply includes the above-mentioned heat dissipation device.

[0083] In an optional embodiment of the present invention, the power supply can be but is not limited to a server power supply.

[0084] The power supply of the present invention has the characteristics and advantages of the above-mentioned heat dissipation device, which will not be elaborated here.

[0085] Embodiment 3

[0086] As Figure 3 、 Figure 7 、 Figure 9 、 Figure 10 shown, the present invention provides a server power supply, and this server power supply includes the above-mentioned heat dissipation device.

[0087] The server power supply of the present invention has the characteristics and advantages of the above-mentioned heat dissipation device, which will not be elaborated here.

[0088] The above are only the schematic specific embodiments of the present invention and are not intended to limit the scope of the present invention. Any equivalent changes and modifications made by those skilled in the art without departing from the concept and principles of the present invention shall fall within the scope of protection of the present invention.

Claims

1. A heat dissipation device, characterized in that, The heat dissipation device includes: A PCB board; A surface-mounted power device, which is connected to the PCB board; A heat dissipation plate, the heat dissipation plate includes a first plate surface and a second plate surface opposite to each other, a heat dissipation structure is provided on the first plate surface, at least one welding foot is provided on the second plate surface, and the heat dissipation plate is connected to the PCB board through the welding foot; The heat dissipation plate and the surface-mounted power device are respectively arranged on two sides of the PCB board; or, the heat dissipation plate and the surface-mounted power device are arranged on the same side of the PCB board, and a accommodation space for accommodating the surface-mounted power device is left between the heat dissipation plate and the plate surface of the PCB board, and the heat dissipation plate at least covers the surface-mounted power device.

2. The heat dissipation device according to claim 1, wherein A heat conduction layer is provided on the second plate surface of the heat dissipation plate.

3. The heat dissipation device according to claim 1, wherein At least one platform is reserved on the heat dissipation plate, and the platform is used for negative pressure adsorption of surface-mounted components.

4. The heat dissipation device according to claim 1, wherein An avoidance part is provided on the heat dissipation plate. When the heat dissipation plate is connected to the PCB board, the avoidance part is used to provide a accommodation space for preset functional components on the PCB board.

5. The heat dissipation device according to claim 4, characterized in that, The avoidance part is a through hole and / or notch opened on the heat dissipation plate and penetrating the heat dissipation plate, and / or, the avoidance part is a accommodation groove opened on the second plate surface of the heat dissipation plate.

6. The heat dissipation device according to claim 1, characterized in that, The heat dissipation structure includes a plurality of convex parts protruding from the first plate surface, and a groove-shaped concave part is formed between two adjacent convex parts.

7. The heat dissipation device according to claim 1 or 6, characterized in that, An insulating layer is covered on the surface of the heat dissipation plate.

8. The heat dissipation device according to claim 1 or 6, characterized in that, The welding foot is a columnar or sheet-shaped welding foot made of carbon steel, and a tin layer is plated on the surface of the carbon steel.

9. A power supply, characterized in that, The power supply includes the heat dissipation device according to any one of claims 1 to 8.

10. A server power supply, characterized in that, The server power supply includes the heat dissipation device according to any one of claims 1 to 8.

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