Polishing mechanism for circuit board processing

Abstract

The utility model discloses a circuit board processing polishing mechanism which comprises a base, a polishing groove is fixedly installed on the base, the bottom of the polishing groove is fixedly communicated with a chip removal pipe penetrating through the base, the bottom end of the chip removal pipe is connected with an end cover in a screwed mode through threads, and the periphery of the bottom side of the polishing groove shrinks towards the chip removal pipe. A supporting base used for containing a circuit board is fixedly connected into the grinding groove, and a clamping assembly used for clamping the circuit board is installed in the supporting base. According to the circuit board polishing device, polishing operation of a circuit board is completed in the polishing groove, waste chips generated in the polishing process can slide into the chip removal pipe along the inclined faces on the periphery of the bottom side of the polishing groove, when the waste chips need to be cleaned, the waste chips can be smoothly discharged only by taking down the end cover, the waste chips can be effectively collected and cleaned, and the waste chips are prevented from splashing all around; and the cleanliness of the working environment is improved, sweeps can be prevented from splashing to the body of an operator, and therefore the safety of the operator is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to a grinding mechanism for circuit board processing. Background Art

[0002] Nowadays, with the rapid development of the electronics industry, the use of circuit boards is becoming more and more popular. In the production and processing of circuit boards, various treatments are required, and grinding is a common process. Special grinding devices are needed to grind circuit boards. For example, in the "Rotary Adjustment Grinding Device for Circuit Board Processing" with the patent application number 202221768583.9, a device is disclosed that realizes the horizontal and vertical movement of the grinding machine by driving a threaded rod with a motor, and drives the grinding machine to rotate by a rotating motor, so as to realize the rotatable adjustment grinding treatment of the circuit board.

[0003] However, there is a problem in the actual application of this device: that is, waste chips will be generated when grinding the circuit board. If these waste chips are not effectively cleaned and collected, the waste chips may fly around, not only polluting the working environment, but also posing a threat to the health of the staff. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a grinding mechanism for circuit board processing to solve the technical problems mentioned in the above background art.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme:

[0006] A grinding mechanism for circuit board processing includes a base. A grinding groove is fixedly installed on the base. The bottom of the grinding groove is fixedly communicated with a chip discharge pipe passing through the base. The bottom end of the chip discharge pipe is threadedly connected with an end cover. The periphery of the bottom side of the grinding groove contracts towards the direction of the chip discharge pipe. A support seat for placing the circuit board is fixedly connected in the grinding groove. A clamping assembly for clamping the circuit board is installed in the support seat. Hydraulic rods are fixedly installed on both sides of the base. The rod ends of the hydraulic rods are fixedly connected with a lifting plate. A grinding motor that moves along the length and width directions of the grinding groove is installed on the lifting plate. A grinding wheel is fixedly sleeved on the output shaft of the grinding motor.

[0007] As a further description of the above technical solution:

[0008] The clamping assembly includes a rotary cylinder, a rotating plate and an L-shaped clamping rod. The rotary cylinder is fixedly installed inside the support seat. The rotating plate is fixedly sleeved on the rotating shaft of the rotary cylinder. A plurality of groups of chutes that transition from the edge to the center are formed on the rotating plate. The plurality of groups of chutes are arranged in a circular array on the rotating plate. A sliding rod is slidably connected in the chute. The horizontal end of the clamping rod passes through the support seat and is rotationally matched with the sliding rod.

[0009] As a further description of the above technical solution:

[0010] On both sides of the bottom of the lifting plate, a first driving screw rod and a first guide rod are respectively installed. A first sliding seat is sleeved on the first driving screw rod and the first guide rod. A first driving motor is fixedly installed on one side of the lifting plate, and the output shaft of the first driving motor is in transmission connection with one end of the first driving screw rod.

[0011] As a further description of the above technical solution:

[0012] On both sides of the bottom of the first sliding seat, a second driving screw rod and a second guide rod are respectively installed. A second sliding seat is sleeved on the second driving screw rod and the second guide rod. A second driving motor is fixedly installed on one side of the first sliding seat, and the output shaft of the second driving motor is in transmission connection with one end of the second driving screw rod. The grinding motor is fixedly installed at the bottom of the second sliding seat.

[0013] As a further description of the above technical solution:

[0014] Guide columns passing through the lifting plate are fixedly connected to the four surrounding sides of the top of the base.

[0015] As a further description of the above technical solution:

[0016] Diagonal bracing-shaped reinforcing plates are fixedly connected between the four surrounding sides of the bottom side of the grinding groove and the base.

[0017] As a further description of the above technical solution:

[0018] The bottom of the support seat and the grinding groove are fixedly connected by four groups of support columns distributed in a circular array.

[0019] To sum up, due to the adoption of the above technical solution, the beneficial effects of the present utility model are as follows:

[0020] 1. In the present utility model, the grinding operation of the circuit board is completed in the grinding groove. The waste chips generated during the grinding process will slide along the inclined surfaces on the four surrounding sides of the bottom side of the grinding groove into the chip discharge pipe. When it is necessary to clean the waste chips, only the end cover needs to be removed, and the waste chips can be discharged smoothly, effectively collecting and cleaning the waste chips, avoiding the waste chips from splashing everywhere, improving the cleanliness of the working environment, and preventing the waste chips from splashing onto the operator, thereby ensuring the safety of the operator.

[0021] 2. In this utility model, the circuit board is placed on the support base, and then the rotary cylinder is started to drive the rotating plate to rotate counterclockwise. As the rotating plate rotates, the sliding groove will guide the four groups of sliding rods to move along the direction of the sliding groove. The movement of the sliding rods will pull the horizontal ends of the four groups of clamping rods to move synchronously towards the center of the support base until the vertical ends of the clamping rods clamp the circuit board, thus completing the clamping work of the circuit board and preparing for the subsequent grinding work. Through such a design, it can ensure that the circuit board is firmly fixed on the support base during the grinding process, avoiding affecting the grinding quality and accuracy due to the movement of the circuit board. At the same time, this clamping mechanism can also adapt to circuit boards of different sizes, improving the flexibility and application range of the equipment.

[0022] 3. In this utility model, by the telescoping of the hydraulic rod, the height of the lifting plate is adjusted so that the grinding wheel reaches a height position close to the circuit board. After that, the first driving motor is started. Through the cooperation of the first transmission screw rod and the first guide rod, the first sliding seat moves in the X-axis direction to directly above the position of the circuit board to be ground. Then, the second driving motor is started. Through the cooperation of the second transmission screw rod and the second guide rod, the second sliding seat moves in the Y-axis direction until the grinding wheel is aligned with the specific grinding position of the circuit board. Finally, the grinding motor is started to drive the grinding wheel to rotate and perform grinding on the circuit board. This grinding mechanism can achieve precise positioning and grinding of the circuit board, improving the grinding efficiency and accuracy. At the same time, the design of multi-axis linkage enables the device to flexibly meet the grinding requirements of different positions and angles. Description of the Drawings

[0023] Figure 1 Shows a three-dimensional structural schematic diagram of a grinding mechanism for circuit board processing provided according to an embodiment of the present utility model;

[0024] Figure 2 Shows an installation schematic diagram of the grinding motor on the lifting plate provided according to an embodiment of the present utility model;

[0025] Figure 3 Shows an internal structural schematic diagram of the grinding groove provided according to an embodiment of the present utility model;

[0026] Figure 4 Shows an internal structural schematic diagram of the support base provided according to an embodiment of the present utility model.

[0027] Legend Explanation:

[0028] 1. Base; 2. Hydraulic rod; 3. Guide post; 4. Grinding groove; 5. Reinforcing plate; 6. Lifting plate; 7. First driving motor; 8. First transmission screw; 9. First guide rod; 10. First sliding seat; 11. Second driving motor; 12. Second transmission screw; 13. Second sliding seat; 14. Grinding motor; 15. Grinding wheel; 16. Clamping rod; 17. Rotating plate; 1701. Chute; 18. Support seat; 19. Rotary cylinder; 20. Support column; 21. Chip removal pipe; 22. End cover; 23. Slide bar; 24. Second guide rod. Detailed implementation manner

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] Please refer to Figures 1-4 , the present invention provides a technical solution: a grinding mechanism for circuit board processing, including a base 1, a grinding groove 4 is fixedly installed on the base 1, a chip removal pipe 21 passing through the base 1 is fixedly communicated with the bottom of the grinding groove 4, the bottom end of the chip removal pipe 21 is threadedly connected with an end cover 22, the periphery of the bottom side of the grinding groove 4 contracts towards the direction of the chip removal pipe 21, and a diagonal bracing-shaped reinforcing plate 5 is fixedly connected between the periphery of the bottom side of the grinding groove 4 and the base 1 to increase the structural stability. When performing the grinding operation of the circuit board in the grinding groove 4, the waste chips generated during the grinding process will slide along the inclined surface of the periphery of the bottom side of the grinding groove into the chip removal pipe 21. When it is necessary to clean the waste chips, only the end cover 22 needs to be removed, and the waste chips can be smoothly discharged. Such a design can not only effectively collect and clean the waste chips, avoid the waste chips from splashing everywhere, improve the cleanliness of the working environment, but also prevent the waste chips from splashing onto the operator, thereby ensuring the safety of the operator. Through this design, not only the problem of cleaning the waste chips during the grinding process is solved, but also the practicability and safety of the entire grinding mechanism are improved.

[0031] Specifically, as Figure 3 and Figure 4As shown, the bottom of the support base 18 and the grinding groove 4 are fixedly connected by four groups of support columns 20 distributed in an annular array. The support columns 20 suspend the support base 18 in the grinding groove 1 without interfering with the discharge of waste chips. A clamping assembly for clamping the circuit board is installed in the support base 18. The clamping assembly includes a rotary cylinder 19, a rotating plate 17, and an L-shaped clamping rod 16. The rotary cylinder 19 is fixedly installed inside the support base 18, the rotating plate 17 is fixedly sleeved on the rotating shaft of the rotary cylinder 19, and a plurality of groups of chutes 1701 transitioning from the edge to the center are formed on the rotating plate 17. The plurality of groups of chutes 1701 are arranged in an annular array on the rotating plate 17. A slide bar 23 is slidably connected in the chute 1701, and the horizontal end of the clamping rod 16 passes through the support base 18 and is rotationally matched with the slide bar 23. Place the circuit board on the support base 18, and then start the rotary cylinder 19 to drive the rotating plate 17 to rotate counterclockwise. As the rotating plate 17 rotates, the chute 1701 will guide the four groups of slide bars 23 to move along the chute direction. The movement of the slide bars 23 will pull the horizontal ends of the four groups of clamping rods 16 to synchronously move towards the center of the support base 18 until the vertical ends of the clamping rods 16 clamp the circuit board, thus completing the clamping work of the circuit board and preparing for the subsequent grinding work. Through such a design, it can be ensured that the circuit board is firmly fixed on the support base during the grinding process, avoiding affecting the grinding quality and accuracy due to the movement of the circuit board. At the same time, this clamping mechanism can also adapt to circuit boards of different sizes, improving the flexibility and application range of the equipment.

[0032] Specifically, as Figure 1 and Figure 2As shown in the figure, hydraulic rods 2 are fixedly installed on both sides of the base 1. The rod ends of the hydraulic rods 2 are fixedly connected to a lifting plate 6. Guide columns 3 passing through the lifting plate 6 are fixedly connected to the four sides of the top of the base 1. On both sides of the bottom of the lifting plate 6, a first driving screw 8 and a first guide rod 9 are respectively installed. A first sliding seat 10 is sleeved on the first driving screw 8 and the first guide rod 9. A first driving motor 7 is fixedly installed on one side of the lifting plate 6. The output shaft of the first driving motor 7 is in transmission connection with one end of the first driving screw 8. On both sides of the bottom of the first sliding seat 10, a second driving screw 12 and a second guide rod 24 are respectively installed. A second sliding seat 13 is sleeved on the second driving screw 12 and the second guide rod 24. A second driving motor 11 is fixedly installed on one side of the first sliding seat 10. The output shaft of the second driving motor 11 is in transmission connection with one end of the second driving screw 12. A grinding motor 14 is fixedly installed at the bottom of the second sliding seat 13. A grinding wheel 15 is fixedly sleeved on the output shaft of the grinding motor 14. By the telescoping of the hydraulic rod 2, the height of the lifting plate 6 is adjusted so that the grinding wheel 15 reaches a height position close to the circuit board. After that, the first driving motor 7 is started. Through the cooperation of the first driving screw 8 and the first guide rod 9, the first sliding seat 10 is moved to directly above the position of the circuit board to be ground in the X-axis direction. Then the second driving motor 11 is started. Through the cooperation of the second driving screw 12 and the second guide rod 24, the second sliding seat 13 is moved in the Y-axis direction until the grinding wheel 15 is aligned with the specific grinding position of the circuit board. Finally, the grinding motor 14 is started to drive the grinding wheel 15 to rotate, and the circuit board is ground. This grinding mechanism can achieve precise positioning and grinding of the circuit board, improving the efficiency and precision of grinding. At the same time, the design of multi-axis linkage enables the device to flexibly meet the grinding requirements of different positions and angles.

[0033] Working principle: When in use, first, place the circuit board on the support seat 18, and then start the rotary cylinder 19 to drive the rotating plate 17 to rotate counterclockwise. As the rotating plate 17 rotates, the sliding groove 1701 will guide the four groups of sliding rods 23 to move along the sliding groove direction. The movement of the sliding rods 23 will pull the horizontal ends of the four groups of clamping rods 16 to synchronously move towards the center of the support seat 18 until the vertical ends of the clamping rods 16 clamp the circuit board.

[0034] Secondly, by the telescoping of the hydraulic rod 2, the height of the lifting plate 6 is adjusted so that the grinding wheel 15 reaches a height position close to the circuit board. After that, the first driving motor 7 is started. Through the cooperation of the first driving screw 8 and the first guide rod 9, the first sliding seat 10 is moved to directly above the position of the circuit board to be ground in the X-axis direction. Then the second driving motor 11 is started. Through the cooperation of the second driving screw 12 and the second guide rod 24, the second sliding seat 13 is moved in the Y-axis direction until the grinding wheel 15 is aligned with the specific grinding position of the circuit board. Finally, the grinding motor 14 is started to drive the grinding wheel 15 to rotate, and the circuit board is ground.

[0035] Finally, the grinding operation of the circuit board is completed in the grinding groove 4. The waste chips generated during the grinding process will slide along the inclined surfaces around the bottom side of the grinding groove into the chip discharge pipe 21. When it is necessary to clean the waste chips, only the end cover 22 needs to be removed, and the waste chips can be smoothly discharged, effectively collecting and cleaning the waste chips, avoiding the splashing of waste chips everywhere, improving the cleanliness of the working environment, and preventing the waste chips from splashing onto the operators, thus ensuring the safety of the operators.

[0036] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, making equivalent substitutions or changes, should be covered by the protection scope of the present invention.

Claims

1. A grinding mechanism for circuit board processing, comprising a base (1), characterized in that, A grinding groove (4) is fixedly installed on the base (1). A chip discharge pipe (21) passing through the base (1) is fixedly communicated with the bottom of the grinding groove (4). The bottom end of the chip discharge pipe (21) is threadedly connected with an end cover (22). The periphery of the bottom side of the grinding groove (4) contracts towards the direction of the chip discharge pipe (21). A support seat (18) for placing a circuit board is fixedly connected in the grinding groove (4). A clamping assembly for clamping the circuit board is installed in the support seat (18). Hydraulic rods (2) are fixedly installed on both sides of the base (1). The rod ends of the hydraulic rods (2) are fixedly connected with a lifting plate (6). A grinding motor (14) movable along the length and width directions of the grinding groove (4) is installed on the lifting plate (6). A grinding wheel (15) is fixedly sleeved on the output shaft of the grinding motor (14).

2. The grinding mechanism for circuit board processing according to claim 1, characterized in that, The clamping assembly includes a rotary cylinder (19), a rotating plate (17), and an L-shaped clamping rod (16). The rotary cylinder (19) is fixedly installed inside the support seat (18). The rotating plate (17) is fixedly sleeved on the rotating shaft of the rotary cylinder (19). A plurality of groups of chutes (1701) transitioning from the edge to the center are formed on the rotating plate (17). The plurality of groups of chutes (1701) are arranged in a circular array on the rotating plate (17). A slide bar (23) is slidably connected in the chute (1701). The horizontal end of the clamping rod (16) passes through the support seat (18) and is rotatably matched with the slide bar (23).

3. A grinding mechanism for circuit board processing according to claim 1, characterized in that, First transmission screws (8) and first guide rods (9) are respectively installed on both sides of the bottom of the lifting plate (6). A first sliding seat (10) is sleeved on the first transmission screws (8) and the first guide rods (9). A first driving motor (7) is fixedly installed on one side of the lifting plate (6). The output shaft of the first driving motor (7) is in transmission connection with one end of the first transmission screw (8).

4. A grinding mechanism for circuit board processing according to claim 3, characterized in that, Second transmission screws (12) and second guide rods (24) are respectively installed on both sides of the bottom of the first sliding seat (10). A second sliding seat (13) is sleeved on the second transmission screws (12) and the second guide rods (24). A second driving motor (11) is fixedly installed on one side of the first sliding seat (10). The output shaft of the second driving motor (11) is in transmission connection with one end of the second transmission screw (12). The grinding motor (14) is fixedly installed on the bottom of the second sliding seat (13).

5. A grinding mechanism for circuit board processing according to claim 1, characterized in that, Guide columns (3) passing through the lifting plate (6) are fixedly connected to the periphery of the top of the base (1).

6. The grinding mechanism for circuit board processing according to claim 1, characterized in that, An inclined support-shaped reinforcing plate (5) is fixedly connected between the periphery of the bottom side of the grinding groove (4) and the base (1).

7. A grinding mechanism for circuit board processing according to claim 1, characterized in that, The bottom of the support seat (18) and the grinding groove (4) are fixedly connected by four groups of support columns (20) distributed in a circular array.

Images